Display device

Abstract

A display device is disclosed, including a display panel including a cover layer, a device layer on the cover layer, and an encapsulation layer on the device layer. A source substrate is on the display panel, and at least one driver chip is on the source substrate. The encapsulation layer can include at least one trench configured to recess a surface of the encapsulation layer. The at least one trench can overlap the driver chip. The trench can contain an air gap, and can be positioned between adjacent protrusions of the encapsulation layer. The display device can further include at least one heat dissipation portion disposed on the driver chip, the heat dissipation portion having elasticity. The trench and protrusion structure are configured to affect heat transfer between the device layer, the driver chip, and an exterior of the display device.

Description

Technical Field

[0001] This disclosure relates to an apparatus, and in particular, for example, but not limited to, a display apparatus. Background Technology

[0002] With the development of an information-oriented society, the demand for display devices for displaying images has increased, and various types of display devices, such as liquid crystal displays and organic light-emitting diode displays, have been used.

[0003] The display device includes multiple pixels and multiple switching elements for driving and controlling the pixels.

[0004] The descriptions provided in the background section should not be construed as prior art simply because they are mentioned in or associated with that section. The background section may include information describing one or more aspects of the subject matter art, and the descriptions in that section do not limit this disclosure. Summary of the Invention

[0005] The purpose of this disclosure is to provide a display device that can improve heat dissipation.

[0006] Another object of the embodiments of this disclosure is to provide a display device that can adjust the travel path for heat dissipation.

[0007] Another objective of the embodiments of this disclosure is to provide a display device capable of withstanding external impacts.

[0008] Another object of the embodiments of this disclosure is to provide a display device that can improve heat dissipation performance by taking into account differences in heat generation.

[0009] Another object of the embodiments of this disclosure is to provide a display device capable of adjusting the temperature balance between driver chips by taking into account differences in heat generation.

[0010] Another object of the embodiments of this disclosure is to provide a display device that is thinner in terms of thickness.

[0011] Another object of the embodiments of this disclosure is to provide a low-power display device.

[0012] The technical objectives of this disclosure are not limited to those described above; other objectives can be inferred based on the following implementation methods.

[0013] One embodiment is a display device comprising: a display panel including a cover layer, a device layer on the cover layer and an encapsulation layer on the device layer; a source substrate on the display panel; and at least one driver chip on the source substrate, wherein the encapsulation layer may include at least one trench configured to recess a surface of the encapsulation layer, and the at least one trench may overlap with the driver chip.

[0014] Another embodiment is a display device comprising: a display panel including a device layer and an encapsulation layer on the device layer; a source substrate on the display panel; and a source substrate portion including at least one driver chip on the source substrate; and a plurality of heat dissipation portions on the at least one driver chip, wherein the heat dissipation portions may be elastic.

[0015] Further details of the implementation are included in the detailed description and accompanying drawings.

[0016] According to the embodiments of the present disclosure, since a path for dissipating heat generated on the device layer is formed along the protrusions between the trapezoidal grooves and the heat dissipation portion overlapping the grooves, heat dissipation performance can be improved by heat conduction, and the amount of heat dissipated in the driver chip is increased by heat conduction generated in the heat dissipation portion, thereby improving the overall heat dissipation performance of the display device.

[0017] The display device according to embodiments of the present disclosure can be adjusted to limit the heat dissipation path because the display device can limit the movement of heat generated from the driver chip to the display panel due to the air gap included on the encapsulation layer, and the heat dissipation path can be changed to be guided in the opposite direction to the display panel.

[0018] Since the heat dissipation section of the display device according to the embodiments of the present disclosure is elastic, the display device according to the embodiments of the present disclosure can mitigate the impact generated when the heat dissipation section and the bottom of the cover come into contact with each other by an impact applied from the outside.

[0019] The display device according to the embodiments of the present disclosure can improve its heat dissipation performance by adjusting the arrangement of the encapsulation layer and the heat dissipation part, taking into account the heat dissipation that varies according to the size of the driver chip.

[0020] The display device according to the embodiments of the present disclosure can uniformly regulate the temperature of the driver chip by adjusting the arrangement of the encapsulation layer and the heat sink, taking into account the heat dissipation that varies according to the size of the driver chip.

[0021] The display device according to the embodiments of the present disclosure can be made thinner in terms of thickness because the heat dissipation part is elastic.

[0022] The display device according to embodiments of the present disclosure can achieve lower power consumption by blocking heat travel to the device layer.

[0023] The effects of this disclosure are not limited to those described above. Those skilled in the art can derive other effects not described herein from the following description of the embodiments of this disclosure.

[0024] It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed inventive concept. Attached Figure Description

[0025] The accompanying drawings are included to provide a further understanding of this disclosure and are incorporated in and constitute a part of this application. The drawings illustrate embodiments of the disclosure and, together with the description, serve to illustrate the principles of the disclosure. In the drawings: Figure 1 This is a cross-sectional view of one embodiment of the present disclosure.

[0026] Figure 2 It is based on Figure 1 A plan view of the display device.

[0027] Figure 3 It is shown Figure 2 The graph of the Q1 region.

[0028] Figure 4 It is shown Figure 2 A 3D view of region Q1.

[0029] Figure 5 It is along Figure 2 A cross-sectional view taken from the A-A' line.

[0030] Figure 6 This is a schematic diagram illustrating the heat travel path in a display device according to an embodiment.

[0031] Figure 7 This is a schematic diagram illustrating the temperature gradient of a display device according to an embodiment.

[0032] Figure 8 This is a cross-sectional view of a display device according to another embodiment.

[0033] Figure 9 It shows the basis Figure 8 A schematic diagram of the heat travel path in a display device.

[0034] Figure 10 This is a cross-sectional view of a display device according to another embodiment.

[0035] Figure 11 It shows the basis Figure 10A schematic diagram of the heat travel path in a display device.

[0036] Figure 12 This is a cross-sectional view of a display device according to another embodiment.

[0037] Figure Labels

[0038] 10: Display device

[0039] 100: Display panel

[0040] 110: Polarization layer

[0041] 120: Overlay

[0042] 150: Device Layer

[0043] 170: Encapsulation layer

[0044] 200: Source substrate part

[0045] 210: Source substrate

[0046] 220: Driver chip

[0047] 250: Heat sink substrate

[0048] 255: Heat dissipation section

[0049] 300: Inner Panel

[0050] 400: Cover the bottom

[0051] 500: Control Printed Circuit Board

[0052] TRP: Trench

[0053] PT: protrusion

[0054] H: Hole Detailed Implementation

[0055] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings.

[0056] The same reference numerals will be used throughout the accompanying drawings to refer to the same or similar parts. Furthermore, the thickness, scale, and dimensions of the parts are exaggerated in the drawings for clarity. Because the scale of each element shown in the drawings differs from the actual scale for ease of description, this disclosure is not limited to the scales shown.

[0057] In this specification, when a component (or area, layer, part, etc.) is referred to as "on another component", "connected to", or "combined to" another component, it means that the component may be directly on, connected to, or combined to the other component, or may be a third component present therein.

[0058] "And / or" includes all of one or more combinations defined by the relevant component.

[0059] It should be understood that when the terms “first” and “second” are used herein to describe various components, those components should not be limited by these terms. The terms are used only to distinguish one component from another. For example, a first component may be referred to as a second component without departing from the scope of this disclosure, and vice versa. Unless the context clearly indicates otherwise, the singular expressions and terms used herein also cover or include the plural expressions and terms.

[0060] For ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” “upper,” etc., may be used herein to describe the relationship between one element or feature and another element or feature as shown in the accompanying drawings. These terms are relative concepts and are described based on the orientations shown in the drawings. For example, unless “exactly” or “directly” is used, there may be one or more other parts between the two parts. As shown in the drawings, spatial relative terms such as “below,” “lower,” “lower,” “above,” and “upper” can be used to readily describe the relationship between one element or component and another. In addition to the orientations depicted in the drawings, spatial relative terms should be understood to include different orientations of elements during use or operation. For example, if an element depicted in the figure is flipped, an element described as “below” or “under” another element may end up being placed “above” another element. Thus, the exemplary term “below” can encompass both downward and upward directions.

[0061] In various embodiments of this disclosure, the terms "comprising" or "including" specify attributes, fixed quantities, steps, processes, elements and / or components or combinations thereof, but do not exclude the presence or addition of other attributes, fixed quantities, steps, processes, elements and / or components or combinations thereof.

[0062] As will be fully understood by those skilled in the art, the features of the various embodiments of this disclosure may be joined or combined in part or in whole, and may interoperate and be technology-driven in various ways. Embodiments of this disclosure may be performed independently of each other, or may be performed together in an interdependent relationship.

[0063] Any implementation described as an "example" in this article is not necessarily to be interpreted as preferred or superior to other implementations.

[0064] Furthermore, when referring to any size, relative size, etc., it should be assumed that the numerical or corresponding information of an element or feature (e.g., level, range, etc.) includes tolerances or error ranges that may be caused by various factors (e.g., process factors, internal or external influences, noise, etc.), even if no relevant description is specified. Additionally, the term "may" fully encompasses all the meanings of the term "able to".

[0065] When describing temporal relationships, discontinuous cases may be included when the time sequence is described as such as "after", "following", "next", and "before", unless more restrictive terms such as "just", "immediately", or "directly" are used.

[0066] The term “at least one” should be understood to include any and all combinations of one or more of the associated listed items. For example, “at least one of the first element, the second element, and the third element” means a combination of all three listed elements, a combination of any two of the three elements, and each individual element: the first element, the second element, or the third element.

[0067] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the example embodiments pertain. It should also be understood that terms (such as those defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant field and should not be interpreted in an idealized or overly formal sense unless explicitly defined herein. For example, the terms “part” or “unit” can be applied to, for example, a single circuit or structure, an integrated circuit, a computational block of a circuit arrangement, or any structure configured to perform the functions described herein that would be understood by one of ordinary skill in the art.

[0068] Reference will now be made in detail to embodiments of this disclosure, examples of which are illustrated in the accompanying drawings. In the following description, detailed descriptions of well-known functions or configurations associated with this document will be omitted where such descriptions would be deemed to unnecessarily obscure the essential points of the inventive concept. The described progression of processing steps and / or operations is exemplary; however, the order of steps and / or operations is not limited to that set forth herein, except that they must occur in a specific order, and can be varied as is known in the art. The same reference numerals always denote the same elements. The names of the elements used in the following description may be chosen solely for convenience of writing the specification and may therefore differ from the names used in actual products.

[0069] The display device of this disclosure will be discussed in detail below with reference to the accompanying drawings and embodiments.

[0070] Figure 1 This is a cross-sectional view of one embodiment of the present disclosure.

[0071] refer to Figure 1 The display device 10 according to the embodiment may include a display panel 100, a source substrate 200, an inner plate 300, a cover bottom 400, and a control printed circuit board 500.

[0072] The display panel 100 may include an encapsulation layer 170, a device layer 150 on the encapsulation layer 170, a cover layer 120 on the device layer 150, and a polarization layer 110 on the cover layer 120. The display panel 100 may include an organic light-emitting display panel, but the embodiments disclosed herein are not limited thereto.

[0073] However, Figure 1 This is a diagram showing the top and bottom of the display panel 100 upside down, and in the following description, this disclosure will be centered on the upside-down display panel 100. Therefore, terms such as “upper,” “upper part,” “lower part,” “upper surface,” or “lower surface” have relative concepts.

[0074] In various embodiments, the first direction DR1 and the second direction DR2 are different from each other and intersect, for example, directions that intersect perpendicularly in a plan view. The third direction DR3 is a direction that intersects the plane on which the first direction DR1 and the second direction DR2 are provided, for example, a direction that intersects perpendicularly with both the first direction DR1 and the second direction DR2. Figure 1 In this embodiment, the first direction DR1 may be the same as the extension direction of the short side of the display panel 100, the second direction DR2 may be the same as the extension direction of the long side of the display panel 100, and the third direction DR3 may be the same as the stacking direction of the display panel 100, the source substrate 200, the inner board 300, the cover bottom 400, and the control printed circuit board 500. However, the directions mentioned in the embodiment should be understood as relative directions, and the embodiment is not limited to the directions mentioned.

[0075] The display panel 100 may have a rectangular shape including a short side extending along a first direction DR1 and a long side extending along a second direction DR2. However, the shape of the display panel 100 is not limited to this and may be a square, circle, ellipse, or other polygonal shape. In the following description, for ease of description, this disclosure will focus on the assumption that the display panel 100 has a rectangular shape. The edges of the display panel 100 may have angular or rounded shapes.

[0076] The polarizing layer 110 can be used to reduce external light on the rear surface of the display device 10 (based on...). Figure 1 The reflection on the surface of the polarizing layer 110 is reflected, and the upper surface of the polarizing layer 110 can face the lower surface of the cover layer 120.

[0077] A capping layer 120 may be disposed on the polarization layer 110. The capping layer 120 may be disposed below the device layer 150 and may protect the device layer 150. The lower surface of the capping layer 120 may face the upper surface of the polarization layer 110, and the upper surface of the capping layer 120 may face the lower surface of the device layer 150. The capping layer 120 may be formed of a rigid material including glass or quartz, or a plastic material. The thermal conductivity of the capping layer 120 may be lower than that of the encapsulation layer 170. For example, the thermal conductivity of the capping layer 120 may be approximately 0.75 W / mK, which may be higher than that of the encapsulation layer 170, and therefore, heat generated from the device layer 150 may be better transferred to the encapsulation layer 170 rather than to the capping layer 120.

[0078] Device layer 150 may be disposed on capping layer 120. Although not shown, device layer 150 may include a first electrode, an organic layer, and a second electrode. The first electrode may be used as an anode, and the second electrode may be used as a cathode.

[0079] The first electrode may include a metallic material with high reflectivity, such as a stacked structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a stacked structure of aluminum (Al) and indium tin oxide (ITO) (ITO / Al / ITO), a stacked structure of silver (Ag) and indium tin oxide (ITO) (ITO / Ag / ITO), and an APC alloy, and may consist of a single layer or multiple layers, but the embodiments disclosed herein are not limited thereto.

[0080] The organic layer may include one or more light-emitting structures (or light-emitting elements or components) stacked on the first electrode in the order of hole transport layer and electron transport layer or in reverse order. For example, the hole transport layer may include a hole transport layer, a hole injection layer, an electron blocking layer, a P-type charge generation layer, etc., but the embodiments of this disclosure are not limited thereto. For example, the electron transport layer may include an electron transport layer, an electron injection layer, a hole blocking layer, an N-type charge generation layer, etc., but the embodiments of this disclosure are not limited thereto.

[0081] The organic layer may include an organic light-emitting layer. In some embodiments, the organic layer may be replaced by an inorganic light-emitting layer, a quantum dot light-emitting layer, a micro light-emitting diode, a micro-mini light-emitting diode, etc., but the embodiments of this disclosure are not limited thereto. For example, the organic layer of the display panel 100 according to the embodiments of this disclosure may include an organic light-emitting layer, and the organic layer may include a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer. The organic layer may also include a white light-emitting layer, but the embodiments of this disclosure are not limited thereto.

[0082] When the display device 10 is used for a long time, heat can be generated from the organic layer of the device layer 150, and an encapsulation layer 170 with a higher thermal conductivity than the device layer 150 can be disposed on the upper side of the device layer 150 to dissipate heat.

[0083] The second electrode may include a transparent conductive material or metal that transmits visible light, such as ITO (indium tin oxide) or IZO (indium zinc oxide), but embodiments of this disclosure are not limited thereto. For example, the first electrode may be used as a cathode, and the second electrode may be used as an anode.

[0084] Encapsulation layer 170 may be disposed on device layer 150. Encapsulation layer 170 may include metals such as aluminum (Al), iron (Fe), and nickel (Ni), and may include alloys made of different kinds of metals. Alternatively, encapsulation layer 170 may include stainless steel, such as Invar or special purpose stainless steel (SUS).

[0085] The thermal conductivity of the encapsulation layer 170 can be higher than that of the device layer 150. For example, the thermal conductivity of the encapsulation layer 170 can be about 16 W / mK, and the thermal conductivity of the device layer can be lower than about 16 W / mK, and the heat generated from the device layer 150 can be transferred to the encapsulation layer 170.

[0086] Heat generated from the device layer 150 of the display panel 100 due to the operation of the display device 10 can be transferred to the encapsulation layer 170 through heat conduction, dissipated to the outside of the display panel 100 through convection or radiation between the encapsulation layer 170 and the bottom cover 400, or dissipated to the outside through the inner plate 300 via convection or radiation. Therefore, the degradation of the device layer 150 of the display panel 100 can be prevented or at least reduced, and the service life of the device layer 150 can be improved.

[0087] Although the figure shows that the package layer 170 is disposed directly on the device layer 150, at least one insulating layer or at least one transistor may be disposed between the package layer 170 and the device layer 150.

[0088] exist Figure 1 In the diagram, the polarizing layer 110, the cover layer 120, the device layer 150, and the encapsulation layer 170 are shown in contact with each other, but an adhesive layer may be further disposed between them. However, embodiments of this disclosure are not limited thereto.

[0089] The source substrate portion 200 may be disposed on the encapsulation layer 170. The source substrate portion 200 may provide signals to the display panel 100 for driving the display panel 100 of the display device 10. The source substrate portion 200 may include at least one driver chip. Driver chips are known in the art, therefore, a detailed description of the function of the driver chip will be omitted.

[0090] The bottom cover 400 can support and protect the display panel 100 and the source substrate portion 200. The bottom cover 400 can be formed in a shape corresponding to the planar shape of the display panel 100. However, in other embodiments of this disclosure, the bottom cover 400 can cover the rear surface and side surfaces of the display device 10. The bottom cover 400 can be formed of a material with high thermal conductivity and rigidity, and can be formed of metallic or plastic materials such as aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au), iron (Fe), special purpose stainless steel (SUS), or Invar alloy.

[0091] The inner board 300 can be disposed between the bottom cover 400 and the display panel 100, and the upper surface of the inner board 300 can directly contact the lower surface of the bottom cover 400. When heat generated from the device layer 150 and the source substrate portion 200 is dissipated between the bottom cover 400 and the display panel 100, the heat can be transferred to the inner board 300 by convection or radiation, and the heat transferred to the inner board 300 can be dissipated to the outside of the display device 10 by thermal conduction or radiation. The inner board 300 can dissipate heat generated from the control printed circuit board 500 by thermal conduction or radiation, and can prevent the control printed circuit board 500 and the display panel 100 from directly contacting each other, thereby minimizing or at least reducing the heat concentration from the control printed circuit board 500 to the display panel 100.

[0092] A control printed circuit board 500 may be disposed on the bottom of the cover 400. The control printed circuit board 500 can control the display panel 100 and the source substrate portion 200. The control printed circuit board 500 is known in the art, therefore a detailed description of the function of the control printed circuit board 500 will be omitted.

[0093] Figure 2 It is based on Figure 1 A plan view of the display device.

[0094] refer to Figure 2 The source substrate portion 200 may be disposed on the packaging layer 170, and multiple source substrate portions 200 may be provided. The source substrate portion 200 may include a source substrate 210 and a driver chip 220.

[0095] The source substrate 210 can be disposed on the packaging layer 170, and the driver chip 220 can be disposed on the source substrate 210. Multiple driver chips 220 can be configured. For example, the driver chip 220 may include a first driver chip 221 and a second driver chip 222, and the width W1 of the first driver chip 221 according to the second direction DR2 may be smaller than the width W2 of the second driver chip 222 according to the second direction DR2.

[0096] The figure shows a first driver chip 221 disposed on the outer side of the display device 10 and a second driver chip 222 disposed on the central side of the display device 10 on the source substrate 210. However, the embodiments of this disclosure are not limited to this. For example, the second driver chip 222 may be disposed on the outer side of the display device 10 and the first driver chip 221 may be disposed on the central side of the display device 10.

[0097] Figure 3 It is shown Figure 2 The graph of the Q1 region.

[0098] refer to Figure 3 The first driver chip 221 can be disposed on the trench TRP, and the heat sink 255 can be disposed on the first driver chip 221. The trench TRP and the first driver chip 221 can be disposed overlapping each other.

[0099] Multiple grooved TRPs can be configured, extending in either a first direction DR1 or a second direction DR2. The grooved TRPs extending in the first direction DR1 can be spaced apart from each other in the second direction DR2, and vice versa. The grooved TRPs extending in the first direction DR1 and the second direction DR2 can intersect each other; therefore, the multiple grooved TRPs extending in the first direction DR1 and the second direction DR2 can be arranged in a grid pattern.

[0100] Because the trench TRP is on the surface of the encapsulation layer along the direction that causes the encapsulation layer to be recessed (see... Figure 1 (170 in the middle) is formed, therefore the encapsulation layer (see 170) is formed. Figure 5 The PT (Turf P) in the trench can be set between multiple adjacent TRPs. This will be discussed in more detail below. Figure 4 Further description is provided.

[0101] Multiple heat sinks 255 can be configured, and when viewed from a plane intersecting the first direction DR1 and the second direction DR2, the heat sinks 255 can be configured as an encapsulation layer disposed between multiple adjacent trench TRPs (see reference). Figure 5 The protrusions (PT) overlap. Therefore, from the device layer (reference layer) Figure 1 The heat generated by the 150 (in the middle) can travel to a device layer with a higher temperature than the reference (reference). Figure 1 A packaging layer 170 with a higher thermal conductivity than the device layer (reference 150) can then proceed to a packaging layer with a higher thermal conductivity than the device layer (reference 150). Figure 1 The heat dissipation part 255 (150) has a higher thermal conductivity and can be discharged to the outside (or toward the bottom of the cover 400).

[0102] Figure 4 It is shown Figure 2 A 3D view of region Q1.

[0103] Reference Figure 4 The encapsulation layer 170 may include protrusions PT disposed between a plurality of trench TRPs, and there may be multiple protrusions PT. When viewed from a plane (or cross-section) where the second direction DR2 intersects the third direction DR3, the protrusion PT may be trapezoidal; it may also be trapezoidal when viewed from a plane (or cross-section) where the first direction intersects the third direction DR3. The width of the upper surface of the trapezoidal shape may be less than the width of its lower surface.

[0104] Air or air gaps can be provided in multiple trench TRPs. Although not shown, the source substrate portion (reference) Figure 1 The 200 in the diagram can be disposed on the packaging layer 170 and the trench TRP. Therefore, the side and lower surfaces of the air gap can be surrounded by the trench TRP, and its upper surface can be surrounded by the source substrate portion (see [reference]). Figure 1 (200 in the middle) around.

[0105] Figure 5 It is along Figure 2 A cross-sectional view taken from the A-A' line.

[0106] Reference Figure 5 The trench TRP can be a region that recesses the encapsulation layer 170 from its upper surface toward a downward direction (e.g., toward the other side of DR3). The trench TRP can partially recess the encapsulation layer 170 in the thickness direction. The trench TRP is disposed between the protrusions PT described later, so the shape of the protrusions PT can be taken into consideration in the design, for example, it can have an inverted trapezoidal shape. Each of the plurality of protrusions PT can be spaced apart between the plurality of trench TRPs.

[0107] Multiple protrusions PT and multiple trenches TRP overlapping with the first driver chip 221 can be disposed below the first driver chip 221, and multiple protrusions PT and multiple trenches TRP overlapping with the second driver chip 222 can be disposed below the second driver chip 222. In this case, the width W3 of the trapezoidal lower surface of the multiple protrusions PT disposed below the first driver chip 221 can be the same as the width W4 of the trapezoidal lower surface of the multiple protrusions PT disposed below the second driver chip 222. As described above, the protrusions PT have a trapezoidal shape, therefore, the widths W3 and W4 of each protrusion PT can gradually taper in the upward direction (e.g., to the side facing DR3).

[0108] Air gaps (AIR) can be disposed in multiple trench TRPs. The thermal conductivity of the air gaps (AIR) can be lower than that of the package layer 170 and the source substrate 210. For example, the thermal conductivity of the air gaps (AIR) can be about 0.003 W / mK, and therefore, very little heat can propagate from the package layer 170 or the source substrate 210 to the air gaps (AIR).

[0109] The heat dissipation substrate 250 can be disposed on the first driver chip 221 and the second driver chip 222. There can be multiple heat dissipation substrates 250, and each of the multiple heat dissipation substrates 250 can overlap with the first driver chip 221 and the second driver chip 222.

[0110] The heat dissipation substrate 250 may include a material having a higher thermal conductivity than the device layer 150, and may include, for example, a metallic material, but embodiments of this disclosure are not limited thereto. Since the thermal conductivity of the heat dissipation substrate 250 is higher than that of the device layer 150, heat generated from the device layer 150 can be transferred to one side of the heat dissipation substrate 250 by thermal conduction, and can be discharged to the outside by thermal conduction, convection, or radiation. Heat generated from the source substrate 210 and the driver chips 221 and 222 can be transferred to the side of the heat dissipation substrate 250 by thermal conduction, and can be discharged to the outside by thermal conduction.

[0111] A heat sink 255 can be disposed on a heat sink substrate 250. Multiple heat sinks 255 can be provided, and each of the multiple heat sinks 255 can overlap with the first driver chip 221 and the second driver chip 222. The number of heat sinks 255 overlapping with the first driver chip 221 can be the same as the number of heat sinks 255 overlapping with the second driver chip 222. The multiple heat sinks 255 can overlap with multiple protrusions PT.

[0112] The heat dissipation substrate 250 may be additionally disposed on the heat dissipation portion 255, but the embodiments disclosed herein are not limited thereto. When the heat dissipation substrate 250 is additionally disposed on the heat dissipation portion 255, the heat dissipation substrate 250 may have the following structure: in this structure, a plurality of heat dissipation portions 255 are sandwiched between the upper heat dissipation substrate 250 and the lower heat dissipation substrate 250.

[0113] The heat sink 255 may include a material having a higher thermal conductivity than the device layer 150, and may include, for example, a metallic material, but embodiments of this disclosure are not limited thereto. Since the thermal conductivity of the heat sink 255, the heat sink substrate 250, the encapsulation layer 170, and the protrusion PT are all higher than that of the device layer 150, heat generated from the device layer 150 can be transferred to the protrusion PT and the heat sink substrate 250 and heat sink 255 overlapping with the protrusion PT, and can be discharged to the outside. Heat generated from the source substrate 210 and the driver chips 221 and 222 can be transferred to the heat sink substrate 250 and heat sink 255, and can be discharged to the outside.

[0114] The heat dissipation portion 255 may be made of a resilient material. For example, the heat dissipation portion 255 may include a spring or a spring coil, but embodiments of this disclosure are not limited thereto, and if a component is resilient, that component may be included in the heat dissipation portion 255. Because the heat dissipation portion 255 is resilient, when an impact is applied to the display device 10 from the outside, the heat dissipation portion 255 can mitigate the impact on the heat dissipation portion 255 and the bottom of the cover (see...). Figure 1 The impact generated between 400 and the heat sink 255. When the heat sink 255 includes a spring coil, the area through which heat is dissipated by the heat sink 255 can be increased, and the heat dissipation efficiency can be improved.

[0115] In conventional large-scale display devices, to address the issue of excessive heat generated by the increased heat output of the lower source substrate, heat dissipation is typically achieved through radiation or convection in the direction of the bottom cover. To ensure even more efficient heat dissipation, attempts have been made to utilize heat conduction by attaching thermally conductive heat sinks used in other industries. However, this requires a wider surface area for the heat sink, necessitating a longer design in the thickness direction, which narrows the gap between the heat sink and the bottom cover. Consequently, the heat sink becomes susceptible to physical damage from external impacts. To compensate for this, widening the gap between the heat sink and the bottom cover increases the overall thickness of the display device. Therefore, in many cases, conventional large-scale display devices do not utilize thermally conductive heat sinks.

[0116] When the heat dissipation portion 255 according to one embodiment includes a resilient material, physical damage to the heat dissipation portion 255 can be prevented or at least reduced even if an impact occurs between the heat dissipation portion 255 and the bottom cover 400 due to an impact applied from the outside.

[0117] Furthermore, without increasing the gap between the heat dissipation section 255 and the bottom cover 400, the thickness of the display device 10 can be reduced. Additionally, when the heat dissipation section 255 comprises a flexible material, its thickness can be reduced compared to that of a conventional heat dissipation section, thus further reducing the thickness of the display device 10.

[0118] Figure 6 This is a schematic diagram illustrating the heat travel path in a display device according to an embodiment.

[0119] refer to Figure 6 The heat H1 generated from the device layer 150 can be better transferred to the encapsulation layer 170, which has a higher thermal conductivity than the cover layer 120. Very little heat propagates to the air gap AIR, whose thermal conductivity is much lower than that of the encapsulation layer 170. Therefore, most of the heat H1 transferred to the encapsulation layer 170 can be transferred along the protrusion PT to one side of the source substrate 210. The heat H1 transferred to the source substrate 210 can travel along the heat sink 255, which overlaps with the driver chip 220, the heat sink 250, and the protrusion PT, via thermal conduction, and can then be discharged to the outside (or toward the bottom cover 400 side). The discharged heat H1 can be completely discharged to the outside of the display device 10 through thermal conduction, convection, or radiation between the driver chips 221, 222 and the bottom cover 400.

[0120] The heat H2 generated from the driver chip 220 and / or source substrate 210 can be transferred to the encapsulation layer 170, which has a higher thermal conductivity. Since the heat H2 transferred to the encapsulation layer 170 is prevented or at least its propagation to the air gap AIR, which has a lower thermal conductivity than the encapsulation layer 170, the heat H2 cannot propagate through the encapsulation layer 170 to the device layer 150 and can be discharged to the outside (or in the direction of the cover bottom 400) through the heat dissipation substrate 250 and heat dissipation section 255, which have a higher thermal conductivity than the air gap AIR. The heat H2 discharged to the outside can be completely discharged to the outside of the display device 10 through thermal conduction, convection, or radiation between the driver chips 221, 222 and the cover bottom 400. In this case, as described above, the protrusions PT have a trapezoidal shape, and therefore, the widths W3 and W4 of each protrusion PT can gradually taper in the upward direction (e.g., to the side facing DR3). Therefore, in the region that contacts the source substrate 210, the widths W3 and W4 of each protrusion PT can be smaller than those in the region that does not contact the source substrate 210.

[0121] Therefore, the heat H1 generated from device layer 150 and the heat H2 generated from driver chip 220 and source substrate 210 can both be transferred to one side of heat sink 255, instead of to one side of device layer 150, and can be discharged to one side of the bottom of the cover (see reference). Figure 1 (400 in the middle).

[0122] Figure 7 This is a schematic diagram illustrating the temperature gradient of a display device according to an embodiment.

[0123] Reference Figure 7 Based on the plane where the first direction DR1 and the second direction DR2 intersect, the area of ​​the first driver chip 221 can be smaller than the area of ​​the second driver chip 222, and the temperature of the first driver chip 221 can be higher than the temperature of the second driver chip 222. Therefore, when the first driver chip 221 is disposed on the outside of the display device 10 and the second driver chip 222 is disposed in the center of the display device 10 in the plan view, the temperature on the outside of the display device 10 may be higher than the temperature in the center.

[0124] Although not shown, the device layer (reference) located below the package layer 170 (e.g., on the third-direction DR3) Figure 1 A heat-generating reaction can occur in the 150 (reference) layer, and the device layer (reference) Figure 1 The heat generated by driver chips 221 and 222 can be less than that generated by driver chips 221 and 222. Therefore, when driver chips 221 and 222 are located on the lower side of display device 10 in a plan view, the temperature on the lower side of display device 10 can be higher than the temperature on the upper side and the center of display device 10.

[0125] Figure 8 This is a cross-sectional view of a display device according to another embodiment.

[0126] Reference Figure 8 Multiple trench TRPs and multiple protrusions PTs overlapping with the first driver chip 221 can be disposed below the first driver chip 221, and multiple trench TRPs and multiple protrusions PTs overlapping with the second driver chip 222 can be disposed below the second driver chip 222. In this case, the width W3 of the lower surface of the trapezoid of the multiple protrusions PTs disposed below the first driver chip 221 can be smaller than the width W4 of the lower surface of the trapezoid of the multiple protrusions PTs disposed below the second driver chip 222, and the width of the upper surface of the trapezoid of the multiple protrusions PTs overlapping with the first driver chip 221 can be smaller than the width of the upper surface of the trapezoid of the multiple protrusions PTs overlapping with the second driver chip 222.

[0127] The trench TRPs are disposed between the protrusions PT. Based on the plan view of the intersection of the second direction DR2 and the third direction DR3, the area of ​​each of the multiple trench TRPs disposed below the first driver chip 221 can be greater than the area of ​​each of the multiple trench TRPs disposed below the second driver chip 222.

[0128] In order to effectively dissipate the heat generated from the first driver chip 221, the heat is usually discharged to the outside through the heat dissipation substrate 250 and the heat dissipation part 255 without being transferred to the package layer 170. Therefore, the area of ​​the protrusion PT overlapping with the first driver chip 221 may be reduced, while the area of ​​the air gap AIR overlapping with the first driver chip 221 may be increased.

[0129] Conversely, the heat generated in the second driver chip 222 is relatively less than the heat generated in the first driver chip 221. Therefore, the area of ​​the protrusion PT overlapping with the second driver chip 222 can be increased, while the area of ​​the air gap AIR overlapping with the second driver chip 222 can be decreased. By increasing the area of ​​the protrusion PT and the source substrate (refer to the first driver chip 222), the area of ​​the air gap AIR overlapping with the second driver chip 222 can be increased. Figure 1 The overlap area of ​​210 can stabilize the structure and increase the area from the device layer (refer to 210). Figure 1 The amount of heat dissipated by 150).

[0130] As described above, by taking into account the heat dissipation of driver chips 221 and 222, and changing the area of ​​the protrusion PT and air gap AIR overlapping with driver chips 221 and 222, the device layer (refer to) can be adjusted. Figure 1 The heat dissipation efficiency of the 150) and driver chips 221 and 222. In addition, by increasing the heat dissipation at the locations with high surface temperatures on the display device 10, it is possible to establish a temperature balance on the surface of the display device 10.

[0131] Detailed descriptions of other components have been referenced. Figure 5 Provided, and will be omitted.

[0132] Figure 9 It shows the basis Figure 8 A schematic diagram of the heat travel path in a display device.

[0133] Reference Figure 9 Based on the plan view where the second direction DR2 and the third direction DR3 intersect, as the area of ​​the trench TRP overlapping with the first driver chip 221 becomes larger than the area of ​​the trench overlapping with the second driver chip 222, the travel of the heat generated from the first driver chip 221 to the package layer 170 can be relatively more restricted than the travel of the heat generated from the second driver chip 222 to the package layer 170.

[0134] Conversely, when the area of ​​the protrusion PT overlapping with the first driver chip 221 becomes smaller than the area of ​​the protrusion PT overlapping with the second driver chip 222, the amount of heat generated from the device layer 150 dissipated through the protrusion PT overlapping with the second driver chip 222 can become greater than that in the protrusion overlapping with the first driver chip 221.

[0135] Figure 10 This is a cross-sectional view of a display device according to another embodiment.

[0136] Reference Figure 10 Multiple trench TRPs and multiple protrusions PTs can be disposed below the first driver chip 221 and the second driver chip 222, and multiple heat sinks 255 can be disposed on the first driver chip 221 and the second driver chip 222. The amount of multiple trench TRPs, protrusions PTs and heat sinks 255 overlapping with the first driver chip 221 can be greater than the amount of multiple trench TRPs, protrusions PTs and heat sinks 255 overlapping with the second driver chip 222.

[0137] Based on the plan view of the intersection of the second direction DR2 and the third direction DR3, the sum of the areas of each of the plurality of trench TRPs overlapping with the first driver chip 221 can be greater than the sum of the areas of each of the plurality of trench TRPs overlapping with the second driver chip 222.

[0138] Descriptions of other components have been referenced. Figure 5 and Figure 8 Provided, and will be omitted.

[0139] Figure 11 It shows the basis Figure 10 A schematic diagram of the heat travel path in a display device.

[0140] Reference Figure 11 Based on the plan view where the second direction DR2 and the third direction DR3 intersect, since the sum of the areas of each of the plurality of trench TRPs overlapping with the first driver chip 221 is greater than the sum of the areas of each of the plurality of trench TRPs overlapping with the second driver chip 222, the travel of the thermally driven package layer 170 generated from the first driver chip 221 can be relatively more restricted than the travel of the thermally driven package layer 170 generated from the second driver chip 222.

[0141] When the sum of the areas of each of the plurality of protrusions PT overlapping the first driver chip 221 becomes less than the sum of the areas of each of the protrusions PT overlapping the second driver chip 222, the amount of heat dissipated through the protrusions PT from the device layer 150 can be increased more in the protrusions PT overlapping the second driver chip 222 compared to the protrusions PT overlapping the first driver chip 221.

[0142] Heat transferred from device layer 150 to first driver chip 221 and / or generated from first driver chip 221 can be discharged to the outside through multiple heat dissipation sections 255.

[0143] Figure 12This is a cross-sectional view of a display device according to another embodiment.

[0144] Reference Figure 12 Multiple heat dissipation substrates 250_1 can be configured, and the multiple heat dissipation substrates 250_1 can be sandwiched between the heat dissipation part 255 in a sandwich configuration. The heat dissipation substrates 250_1 disposed on the heat dissipation part 255 can have holes H, which can be configured not to overlap with the heat dissipation part 255.

[0145] Through the heat dissipation part 255 and the heat dissipation substrate 250_1, the display panel 100 and the bottom of the cover (see reference) Figure 1 The heat transferred between the holes (40) is discharged to the outside through convection or radiation. In this case, the heat dissipation efficiency can be improved by the convective heat transfer generated in the holes H.

[0146] Detailed descriptions of other components have been referenced. Figure 5 It has been provided and will be omitted.

[0147] The display device according to various embodiments of the present disclosure can be described as follows.

[0148] One embodiment is a display device comprising: a display panel including a cover layer, a device layer on the cover layer and an encapsulation layer on the device layer; a source substrate on the display panel; and at least one driver chip on the source substrate, wherein the encapsulation layer may include at least one trench configured to recess a surface of the encapsulation layer, and the at least one trench may overlap with the driver chip.

[0149] In the display device according to various embodiments of the present disclosure, an air gap may be provided in at least one groove.

[0150] In the display device according to various embodiments of the present disclosure, the air gap may be surrounded by a source substrate and a trench.

[0151] In various embodiments of the display device according to the present disclosure, the display device may further include at least one protrusion, which may be disposed between adjacent grooves.

[0152] In the display device according to various embodiments of the present disclosure, the width of the upper surface of at least one protrusion may be smaller than the width of its lower surface.

[0153] In various embodiments of the display device according to the present disclosure, the display device may further include at least one heat sink, which may be disposed on a driver chip.

[0154] In the display device according to various embodiments of the present disclosure, at least one heat dissipation portion may be elastic.

[0155] In the display device according to various embodiments of the present disclosure, at least one heat dissipation portion may overlap with at least one protrusion in a plan view.

[0156] In the display device according to various embodiments of the present disclosure, the encapsulation layer may include a metallic material.

[0157] In the display device according to various embodiments of the present disclosure, the thermal conductivity of the encapsulation layer may be higher than that of the cover layer.

[0158] In the display device according to various embodiments of the present disclosure, at least one driver chip may include a first driver chip and a second driver chip, and the width of the first driver chip may be smaller than the width of the second driver chip.

[0159] In the display device according to various embodiments of the present disclosure, the temperature generated from the first driver chip can be higher than the temperature generated from the second driver chip.

[0160] In various embodiments of the display device according to the present disclosure, the display device may further include: at least one protrusion, the at least one protrusion may be disposed between adjacent trenches, and the width of the protrusion disposed below the first driver chip may be smaller than the width of the protrusion disposed below the second driver chip.

[0161] In various embodiments of the display device according to the present disclosure, the display device may further include: at least one protrusion disposed between adjacent trenches, and in a plan view, the ratio of the area of ​​overlap between the trench and the first driver chip to the total area of ​​the first driver chip may be greater than the ratio of the area of ​​overlap between the trench and the second driver chip to the total area of ​​the second driver chip.

[0162] Another embodiment is a display device, comprising: a display panel including a device layer and an encapsulation layer on the device layer; a source substrate on the display panel; and a source substrate portion including at least one driver chip on the source substrate; and a plurality of heat dissipation portions on the at least one driver chip, the heat dissipation portions being elastic.

[0163] In a display device according to various embodiments of the present disclosure, the encapsulation layer may include a plurality of trenches configured to recess the surface of the encapsulation layer and protrusions between adjacent trenches, and the plurality of trenches and protrusions may overlap with a driver chip.

[0164] In the display device according to various embodiments of the present disclosure, the air gap may be provided in a plurality of grooves.

[0165] In the display device according to various embodiments of the present disclosure, the heat dissipation portion may overlap with the protrusion in a plan view.

[0166] In the display device according to various embodiments of the present disclosure, the width of the upper surface of the protrusion may be smaller than the width of the lower surface of the protrusion.

[0167] Embodiments of this disclosure have been described with reference to the accompanying drawings. Those skilled in the art will recognize that this disclosure may be implemented in other specific forms without departing from its technical concept or essential characteristics. The described embodiments are to be considered illustrative in all respects and not restrictive. Therefore, the scope of this disclosure is indicated by the appended claims rather than by the foregoing description. All variations falling within the meaning and equivalents of the claims are included within the scope of this disclosure.

[0168] Cross-reference of related applications

[0169] This application claims priority to Korean Patent Application No. 10-2025-0024362, filed on February 25, 2025, the entire contents of which are incorporated herein by reference for all purposes.

Claims

1. A display device, the display device comprising: The display panel includes a cover layer, a device layer on the cover layer, and an encapsulation layer on the device layer; The source substrate on the display panel; as well as At least one driver chip on the source substrate, The encapsulation layer includes at least one trench, which is configured to recess the surface of the encapsulation layer. The at least one trench overlaps with the at least one driver chip.

2. The display device according to claim 1, in, An air gap is provided in the at least one groove.

3. The display device according to claim 2, in, The air gap is surrounded by the source substrate and the at least one trench.

4. The display device according to claim 1, further comprising: At least one protrusion, The at least one protrusion is disposed adjacent to the at least one groove.

5. The display device according to claim 4, in, The width of the upper surface of the at least one protrusion is less than the width of the lower surface of the at least one protrusion.

6. The display device according to claim 4, further comprising: At least one heat dissipation part, The at least one heat dissipation unit is disposed on the at least one driver chip.

7. The display device according to claim 6, in, The at least one heat dissipation component is elastic.

8. The display device according to claim 6, in, In the plan view, the at least one heat dissipation part overlaps with the at least one protrusion.

9. The display device according to claim 1, in, The encapsulation layer comprises a metallic material.

10. The display device according to claim 1, in, The thermal conductivity of the encapsulation layer is higher than that of the cover layer.

11. The display device according to claim 1, in, The at least one driver chip includes a first driver chip and a second driver chip, and The width of the first driver chip is smaller than the width of the second driver chip.

12. The display device according to claim 11, in, The temperature of the first driver chip during operation is higher than that of the second driver chip during operation.

13. The display device according to claim 11, further comprising: At least one protrusion, Wherein, the at least one protrusion is disposed adjacent to the at least one groove, and The width of the protrusion located below the first driver chip is smaller than the width of the protrusion located below the second driver chip.

14. The display device according to claim 11, further comprising: At least one protrusion, Wherein, the at least one protrusion is disposed between adjacent grooves, and In the plan view, the ratio of the overlap area between the trench and the first driver chip to the total area of ​​the first driver chip is greater than the ratio of the overlap area between the trench and the second driver chip to the total area of ​​the second driver chip.

15. A display device, the display device comprising: The display panel includes a device layer and an encapsulation layer on the device layer; The source substrate on the display panel; as well as A source substrate portion, the source substrate portion including at least one driver chip on the source substrate; as well as Multiple heat sinks on the at least one driver chip, Each of the plurality of heat dissipation parts is elastic.

16. The display device according to claim 15, in, The encapsulation layer includes a plurality of trenches and protrusions between adjacent trenches, the trenches being configured to recess the surface of the encapsulation layer. The plurality of trenches and the protrusions overlap with the at least one driver chip.

17. The display device according to claim 16, further comprising: Air gaps are provided in the plurality of grooves.

18. The display device according to claim 17, in, Each of the plurality of heat dissipation sections overlaps with the protrusion in the plan view.

19. The display device according to claim 17, in, The width of the upper surface of the protrusion is smaller than the width of the lower surface of the protrusion.

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