Display panel, display panel preparation method and display device

Abstract

Embodiments of the present application provide a display panel, a display panel preparation method and a display device. The display panel includes a display area and a non-display area adjacent to the display area. The display panel includes: a substrate; a first isolation structure located in the display area and arranged on one side of the substrate to enclose a plurality of isolated openings; a light emitting unit at least partially located in the isolated opening; a dam portion located in the non-display area and arranged on one side of the substrate; a second isolation structure located in the non-display area and arranged on a side of the dam portion away from the substrate; and a first encapsulation layer covering at least a surface of the second isolation structure away from the substrate. The second isolation structure is arranged on the dam portion in the non-display area to increase the blocking height and prevent the organic material from overflowing. The first encapsulation layer is arranged on the surface of the second isolation structure away from the substrate to improve the encapsulation effect of the non-display area, thereby improving the reliability and use performance of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] In traditional display panel manufacturing, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision, high development costs, and long development cycles. Fine metal maskless technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe relevant aspects of fine metal maskless technology and are provided for reference. Summary of the Invention

[0003] This application provides a display panel, a method for manufacturing the display panel, and a display device, aiming to improve the performance of the display panel.

[0004] An embodiment of this application provides a display panel, the display panel including a display area and a non-display area adjacent to the display area, the display panel including: a substrate; a first isolation structure located in the display area and disposed on one side of the substrate, forming a plurality of isolation openings; a light-emitting unit located at least partially within the isolation openings; a dam portion located in the non-display area and disposed on one side of the substrate; a second isolation structure located in the non-display area and disposed on the side of the dam portion opposite to the substrate; and a first encapsulation layer covering at least the surface of the second isolation structure opposite to the substrate.

[0005] According to any embodiment of one aspect of this application, it further includes a plurality of spaced-apart encapsulation units, each encapsulation unit being disposed corresponding to each of the light-emitting units and covering the surface of the light-emitting unit facing away from the substrate; preferably, the encapsulation unit extends along the sidewall of the first isolation structure to the surface of the first isolation structure facing away from the substrate; preferably, the material of the encapsulation unit includes inorganic materials.

[0006] According to any embodiment of one aspect of this application, the material of the first encapsulation layer includes an inorganic material; preferably, the material of the first encapsulation layer includes at least one of silicon nitride, silicon oxide, and silicon oxynitride; preferably, the material of the encapsulation unit is the same as the material of the first encapsulation layer; preferably, the encapsulation unit and the first encapsulation layer are disposed in the same layer, or the first encapsulation layer is disposed as a whole layer, with a portion of the first encapsulation layer located on the side of the encapsulation unit away from the substrate; preferably, the display panel further includes a first conductive layer located on one side of the substrate, the first conductive layer being at least partially disposed adjacent to the dam portion, and the first encapsulation layer extending from the surface of the second isolation structure away from the substrate to the first conductive layer.

[0007] According to any embodiment of this application, the film thickness of the packaging unit is different from the film thickness of the first packaging layer; preferably, the film thickness of the first packaging layer is greater than the film thickness of the packaging unit.

[0008] According to any embodiment of this application, the light-emitting unit includes at least two light-emitting units with different light-emitting colors, and the material of the first encapsulation layer is the same as the material of the encapsulation unit corresponding to one of the at least two light-emitting units with different light-emitting colors, and they are disposed in the same layer.

[0009] According to any embodiment of one aspect of this application, the display panel further includes a second encapsulation layer, the second encapsulation layer being located at least on the side of the encapsulation unit facing away from the substrate; preferably, the material of the second encapsulation layer includes an organic material; preferably, the display panel further includes a third encapsulation layer disposed on the side of the second encapsulation layer facing away from the substrate; preferably, the material of the third encapsulation layer includes an inorganic material; preferably, the material of the third encapsulation layer is the same as the material of the encapsulation unit; preferably, the second encapsulation layer is disposed on the side of the second isolation structure near the display area.

[0010] According to any embodiment of this application, the first isolation structure and the second isolation structure are disposed in the same layer, and the first isolation structure and the second isolation structure are made of the same material.

[0011] According to any embodiment of this application, the first isolation structure and the second isolation structure are provided insulated from each other along a direction parallel to the surface of the substrate; preferably, the orthographic projection of the second isolation structure on the substrate is at least partially disposed around the outer edge of the orthographic projection of the first isolation structure on the substrate; preferably, the second isolation structure is an open ring structure.

[0012] According to any embodiment of this application, along a direction away from the substrate, the first isolation structure includes a first sublayer, a second sublayer, and a third sublayer stacked together, wherein the orthographic projection of the second sublayer onto the substrate lies within the orthographic projection of the first sublayer onto the substrate; preferably, the orthographic projection of the first sublayer onto the substrate lies within the orthographic projection of the third sublayer onto the substrate; preferably, the material of the first isolation structure includes a conductive material; preferably, the light-emitting unit includes a first electrode layer, and the first electrode layer is connected to the first isolation structure; preferably, the material of the first sublayer includes molybdenum metal, the material of the second sublayer includes aluminum metal, and the material of the third sublayer includes titanium metal.

[0013] According to any embodiment of this application, along a direction away from the substrate, the second isolation structure includes a fourth sublayer, a fifth sublayer, and a sixth sublayer stacked together, wherein the orthographic projection of the fifth sublayer onto the substrate is located within the orthographic projection of the fourth sublayer onto the substrate; preferably, the orthographic projection of the fourth sublayer onto the substrate is located within the orthographic projection of the sixth sublayer onto the substrate; preferably, the fourth sublayer and the first sublayer are disposed in the same layer and made of the same material, the fifth sublayer and the second sublayer are disposed in the same layer and made of the same material, and the sixth sublayer and the third sublayer are disposed in the same layer and made of the same material.

[0014] According to any embodiment of one aspect of this application, the display panel further includes a planarization layer and a pixel defining layer sequentially disposed on one side of the substrate along a direction away from the substrate, the pixel defining layer enclosing a plurality of pixel openings, the pixel openings communicating with the corresponding isolation openings, and the light-emitting unit being at least partially located within each of the pixel openings; along a direction away from the substrate, the dam portion includes a first portion and a second portion stacked together, the first portion and the planarization layer being disposed in the same layer and of the same material, and the second portion and the pixel defining layer being disposed in the same layer and of the same material.

[0015] Another embodiment of this application provides a method for manufacturing a display panel, the display panel including a display area and a non-display area adjacent to the display area, the method for manufacturing the display panel including the following steps: providing a substrate; forming a dam portion on one side of the substrate in the non-display area; forming a first isolation structure and a second isolation structure, the first isolation structure being formed on one side of the substrate in the display area, the first isolation structure enclosing a plurality of isolation openings, the second isolation structure being formed on the side of the dam portion in the non-display area away from the substrate; forming a light-emitting unit, the light-emitting unit being at least partially formed within the isolation openings; forming a first encapsulation layer, the first encapsulation layer at least covering the surface of the second isolation structure away from the substrate.

[0016] According to any embodiment of another aspect of this application, between the step of forming a light-emitting unit, wherein the light-emitting unit is at least partially formed within the isolation opening and the step of forming a first encapsulation layer, wherein the first encapsulation layer at least covers the surface of the second isolation structure opposite to the substrate, the method further includes: forming an encapsulation unit, wherein the encapsulation unit is formed corresponding to each of the light-emitting units and covers the surface of the light-emitting unit opposite to the substrate; preferably, the encapsulation unit extends along the sidewall of the first isolation structure to the surface of the first isolation structure opposite to the substrate.

[0017] According to any embodiment of another aspect of this application, after the step of forming a first encapsulation layer, wherein the first encapsulation layer at least covers the surface of the second isolation structure opposite to the substrate, the method further includes: forming a second encapsulation layer at least on the side of the encapsulation unit opposite to the substrate; preferably, the material of the second encapsulation layer includes an organic material; preferably, after the step of forming a second encapsulation layer at least on the side of the encapsulation unit opposite to the substrate, the method further includes: forming a third encapsulation layer on the side of the second encapsulation layer opposite to the substrate; preferably, the material of the third encapsulation layer includes an inorganic material; preferably, the material of the third encapsulation layer is the same as the material of the encapsulation unit; preferably, the second encapsulation layer is formed on the side of the second isolation structure near the display area.

[0018] Another aspect of this application provides a display device, including: the display panel in any of the above embodiments.

[0019] The display panel provided in this application embodiment includes a substrate, a first isolation structure, a light-emitting unit, a dam portion, a second isolation structure, and a first encapsulation layer. By providing a second isolation structure on the dam portion in the non-display area, the barrier height is increased to prevent organic materials from overflowing. Furthermore, the first encapsulation layer covers the surface of the second isolation structure on the side away from the substrate to improve the encapsulation effect of the non-display area, thereby improving the reliability and performance of the display panel. Attached Figure Description

[0020] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar features.

[0021] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0022] Figure 2 One example Figure 1 Sectional view at point BB;

[0023] Figure 3 In another example Figure 1 Sectional view at point BB;

[0024] Figure 4 This is a flowchart of a display panel manufacturing method provided in an embodiment of this application;

[0025] Figures 5 to 10 This is a schematic diagram of the structure obtained during the manufacturing process of the display panel.

[0026] Explanation of reference numerals in the attached figures:

[0027] 100. Substrate;

[0028] 200, First isolation structure; 210, First sublayer; 220, Second sublayer; 230, Third sublayer;

[0029] 300, Light-emitting unit; 310, First electrode layer; 320, Light-emitting layer; 330, Second electrode layer;

[0030] 400. Dam section; 410. Part One; 420. Part Two;

[0031] 500. Second isolation structure; 510. Fourth sublayer; 520. Fifth sublayer; 530. Sixth sublayer;

[0032] 600, First encapsulation layer;

[0033] 700, Packaging unit; 800, Second packaging layer; 900, Third packaging layer;

[0034] C1, First electrode plate; C2, Second electrode plate; P, Pixel confinement layer; K1, Isolation opening; K2, Pixel opening; T, Planarization layer; M1, First conductive layer; M2, Second conductive layer; M3, Third conductive layer; M4, Fourth conductive layer; Y, Semiconductor; S, Source; D, Drain; G, Gate; AA, Display area; NA, Non-display area. Detailed Implementation

[0035] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0036] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0037] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the embodiments of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0038] To better understand this application, the following will be combined with... Figures 1 to 10 The display panel, display panel manufacturing method, and display device according to the embodiments of this application will be described in detail.

[0039] Please see Figures 1 to 2 This application provides a display panel, which includes a display area AA and a non-display area NA adjacent to the display area AA. The display panel includes: a substrate 100; a first isolation structure 200 located in the display area AA and disposed on one side of the substrate 100, forming a plurality of isolation openings K1; a light-emitting unit 300, at least partially located within the isolation openings K1; a dam portion 400 located in the non-display area NA and disposed on one side of the substrate 100; a second isolation structure 500 located in the non-display area NA and disposed on the side of the dam portion 400 away from the substrate 100; and a first encapsulation layer 600, which at least covers the surface of the second isolation structure 500 away from the substrate 100.

[0040] The display panel provided in this embodiment of the invention includes a substrate 100, a first isolation structure 200, a light-emitting unit 300, a dam portion 400, a second isolation structure 500, and a first encapsulation layer 600. By providing the second isolation structure 500 on the dam portion 400 of the non-display area NA, the barrier height is increased to prevent organic materials from overflowing. Furthermore, the first encapsulation layer 600 covers the surface of the second isolation structure 500 on the side facing away from the substrate 100, thereby improving the encapsulation effect of the non-display area NA and thus improving the reliability and performance of the display panel.

[0041] Please see Figure 3Optionally, the substrate 100 may include a substrate and an array substrate 100, and the array substrate 100 may include a driving circuit. For example, the array substrate 100 may include a second conductive layer M2, a third conductive layer M3, a fourth conductive layer M4, and a first conductive layer M1 disposed on one side of the substrate and stacked thereon. An insulating layer is disposed between adjacent conductive layers. Exemplarily, a pixel driving circuit disposed on the array substrate 100 includes a transistor and a storage capacitor. The transistor includes a semiconductor Y, a gate G, a source S, and a drain D. The storage capacitor includes a first electrode C1 and a second electrode C2. As an example, the gate G and the second electrode C2 may be located in the second conductive layer M2, the first electrode C1 may be located in the third conductive layer M3, and the source S and drain D may be located in the fourth conductive layer M4.

[0042] Optionally, along the direction away from the substrate 100, the light-emitting unit 300 includes a second electrode layer 330, a light-emitting layer 320, and a first electrode layer 310 stacked together.

[0043] Optionally, the first electrode layer 310 includes a plurality of first electrodes, and at least part of the isolation structure is made of a metallic material. The first electrodes and the isolation structure are electrically connected to each other, so that the plurality of first electrodes can be interconnected through the isolation structure to form a whole-surface electrode.

[0044] Optionally, the display panel further includes a second electrode layer 330 located on the side of the light-emitting functional layer facing the substrate 100. The second electrode layer 330 and the first electrode layer 310 interact to drive the light-emitting functional layer to emit light. One of the first electrode layer 310 and the second electrode layer 330 is an anode, and the other is a cathode. In this embodiment, the second electrode layer 330 is used as the anode and the first electrode layer 310 is used as the cathode for illustrative purposes.

[0045] Optionally, the light-emitting layer 320 includes one or more of the following: an electron injection layer, an electron transport layer, a light-emitting material layer, a hole blocking layer, an electron blocking layer, a hole transport layer, and a hole injection layer. The specific selection depends on the type of the light-emitting layer 320 and is not particularly limited. The electron injection layer, electron transport layer, and hole blocking layer may be disposed between the first electrode layer 310 and the light-emitting material layer. The electron blocking layer, hole transport layer, and hole injection layer may be disposed between the second electrode layer 330 and the light-emitting material layer.

[0046] The material of the first electrode layer 310 can be one of the following metals: silver (Ag), aluminum (Al), lithium (Li), magnesium (Mg), ytterbium (Yb), calcium (Ca), or indium (In). It can also be an alloy of the aforementioned metals, such as magnesium-silver alloy (Mg / Ag) or lithium-aluminum alloy (Li / Al). This embodiment does not limit the material in this regard.

[0047] The material of the second electrode layer 330 is generally a material with a high work function to improve hole injection efficiency. It can be gold (Au), platinum (Pt), titanium (Ti), silver (Ag), indium tin oxide (ITO), zinc tin oxide (IZO), or a transparent conductive polymer (such as polyaniline). For example, the second electrode layer 330 can be made of ITO-Ag-ITO composite material, without any special limitations.

[0048] Please see Figure 2 or Figure 3 In some optional embodiments, the display panel further includes a plurality of spaced-apart encapsulation units 700, each encapsulation unit 700 being disposed corresponding to each light-emitting unit 300 and covering the surface of the light-emitting unit 300 facing away from the substrate 100.

[0049] The encapsulation unit 700 covers the surface of the light-emitting unit 300 facing away from the substrate 100, that is, it is in direct contact with the surface of the light-emitting unit 300 facing away from the substrate 100. This can improve the problem of water and oxygen intruding into the light-emitting unit 300 from the encapsulation unit 700, realize independent encapsulation of each light-emitting unit 300, and further improve the encapsulation effect of the display panel.

[0050] Optionally, the encapsulation unit 700 extends along the sidewall of the first isolation structure 200 to the surface of the first isolation structure 200 facing away from the substrate 100. That is, the encapsulation unit 700 covers both the light-emitting unit 300 and the first isolation structure 200, which can improve the continuity of the encapsulation unit 700, thereby improving the sealing performance of the encapsulation unit 700 and improving the encapsulation effect of the display panel.

[0051] Optionally, the material of the encapsulation unit 700 may include inorganic materials. For example, the material of the encapsulation unit 700 may include at least one of silicon nitride, silicon oxide, and silicon oxynitride to ensure water and oxygen barrier effect.

[0052] Optionally, the material of the first encapsulation layer 600 may include inorganic materials to achieve insulation and water and oxygen barrier effects. Specifically, it may be formed using a CVD (Chemical Vapor Deposition) process.

[0053] Optionally, the material of the first encapsulation layer 600 includes at least one of silicon nitride, silicon oxide, and silicon oxynitride.

[0054] Optionally, the material of the packaging unit 700 is the same as that of the first packaging layer 600 to reduce production costs.

[0055] Optionally, the encapsulation unit 700 and the first encapsulation layer 600 are arranged in the same layer, that is, the encapsulation unit 700 and the first encapsulation layer 600 can be formed together with the encapsulation unit 700 corresponding to any light-emitting unit 300 of any light-emitting color using the same process.

[0056] Alternatively, the encapsulation unit 700 and the first encapsulation layer 600 can be set separately. That is, after the encapsulation unit 700 corresponding to each light-emitting unit 300 of each light-emitting color is prepared, a whole first encapsulation layer 600 is formed to improve the encapsulation effect.

[0057] Optionally, the display panel also includes a first conductive layer M1 located on one side of the substrate 100. The first conductive layer M1 is at least partially disposed adjacent to the dam portion 400. The first encapsulation layer 600 extends from the surface of the second isolation structure 500 away from the substrate 100 to the first conductive layer M1. The first encapsulation layer 600 is used to prevent the first conductive layer M1 from directly contacting the organic material, thereby reducing the risk of film peeling.

[0058] Optionally, a portion of the first conductive layer M1 can be used to form the dam section 400, increasing the height and structural stability of the dam section 400 and ensuring the blocking effect.

[0059] In some optional embodiments, the film thickness of the encapsulation unit 700 is different from that of the first encapsulation layer 600 to ensure the uniformity of the encapsulation unit 700 and the protective performance of the first encapsulation layer 600.

[0060] Optionally, the thickness of the first encapsulation layer 600 is greater than the thickness of the encapsulation unit 700 to provide better encapsulation protection.

[0061] In some optional embodiments, the light-emitting unit 300 includes at least two light-emitting units 300 with different light-emitting colors. The material of the first encapsulation layer 600 is the same as the material of the encapsulation unit 700 corresponding to one of the light-emitting units 300 with different light-emitting colors, and they are disposed in the same layer.

[0062] It should be noted that the first encapsulation layer 600 and the encapsulation unit 700 corresponding to any light-emitting unit 300 of any light-emitting color can be formed together using the same process. That is, the two can be made of the same material and set in the same layer to reduce the difficulty of manufacturing, simplify the production process and reduce production costs.

[0063] Optionally, the light-emitting unit 300 may include a red light-emitting unit 300, a green light-emitting unit 300, and a blue light-emitting unit 300. Since the encapsulation units 700 corresponding to the red light-emitting unit 300, the green light-emitting unit 300, and the blue light-emitting unit 300 are prepared separately, the first encapsulation layer 600 may be prepared together with the encapsulation units 700 corresponding to any one of the red light-emitting unit 300, the green light-emitting unit 300, and the blue light-emitting unit 300.

[0064] Please see Figure 2 or Figure 3 In some optional embodiments, the display panel further includes a second encapsulation layer 800, which is located at least on the side of the encapsulation unit 700 away from the substrate 100.

[0065] Optionally, the material of the second encapsulation layer 800 may include organic materials. The organic material may be made of resin or polymeric organic materials, specifically formed using IJP (Inkjet printing) technology.

[0066] Optionally, the display panel may also include a third encapsulation layer 900 disposed on the side of the second encapsulation layer 800 away from the substrate 100. The material of the third encapsulation layer 900 includes inorganic materials. Adding an inorganic encapsulation layer outside the organic encapsulation layer can further improve the encapsulation effect of the encapsulation layer. In this embodiment, the material of the third encapsulation layer 900 may be the same as or different from the material of the first encapsulation layer 600, and there is no special limitation.

[0067] Optionally, the first encapsulation layer 600 and the third encapsulation layer 900 are made of the same material, so that the first encapsulation layer 600 and the third encapsulation layer 900 can be manufactured using the same equipment, which simplifies the manufacturing process of the display panel.

[0068] Optionally, the second encapsulation layer 800 is disposed on the side of the second isolation structure 500 near the display area AA, and the second isolation structure 500 is used to block the second encapsulation layer 800 to prevent the second encapsulation layer 800 from overflowing.

[0069] In some optional embodiments, the first isolation structure 200 and the second isolation structure 500 are disposed in the same layer, and the first isolation structure 200 and the second isolation structure 500 are made of the same material.

[0070] It should be noted that the first isolation structure 200 and the second isolation structure 500 are arranged in the same layer. On the one hand, the film layers of the first isolation structure 200 and the second isolation structure 500 are located in the same layer. On the other hand, the first isolation structure 200 and the second isolation structure 500 can also be formed together using the same preparation process to simplify the preparation process and reduce production costs. Since they are formed together using the same preparation process, the first isolation structure 200 and the second isolation structure 500 are made of the same material, which further reduces costs.

[0071] Please see Figure 2 or Figure 3 In some optional embodiments, the first isolation structure 200 and the second isolation structure 500 are spaced apart and insulated along the direction parallel to the surface of the substrate 100, that is, there is a certain distance between the first isolation structure 200 and the second isolation structure 500 along the direction parallel to the surface of the substrate 100 to avoid mutual interference.

[0072] Optionally, the orthographic projection of the second isolation structure 500 on the substrate 100 is at least partially arranged around the outer edge of the orthographic projection of the first isolation structure 200 on the substrate 100. Depending on the actual structural design of the display panel, the orthographic projection of the second isolation structure 500 on the substrate 100 can be partially arranged around the outer edge of the orthographic projection of the first isolation structure 200 on the substrate 100, or it can be completely arranged around the outer edge of the orthographic projection of the first isolation structure 200 on the substrate 100, without any special limitation.

[0073] Optionally, the second isolation structure 500 is an open ring structure. The display panel includes a ring of the second isolation structure 500 surrounding the display area AA. For example, the second isolation structure 500 may have an opening in the lower frame of the corresponding display panel to avoid the traces, flexible circuit boards and other components of the lower frame.

[0074] Please see Figure 2 or Figure 3 In some optional embodiments, along the direction away from the substrate 100, the first isolation structure 200 includes a first sublayer 210, a second sublayer 220 and a third sublayer 230 stacked together, wherein the orthographic projection of the second sublayer 220 onto the substrate 100 is located within the orthographic projection of the first sublayer 210 onto the substrate 100, and the orthographic projection of the first sublayer 210 onto the substrate 100 is located within the orthographic projection of the third sublayer 230 onto the substrate 100.

[0075] The orthographic projection of the second sublayer 220 onto the substrate 100 lies within the orthographic projection of the first sublayer 210 onto the substrate 100, meaning that the size of the second sublayer 220 is less than or equal to the size of the first sublayer 210. Similarly, the orthographic projection of the first sublayer 210 onto the substrate 100 lies within the orthographic projection of the third sublayer 230 onto the substrate 100, meaning that the size of the first sublayer 210 is less than or equal to the size of the third sublayer 230, so as to facilitate the formation of the first electrode layer 310 and the light-emitting unit 300 with the desired pattern.

[0076] Optionally, the first sublayer 210 includes titanium metal material, the second sublayer 220 includes aluminum metal material, and the third sublayer 230 includes titanium metal material.

[0077] Optionally, the isolation structure may be made of conductive materials to facilitate signal transmission.

[0078] In some alternative embodiments, along the direction away from the substrate 100, the second isolation structure 500 includes a fourth sublayer 510, a fifth sublayer 520 and a sixth sublayer 530 stacked together, wherein the orthographic projection of the fifth sublayer 520 onto the substrate 100 is located within the orthographic projection of the fourth sublayer 510 onto the substrate 100, and the orthographic projection of the fourth sublayer 510 onto the substrate 100 is located within the orthographic projection of the sixth sublayer 530 onto the substrate 100.

[0079] The orthographic projection of the fifth sublayer 520 onto the substrate 100 lies within the orthographic projection of the fourth sublayer 510 onto the substrate 100, meaning that the size of the fifth sublayer 520 is less than or equal to the size of the fourth sublayer 510. Similarly, the orthographic projection of the fourth sublayer 510 onto the substrate 100 lies within the orthographic projection of the sixth sublayer 530 onto the substrate 100, meaning that the size of the fourth sublayer 510 is less than or equal to the size of the sixth sublayer 530.

[0080] Optionally, the fourth sublayer 510 and the first sublayer 210 are made of the same material, the fifth sublayer 520 and the second sublayer 220 are made of the same material, and the sixth sublayer 530 and the third sublayer 230 are made of the same material. Specifically, the fourth sublayer 510 and the first sublayer 210 can be prepared together using the same process and have the same material, the fifth sublayer 520 and the second sublayer 220 can be prepared together using the same process and have the same material, and the sixth sublayer 530 and the third sublayer 230 can be prepared together using the same process and have the same material.

[0081] Please see Figure 2 or Figure 3In some optional embodiments, the display panel further includes a planarization layer T and a pixel defining layer P disposed sequentially on one side of the substrate 100 along a direction away from the substrate 100. The pixel defining layer P encloses to form a plurality of pixel openings K2, and the pixel openings K2 are connected to the corresponding isolation openings K1. The light-emitting unit 300 is at least partially located in each pixel opening K2.

[0082] In this embodiment, a light-emitting unit 300 can be provided inside the pixel opening K2 to realize the light-emitting display of the display panel.

[0083] Optionally, multiple pixel openings K2 are spaced apart, and each pixel opening K2 is provided with a light-emitting unit 300.

[0084] Optionally, along the direction away from the substrate 100, the dam portion 400 includes a first portion 410 and a second portion 420 stacked together. The first portion 410 is disposed in the same layer and with the same material as the planarization layer T, and the second portion 420 is disposed in the same layer and with the same material as the pixel defining layer P. That is, the first portion 410 and the planarization layer T can be fabricated using the same process and the same material, and the second portion 420 and the pixel defining layer P can be fabricated using the same process and the same material to reduce costs.

[0085] Please see Figure 4 This invention also provides a method for manufacturing a display panel. The display panel includes a display area AA and a non-display area NA adjacent to the display area AA. The method for manufacturing the display panel includes the following steps:

[0086] S110: Provides substrate 100, such as Figure 5 As shown;

[0087] S120: A dam portion 400 is formed on one side of the substrate 100 in the non-display area NA, such as Figure 6 As shown;

[0088] S130: A first isolation structure 200 and a second isolation structure 500 are formed. The first isolation structure 200 is formed on one side of the substrate 100 in the display area AA, and the first isolation structure 200 encloses a plurality of isolation openings K1. The second isolation structure 500 is formed on the side of the dam portion 400 in the non-display area NA away from the substrate 100. Figure 7 As shown;

[0089] S140: Forming a light-emitting unit 300, the light-emitting unit 300 being at least partially formed within the isolation opening K1, such as Figure 8 As shown;

[0090] S150: Form a first encapsulation layer 600, the first encapsulation layer 600 at least covering the surface of the second isolation structure 500 opposite to the substrate 100, such as Figure 9 As shown.

[0091] The display panel manufacturing method provided in this embodiment of the invention forms a second isolation structure 500 on the side of the dam portion 400 of the non-display area NA away from the substrate 100 to increase the barrier height and prevent organic materials from overflowing. Furthermore, a first encapsulation layer 600 is covered on the surface of the second isolation structure 500 on the side away from the substrate 100 to improve the encapsulation effect of the non-display area NA, thereby improving the reliability and performance of the display panel.

[0092] In step S110, the substrate 100 can be formed through processes such as coating, curing, and film formation. The substrate 100 can be a rigid substrate, such as a glass substrate; or it can be a flexible substrate, made of materials such as polyimide, polystyrene, polyethylene terephthalate, parylene, polyethersulfone, or polyethylene naphthalate. The substrate 100 is mainly used to support devices disposed on it.

[0093] In step S120, the dam section 400 may include at least one of an inorganic layer, a metallic layer, or an organic layer.

[0094] In step S130, the first isolation structure 200 and the second isolation structure 500 can also be formed together using the same manufacturing process to simplify the manufacturing process and reduce production costs. Since they are formed together using the same manufacturing process, the first isolation structure 200 and the second isolation structure 500 are made of the same material, which further reduces costs.

[0095] In step S140, along the direction away from the substrate 100, the light-emitting unit 300 includes a second electrode layer 330, a light-emitting layer 320 and a first electrode layer 310 stacked together.

[0096] In step S150, the material of the first encapsulation layer 600 includes inorganic materials to achieve insulation and water and oxygen barrier effects. Specifically, it can be formed using CVD (Chemical Vapor Deposition) process.

[0097] Please see Figure 10 In some optional embodiments, between the steps of forming the light-emitting unit 300, which is at least partially formed in the isolation opening K1, and forming the first encapsulation layer 600, which at least covers the surface of the second isolation structure 500 away from the substrate 100, the method further includes: forming an encapsulation unit 700, which is formed corresponding to each light-emitting unit 300 and covers the surface of the light-emitting unit 300 away from the substrate 100.

[0098] In this embodiment, the first encapsulation layer 600 and the encapsulation unit 700 are prepared separately to avoid mutual interference and to facilitate the separate control of the thickness of the first encapsulation layer 600 and the encapsulation unit 700. Specifically, the first encapsulation layer 600 can be prepared after the encapsulation unit 700 is prepared to ensure the encapsulation effect of the light-emitting unit 300.

[0099] Optionally, the encapsulation unit 700 extends along the sidewall of the first isolation structure 200 to the surface of the first isolation structure 200 facing away from the substrate 100. That is, the encapsulation unit 700 simultaneously covers the light-emitting unit 300 and the first isolation structure 200, which can improve the continuity of the encapsulation unit 700, thereby improving the sealing performance of the encapsulation unit 700 and improving the encapsulation effect of the display panel.

[0100] In some alternative embodiments, after forming the first encapsulation layer 600, which at least covers the surface of the second isolation structure 500 away from the substrate 100, the method further includes forming a second encapsulation layer 800 at least on the side of the encapsulation unit 700 away from the substrate 100.

[0101] Optionally, the material of the second encapsulation layer 800 may include organic materials. The organic material may be made of resin or polymeric organic materials, specifically formed using IJP (Inkjet printing) technology.

[0102] Optionally, after forming the second encapsulation layer 800 on at least the side of the encapsulation unit 700 away from the substrate 100, the method further includes forming a third encapsulation layer 900 on the side of the second encapsulation layer 800 away from the substrate 100.

[0103] The material of the third encapsulation layer 900 includes inorganic materials. Adding an inorganic encapsulation layer outside the organic encapsulation layer can further improve the encapsulation effect of the encapsulation layer. In this embodiment, the material of the third encapsulation layer 900 can be the same as or different from the material of the first encapsulation layer 600, and there is no special limitation.

[0104] Optionally, the first encapsulation layer 600 and the third encapsulation layer 900 are made of the same material, so that the first encapsulation layer 600 and the third encapsulation layer 900 can be manufactured using the same equipment, which simplifies the manufacturing process of the display panel.

[0105] Optionally, the second encapsulation layer 800 is disposed on the side of the second isolation structure 500 near the display area AA, and the second isolation structure 500 is used to block the second encapsulation layer 800 to prevent the second encapsulation layer 800 from overflowing.

[0106] Another embodiment of this application provides a display device including the display panel of any of the above embodiments.

[0107] Since the display device provided in the embodiments of this application includes the display panel of any of the above embodiments, the display device provided in the second aspect of this application has the beneficial effects of the display panel of any of the first aspects of the application, which will not be repeated here.

[0108] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0109] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area adjacent to the display area. The display panel includes: substrate; A first isolation structure is located in the display area and disposed on one side of the substrate, forming a plurality of isolation openings; The light-emitting unit is at least partially located within the isolation opening; The dam section is located in the non-display area and is disposed on one side of the substrate; The second isolation structure is located in the non-display area and is disposed on the side of the dam portion away from the substrate; The first encapsulation layer covers at least the surface of the second isolation structure opposite to the substrate.

2. The display panel according to claim 1, characterized in that, It also includes multiple spaced-apart encapsulation units, each encapsulation unit being disposed corresponding to each of the light-emitting units and covering the surface of the light-emitting unit facing away from the substrate; Preferably, the packaging unit extends along the sidewall of the first isolation structure to the surface of the first isolation structure opposite to the substrate; Preferably, the material of the packaging unit includes inorganic materials.

3. The display panel according to claim 2, characterized in that, The material of the first encapsulation layer includes inorganic materials; Preferably, the material of the first encapsulation layer includes at least one of silicon nitride, silicon oxide, and silicon oxynitride; Preferably, the material of the packaging unit is the same as the material of the first packaging layer; Preferably, the packaging unit and the first packaging layer are disposed on the same layer, or the first packaging layer is disposed as a whole, with a portion of the first packaging layer located on the side of the packaging unit away from the substrate; Preferably, the display panel further includes a first conductive layer located on one side of the substrate, the first conductive layer being at least partially adjacent to the dam portion, and the first encapsulation layer extending from the surface of the second isolation structure away from the substrate to the first conductive layer.

4. The display panel according to claim 2, characterized in that, The thickness of the film layer of the encapsulation unit is different from the thickness of the film layer of the first encapsulation layer; Preferably, the thickness of the first encapsulation layer is greater than the thickness of the encapsulation unit.

5. The display panel according to claim 2, characterized in that, The light-emitting unit includes at least two light-emitting units with different light-emitting colors. The material of the first encapsulation layer is the same as the material of the encapsulation unit corresponding to one of the light-emitting units with different light-emitting colors, and they are disposed in the same layer.

6. The display panel according to claim 2, characterized in that, The display panel further includes a second encapsulation layer, which is located at least on the side of the encapsulation unit away from the substrate. Preferably, the material of the second encapsulation layer includes organic materials; Preferably, the display panel further includes a third encapsulation layer disposed on the side of the second encapsulation layer opposite to the substrate; Preferably, the material of the third encapsulation layer includes inorganic materials; Preferably, the material of the third encapsulation layer is the same as the material of the encapsulation unit; Preferably, the second encapsulation layer is disposed on the side of the second isolation structure near the display area.

7. The display panel according to claim 1, characterized in that, The first isolation structure and the second isolation structure are disposed in the same layer, and the first isolation structure and the second isolation structure are made of the same material.

8. The display panel according to claim 1, characterized in that, Along a direction parallel to the plane where the substrate is located, the first isolation structure and the second isolation structure are spaced apart and insulated from each other; Preferably, the orthographic projection of the second isolation structure on the substrate is at least partially disposed around the outer edge of the orthographic projection of the first isolation structure on the substrate; Preferably, the second isolation structure is an open ring structure.

9. The display panel according to claim 1, characterized in that, Along a direction away from the substrate, the first isolation structure includes a first sublayer, a second sublayer, and a third sublayer stacked together, wherein the orthographic projection of the second sublayer onto the substrate is located within the orthographic projection of the first sublayer onto the substrate; Preferably, the orthographic projection of the first sublayer onto the substrate lies within the orthographic projection of the third sublayer onto the substrate; Preferably, the material of the first isolation structure includes a conductive material; Preferably, the light-emitting unit includes a first electrode layer, and the first electrode layer is connected to the first isolation structure; Preferably, the material of the first sublayer includes molybdenum metal, the material of the second sublayer includes aluminum metal, and the material of the third sublayer includes titanium metal.

10. The display panel according to claim 9, characterized in that, Along a direction away from the substrate, the second isolation structure includes a fourth sublayer, a fifth sublayer, and a sixth sublayer stacked together, wherein the orthographic projection of the fifth sublayer onto the substrate is located within the orthographic projection of the fourth sublayer onto the substrate; Preferably, the orthographic projection of the fourth sublayer onto the substrate is located within the orthographic projection of the sixth sublayer onto the substrate; Preferably, the fourth sub-layer and the first sub-layer are made of the same material, the fifth sub-layer and the second sub-layer are made of the same material, and the sixth sub-layer and the third sub-layer are made of the same material.

11. The display panel according to claim 1, characterized in that, The display panel further includes a planarization layer and a pixel defining layer sequentially disposed on one side of the substrate along a direction away from the substrate. The pixel defining layer encloses and forms a plurality of pixel openings. The pixel openings are connected to the corresponding isolation openings. The light-emitting unit is at least partially located within each of the pixel openings. Along a direction away from the substrate, the dam portion includes a first portion and a second portion stacked together, wherein the first portion and the planarization layer are disposed in the same layer and with the same material, and the second portion and the pixel defining layer are disposed in the same layer and with the same material.

12. A method for manufacturing a display panel, characterized in that, The display panel includes a display area and a non-display area adjacent to the display area. The method for manufacturing the display panel includes the following steps: Provide substrate; A dam portion is formed on one side of the substrate in the non-display area; A first isolation structure and a second isolation structure are formed. The first isolation structure is formed on one side of the substrate in the display area and surrounds a plurality of isolation openings. The second isolation structure is formed on the side of the dam portion in the non-display area away from the substrate. A light-emitting unit is formed, wherein the light-emitting unit is at least partially formed within the isolation opening; A first encapsulation layer is formed, which at least covers the surface of the second isolation structure opposite to the substrate.

13. The method for manufacturing a display panel according to claim 12, characterized in that, Between the step of forming a light-emitting unit, wherein the light-emitting unit is at least partially formed within the isolation opening, and the step of forming a first encapsulation layer, wherein the first encapsulation layer at least covers the surface of the second isolation structure opposite to the substrate, the method further includes: An encapsulation unit is formed, which is formed corresponding to each of the light-emitting units and covers the surface of the light-emitting unit facing away from the substrate; Preferably, the packaging unit extends along the sidewall of the first isolation structure to the surface of the first isolation structure opposite to the substrate.

14. The method for manufacturing a display panel according to claim 13, characterized in that, After the step of forming the first encapsulation layer, wherein the first encapsulation layer at least covers the surface of the second isolation structure opposite to the substrate, the method further includes: A second encapsulation layer is formed at least on the side of the encapsulation unit opposite to the substrate; Preferably, the material of the second encapsulation layer includes organic materials; Preferably, after the step of forming a second encapsulation layer at least on the side of the encapsulation unit opposite to the substrate, the method further includes: A third encapsulation layer is formed on the side of the second encapsulation layer opposite to the substrate; Preferably, the material of the third encapsulation layer includes inorganic materials; Preferably, the material of the third encapsulation layer is the same as the material of the encapsulation unit; Preferably, the second encapsulation layer is formed on the side of the second isolation structure near the display area.

15. A display device, characterized in that, include: The display panel according to any one of claims 1 to 14.

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