Electronic device

Abstract

An electronic device is provided that includes a display panel having light-emitting pixels, a first protective layer on a rear surface of the display panel, and a first adhesive layer between the display panel and the first protective layer, where the first adhesive layer includes a non-conductive film (NCF).

Description

Technical Field

[0001] This disclosure relates to electronic devices. Background Technology

[0002] The electronic device can be activated by an electrical signal and may include a display device for displaying images. The display device may include light-emitting diodes (LEDs), which are capable of producing deep and vibrant colors and providing a wide viewing angle.

[0003] In some cases, a display device included in an electronic device may include curved areas at predetermined angles for each edge and corner. Display devices including such curved areas can enhance user convenience and provide a wide viewing angle. Summary of the Invention

[0004] Embodiments may provide electronic devices capable of addressing buckling that may occur in curved areas of a display device.

[0005] An electronic device according to an embodiment includes: a display panel including light-emitting pixels; a first protective layer located on a rear surface of the display panel; and a first adhesive layer located between the display panel and the first protective layer, wherein the first adhesive layer includes a non-conductive film (NCF).

[0006] The modulus of the first adhesive layer can be 20 MPa or greater.

[0007] The adhesive strength of the first adhesive layer can be 2800 gf / in or greater.

[0008] The first protective layer may consist of metal or glass.

[0009] The first protective layer is in direct contact with the first adhesive layer.

[0010] The electronic device may also include a second protective layer located on the front surface of the display panel opposite the rear surface.

[0011] The electronic device may also include a second adhesive layer located between the display panel and the second protective layer.

[0012] The adhesive strength of the first adhesive layer can be greater than that of the second adhesive layer.

[0013] The display panel may include a planar area and a curved area that bends at the corners of the display panel, and the bending angle of the display panel in the curved area is in the range of 45° to 85°.

[0014] Non-conductive films may include epoxy resin, polyacrylate, or urethane.

[0015] The electronic device may also include a support plate located on the rear surface of the first protective layer.

[0016] An electronic device according to an embodiment includes: a display panel including light-emitting pixels, a first protective layer located on a rear surface of the display panel, a support plate located on the rear surface of the first protective layer, and three or more adhesive layers, wherein a third adhesive layer of the three or more adhesive layers is located between the first protective layer and the support plate, and the third adhesive layer includes a non-conductive film (NCF).

[0017] The modulus of the third adhesive layer can be 20 MPa or greater.

[0018] The adhesive strength of the third adhesive layer can be 2800 gf / in or greater.

[0019] The first protective layer is in direct contact with the third adhesive layer.

[0020] The electronic device may also include a second protective layer located on the front surface of the display panel opposite the rear surface.

[0021] The electronic device may also include a second adhesive layer located between the display panel and the second protective layer.

[0022] The adhesive strength of the third adhesive layer can be greater than that of the second adhesive layer.

[0023] The display panel may include a planar area and a curved area that bends at the corners of the display panel, and the bending angle of the display panel in the curved area may be in the range of 45° to 85°.

[0024] Non-conductive films may include epoxy resins or polyacrylates.

[0025] The electronic device may also include a first adhesive layer located between the display panel and the first protective layer.

[0026] The first adhesive layer may include a pressure-sensitive adhesive.

[0027] According to the embodiments, buckling that may occur at the corners of the electronic device can be prevented.

[0028] Furthermore, according to the embodiments, there are advantageous effects that can be identified throughout the specification. Attached Figure Description

[0029] Figure 1 This is a perspective view showing an electronic device according to an embodiment.

[0030] Figure 2 This is an exploded perspective view showing a portion of an electronic device according to an embodiment.

[0031] Figure 3This is a view illustrating the stacked structure of a display device included in an electronic device according to an embodiment.

[0032] Figure 4 This is a diagram showing the first to third layers of the first protective layer.

[0033] Figure 5 It is along Figure 1 A cross-sectional view taken from line IV-IV'.

[0034] Figure 6 and Figure 7 It is a view used to explain the refraction and distortion of light based on surface waviness.

[0035] Figure 8 It is the equivalent circuit diagram that includes the circuitry of any pixel in the display panel.

[0036] Figure 9 It is a cross-sectional view showing a portion of the display panel provided in an electronic device.

[0037] Figure 10 This is a view illustrating the stacked structure of a display device included in an electronic device according to an embodiment.

[0038] Figure 11 This shows simulation data based on the interfacial pressure difference of the adhesive layer materials.

[0039] Figure 12 This is a block diagram of an electronic device according to an embodiment. Detailed Implementation

[0040] Various embodiments of this disclosure will be described in detail below with reference to the accompanying drawings, enabling those skilled in the art to readily implement them. This disclosure may be implemented in a variety of different forms and is not limited to the embodiments described herein.

[0041] For clarity of this disclosure, parts irrelevant to the description have been omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.

[0042] Terms such as "first," "second," etc., can be used to describe various components, but these components should not be limited by these terms. As used herein, terminology distinguishes one component from others without limiting those components. For example, a first component may be referred to as a second component without departing from the scope of this disclosure, and similarly, a second component may be referred to as a first component. Unless otherwise stated, singular terms may include plural forms.

[0043] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, “a,” “an,” “the,” and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural unless the context clearly indicates otherwise. For example, “element” has the same meaning as “at least one element” unless the context clearly indicates otherwise. “At least one” should not be construed as limited to “a” or “an.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0044] It should also be understood that the terms “comprising” and / or “including” or “containing” and / or “comprises”, when used in this specification, specify the presence of the said feature, area, integral, step, operation, element and / or component, but do not exclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements or components.

[0045] As used herein, the terms “about” or “approximately” include the value and include a suitable range of deviations from the particular value as determined by those skilled in the art considering the measurements discussed and the errors associated with the measurement of the particular quantity. For example, the term “about” can mean within one or more standard deviations of the value or within ±30%, ±20%, ±10%, ±5%.

[0046] As used herein, the term "substantially" means approximately or actually. The term "substantially equal" means approximately or actually equal. The term "substantially identical" means approximately or actually identical. The term "substantially consistent" means approximately or actually consistent. The term "substantially perpendicular" means approximately or actually perpendicular.

[0047] For ease of explanation, the dimensions and thicknesses of each component shown in the accompanying drawings are arbitrarily illustrated, and therefore this disclosure is not necessarily limited to what is shown. Thicknesses are magnified to clearly represent the various layers and regions in the drawings. Moreover, the thicknesses of some layers and regions are exaggerated in the drawings for ease of explanation.

[0048] When a part, such as a layer, membrane, region, or plate, is described as being "on" or "above" another part, this includes not only the case where it is "directly" "on" another part, but also the case where there is another part between them. Conversely, the description of a part being "directly" "on" another part implies that there are no other parts between them. Being "on" or "above" a reference part means being above or below the reference part, and does not necessarily mean being "on" or "above" a part in the direction opposite to gravity.

[0049] Throughout the specification, a partial description of a component "including" implies that other components may be further included, rather than excluding other components, unless otherwise stated.

[0050] Throughout the instruction manual, "in a plan view" refers to the view of the target portion from above, and "in a cross-section" refers to the view of the cross-section of the vertically cut target portion from the side.

[0051] In the following text, reference will be made to Figure 1 An electronic device according to an embodiment is described. Figure 1 This is a perspective view showing an electronic device according to an embodiment.

[0052] Electronic device 10 can be a device that uses electricity to perform various tasks. Electronic device 10 can have the function of transmitting, storing, and calculating information by processing or converting electrical signals. Electronic device 10 including a display panel can perform the function of providing visual information. Electronic device 10 including a display panel can include smartphones, cameras, tablet computers, laptop computers, monitors, televisions, smartwatches, e-book readers, PDAs (personal digital assistants), PMPs (portable multimedia players), game consoles, and car navigation systems.

[0053] The electronic device 10 may have a substantially rectangular shape in a plan view. The electronic device 10 may include two short sides extending in a first direction D1 and two long sides extending in a second direction D2 intersecting the first direction D1. The corner CA where the long and short sides meet may have a curved shape in the plan view.

[0054] The long and short sides of the electronic device 10 can be bent along a third direction D3, which intersects the first direction D1 and the second direction D2, respectively. In some aspects, the corner CA of the electronic device 10 can be bent along the third direction D3. The corner CA can be disposed between a curved surface region BA disposed along the long side and a curved surface region BA disposed along the short side. The electronic device 10 according to an embodiment may include four corner CAs. The curved surface region BA may include a long side, a short side, and corner CAs bent along the third direction D3. The curved surface region BA may surround a planar region PA, which is a flat surface of the electronic device 10.

[0055] Electronic device 10 can display an image in a planar region PA facing a third direction D3. In some aspects, electronic device 10 can display an image in a curved region BA facing the normal direction of the curved surface. The normal direction of the curved surface can be a direction perpendicular to the tangent of the curve. The image can include both moving images and still images.

[0056] Electronic device 10 may include display device 11 and housing EDC. Housing EDC may include a material with relatively high rigidity. For example, housing EDC may include glass, plastic, or metal, or may include a frame composed of a combination of these. Housing EDC may absorb impacts applied from the outside or prevent foreign objects / moisture from penetrating from the outside to protect the display device 11 housed within housing EDC.

[0057] In the following text, reference will be made to Figures 2 to 3 Describe the display device in more detail. Figure 2 This is an exploded perspective view showing a portion of an electronic device according to an embodiment, and Figure 3 This is a view illustrating the stacked structure of a display device included in an electronic device according to an embodiment. Descriptions of components identical to those described above will be omitted.

[0058] The electronic device according to the embodiment may include a display device 11.

[0059] The display device 11 may include a display panel 20, a first protective layer 30, a first adhesive layer 40, a second protective layer 50, a second adhesive layer 60, a support plate 70, and a third adhesive layer 80. The display device 11 may have the support plate 70, third adhesive layer 80, first protective layer 30, first adhesive layer 40, display panel 20, second adhesive layer 60, and second protective layer 50 stacked sequentially along a third direction D3. If desired, the display device 11 may further include other layers besides these.

[0060] In the following text, the front surface of each layer of the display device 11 may mean the upper surface and the rear surface may mean the lower surface. The upper and lower surfaces may be opposite each other.

[0061] The display panel 20 may include a plurality of light-emitting pixels PX. The display panel 20 may be a device for visually displaying information on a screen. The light-emitting pixels PX may include light-emitting elements capable of emitting light. The light-emitting pixels PX may include red pixels, green pixels, and blue pixels. Red pixels may emit red light, green pixels may emit green light, and blue pixels may emit blue light. However, embodiments of this disclosure are not limited thereto, and the light-emitting pixels PX may include pixels that emit white light. In some aspects, various colors may be emitted to achieve the display image.

[0062] Despite Figure 3Although not shown, the display device 11 may include a flexible printed circuit board (FPCB) extending from one end of the display panel 20 and attached to one end of a surface of the support plate 70. In other words, the FPCB is a flexible circuit board that can be attached to the front surface of the display panel 20 and the rear surface of the display device 11. Specifically, the FPCB can be attached to the front surface of the display panel 20 and the rear surface of the support plate 70.

[0063] Reference Figure 9 The specific structure of the display panel 20 is described in detail.

[0064] The first protective layer 30 may be located on the rear surface of the display panel 20. The first protective layer 30 may serve as a cushioning pad to absorb external impacts from the display device 11 to prevent damage to the rear surface of the display panel 20. In some aspects, the first protective layer 30 may have an applied dark color (e.g., black) to aid in background display when the screen is off.

[0065] The first protective layer 30 may include a polymer component. For example, the first protective layer 30 may include polyethylene terephthalate (PET) or polyimide (PI). Furthermore, the first protective layer 30 may include a metal. For example, the first protective layer 30 may include pure titanium (pure Ti), titanium alloy (Ti alloy), stainless steel, aluminum alloy (Al alloy), copper (Cu), nickel alloy (Ni alloy), etc. Additionally, the first protective layer 30 may include a composite metal. The composite metal may be a monolithic or single composite material in which multiple metals are stacked. Composite metals can be manufactured by various methods, such as welding, stamping, casting, extrusion, or laser cladding of multiple metals. For example, the composite metal may be Ni-Cu-Ni or phosphor bronze-Cu-phosphor bronze. Furthermore, the first protective layer 30 may include glass. By including a first protective layer 30 of metal or glass, the overall modulus of the display device 11 included in the electronic device according to the embodiment can be improved, which can be advantageous in preventing buckling that may occur at the corners of the display panel 20.

[0066] The first adhesive layer 40 may be located between the display panel 20 and the first protective layer 30. The first adhesive layer 40 may bond the display panel 20 and the first protective layer 30. The first protective layer 30 may be in direct contact with the first adhesive layer 40.

[0067] The first adhesive layer 40 may include a non-conductive film (NCF). The non-conductive film may be an adhesive film with an added underfill function. The non-conductive film can act as an underfill at the interface where two layers contact each other. This redistributes and mitigates stress and deformation caused by the difference in thermal expansion coefficients between the two layers. The non-conductive film is a non-conductive film that blocks current flow. The first adhesive layer 40 including the non-conductive film can minimize electrical interference to the display panel 20. In some aspects, because the non-conductive film has excellent thermal stability, it can maintain its insulating properties even at high temperatures. In some aspects, because the non-conductive film is thin and has high mechanical strength, it can protect electronic components from external impacts or mechanical damage.

[0068] Non-conductive films may comprise a matrix polymer and a curing agent dispersed within the matrix polymer. The non-conductive film can exhibit adhesiveness through a cross-linking reaction between the matrix polymer and the curing agent initiated via various curing mechanisms, such as heating, light exposure, or humidity exposure. Specifically, thermosetting polymers undergo cross-linking reactions upon heating, photocurable polymers undergo cross-linking reactions induced by ultraviolet light exposure, and thermoplastic polymers achieve thermomelt bonding upon heating. The matrix polymer can be, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, naphthalene type epoxy resin, aminophenol type epoxy resin, hydrogenated bisphenol type epoxy resin, alicyclic epoxy resin, alcohol ether type epoxy resin, alicyclic epoxy resin, fluorene type epoxy resin, siloxane alkyl epoxy resin, etc. Furthermore, the matrix polymer can be a polyacrylate. Additionally, the matrix polymer can be urethane, such as polyether polyurethane, polyester polyurethane, polycarbonate polyurethane, polyol-based polyurethane, etc. However, the matrix polymer is not limited to these. These can be used alone or in combination of two or more.

[0069] For example, the curing agent can be an anhydride-based curing agent such as tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexenedicarboxylic anhydride, phthalic anhydride, maleic anhydride, pyromellitic anhydride, etc.; aromatic amine-based curing agents such as m-phenylenediamine, diaminodiphenylmethane, diaminodiphenyl sulfone, etc.; and curing agents such as diethylenetriamine, triethylenetetramine, etc. Examples include aliphatic amine-based curing agents; phenolic curing agents such as phenol aralkyl-type phenolic resins, linear phenolic resins, xylene-type phenolic resins, linear phenolic resins of cresol, naphthol-type phenolic resins, terpene-type phenolic resins, polyfunctional phenolic resins, dicyclopentadienyl phenolic resins, naphthol-type phenolic resins, and linear phenolic resins synthesized from bisphenol A and methyl-type phenolic resins; and latent curing agents such as dicyandiamide, but not limited thereto. These can be used alone or in combination of two or more.

[0070] In particular, non-conductive films can be readily formed to have high values ​​of adhesive strength and modulus. Adhesive strength can be the force that allows two objects to adhere to each other through it. The stronger the adhesive strength, the stronger the two objects can be bonded. Modulus can be the ratio of stress to strain of an elastomer within its elastic limit. Objects with high modulus can deform less when resisting external forces.

[0071] Because the first adhesive layer 40 includes a non-conductive film, electrical interference to the display panel 20 can be minimized. In some aspects, including a non-conductive film in the first adhesive layer 40 supports a wide range of adjustment for the adhesive strength and modulus of the first adhesive layer 40. Therefore, the first adhesive layer 40 can prevent buckling at the corners of the display panel 20.

[0072] The second protective layer 50 may be located on the front surface of the display panel 20. The front surface of the display panel 20 may be opposite to the rear surface of the display panel 20. The front surface of the second protective layer 50 may correspond to the front surface of the electronic device 10. The second protective layer 50 may cover the entire upper surface of the display device 11. The second protective layer 50 may correspond to the shape of the display device 11. The second protective layer 50 may mitigate external impacts to prevent damage or malfunction of the display device 11 due to external impacts.

[0073] The second protective layer 50 may include an optically transparent material. The second protective layer 50 may include an optically transparent substrate. For example, the second protective layer 50 may include a glass substrate, and the glass substrate may be a tempered glass substrate.

[0074] The second adhesive layer 60 may be located between the display panel 20 and the second protective layer 50. The second adhesive layer 60 can bond the display panel 20 and the second protective layer 50.

[0075] The second adhesive layer 60 may include at least one of optically transparent adhesive (OCA), optically transparent resin (OCR), pressure-sensitive adhesive (PSA), thermally reactive adhesive, and double-sided tape.

[0076] The adhesive strength of the first adhesive layer 40 can be greater than the adhesive strength of the second adhesive layer 60.

[0077] The support plate 70 can be located on the rear surface of the first protective layer 30. The support plate 70 can help enhance the rigidity of the electronic device, shield surrounding noise, and dissipate heat emitted from surrounding heat-generating components.

[0078] The support plate 70 may comprise a metal. As an example, the support plate 70 may comprise at least one of stainless steel, Cu, Al, and composite metals (e.g., a laminated member in which stainless steel and aluminum are arranged alternately). In some aspects, the support plate 70 may comprise other alloy materials.

[0079] According to an embodiment, the support plate 70 may include at least one reinforcing fiber composite material. For example, the support plate 70 may include at least one of carbon fiber reinforced plastic (CFRP) and glass fiber reinforced plastic (GFRP).

[0080] The third adhesive layer 80 can be located between the first protective layer 30 and the support plate 70. The third adhesive layer 80 can bond the first protective layer 30 and the support plate 70.

[0081] The third adhesive layer 80 may include at least one of optically transparent adhesive, optically transparent resin, pressure-sensitive adhesive, heat-reactive adhesive, and double-sided tape.

[0082] In some respects, the adhesive strength of the first adhesive layer 40 may be greater than that of the third adhesive layer 80.

[0083] In the following text, see references Figure 4 The following will describe the case where the first protective layer includes a composite metal. Figure 4 This is a diagram showing the first to third layers of the first protective layer.

[0084] The first protective layer 30 may include a composite metal. When the first protective layer 30 includes a composite metal, the first protective layer 30 may have a multilayer structure. Figure 4 This is a diagram showing the first protective layer 30, which includes a composite metal.

[0085] When the first protective layer 30 comprises a composite metal, the first protective layer 30 may include a first layer 301, a second layer 302, and a third layer 303. The first layer 301, the second layer 302, and the third layer 303 may be stacked in sequence. That is, the second layer 302 may be located between the first layer 301 and the third layer 303.

[0086] For example, the composite metal included in the first protective layer 30 may be Ni-Cu-Ni. In other words, the first layer 301 may include nickel, the second layer 302 may include copper, and the third layer 303 may include nickel.

[0087] Furthermore, the composite metal included in the first protective layer 30 may be phosphor bronze-Cu-phosphor bronze. In other words, the first layer 301 may include phosphor bronze, the second layer 302 may include copper, and the third layer 303 may include phosphor bronze.

[0088] In the following text, reference will be made to Figure 5 Describe the curved surface region in more detail. Figure 5 It is along Figure 1 A cross-sectional view taken from line IV-IV'. Figure 5A portion of a display panel 20, a first adhesive layer 40, a second protective layer 50, a second adhesive layer 60, and a first protective layer 30 stacked at the corner of an electronic device is shown.

[0089] In the curved area BA, the second protective layer 50 may cover the display panel 20, the first adhesive layer 40, the second adhesive layer 60, and the first protective layer 30. The second protective layer 50 may be formed with an area wider than that of the display panel 20, the first adhesive layer 40, the second adhesive layer 60, and the first protective layer 30.

[0090] In the curved area BA, the second protective layer 50 can be bent by a protective layer bending angle 50A. By giving the second protective layer 50 a sufficiently large protective layer bending angle 50A, the display panel 20 can be easily protected. For example, the protective layer bending angle 50A can be 80° to 90°.

[0091] The display panel 20 may be located on the rear surface of the second protective layer 50. The display panel 20 may include a planar region PA and a curved region BA. The display panel 20 may be curved in the curved region BA toward a third direction D3. In the curved region BA, the display panel 20 may have a display panel bending angle 20A. The protective layer bending angle 50A may be greater than the display panel bending angle 20A. The display panel bending angle 20A may be in the range of 45° to 85°.

[0092] The display panel depth PD can be the length of the display panel 20 in the curved region BA along the third direction D3. The display panel depth PD can be a value obtained by measuring the length of the display panel 20 located in the curved region BA along the third direction D3 based on the display panel 20 located in the planar region PA.

[0093] By making the display panel depth PD at the corners of the electronic device sufficiently large, the bezel of the electronic device can be minimized. This is because as the display panel depth PD increases, the length of the display panel 20 extending in the curved area BA can increase. Conversely, as the display panel depth PD decreases, the length of the display panel 20 extending in the curved area BA decreases, and therefore the bezel may increase. To make the display panel depth PD sufficiently large, the display panel curvature angle 20A also needs to be increased.

[0094] However, if the bending angle 20A of the display panel increases, defects may occur in the display device. This may be because each layer of the display device has a curvature difference at the corner, including the curved area BA. As the bending angle 20A of the display panel increases, buckling may occur in the stress portion 20S of the display panel 20. Buckling of the display panel 20 can be a phenomenon in which the display panel 20 deforms abnormally due to external pressure or load. At the corner of the electronic device, the display panel 20 may be stacked while being compressed inside the second protective layer 50. At this time, if a load exceeding the critical load is applied, the display panel 20 may be partially subjected to stretching or contraction. The portion where the contraction is concentrated may be referred to as the stress portion 20S of the display panel 20. The stress portion 20S of the display panel 20 may be located at the end of the display panel 20. If buckling occurs in the display panel 20, the structural stability of the display device may be compromised. In some aspects, the function and quality of the display panel 20 may deteriorate or the display panel 20 may be damaged.

[0095] To prevent buckling of the display panel 20 that may occur when the bending angle 20A of the display panel is increased to minimize the bezel, a non-conductive film may be included in the first adhesive layer 40. The first adhesive layer 40 including the non-conductive film may be located between the display panel 20 and the first protective layer 30. The first adhesive layer 40 including the non-conductive film may support the display panel 20 by being located on the rear surface of the display panel 20.

[0096] The first adhesive layer 40, which includes a non-conductive film, can provide high adhesive strength and high modulus.

[0097] Non-conductive films can achieve higher modulus while maintaining structural strength through specific curing processes. For example, pressure-sensitive adhesives, which are essentially flexible and highly elastic in many cases, may be difficult to achieve high modulus. However, non-conductive films comprising epoxy resin can be tuned to be stronger and harder materials, for example, by further including curing agents or fillers. Therefore, non-conductive films can be easily manufactured to have a relatively high modulus compared to pressure-sensitive adhesives. For example, the modulus of the first adhesive layer 40 comprising the non-conductive film can be 20 MPa or greater. The higher the modulus, the greater the resistance to deformation under external forces, thus improving the reliability against shape deformation.

[0098] In some respects, non-conductive films can be readily manufactured to have relatively high adhesive strength compared to pressure-sensitive adhesives. For example, a non-conductive film can be manufactured to have an adhesive strength approximately five times or greater than that of a pressure-sensitive adhesive. For instance, the adhesive strength of the first adhesive layer 40 can be 2800 gf / in or greater. Higher adhesive strength results in better prevention of interfacial delamination.

[0099] By positioning the first adhesive layer 40, which includes a non-conductive film, on the rear surface of the display panel 20, buckling that may occur in the display device 11 can be prevented. Because the first adhesive layer 40, including the non-conductive film, structurally and stably supports the display panel 20, buckling can be prevented in the display panel 20 even if shrinkage is concentrated in the stress portion 20S of the display panel 20. In some aspects, since the first adhesive layer 40, including the non-conductive film, is firmly bonded to the display panel 20, delamination between the display panel 20 and the first adhesive layer 40 can be prevented, and the display panel 20 can be continuously and stably supported.

[0100] The display device, comprising a display panel 20, a first protective layer 30, a first adhesive layer 40, a second protective layer 50, and a second adhesive layer 60, can be stacked in a flat shape. The display device, immediately after stacking, has a flat shape and may not include curved areas.

[0101] The curing and molding apparatus can be used to form curved areas. The curing and molding apparatus can compress the display device by pressing it from above and below. The curing and molding apparatus can cure the first adhesive layer by applying heat to the display device. In some aspects, the curing and molding apparatus can shape each edge and corner of the display device into a curved surface. In other words, the curing and molding apparatus can form a curved area BA in the display device.

[0102] The curved area BA of the display device can be formed to reduce the bezel size of the electronic device. The curing and molding apparatus can form the curved area BA of the display device while compressing the display device.

[0103] The first adhesive layer 40, including the non-conductive film, can be cured by receiving heat from the curing and molding apparatus. In other words, the first adhesive layer 40, including the non-conductive film, can have an increased modulus by receiving heat from the curing and molding apparatus. The first adhesive layer 40 with increased modulus can prevent buckling in the display panel 20. The curing and molding of the display device can be performed simultaneously.

[0104] The first adhesive layer 40, including a non-conductive film, can compensate for refraction and distortion that may occur due to light introduced from the outside. This will refer to... Figure 6 and Figure 7 Describe it. Figure 6 and Figure 7 It is a view used to explain the refraction and distortion of light based on surface waviness.

[0105] Figure 6A display device according to a comparative example is shown, wherein a display panel 20' is located on the front surface of a first adhesive layer 40' having relatively insufficient surface waviness, a second protective layer 50' is located on the front surface of the display panel 20', and a second adhesive layer 60' is located between the display panel 20' and the second protective layer 50'. For example, the first adhesive layer 40' may include a pressure-sensitive adhesive. Figure 7 A display device according to an embodiment is shown, wherein a display panel 20 is located on the front surface of a first adhesive layer 40 having relatively superior surface waviness. For example, the first adhesive layer 40 may include a non-conductive film.

[0106] according to Figure 6 In a comparative example, the first adhesive layer 40' may have a relatively low modulus. In cases where the modulus is low, it may be easily deformed by external forces. This can be described as having a high surface waviness value. In some aspects, it can be described as having poor surface waviness. Bending occurring in the first adhesive layer 40' may cause bending of the display panel 20'. This is because the display panel 20' is supported by the first adhesive layer 40'. Due to the bending of the first adhesive layer 40' and the display panel 20', distortion may occur depending on the position of the external light LP incident on the display panel 20'.

[0107] Figure 6 The diagram shows a first adhesive layer 40' that bends due to its low modulus. Bending may also occur in the display panel 20' due to the bending of the first adhesive layer 40'. Bending can occur in the third direction D3. External light LP incident on region A can be reflected from both the first adhesive layer 40' and the display panel 20', resulting in an optical path difference A1 LPA1. External light LP incident on region B can be reflected from both the first adhesive layer 40' and the display panel 20', resulting in an optical path difference B1 LPB1. Different optical path differences may occur in regions A and B due to the bending shapes of the display panel 20' and the first adhesive layer 40'. That is, because different optical path differences occur depending on the position of the display panel 20', distorted images may be displayed in the electronic device.

[0108] Figure 7A first adhesive layer 40, according to an embodiment, is shown that does not bend due to its high modulus. Because no bending occurs in the first adhesive layer 40, no bending also occurs in the display panel 20. External light LP incident on region A can be reflected from both the first adhesive layer 40 and the display panel 20, resulting in an optical path difference A2 LPA2. External light LP incident on region B can be reflected from both the first adhesive layer 40 and the display panel 20, resulting in an optical path difference B2 LPB2. Because no bending occurs in the display panel 20 and the first adhesive layer 40 in regions A and B, the same optical path difference can occur. That is, because the same optical path difference occurs at different locations on the display panel 20, image distortion in the electronic device can be prevented.

[0109] In the following text, reference will be made to Figure 8 and Figure 9 The description includes the pixels in the display panel. Figure 8 It is the equivalent circuit diagram that includes the circuitry of any pixel in the display panel. Figure 9 It is a cross-sectional view showing a portion of the display panel provided in an electronic device.

[0110] refer to Figure 8 The pixel circuit PC may include a driving transistor T1, a switching transistor T2, and a storage capacitor Cst. In some aspects, the pixel circuit PC may be electrically connected to an organic light-emitting diode (OLED).

[0111] Switching transistor T2 can be connected to data line DL and scan line SL. Switching transistor T2 can send data signal or data voltage input from data line DL to drive transistor T1 based on the scan signal or switching voltage input from scan line SL.

[0112] The storage capacitor Cst is connected to the switching transistor T2 and the drive voltage line PL, and can store a voltage corresponding to the difference between the voltage received from the switching transistor T2 and the first power supply voltage ELVDD supplied to the drive voltage line PL.

[0113] A driving transistor T1 is connected to a driving voltage line PL and a storage capacitor Cst, and can control the driving current flowing from the driving voltage line PL to the organic light-emitting diode (OLED) in response to the voltage value stored in the storage capacitor Cst. The counter electrode (e.g., cathode) of the OLED can receive a second power supply voltage ELVSS. The OLED can emit light with a predetermined brightness by the driving current.

[0114] exist Figure 8The pixel circuit PC has already been described as including two transistors and one storage capacitor, but this disclosure is not limited thereto. For example, the pixel circuit PC may include three or more transistors. In some aspects, the pixel circuit PC may include two or more storage capacitors. As an example, the pixel circuit PC may include seven transistors and one storage capacitor. The number of transistors and storage capacitors can vary depending on the design of the pixel circuit PC.

[0115] The preceding text has described electronic devices that include organic light-emitting diodes (OLEDs) as light-emitting elements; however, electronic devices are not limited to this. In other examples, the electronic device may be a light-emitting display device that includes inorganic light-emitting diodes, i.e., an inorganic light-emitting display. In other examples, the electronic device may be a quantum dot light-emitting display.

[0116] Reference Figure 9 The display panel 20 may include a substrate 100, a pixel circuit layer PCL, a display layer DISL, a thin film encapsulation layer TFE, and a touch sensing layer TSL.

[0117] The substrate 100 may have a multilayer structure, comprising a base layer containing a polymer resin and an inorganic layer. For example, the substrate 100 may include a base layer containing a polymer resin and a barrier layer serving as an inorganic insulating layer. For example, the substrate 100 may include a first base layer 101, a first barrier layer 102, a second base layer 103, and a second barrier layer 104 stacked sequentially. The first base layer 101 and the second base layer 103 may include polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose triacetate (TAC), and / or cellulose acetate propionate (CAP). The first barrier layer 102 and the second barrier layer 104 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, and / or silicon nitride. Such a substrate 100 may have flexible properties.

[0118] The pixel circuit layer PCL can be disposed on the substrate 100. The pixel circuit layer PCL may include a pixel circuit PC, which includes a transistor TFT and a storage capacitor Cst. In some aspects, the pixel circuit layer PCL may include a buffer layer 111, a first gate insulating layer 112, a second gate insulating layer 113, an interlayer insulating layer 114, a first insulating layer 115, and a second insulating layer 116 disposed below and / or above the components of the pixel circuit PC.

[0119] The buffer layer 111 can reduce or prevent the penetration of foreign matter, moisture, or external air from the lower part of the substrate 100, and can provide a flat surface on the substrate 100. The buffer layer 111 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, and / or silicon nitride, and may have a single-layer or multi-layer structure including the above materials.

[0120] The transistor TFT on the buffer layer 111 includes a semiconductor layer Act, and the semiconductor layer Act may include polycrystalline silicon. Alternatively, the semiconductor layer Act may include amorphous silicon, oxide semiconductor, or organic semiconductor, etc. The semiconductor layer Act may include a channel region C and a drain region D and a source region S respectively disposed on both sides of the channel region C. The gate electrode GE may overlap with the channel region C.

[0121] The gate electrode GE may include a low-resistance metallic material. The gate electrode GE may include conductive materials such as molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may be formed as a multilayer or a single layer comprising the above materials.

[0122] The first gate insulating layer 112 between the semiconductor layer Act and the gate electrode GE may include materials such as silicon oxide (SiO2) and silicon nitride (SiN). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x Inorganic insulating materials, such as zinc oxide (ZnO), are used as an example. x () can be zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0123] A second gate insulating layer 113 may be provided to cover the gate electrode GE. Similar to the first gate insulating layer 112, the second gate insulating layer 113 may include materials such as silicon oxide (SiO2) and silicon nitride (SiN). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x Inorganic insulating materials, such as zinc oxide (ZnO), are used as an example. x () can be zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0124] The upper electrode Cst2 of the storage capacitor Cst can be disposed on the upper part of the second gate insulating layer 113. The upper electrode Cst2 can overlap with the gate electrode GE below it. The gate electrode GE and the upper electrode Cst2 can overlap through the second gate insulating layer 113 to form the storage capacitor Cst. That is, the gate electrode GE can be used as the lower electrode Cst1 of the storage capacitor Cst.

[0125] Thus, the storage capacitor Cst and the transistor TFT can be formed to overlap. In some examples, the storage capacitor Cst can be formed not to overlap with the transistor TFT.

[0126] The upper electrode Cst2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and may be a single layer or multiple layers of the above materials.

[0127] The interlayer insulating layer 114 may cover the upper electrode Cst2. The interlayer insulating layer 114 may include silicon oxide (SiO2) or silicon nitride (SiN). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO) x At this point, zinc oxide (ZnO) x The inorganic insulating layer 114 may be zinc oxide (ZnO) and / or zinc peroxide (ZnO2). The interlayer insulating layer 114 may be a single layer or multiple layers including the aforementioned inorganic insulating materials.

[0128] The drain electrode DE and source electrode SE can be located on the interlayer insulating layer 114, respectively. The drain electrode DE and source electrode SE can be connected to the drain region D and source region S, respectively, through contact holes in the insulating layer beneath them. The drain electrode DE and source electrode SE can comprise materials with good conductivity. The drain electrode DE and source electrode SE can comprise conductive materials containing molybdenum (Mo), aluminum (Al), copper (Cu), and / or titanium (Ti), and can be formed as a multilayer or a single layer comprising the aforementioned materials. As an example, the drain electrode DE and source electrode SE can have a Ti / Al / Ti multilayer structure.

[0129] The first insulating layer 115 may cover the drain electrode DE and the source electrode SE. The first insulating layer 115 may include organic insulating materials such as general polymers (e.g., polymethyl methacrylate (PMMA) or polystyrene (PS)), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluoropolymers, p-xylyl polymers, vinyl alcohol polymers and / or blends thereof.

[0130] The second insulating layer 116 may be disposed on the first insulating layer 115 and the contact metal CM. The second insulating layer 116 may comprise the same material as the first insulating layer 115, and may comprise organic insulating materials such as general-purpose polymers (e.g., polymethyl methacrylate (PMMA) or polystyrene (PS)), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluoropolymers, p-xylene polymers, vinyl alcohol polymers, and / or blends thereof.

[0131] The display layer DISL can be disposed on the pixel circuit layer PCL having the above-described structure. The display layer DISL may include a light-emitting element 200 and a pixel defining layer 120. The light-emitting element 200 includes, for example, an organic light-emitting diode (OLED), and the OLED may include a stacked structure of a first electrode 210, an intermediate layer 220, and a counter electrode 230. The OLED may emit, for example, red, green, or blue light, or may emit red, green, blue, or white light. The OLED emits light through a light-emitting region, and the light-emitting region may be defined as a light-emitting pixel PX.

[0132] The first electrode 210 may be disposed on the second insulating layer 116. The first electrode 210 is connected to a contact metal CM disposed on the first insulating layer 115 through a contact hole formed in the second insulating layer 116, and can be electrically connected to the transistor TFT through the contact metal CM. Although this specification shows an example in which the transistor TFT and the first electrode 210 are connected through the contact metal CM, it is not limited thereto, and the contact metal CM and the second insulating layer 116 may be omitted, and one electrode of the transistor TFT and the first electrode 210 may be directly connected.

[0133] The first electrode 210 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or zinc aluminum oxide (AZO). In other examples, the first electrode 210 may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof. In other examples, the first electrode 210 may further include a layer formed of ITO, IZO, ZnO, and / or In2O3 above / below the aforementioned reflective layer.

[0134] A pixel defining layer 120 having an opening 120OP exposing the central portion of the first electrode 210 is disposed on the first electrode 210. The pixel defining layer 120 may comprise an organic insulating material and / or an inorganic insulating material. The opening 120OP may define a light-emitting region for light emitted from the light-emitting element 200. For example, the size / width of the opening 120OP may correspond to the size / width of the light-emitting region. Therefore, the size and / or width of the light-emitting pixel PX may depend on the size and / or width of the corresponding opening 120OP of the pixel defining layer 120.

[0135] The intermediate layer 220 may include a light-emitting layer 222 formed corresponding to the first electrode 210. The light-emitting layer 222 may include a polymer or low-molecular-weight organic material that emits light of a predetermined color. Alternatively, the light-emitting layer 222 may include an inorganic light-emitting material or quantum dots.

[0136] The first functional layer 221 and the second functional layer 223 can be disposed below and above the light-emitting layer 222, respectively. The first functional layer 221 may include, for example, a hole transport layer (HTL), or may include a hole transport layer and a hole injection layer (HIL). The second functional layer 223 is a component disposed above the light-emitting layer 222 and may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The first functional layer 221 and / or the second functional layer 223 may be a common layer formed to completely cover the substrate 100, similar to the counter electrode 230 described later.

[0137] Counter electrode 230 is disposed on and may overlap with the first electrode 210. Counter electrode 230 may be formed of a conductive material having a low work function. For example, counter electrode 230 may include a transparent or translucent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), and / or alloys thereof. Alternatively, counter electrode 230 may also include a layer comprising, for example, ITO, IZO, ZnO, and / or In2O3, on the transparent or translucent layer comprising the above-described materials. Counter electrode 230 may be integrally formed to completely cover substrate 100.

[0138] The display panel 20 includes a plurality of light-emitting elements 200, and the plurality of light-emitting elements 200 can provide an image by emitting light through light-emitting pixels PX.

[0139] A thin-film encapsulation layer (TFE) is disposed on the counter electrode 230 of the light-emitting element 200 and may cover the light-emitting element 200 of the display layer DISL. The thin-film encapsulation layer (TFE) may include at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0140] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise one or more inorganic materials selected from alumina, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 320 may comprise a polymer-based material. The polymer-based material may comprise acrylic resin, epoxy resin, polyimide, and polyethylene. As an example, the organic encapsulation layer 320 may comprise acrylate. The organic encapsulation layer 320 may be formed by curing monomers or applying polymers. The organic encapsulation layer 320 may be transparent.

[0141] The touch sensing layer (TSL) can be disposed on the thin-film encapsulation layer (TFE). For example, as shown... Figure 9 As shown, the touch sensing layer TSL can be formed directly on the thin film encapsulation layer TFE, and in this case, the adhesive layer may not be located between the touch sensing layer TSL and the thin film encapsulation layer TFE.

[0142] A touch sensing layer (TSL) can obtain coordinate information based on external input (e.g., a touch event). A TSL may include, for example, sensing electrodes and signal lines connected to the sensing electrodes. The TSL can detect external input using either mutual capacitance or self-capacitance methods.

[0143] Figure 10 This is a view illustrating the stacked structure of the display device of an electronic device according to an embodiment. Descriptions of components identical to those described above will be omitted.

[0144] The display device 11 may include a third adhesive layer 80, which includes a non-conductive film. The third adhesive layer 80 may be located between the first protective layer 30 and the support plate 70.

[0145] The first adhesive layer 40 may include at least one of optically transparent adhesive, optically transparent resin, pressure-sensitive adhesive, heat-reactive adhesive, and double-sided tape.

[0146] By including a non-conductive film in the third adhesive layer 80, buckling of the display panel 20 can be prevented. That is, by including a non-conductive film in the third adhesive layer 80, buckling of the display panel 20 can be prevented even if the first adhesive layer 40 does not contain a non-conductive film. The third adhesive layer 80 is not in direct contact with the display panel 20. However, the high modulus and adhesive strength of the third adhesive layer 80 can prevent buckling of the display panel 20. For example, compared to using a pressure-sensitive adhesive, using a non-conductive film with higher modulus and higher adhesive strength in the third adhesive layer 80 can improve the overall rigidity of the display device 11 and maintain excellent surface waviness. The adhesive strength of the third adhesive layer 80 can be greater than the adhesive strength of the second adhesive layer 60.

[0147] The display device 11 may include a first adhesive layer 40 comprising a non-conductive film, and also includes a third adhesive layer 80 comprising a non-conductive film.

[0148] The third adhesive layer 80 may be in direct contact with the first protective layer 30. The first protective layer 30 may include a polymer component, metal, or glass. By including a first protective layer 30 of metal or glass, the overall modulus of the display device 11 included in the electronic device according to the embodiment can be improved, which may be advantageous in preventing buckling that may occur at the corners of the display panel 20.

[0149] Figure 11 This shows simulation data based on the interfacial pressure difference of the adhesive layer materials.

[0150] Figure 11 The interfacial pressure difference between the first adhesive layer and the display panel is illustrated. Interfacial pressure difference refers to the pressure difference that occurs at the interface where two layers meet. This difference affects structural strength and stability and may be related to defects at the interface or layer adhesion. A smaller interfacial pressure difference between the first adhesive layer and the display panel is more advantageous in preventing delamination. In this simulation, an interfacial pressure difference of 0.354 MPa or less between the first adhesive layer and the display panel is defined as acceptable.

[0151] For the case where the pressure-sensitive adhesive (PSA) has an adhesive strength of 500 gf / in and a modulus of 0.08 MPa at 25°C, the calculated interfacial pressure difference between the first adhesive layer and the display panel is 1.090 MPa. This does not meet the acceptable criteria for this simulation.

[0152] For the case where the pressure-sensitive adhesive has an adhesive strength of 500 gf / in and a modulus of 0.2 MPa at 25°C, the calculated interfacial pressure difference between the first adhesive layer and the display panel is 0.863 MPa. This does not meet the acceptable standard for this simulation.

[0153] For the case where the non-conductive film (NCF) has an adhesive strength of 2800 gf / in and a modulus of 0.3 MPa at 25°C, the calculated interfacial pressure difference between the first adhesive layer and the display panel is 0.774 MPa. This does not meet the acceptable criteria for this simulation.

[0154] For the case where the non-conductive film has an adhesive strength of 2800 gf / in and a modulus of 5 MPa at 25°C, the calculated interfacial pressure difference between the first adhesive layer and the display panel is 0.723 MPa. This does not meet the acceptable criteria for this simulation.

[0155] For the case where the non-conductive film has an adhesive strength of 2800 gf / in and a modulus of 10 MPa at 25°C, the calculated interfacial pressure difference between the first adhesive layer and the display panel is 0.544 MPa. This does not meet the acceptable standard for this simulation.

[0156] For the case where the non-conductive film has an adhesive strength of 2800 gf / in and a modulus of 20 MPa at 25°C, the calculated interfacial pressure difference between the first adhesive layer and the display panel is 0.329 MPa. This meets the acceptable criteria for the simulation.

[0157] In summary, a satisfactory interfacial pressure difference can be obtained for cases where the adhesive strength is 2800 gf / in or greater and the modulus is 20 MPa or greater. Furthermore, embodiments of this disclosure may include using a non-conductive film to obtain the target adhesive strength and modulus of the first adhesive layer.

[0158] Figure 12 This is a block diagram of an electronic device according to an embodiment.

[0159] Reference Figure 12 The electronic device 10 according to the embodiment may include a display device 11, a power supply module PM, a first electronic module EM1, and a second electronic module EM2. The display device 11, the power supply module PM, the first electronic module EM1, and the second electronic module EM2 may be electrically connected to each other.

[0160] The display device 11 may include light-emitting pixels PX and a touch sensor TS. The display device 11 may include light-emitting pixels PX, which are units for displaying images and are visible to the user from the outside. The touch sensor TS may overlap with the display panel and can detect external input.

[0161] The power supply module PM provides the power required for the overall operation of the electronic device 10. The power supply module PM may include a battery module.

[0162] The first electronic module EM1 and the second electronic module EM2 may include various functional modules for operating the electronic device 10. The first electronic module EM1 may be directly mounted on a motherboard that is electrically connected to the display device 11, or it may be mounted on a separate substrate and electrically connected to the motherboard via a connector or the like.

[0163] The first electronic module EM1 may include a control module CTM, a wireless communication module TM, an image input module IIM, an audio input module AIM, a memory MM, and an external interface IF. Some of these modules may not be mounted on the motherboard and can be electrically connected to the motherboard via a flexible printed circuit board that is connected to the motherboard.

[0164] The control module CTM can control the overall operation of the electronic device 10. The control module CTM can be a microprocessor. For example, the control module CTM activates or deactivates the display device 11. The control module CTM can control other modules, such as the image input module IIM or the audio input module AIM, based on touch signals received from the display device 11.

[0165] The wireless communication module™ can send / receive wireless signals with other terminals using Bluetooth or Wi-Fi lines. The wireless communication module™ can also send / receive voice signals using common communication lines. The wireless communication module™ includes a transmitter TM1 that modulates and transmits the signal to be transmitted and a receiver TM2 that demodulates the received signal.

[0166] The image input module IIM can process image signals and convert them into image data that can be displayed on the display device 11. The audio input module AIM can receive external audio signals through a microphone in recording mode, voice recognition mode, etc., and convert them into electronic voice data.

[0167] The external interface IF can be used as an interface to connect to external chargers, wired / wireless data ports, card (e.g., memory card, SIM / UIM card) slots, etc.

[0168] The second electronic module EM2 may include an audio output module AOM, a light-emitting module LM, a light-receiving module LRM, and a camera module CMM, and at least some of these modules may be located as optical elements on the rear surface of the display device 11. The optical elements may include the light-emitting module LM, the light-receiving module LRM, and the camera module CMM, etc. In some aspects, the second electronic module EM2 may be directly mounted on a motherboard, or mounted on a separate substrate and electrically connected to the display device 11 or the first electronic module EM1 via a connector.

[0169] The audio output module AOM can convert audio data received from the wireless communication module TM or stored in the memory MM and output it to the outside.

[0170] A light-emitting module (LM) can generate and output light. The LM can output infrared light. For example, the LM may include LED elements. A light-receiving module (LRM) can detect infrared light. The LRM can be activated when infrared light above a predetermined level is detected. The LRM may include a CMOS sensor. After the infrared light generated by the LM is output, it can be reflected by an external object (e.g., a user's finger or face), and the reflected infrared light can be incident on the LRM. A camera module (CMM) can capture external images.

[0171] The electronic device according to the embodiments can minimize electrical interference to the display panel by including a non-conductive film in a first adhesive layer located between the display panel and the first protective layer. In some aspects, where the first adhesive layer includes a non-conductive film, the adhesive strength and modulus of the first adhesive layer can be widely adjusted. Therefore, embodiments of the present disclosure include adjusting the adhesive strength and modulus of the first adhesive layer such that buckling at the corners of the display panel can be prevented or reduced.

[0172] Although embodiments of the present disclosure have been described in detail above, the scope of the present disclosure is not limited thereto, and various modifications and improvements made by those skilled in the art using the basic concepts of the present disclosure as defined in the appended claims also fall within the scope of the present disclosure.

Claims

1. Electronic devices, including: Display panel, including luminescent pixels; The first protective layer is located on the rear surface of the display panel; as well as A first adhesive layer is located between the display panel and the first protective layer. The first adhesive layer includes a non-conductive film. 2.The electronic device of claim 1, wherein, The modulus of the first adhesive layer is 20 MPa or greater. 3.The electronic device of claim 2, wherein, The adhesive strength of the first adhesive layer is 2800 gf / in or greater. 4.The electronic device of claim 1, wherein The first protective layer comprises metal or glass. 5.The electronic device of claim 1, wherein The first protective layer is in direct contact with the first adhesive layer. 6.The electronic device of claim 1, further comprising a second protection layer on a front surface of the display panel, wherein, The front surface is opposite to the rear surface.

7. The electronic device of claim 6, further comprising a second adhesive layer located between the display panel and the second protective layer. 8.The electronic device of claim 7, wherein, The adhesive strength of the first adhesive layer is greater than that of the second adhesive layer. 9.The electronic device of claim 1, wherein The display panel includes: planar area; and The curved area bends at the corners of the display panel. The bending angle of the display panel in the curved area is in the range of 45° to 85°. 10.The electronic device of claim 1, wherein The non-conductive film includes epoxy resin, polyacrylate, or urethane.

11. The electronic device of claim 1, further comprising a support plate located on the rear surface of the first protective layer.

12. Electronic devices, including: Display panel, including luminescent pixels; The first protective layer is located on the rear surface of the display panel; A support plate is located on the rear surface of the first protective layer; as well as A third adhesive layer is located between the first protective layer and the support plate. The third adhesive layer includes a non-conductive film. 13.The electronic device of claim 12, wherein, The modulus of the third adhesive layer is 20 MPa or greater. 14.The electronic device of claim 13, wherein, The adhesive strength of the third adhesive layer is 2800 gf / in or greater. 15.The electronic device of claim 12, wherein The first protective layer comprises metal or glass. 16.The electronic device of claim 12, wherein The first protective layer is in direct contact with the third adhesive layer. 17.The electronic device of claim 12, further comprising a second protection layer on a front surface of the display panel, wherein, The front surface is opposite to the rear surface of the display panel.

18. The electronic device of claim 17, further comprising a second adhesive layer located between the display panel and the second protective layer. 19.The electronic device of claim 18, wherein, The adhesive strength of the third adhesive layer is greater than that of the second adhesive layer. 20.The electronic device of claim 12, wherein, The display panel includes: planar area; and The curved area bends at the corners of the display panel. The bending angle of the display panel in the curved area is in the range of 45° to 85°.

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