A method for processing a micro-channel heat sink

Abstract

The application provides a micro-channel heat sink processing method, comprising the following steps: S1, forming a cooling liquid to form a cooling pipeline; wherein the cooling liquid is a liquid metal; S2, packaging the cooling pipeline to form a heat sink.

Description

Technical Field

[0001] This invention relates to the field of heat sink processing technology, and in particular to a processing method for a microchannel heat sink. Background Technology

[0002] As hybrid integrated circuits evolve towards higher power densities, the demand for heat dissipation is also increasing. Microfluidic technology is an active heat dissipation technology that uses fluid to carry away heat through tiny channels, offering the advantage of high power density and meeting the heat dissipation requirements of highly integrated circuits.

[0003] Conventional processing of microchannel heat sinks requires first fabricating the microchannels using methods such as laser etching, micro-pressing, and sacrificial slurry sintering, then filling them with coolant, and finally encapsulating them. This process is complex and presents challenges in fabricating embedded cavities. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a method for processing microchannel heat sinks, which addresses the shortcomings of the prior art.

[0005] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: a processing method for a microchannel heat sink, comprising: S1, forming a cooling liquid to form a cooling channel; wherein, the cooling liquid is liquid metal; S2, encapsulating the cooling channel to form a heat sink.

[0006] The beneficial effects of adopting the technical solution of this invention are that by designing a processing method that first shapes the coolant and then encapsulates it, the processing flow of the microchannel heat sink is simplified, while also enabling the processing of embedded cavities. The traditional outside-to-inside processing method is transformed into an inside-to-outside method, simplifying the process flow, reducing processing difficulty, and shortening the processing cycle.

[0007] Further, in step S1, the coolant is EGaIn, indium bismuth tin alloy, Wood's alloy, Galinstan alloy, mercury or NaK alloy.

[0008] The beneficial effect of adopting the above-mentioned further technical solution is that the coolant is a liquid metal, which has the characteristics of low melting point and high thermal conductivity. As a liquid metal, the coolant has a higher thermal conductivity than conventional coolants, resulting in a stronger heat conduction effect.

[0009] Furthermore, the coolant is EGaIn liquid metal.

[0010] The beneficial effect of adopting the above-mentioned further technical solution is that the coolant is EGaIn liquid metal, which has the characteristics of low melting point and high thermal conductivity. As a liquid metal, the coolant has higher thermal conductivity than conventional coolants, resulting in a stronger heat conduction effect.

[0011] Furthermore, in step S1, the coolant is shaped by a molding mechanism to form a cooling pipe of a preset shape.

[0012] The beneficial effects of adopting the above-mentioned further technical solution are that it simplifies the processing flow of microchannel heat sinks and enables the processing of embedded cavities. It transforms the traditional outside-to-inside processing method into an inside-to-outside method, simplifying the process flow, reducing processing difficulty, and shortening the processing cycle.

[0013] Furthermore, the molding mechanism is a coolant printer or an extrusion molding device.

[0014] The advantages of adopting the above-mentioned further technical solutions are that the cooling pipes can be processed by printing, which offers high precision; or by conventional processing methods such as extrusion molding, which reduces equipment costs. It also allows for the selection of the molding mechanism according to actual needs, improving applicability.

[0015] Furthermore, when the forming mechanism is a coolant printer, the coolant printer includes: a control system, a printhead, and a substrate. The printhead is movably mounted on the control system, and the substrate is located below the printhead. The temperature of the substrate is lower than the melting point of the coolant.

[0016] The beneficial effect of adopting the above-mentioned further technical solution is that, during printing, because the coolant has a low melting point, it can remain liquid inside the print head. The print head is moved by the control system and the coolant is extruded. After the coolant comes into contact with the substrate, it cools down and solidifies, forming a coolant channel of a specific shape.

[0017] Furthermore, the substrate material is a temperature control platform with different temperatures set according to the material of the coolant to be printed; when the forming mechanism is a coolant printer, liquid coolant is provided in the print head.

[0018] The beneficial effect of adopting the above-mentioned further technical solution is that the substrate can be set to different temperatures according to the material of the coolant to be printed, which facilitates the formation of coolant.

[0019] Furthermore, when the forming mechanism is a coolant printer, a heating system is installed in the print head; a protective gas and a water vapor monitoring device for monitoring water vapor in the printing environment and preventing water vapor condensation in low-temperature environments are provided near the print head.

[0020] The beneficial effect of adopting the above-mentioned further technical solution is that the printhead can be equipped with a heating system to help maintain the coolant in a liquid state. A protective gas is added near the printhead to prevent the coolant from oxidizing during printing.

[0021] Further, step S2 includes: S21, encapsulating the cooling pipes through an encapsulation mechanism; S22, connecting the encapsulated cooling pipes to a micro-pressure pump to form a microchannel heat sink.

[0022] The beneficial effect of adopting the above-mentioned further technical solution is that the encapsulated cooling pipe is connected to the micro-pressure pump to form a complete microchannel heat sink.

[0023] Further, in step S21, the cooling pipe is encapsulated by an encapsulation mechanism at a temperature below the melting point of the coolant; the encapsulation mechanism is a flexible encapsulation mechanism, and the material of the encapsulation mechanism is a low-temperature curing resin or an ultraviolet light curing resin; in step S22, the encapsulated cooling pipe has an inlet and an outlet, the inlet and the outlet are connected, and both the inlet and the outlet are connected to a micro-pressure pump.

[0024] The beneficial effects of adopting the above-mentioned further technical solution are that the encapsulation process is carried out at low temperature, thus keeping the cooling channels solid. The encapsulation mechanism is a flexible encapsulation mechanism, making the finished product flexible. Flexible encapsulation materials can be used to make flexible heat sinks, meeting the heat dissipation requirements of special heat sources such as curved surfaces. The encapsulated cooling channels are connected to a micro-pressure pump to form a complete microchannel heat sink. The heat sink is then mounted to the location requiring heat dissipation. Due to the high temperature of the heat-generating area, the cooling channels inside the heat sink will melt and return to a liquid state. Under the action of the micro-pressure pump, the coolant can form a reflux within the heat sink, carrying heat away from the heat-generating area.

[0025] The advantages of additional aspects of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of a coolant printer provided in an embodiment of the present invention.

[0028] Figure 2 This is a schematic diagram of the coolant printing process provided in an embodiment of the present invention.

[0029] Figure 3 The image shows the effect of coolant printing in an embodiment of the present invention.

[0030] Figure 4 This is a schematic diagram of the packaging process provided in an embodiment of the present invention.

[0031] Figure 5 This is a schematic diagram of a heat sink provided in an embodiment of the present invention.

[0032] The following are the symbols and their meanings: 1. Coolant; 2. Cooling pipe; 3. Heat sink; 4. Control system; 5. Printhead; 6. Substrate; 7. Heating system; 8. Packaging mechanism; 9. Micro-pressure pump. Detailed Implementation

[0033] The principles and features of the present invention are described below with reference to the accompanying drawings. The embodiments described are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0037] In the description of the embodiments of the present invention, it should be noted that if terms such as "upper", "lower", "horizontal", "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the invention is usually placed during use, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0038] In the description of the embodiments of the present invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.

[0039] like Figures 1 to 5 As shown, an embodiment of the present invention provides a method for processing a microchannel heat sink, including: S1, molding a coolant 1 to form a cooling channel 2; wherein the coolant 1 is liquid metal; S2, encapsulating the cooling channel 2 to form a heat sink 3.

[0040] The beneficial effects of adopting the technical solution of this invention are that by designing a processing method that first shapes the coolant and then encapsulates it, the processing flow of the microchannel heat sink is simplified, while also enabling the processing of embedded cavities. The traditional outside-to-inside processing method is transformed into an inside-to-outside method, simplifying the process flow, reducing processing difficulty, and shortening the processing cycle.

[0041] like Figures 1 to 5 As shown, further, in step S1, the coolant 1 is EGaIn, indium bismuth tin alloy, Wood's alloy, Galinstan alloy, mercury or NaK alloy.

[0042] The beneficial effect of adopting the above-mentioned further technical solution is that the coolant is a liquid metal, which has the characteristics of low melting point and high thermal conductivity. As a liquid metal, the coolant has a higher thermal conductivity than conventional coolants, resulting in a stronger heat conduction effect.

[0043] This invention is based on the melting point of the coolant, and is formed below the melting point and used above the melting point.

[0044] For example, the coolant can be, but is not limited to, EGaIn, and can also be other alloy compositions. EGaIn has a melting point of around -15°C, can be molded in ice water (below its melting point), and can be used at room temperature (above its melting point). The coolant only needs to have a melting point lower than the operating temperature. For example, indium bismuth tin alloys and Wood's alloys have melting points of about 60°C-70°C, can be molded at room temperature, and can then be used in high-temperature (e.g., 80°C) environments.

[0045] Furthermore, the coolant 1 is EGaIn liquid metal.

[0046] The beneficial effect of adopting the above-mentioned further technical solution is that the coolant is EGaIn liquid metal, which has the characteristics of low melting point and high thermal conductivity. As a liquid metal, the coolant has higher thermal conductivity than conventional coolants, resulting in a stronger heat conduction effect.

[0047] like Figures 1 to 5 As shown, further, in step S1, the coolant 1 is shaped by the molding mechanism to form a cooling pipe 2 of a preset shape.

[0048] The beneficial effects of adopting the above-mentioned further technical solution are that it simplifies the processing flow of microchannel heat sinks and enables the processing of embedded cavities. It transforms the traditional outside-to-inside processing method into an inside-to-outside method, simplifying the process flow, reducing processing difficulty, and shortening the processing cycle.

[0049] Among them, cooling pipe 2 can be an S-shaped structure.

[0050] like Figures 1 to 5 As shown, the molding mechanism is further described as a coolant printer or an extrusion molding device.

[0051] The advantages of adopting the above-mentioned further technical solutions are that the cooling pipes can be processed by printing, which offers high precision; or by conventional processing methods such as extrusion molding, which reduces equipment costs. It also allows for the selection of the molding mechanism according to actual needs, improving applicability.

[0052] like Figures 1 to 5 As shown, when the forming mechanism is a coolant printer, the coolant printer includes: a control system 4, a print head 5, and a substrate 6. The print head 5 is movably mounted on the control system 4, and the substrate 6 is located below the print head 5. The temperature of the substrate 6 is lower than the melting point of the coolant 1.

[0053] The beneficial effect of adopting the above-mentioned further technical solution is that, during printing, because the coolant has a low melting point, it can remain liquid inside the print head. The print head is moved by the control system and the coolant is extruded. After the coolant comes into contact with the substrate, it cools down and solidifies, forming a coolant channel of a specific shape.

[0054] The control system 4 may include a controller and multiple linear modules for realizing the horizontal movement and lifting of the print head 5. The linear modules and the print head are electrically connected to the controller.

[0055] like Figures 1 to 5 As shown, the substrate 6 is made of a temperature control platform with different temperatures set according to the material of the coolant to be printed; when the forming mechanism is a coolant printer, liquid coolant is provided in the print head 5.

[0056] The beneficial effect of adopting the above-mentioned further technical solution is that the substrate can be set to different temperatures according to the material of the coolant to be printed, which facilitates the formation of coolant.

[0057] The substrate does not react with the coolant. It serves as a temperature-controlled platform, with different temperatures set according to the coolant material to be printed. For example, the substrate temperature for EGaIn can be set to -20℃ to ensure EGaIn can be formed.

[0058] like Figures 1 to 5 As shown, when the forming mechanism is a coolant printer, a heating system 7 is installed in the print head 5; a protective gas and a water vapor monitoring device for monitoring water vapor in the printing environment and preventing water vapor condensation in low-temperature environments are provided near the print head 5.

[0059] The beneficial effect of adopting the above-mentioned further technical solution is that the printhead can be equipped with a heating system to help maintain the coolant in a liquid state. A protective gas is added near the printhead to prevent the coolant from oxidizing during printing.

[0060] like Figures 1 to 5 As shown, step S2 further includes: S21, encapsulating the cooling pipe 2 through the encapsulation mechanism 8; S22, connecting the encapsulated cooling pipe 2 to the micro-pressure pump 9 to form a microchannel heat sink.

[0061] The beneficial effect of adopting the above-mentioned further technical solution is that the encapsulated cooling pipe is connected to the micro-pressure pump to form a complete microchannel heat sink.

[0062] The cross-section of the encapsulation mechanism 8 can be square, rectangular, circular, rhomboid, triangular, elliptical, or trapezoidal, etc.

[0063] like Figures 1 to 5 As shown, further, in step S21, the cooling pipe 2 is encapsulated by the encapsulation mechanism 8 at a temperature below the melting point of the coolant; the encapsulation mechanism 8 is a flexible encapsulation mechanism, and the material of the encapsulation mechanism 8 is a low-temperature curing resin or an ultraviolet light curing resin; in step S22, the encapsulated cooling pipe 2 has an inlet and an outlet, the inlet and the outlet are connected, and both the inlet and the outlet are connected to the micro-pressure pump 9.

[0064] The beneficial effects of adopting the above-mentioned further technical solution are that the encapsulation process is carried out at low temperature, thus keeping the cooling channels solid. The encapsulation mechanism is a flexible encapsulation mechanism, making the finished product flexible. Flexible encapsulation materials can be used to make flexible heat sinks, meeting the heat dissipation requirements of special heat sources such as curved surfaces. The encapsulated cooling channels are connected to a micro-pressure pump to form a complete microchannel heat sink. The heat sink is then mounted to the location requiring heat dissipation. Due to the high temperature of the heat-generating area, the cooling channels inside the heat sink will melt and return to a liquid state. Under the action of the micro-pressure pump, the coolant can form a reflux within the heat sink, carrying heat away from the heat-generating area.

[0065] The encapsulated cooling pipe can be a single pipe, connected end-to-end by a micro-pressure pump 9. Alternatively, it can consist of multiple cooling pipes, each connected end-to-end by a micro-pressure pump 9.

[0066] This invention proposes a processing method that first shapes the coolant and then encapsulates it, simplifying the processing flow of microchannel heat sinks and enabling the processing of embedded cavities, resulting in a flexible finished product. The microchannel heat sink processing method provided by this invention represents a new approach to microchannel heat sink processing, aiming to simplify the process flow and meet the requirements for embedded cavity processing and flexible heat sinks.

[0067] The conventional process flow for microchannel heat sinks is: microchannel fabrication - coolant injection - encapsulation.

[0068] This invention provides a new process flow: coolant molding and packaging.

[0069] The coolant of this invention needs to have the characteristics of low melting point (generally below room temperature) and high thermal conductivity, such as EGaIn liquid metal.

[0070] This invention requires the use of a coolant printer, as shown in the schematic diagram. Figure 1 A coolant printer consists of a control system, a printhead, and a substrate. The substrate can be sand, ice water, or other media materials with a temperature lower than the coolant's melting point. During printing, because the coolant has a low melting point, it remains liquid within the printhead. The printhead is moved by the control system and extrudes the coolant. Upon contact with the substrate, the coolant cools and solidifies, forming coolant channels of a specific shape. Additionally, the printhead can be equipped with a heating system to help maintain the coolant's liquid state. Furthermore, a protective gas can be added near the printhead to prevent the coolant from oxidizing during printing.

[0071] Figure 1 In the process, the coolant in the printhead 5 is a liquid coolant, while the coolant on the substrate 6 is a solid coolant. Figure 4 In the middle, cooling pipe 2 is a cooling pipe formed by solid coolant.

[0072] The specific implementation steps of this invention are as follows.

[0073] 1) Load the coolant into the 3D printer (coolant printer) and print the cooling pipes as needed.

[0074] 2) The printed cooling channels are then encapsulated, for example, using materials such as low-temperature curing resin or UV-curing resin. The encapsulation process is carried out at low temperatures, thus keeping the cooling channels solid.

[0075] 3) Connect the encapsulated cooling pipes to the micro-pressure pump to form a complete microchannel heat sink.

[0076] 4) Usage: Attach the heatsink to the area requiring heat dissipation (heat-generating area). Due to the high temperature in the heat-generating area, the cooling channels inside the heatsink will melt and return to a liquid state. Under the action of the micro-pressure pump, the coolant can form a reflux within the heatsink, carrying heat away from the heat-generating area.

[0077] Beneficial effects 1) This invention transforms the traditional outside-in processing method into an inside-out process, which simplifies the process flow, reduces processing difficulty, and shortens the processing cycle.

[0078] 2) The process of the present invention is applicable to the processing of embedded microchannels, overcoming the limitations of some conventional processes.

[0079] 3) The coolant used in this invention can be liquid metal, which has a higher thermal conductivity and stronger heat conduction effect than conventional coolants.

[0080] 4) Optionally, flexible heat sinks can be made using flexible encapsulation materials to meet the heat dissipation requirements of special heat sources such as curved surfaces.

[0081] 5) Optionally, the cooling pipes can be processed by printing, which has high precision; or by conventional processing such as extrusion molding, which can reduce equipment costs.

[0082] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for processing a microchannel heat sink, characterized in that, include: S1. The coolant is molded to form a cooling pipe; wherein the coolant is liquid metal; S2. Encapsulate the cooling pipes to form a heat sink.

2. The processing method of a microchannel heat sink according to claim 1, characterized in that, In step S1, the coolant is EGaIn, indium bismuth tin alloy, Wood's alloy, Galinstan alloy, mercury or NaK alloy.

3. The processing method of a microchannel heat sink according to claim 2, characterized in that, The coolant is EGaIn liquid metal.

4. The processing method of a microchannel heat sink according to claim 1, characterized in that, In step S1, the coolant is shaped by a molding mechanism to form a cooling pipe of a preset shape.

5. The processing method of a microchannel heat sink according to claim 4, characterized in that, The forming mechanism is a coolant printer or an extrusion molding device.

6. The processing method of a microchannel heat sink according to claim 5, characterized in that, When the forming mechanism is a coolant printer, the coolant printer includes: a control system, a printhead, and a substrate. The printhead is movably mounted on the control system, and the substrate is located below the printhead. The temperature of the substrate is lower than the melting point of the coolant.

7. The method for processing a microchannel heat sink according to claim 6, characterized in that, The substrate material is a temperature control platform with different temperatures set according to the material of the coolant to be printed; when the forming mechanism is a coolant printer, liquid coolant is provided in the print head.

8. The method for processing a microchannel heat sink according to claim 6, characterized in that, When the forming mechanism is a coolant printer, a heating system is installed in the print head; a protective gas and a water vapor monitoring device for monitoring water vapor in the printing environment and preventing water vapor condensation in low-temperature environments are provided near the print head.

9. The processing method of a microchannel heat sink according to claim 1, characterized in that, Step S2 includes: S21, encapsulating the cooling pipes using an encapsulation mechanism; S22. Connect the encapsulated cooling pipe to the micro-pressure pump to form a micro-channel heat sink.

10. A method for processing a microchannel heat sink according to claim 9, characterized in that, In step S21, the cooling pipe is encapsulated by an encapsulation mechanism at a temperature below the melting point of the coolant. The encapsulation mechanism is a flexible encapsulation mechanism, and the material of the encapsulation mechanism is a low-temperature curing resin or an ultraviolet light curing resin. In step S22, the encapsulated cooling pipe has an inlet and an outlet, which are connected to each other and are both connected to a micro-pressure pump.

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