Display panel, display device and preparation method of display panel

Abstract

The application discloses a display panel, a display device and a preparation method of the display panel. The display panel comprises a first display area and a second display area surrounding the first display area, the light transmittance of the first display area is greater than that of the second display area, and the display panel further comprises a substrate, a pixel definition layer, a cathode protection layer and a light-emitting device layer. The pixel definition layer is arranged on one side of the substrate, and the pixel definition layer is provided with a plurality of pixel openings. The cathode protection layer is located in the first display area, and the cathode protection layer is arranged on the side, away from the substrate, of the pixel definition layer and is provided with a plurality of protection openings. The light-emitting device layer comprises an anode, a light-emitting layer and a cathode which are sequentially stacked, the anode and the light-emitting layer are located in the pixel openings, the cathode covers the cathode protection layer, the cathode is provided with a plurality of light-transmitting openings, and the plurality of light-transmitting openings are arranged in one-to-one correspondence with the plurality of protection openings, so that the use performance of the display panel is improved.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] Organic light-emitting diode (OLED) and flat panel display devices based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] The purpose of this application is to provide a display panel, a display device, and a method for manufacturing the display panel, which can improve the performance of the display panel.

[0005] The first aspect of this application provides a display panel, which includes a first display area and a second display area surrounding the first display area. The light transmittance of the first display area is greater than that of the second display area. The display panel also includes a substrate, a pixel defining layer, a cathode protection layer, and a light-emitting device layer. The pixel defining layer is disposed on one side of the substrate and has multiple pixel openings. The cathode protection layer is located in the first display area and is disposed on the side of the pixel defining layer away from the substrate. The cathode protection layer has multiple protective openings. The light-emitting device layer includes an anode, a light-emitting layer, and a cathode stacked sequentially. The anode and the light-emitting layer are located within the pixel openings. The cathode covers the cathode protection layer and has multiple light-transmitting openings. The multiple light-transmitting openings correspond one-to-one with the multiple protective openings.

[0006] In some embodiments, the cathode protection layer is disposed in the same layer as the anode and comprises the same material.

[0007] In some embodiments, the display panel further includes an anode protection layer disposed within the substrate, wherein the orthographic projection of the anode onto the substrate is located within the range of the orthographic projection of the anode protection layer onto the substrate.

[0008] Preferably, in the direction perpendicular to the substrate, the projected area of ​​the anode is smaller than the projected area of ​​the anode protective layer.

[0009] Preferably, the orthographic projection of the cathode protective layer onto the substrate and the orthographic projection of the anode protective layer onto the substrate at least partially overlap.

[0010] In some embodiments, the pixel defining layer includes a first pixel defining portion and a second pixel defining portion, the second pixel defining portion being disposed on the side of the first pixel defining portion facing the pixel opening, and the second pixel defining portion covering the edge of the anode.

[0011] In some embodiments, the display panel further includes a support layer disposed on the side of the pixel defining layer opposite to the substrate;

[0012] Preferably, the support layer and the second pixel defining portion are disposed in the same layer and include the same material.

[0013] In some embodiments, the cathode protection layer includes a first connection portion and a second connection portion, and the orthographic projection of the light-emitting layer onto the substrate is located within the range of the orthographic projection of the first connection portion onto the substrate; along a first direction, adjacent first connection portions are connected by the second connection portion; along a second direction, a plurality of first connection portions are spaced apart; wherein the first direction and the second direction are intersecting.

[0014] In some embodiments, the orthographic projection of the cathode protection layer onto the substrate coincides with the orthographic projection of the cathode onto the substrate.

[0015] In some embodiments, the display panel further includes a thin-film transistor and a connection lead. The thin-film transistor is disposed in the second display area, the connection lead is disposed on the substrate, the anode is disposed on the side of the connection lead away from the substrate, and the connection lead is connected to the thin-film transistor.

[0016] Secondly, embodiments of this application also provide a display device, including the display panel of any of the above embodiments.

[0017] Thirdly, embodiments of this application also provide a method for manufacturing a display panel, comprising the following steps:

[0018] A pixel defining layer is formed on one side of a substrate; wherein the pixel defining layer has multiple pixel openings;

[0019] An anode material layer is formed on one side of a substrate, and the anode material layer is patterned to obtain an anode and a cathode protection layer with multiple protective openings; wherein, the anode is located within the pixel opening, the display panel includes a first display area and a second display area surrounding the first display area, the light transmittance of the first display area is greater than the light transmittance of the second display area, and the cathode protection layer is located in the first display area;

[0020] A light-emitting layer is formed within the pixel aperture;

[0021] A cathode material layer is prepared, and laser etching is performed on the side of the substrate away from the anode to obtain the cathode; the cathode has multiple light-transmitting openings, and the multiple light-transmitting openings are arranged in a one-to-one correspondence with multiple protective openings.

[0022] This application provides a display panel, a display device, and a method for fabricating the display panel. Because a patterned cathode protection layer is provided on the pixel defining layer, after the cathode material layer is fabricated, during laser etching on the side of the substrate away from the anode, the laser passes through the protective opening of the cathode protection layer to remove the portion outside the corresponding cathode protection layer, resulting in a cathode with a light-transmitting opening. Since the cathode protection layer and the cathode are very close, diffraction phenomena during laser etching are reduced, thereby reducing the unevenness of received light energy at the cathode ashing boundary, reducing the peeling phenomenon between the cathode ashing boundary and adjacent film layers, and improving the performance of the display panel. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 Top view of a display panel provided in some embodiments of this application;

[0025] Figure 2 This is a cross-sectional schematic diagram of the first display area of ​​a display panel provided in some embodiments of this application;

[0026] Figure 3 This is a cross-sectional schematic diagram of the first display area of ​​a display panel provided in other embodiments of this application;

[0027] Figure 4 A cross-sectional schematic diagram of the first display area of ​​a display panel provided in some embodiments of this application;

[0028] Figure 5 A top view of the first display area of ​​a display panel provided in some embodiments of this application;

[0029] Figure 6 A schematic flowchart illustrating a display panel fabrication method provided in some embodiments of this application;

[0030] Figures 7a-7d This is a schematic diagram illustrating the manufacturing process of a display panel provided in some embodiments of this application.

[0031] Explanation of reference numerals in the attached figures:

[0032] 100. Display panel; AA1. First display area; AA2. Second display area; 10. Substrate; 11. Substrate; 12. Driving circuit layer; 20. Pixel defining layer; 21. Pixel opening; 22. First pixel defining portion; 23. Second pixel defining portion; 30. Light-emitting device layer; 31. Anode; 32. Light-emitting layer; 33. Cathode; 331. Light-transmitting opening; 332. First connecting portion; 333. Second connecting portion; 40. Cathode protection layer; 41. Protective opening; 50. Anode protection layer; 60. Support layer; 70. Connecting lead; X. First direction; Y. Second direction. Detailed Implementation

[0033] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application, that is, this application is not limited to the described embodiments.

[0034] This application provides a display panel 100, which may be an organic light-emitting diode (OLED) display panel 100, or other types of display panels 100, such as micro light-emitting diode (Micro-LED) or quantum light-emitting diode (QLED) display panels 100.

[0035] Please refer to the following: Figure 1 and Figure 2 The first aspect of this application provides a display panel 100, which includes a first display area AA1 and a second display area AA2 surrounding the first display area AA1. The light transmittance of the first display area AA1 is greater than that of the second display area AA2. The display panel 100 also includes a substrate 10, a pixel defining layer 20, a cathode protection layer 40, and a light-emitting device layer 30. The pixel defining layer 20 is disposed on one side of the substrate 10 and has a plurality of pixel openings 21. The cathode protection layer 40 is located in the first display area AA1 and is disposed on the side of the pixel defining portion away from the substrate 10. The cathode protection layer 40 has a plurality of protective openings 41. The light-emitting device layer 30 includes an anode 31, a light-emitting layer 32, and a cathode 33 stacked sequentially. The anode 31 and the light-emitting layer 32 are located within the pixel openings 21. The cathode 33 covers the cathode protection layer 40 and has a plurality of light-transmitting openings 331. The plurality of light-transmitting openings 331 and the plurality of protective openings 41 are arranged one-to-one.

[0036] The substrate 10 includes a substrate 11 and a driving circuit layer 12 disposed on the substrate 11. The substrate 11 can be a rigid substrate made of materials such as glass or plastic, or a flexible substrate made of materials such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), or cellulose acetate propionate (CAP). The driving circuit layer 12 contains a driving circuit for controlling the light emission of the light-emitting unit. The driving circuit layer 12 is generally composed of inorganic film layers such as a metal layer, a semiconductor layer (active layer), and an insulating layer. By patterning these inorganic film layers, a driving circuit for controlling the light emission of the light-emitting unit can be formed. There are various ways to implement the specific circuit structure, which will not be described in detail here.

[0037] The pixel limiting layer 20 can reduce crosstalk between sub-pixels and improve the display effect of the display panel 100.

[0038] When the anode 31 and cathode 33 are energized, electrons and holes migrate to the light-emitting layer 32 and meet in the light-emitting layer 32 to form excitons that excite the light-emitting molecules, thereby generating visible light to achieve the purpose of display.

[0039] The cathode protective layer 40 can be prepared using the same material and process steps as the anode 31, or it can be prepared separately using metals such as Mo or TiAlTi.

[0040] The display panel 100 has a light-emitting side and a backlight side. The light-emitting side is the side from which the sub-pixel light is emitted, which is the side used for display illumination. The backlight side is the opposite side.

[0041] An under-display camera or infrared receiver can be installed at the location corresponding to the first display area AA1 on the display device. For example, the under-display camera uses a high screen-to-body ratio display design. The area of ​​this screen corresponding to the placement of the imaging optical module has pixels and also functions as a display, thereby improving the integrity of the screen display and creating a true full-screen display for a better visual experience. Since the under-display camera or infrared receiver in the first display area AA1 needs to receive external light, the light transmittance of the first display area AA1 is relatively high, and the light transmittance of the first display area AA1 is set to be greater than that of the second display area AA2.

[0042] First, a full-layer cathode 33 material layer is prepared on the cathode protection layer 40 and the light-emitting layer 32. Then, a proximity exposure machine is used to etch the cathode 33 material layer with a laser on the side of the substrate 10 away from the anode 31, i.e., on the backlight side of the display panel 100. Since the anode 31 is made of opaque metal, the laser cannot pass through the anode 31 and the cathode protection layer 40. Alternatively, a metallic anode protection layer 50 can be prepared below the anode 31, in which case the laser cannot pass through the anode protection layer 50 and the cathode protection layer 40. The laser can only pass through the protective opening 41 of the cathode protection layer 40. Therefore, part of the cathode 33 material layer within the protective opening 41 is etched away by the laser, leaving a patterned cathode 33, i.e., a cathode 33 with multiple light-transmitting openings 331. The light-transmitting openings 331 are located in the first display area AA1, so that the light transmittance of the first display area AA1 is greater than that of the second display area AA2.

[0043] During the etching process, "ashing" is a method of material removal. Due to diffraction, the etching light rays (used to alt the cathode 33 material to form a pattern), which should be precisely confined within a certain range, diffuse into undesirable areas. This results in uneven light energy distribution at the alt boundaries of the cathode 33 (i.e., at the boundaries of the light-transmitting opening 331), with insufficient light intensity in some areas to completely alt the cathode 33 material. Incomplete alting causes the structure and properties of the cathode 33 material in these boundary regions to differ from those in the normally alt regions. This difference can lead to decreased adhesion of the cathode 33 material, resulting in "peeling." In subsequent processes or during use, these incompletely alt, poorly adhered boundary portions of the cathode 33 material can easily detach from adjacent materials, affecting the performance and stability of the device.

[0044] In this embodiment, a patterned cathode protection layer 40 is provided on the pixel limiting layer 20. After the cathode 33 material layer is prepared, when laser etching is performed on the side of the substrate 10 away from the anode 31, the laser passes through the protective opening 41 of the cathode protection layer 40 to remove the portion outside the corresponding cathode protection layer 40, resulting in a cathode 33 with a light-transmitting opening 331. Since the cathode protection layer 40 and the cathode 33 are very close, the diffraction phenomenon of laser etching is reduced, thereby reducing the unevenness of received light energy at the ashing boundary of the cathode 33, reducing the peeling phenomenon between the ashing boundary of the cathode 33 and adjacent film layers, and improving the performance of the display panel 100.

[0045] In some embodiments, the cathode protection layer 40 is disposed in the same layer as the anode 31 and comprises the same material.

[0046] For example, both the cathode protective layer 40 and the anode 31 are made of indium tin oxide or other metals. The anode protective layer 50 and the anode 31 are made of the same material and the same mask, and are completed in the same step, which improves the manufacturing efficiency of the display panel 100.

[0047] like Figure 3 As shown, in some embodiments, the display panel 100 further includes an anode protection layer 50 disposed within the substrate 10, wherein the orthographic projection of the anode 31 onto the substrate 10 is located within the range of the orthographic projection of the anode protection layer 50 onto the substrate 10.

[0048] An anode protection layer 50 can be disposed within the driving circuit layer 12 of the substrate 10, located directly below the anode 31. An anode protection layer 50 is disposed below each anode 31. The anode protection layer 50 can also be fabricated using the same material and process steps as the existing metal layer in the driving circuit board, i.e., it can be disposed in the same layer to improve the fabrication efficiency of the display panel 100.

[0049] The area of ​​the anode 31 projected onto the substrate 10 can be smaller than the area of ​​the anode protective layer 50 projected onto the substrate 10, or the area of ​​the anode 31 projected onto the substrate 10 can be the same as the area of ​​the anode protective layer 50 projected onto the substrate 10.

[0050] The anode protective layer 50 can be formed using metals such as Mo or TiAlTi. Although the anode 31 can also block the laser, the anode protective layer 50 can better protect the anode 31 and prevent the laser from damaging or destroying the anode 31.

[0051] Preferably, in the direction perpendicular to the substrate 10, the projected area of ​​the anode 31 is smaller than the projected area of ​​the anode protective layer 50.

[0052] In other words, along the direction parallel to the substrate 10, the edge of the anode protective layer 50 extends beyond the edge of the anode 31, ensuring that the orthogonal projection of the anode protective layer 50 on the substrate 10 can completely cover the orthogonal projection of the anode 31 on the substrate 10, thereby further enhancing the protective effect of the anode protective layer 50 on the anode 31.

[0053] Furthermore, there is a gap between the cathode protective layer 40 and the anode 31 along the direction parallel to the substrate 10. If the projected area of ​​the anode protective layer 50 is equal to the projected area of ​​the anode protective layer 50 along the direction parallel to the substrate 10, and the orthographic projection of the anode protective layer 50 on the substrate 10 coincides with the orthographic projection of the anode 31 on the substrate 10, the anode protective layer 50 can cover the gap between the anode 31 and the anode protective layer 50, preventing diffraction at the boundary of the anode protective layer 50 during laser etching of the cathode 33, which would lead to the problem of the ashing boundary of the cathode 33 peeling off from the adjacent film layer.

[0054] Preferably, the orthographic projection of the cathode protective layer 40 onto the substrate 10 and the orthographic projection of the anode protective layer 50 onto the substrate 10 at least partially overlap, further ensuring that there is no gap between the cathode protective layer 40 and the anode protective layer 50 in the direction parallel to the substrate 10, further preventing diffraction at the boundary of the anode protective layer 50 during laser etching of the cathode 33, and further preventing peeling between the ashing boundary of the cathode 33 and adjacent film layers.

[0055] In some embodiments, the pixel defining layer 20 includes a first pixel defining portion 22 and a second pixel defining portion 23, the second pixel defining portion being disposed on the side of the first pixel defining portion 22 facing the pixel opening 21, and the second pixel defining portion 23 covering the edge of the anode 31.

[0056] First, a first pixel limiting portion 22 with a pixel opening 21 is prepared. Then, an anode 31 and a cathode protection layer 40 can be prepared simultaneously. The anode 31 is located inside the pixel opening 21. Then, a second pixel limiting portion 23 is prepared so that the second pixel limiting portion 23 can cover the edge of the anode 31. When preparing the light-emitting layer 32, the light-emitting material can be completely deposited on the anode 31, so that the charge carriers of the anode 31 are transported to the light-emitting side of the entire light-emitting layer 32, thereby improving the light-emitting efficiency.

[0057] like Figure 4 As shown, in some embodiments, the display panel 100 further includes a support layer 60, which is disposed on the side of the pixel defining layer 20 away from the substrate 10.

[0058] Because the photomask needs to be precisely positioned above the pixel-defining layer 20 to ensure accurate deposition of the organic light-emitting material, a stable support structure is required. The support layer 60 perfectly meets this requirement. Without the support layer 60, the photomask may shift due to its own weight or external factors (such as airflow, slight vibration, etc.), resulting in inaccurate deposition of the organic light-emitting material, which in turn affects the pixel accuracy and display quality of the display panel 100. Moreover, in some high-precision manufacturing processes, the distance between the photomask and the pixel-defining layer 20 also needs to be precisely controlled. The support layer 60 helps maintain this distance, ensuring the stability and reliability of the manufacturing process.

[0059] Preferably, the support layer 60 and the second pixel defining portion 23 are disposed in the same layer and comprise the same material. The support layer 60 and the second pixel defining portion 23 are fabricated simultaneously using the same material and the same mask, and are completed in the same step, thereby improving the fabrication efficiency of the display panel 100.

[0060] like Figure 5As shown, in some embodiments, the cathode protection layer 40 includes a first connecting portion 332 and a second connecting portion 333, and the orthographic projection of the light-emitting layer 32 onto the substrate 10 is located within the range of the orthographic projection of the first connecting portion 332 onto the substrate 10; along the first direction X, adjacent first connecting portions 332 are connected by the second connecting portion 333; along the second direction Y, a plurality of first connecting portions 332 are arranged at intervals; wherein the first direction X and the second direction Y are intersecting.

[0061] The first connecting portion 332 and the second connecting portion 333 can be arranged in an array. For example, the first direction X is the column direction and the second direction Y is the row direction. The second connecting portion 333 extends and connects to the cathode 33 of the second display area AA2, realizing the mutual electrical connection between the cathodes 33 of the entire layer. The first connecting portion 332 can be annular, circular, or rectangular. The second connecting portion 333 can be elongated or block-shaped.

[0062] The embodiments of this application facilitate the positioning and operation of the cathode protection layer 40 during the manufacturing process, thereby improving production efficiency and product quality stability.

[0063] Preferably, the second connecting portion 333 is wavy. When the cathode protection layer 40 is wavy, the edge of its protective opening 41 is no longer a simple straight line or a regular geometric shape. This irregular shape makes it difficult for the laser to form a fixed diffraction pattern produced under a traditional regular shape when passing through the edge of the protective opening 41. Compared with a simple rectangular opening, the wavy edge disrupts the propagation path of light, making it difficult for light to propagate in the way that would normally produce obvious diffraction.

[0064] In some embodiments, the orthographic projection of the cathode protection layer 40 onto the substrate 10 coincides with the orthographic projection of the cathode 33 onto the substrate 10.

[0065] In other words, the protective opening 41 and the light-transmitting opening 331 are the same size and overlap each other in the direction perpendicular to the substrate 10. This can increase the light transmittance of the first display area AA1 and reduce the diffraction phenomenon of laser etching, thereby further reducing the uneven light energy received at the ashing boundary of the cathode 33, further reducing the peeling phenomenon between the ashing boundary of the cathode 33 and the adjacent film layer, and improving the performance of the display panel 100.

[0066] In some embodiments, the display panel 100 further includes a thin-film transistor and a connecting lead 70. The thin-film transistor is disposed in the second display area AA2, the connecting lead 70 is disposed on the substrate 10, the anode 31 is disposed on the side of the connecting lead 70 away from the substrate 10, and the connecting lead 70 is connected to the thin-film transistor.

[0067] Thin-film transistors are used to control the voltage signal applied to the electrodes of the light-emitting device layer 30. By placing the thin-film transistor in the second display area AA2, compared to placing the thin-film transistor in the first display area AA1, the shading of the metal layer in the first display area AA1 can be reduced, thereby further improving the light transmittance of the first display area AA1.

[0068] Secondly, embodiments of this application also provide a display device, including the display panel 100 of any of the above embodiments.

[0069] like Figure 6 As shown, in a third aspect, embodiments of this application also provide a method for manufacturing a display panel 100, comprising the following steps:

[0070] like Figure 7a As shown, in step S10, a pixel defining layer 20 is formed on one side of the substrate 10; wherein the pixel defining layer 20 has a plurality of pixel openings 21.

[0071] The first pixel defining part 22 can be prepared first, and after the anode 31 is prepared, the second pixel defining part 23 can be prepared, and the second pixel defining part 23 covers the edge of the anode 31.

[0072] The pixel-defining layer 20 can be formed using photolithography materials. By coating a photoresist on one side of the substrate 10 and then directly forming a pattern using an exposure and development process, the material properties are stabilized by a curing process after patterning, thus obtaining the pixel-defining layer 20.

[0073] like Figure 7b As shown, in step S20, an anode 31 material layer is formed on one side of the substrate 10, and the anode 31 material layer is patterned to obtain an anode 31 and a cathode protection layer 40 with multiple protective openings 41. The anode 31 is located within the pixel opening 21. The display panel 100 includes a first display area AA1 and a second display area AA2 surrounding the first display area AA1. The light transmittance of the first display area AA1 is greater than that of the second display area AA2. The cathode protection layer 40 is located in the first display area AA1.

[0074] The anode protective layer 50 and the anode 31 are prepared simultaneously using the same material and the same mask, and are completed in the same step, which improves the preparation efficiency of the display panel 100.

[0075] The anode 31 material layer can be prepared by methods such as physical vapor deposition (PVD) or chemical vapor deposition (CVD) to deposit the anode 31 material (such as the common indium tin oxide, ITO) on one side of the substrate 10. These deposition methods can ensure that the anode 31 material is uniformly covered on the substrate 10 and the pixel defining layer 20.

[0076] The patterning of the anode 31 and the cathode protection layer 40 is similar to the patterning process of the pixel defining layer 20. First, photoresist is applied, and then the desired anode 31 pattern is transferred onto the photoresist through a photomask and photolithography process. After development and etching, the unwanted parts of the anode 31 material layer are removed, leaving only the anode 31 portion located in the pixel opening 21 and the cathode protection layer 40 on the pixel defining layer 20.

[0077] like Figure 7c As shown, in step S30, a light-emitting layer 32 is formed within the pixel opening 21.

[0078] The light-emitting layer 32 can be deposited with organic light-emitting materials on top of the anode 31 inside the pixel opening 21 by methods such as vapor deposition.

[0079] like Figure 7d As shown, in step S40, a cathode 33 material layer is prepared and laser etching is performed on the side of the substrate 10 away from the anode 31 to obtain the cathode 33; the cathode 33 has multiple light-transmitting openings 331, and the multiple light-transmitting openings 331 are arranged in a one-to-one correspondence with the multiple protective openings 41.

[0080] By using a proximity exposure machine to etch the cathode 33 material layer with a laser on the side of the substrate 10 away from the anode 31, i.e., on the backlight side of the display panel 100, the laser cannot pass through the anode 31 and the cathode protective layer 40 because the anode 31 is made of opaque metal. Alternatively, if a metallic anode protective layer 50 is formed below the anode 31, the laser cannot pass through the anode protective layer 50 and the cathode protective layer 40. The laser can only pass through the protective opening 41 of the cathode protective layer 40. Therefore, part of the cathode 33 material layer within the protective opening 41 is etched away by the laser, leaving a patterned cathode 33, i.e., a cathode 33 with multiple light-transmitting openings 331. The light-transmitting openings 331 are located in the first display area AA1, so that the light transmittance of the first display area AA1 is greater than that of the second display area AA2.

[0081] Because the cathode protective layer 40 is very close to the cathode 33, the diffraction phenomenon of laser etching is reduced, thereby reducing the unevenness of received light energy at the ashing boundary of the cathode 33, reducing the peeling phenomenon between the ashing boundary of the cathode 33 and the adjacent film layer, and improving the performance of the display panel 100.

[0082] Secondly, this application also provides a display device, including the display panel 100 described above, or a display panel 100 prepared by any of the above-described preparation methods. Since this display device employs all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here.

[0083] The display device can be any device with display function, such as mobile devices such as mobile phones, tablets, laptops, handheld computers, in-vehicle electronic devices, wearable devices, ultra-mobile personal computers (UMPCs), netbooks, or personal digital assistants (PDAs), as well as non-mobile devices such as personal computers (PCs), televisions (TVs), ATMs, or self-service machines.

[0084] The above description is merely a specific embodiment of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, substitutions for other connection methods described above can be made by referring to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application.

Claims

1. A display panel, characterized in that, The display panel includes a first display area and a second display area surrounding the first display area, wherein the light transmittance of the first display area is greater than that of the second display area, and the display panel further includes: substrate; A pixel defining layer is disposed on one side of the substrate, and the pixel defining layer has a plurality of pixel openings; A cathode protection layer is located in the first display area. The cathode protection layer is disposed on the side of the pixel defining portion away from the substrate, and the cathode protection layer has multiple protective openings. The light-emitting device layer includes an anode, a light-emitting layer, and a cathode stacked sequentially. The anode and the light-emitting layer are located within the pixel opening. The cathode covers the cathode protection layer. The cathode has multiple light-transmitting openings, and the multiple light-transmitting openings are arranged in a one-to-one correspondence with the multiple protection openings.

2. The display panel according to claim 1, characterized in that, The cathode protection layer is disposed in the same layer as the anode and comprises the same material.

3. The display panel according to claim 1, characterized in that, The display panel further includes an anode protective layer disposed within the substrate, wherein the orthographic projection of the anode onto the substrate is located within the range of the orthographic projection of the anode protective layer onto the substrate; Preferably, in the direction perpendicular to the substrate, the projected area of ​​the anode is smaller than the projected area of ​​the anode protective layer; Preferably, the orthographic projection of the cathode protective layer onto the substrate and the orthographic projection of the anode protective layer onto the substrate at least partially overlap.

4. The display panel according to claim 1, characterized in that, The pixel defining layer includes a first pixel defining portion and a second pixel defining portion, wherein the second pixel defining portion is disposed on the side of the first pixel defining portion facing the pixel opening, and the second pixel defining portion covers the edge of the anode.

5. The display panel according to claim 4, characterized in that, The display panel further includes a support layer, which is disposed on the side of the pixel defining layer opposite to the substrate; Preferably, the support layer is disposed in the same layer as the second pixel defining portion and comprises the same material.

6. The display panel according to claim 1, characterized in that, The cathode protection layer includes a first connecting portion and a second connecting portion, and the orthographic projection of the light-emitting layer on the substrate is located within the range of the orthographic projection of the first connecting portion on the substrate; along a first direction, adjacent first connecting portions are connected through the second connecting portion; along a second direction, a plurality of first connecting portions are arranged at intervals; wherein, the first direction and the second direction are intersecting.

7. The display panel according to claim 1, characterized in that, The orthographic projection of the cathode protection layer onto the substrate coincides with the orthographic projection of the cathode onto the substrate.

8. The display panel according to claim 1, characterized in that, The display panel further includes a thin-film transistor and connecting leads. The thin-film transistor is disposed in the second display area, and the connecting leads are disposed on the substrate. The anode is disposed on the side of the connecting leads away from the substrate, and the connecting leads are connected to the thin-film transistor.

9. A display device, characterized in that, Includes the display panel as described in any one of claims 1-9.

10. A method for manufacturing a display panel, characterized in that, Includes the following steps: A pixel defining layer is formed on one side of a substrate; wherein the pixel defining layer has a plurality of pixel openings; An anode material layer is formed on one side of the substrate, and the anode material layer is patterned to obtain an anode and a cathode protection layer with multiple protective openings; wherein the anode is located within the pixel opening, the display panel includes a first display area and a second display area surrounding the first display area, the light transmittance of the first display area is greater than the light transmittance of the second display area, and the cathode protection layer is located in the first display area; A light-emitting layer is formed within the pixel opening; A cathode material layer is prepared, and laser etching is performed on the side of the substrate away from the anode to obtain the cathode; the cathode has multiple light-transmitting openings, and the multiple light-transmitting openings are arranged in a one-to-one correspondence with the multiple protective openings.

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