Electronic device

Abstract

The application discloses an electronic device, and belongs to the technical field of electronic devices. The electronic device comprises a side key structure and a side key FPC which are connected with each other, and the electronic device has a side key area and a middle frame area; the side key structure is arranged in the side key area, and the side key FPC is arranged in the side key area and the middle frame area; the side key FPC comprises a first FPC, and the first FPC is arranged in the side key area; the first FPC comprises a first flexible base material, a first insulating reinforcing piece and a first adhesive layer; the first flexible base material and the first insulating reinforcing piece are stacked; the first adhesive layer is arranged between the first flexible base material and the first insulating reinforcing piece; and the first adhesive layer is connected with the first flexible base material and the first insulating reinforcing piece respectively.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] Side buttons on electronic devices are typically volume buttons and power buttons, but newer features include camera, lighting, and AI (artificial intelligence) activation. Pressing a side button pushes it a certain distance to activate the circuitry.

[0003] In the prior art, the FPC design for side keys generally adopts a process of bonding a substrate, a reinforcing plate, and a cover film for protection. At the location of the solder pads that need to be soldered, the cover film is removed by punching and then soldered to the device. However, its structure results in a large thickness of FPC.

[0004] To adapt to the trend of thinner and lighter electronic devices, and considering that the number of module components and solder pads in side key FPCs is relatively small, the design of side key FPCs is evolving towards thinner and lower cost. Summary of the Invention

[0005] The purpose of this application is to provide an electronic device that can solve at least some of the above-mentioned problems.

[0006] To solve the above-mentioned technical problems, this application is implemented as follows: This application provides an electronic device including an interconnected side key structure and a side key FPC. The electronic device has a side key area and a mid-frame area. The side key structure is disposed in the side key area, and the side key FPC is disposed in both the side key area and the mid-frame area. The side key FPC includes a first FPC disposed in the side key area. The first FPC includes a first flexible substrate, a first insulating reinforcement, and a first adhesive layer. The first flexible substrate and the first insulating reinforcement are stacked, and the first adhesive layer is disposed between the first flexible substrate and the first insulating reinforcement. The first adhesive layer is connected to both the first flexible substrate and the first insulating reinforcement.

[0007] In practical applications, electronic devices include a mid-frame, which typically connects the display screen and back cover, supports core components such as the motherboard and battery, and ensures the overall structural strength and rigidity of the device. Additionally, a side button area is provided to accommodate side buttons, such as volume buttons and power buttons. Specifically, mounting slots or through holes are formed in the mid-frame, and the side button structure is installed within this independent space. The side button structure is the physical component that the user's fingers contact, used to receive external pressure and transmit this force. The side button FPC integrates conductive contacts or haptic switches, usually located on the inside of the side button structure. When the side button structure is pressed, it compresses a specific area on the side button FPC, thereby generating an electrical signal.

[0008] In this embodiment, one end of the side button FPC is disposed in the side button area and connected to the side button structure, while the other end of the side button FPC is disposed in the mid-frame area and connected to the motherboard of the electronic device. The first FPC is disposed in the side button area, and its thickness affects the overall width of the electronic device. In this embodiment, the first FPC includes a first flexible substrate, a first insulating reinforcement, and a first adhesive layer. In terms of lamination, the first insulating reinforcement and the first flexible substrate are tightly bonded together through the first adhesive layer. Specifically, a hot-pressing process can be used to fill and wrap the circuit body on the first flexible substrate with the first adhesive layer, thereby replacing the traditional cover film to achieve insulation protection and mechanical support for the circuit. This embodiment, considering the limited number of side button FPC devices and solder pads, also abandons the traditional mold-opening process and instead uses laser ablation technology to remove insulating material at specific locations after lamination (such as side button contacts or connection ends) to form an opening.

[0009] In this embodiment, for side button applications with fewer pads, the above design significantly achieves extreme thinning of the first FPC. By removing the traditional cover film layer, the assembly thickness of the side button area is effectively reduced, meeting the stringent requirements of electronic devices for narrow side space and high integration. Simultaneously, using laser ablation instead of traditional cover film bonding not only avoids the risk of bonding misalignment or wrinkles caused by window openings but also significantly improves the accuracy and edge quality of pad exposure. Furthermore, using a first insulating reinforcement in conjunction with a first adhesive layer to press and protect the circuitry enhances the rigidity of the first FPC in the side button area. This prevents the circuitry from breaking or peeling under frequent pressing and ensures a crisp and consistent feel when pressing the side buttons, effectively improving product reliability and yield.

[0010] Optionally, in an embodiment of this application, the first flexible substrate includes a first conductive layer and a first insulating layer, the first conductive layer and the first insulating layer are stacked, and the first conductive layer and the first adhesive layer are connected.

[0011] Optionally, in this embodiment, the side-key FPC further includes a second FPC, and the second FPC and the first FPC are independent of each other and electrically connected.

[0012] Optionally, in this embodiment, the second FPC includes a second flexible substrate, a second insulating reinforcement, a second adhesive layer, and a first cover film. The first cover film, the second flexible substrate, and the second insulating reinforcement are stacked sequentially. The second adhesive layer is disposed between the second flexible substrate and the second insulating reinforcement, and is connected to the second flexible substrate and the second insulating reinforcement respectively.

[0013] Optionally, in an embodiment of this application, the second flexible substrate includes a second conductive layer, a second insulating layer, and a third conductive layer, wherein the first conductive layer, the second insulating layer, and the third conductive layer are stacked sequentially, the first conductive layer is connected to the first cover film, and the second conductive layer is connected to the second adhesive layer. Optionally, in an embodiment of this application, at least one first opening is provided on the first insulating layer, and at least a portion of the first conductive layer is exposed through the first opening to form a welding area.

[0014] Optionally, in an embodiment of this application, the first FPC includes a first end and a second end disposed opposite to each other, and the welding area is disposed at the first end or the second end.

[0015] Optionally, in this embodiment, the second FPC further includes at least two pads, which are electrically connected to the second flexible substrate.

[0016] Optionally, in this embodiment, the second FPC includes a third end and a fourth end disposed opposite to each other, and at least two pads are disposed on the third end or the second end.

[0017] Optionally, in this embodiment, the welding area and the pad are welded. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the side-key FPC in an electronic device according to an embodiment of this application; Figure 2 This is a schematic diagram of the side-key FPC structure in an embodiment of this application; Figure 3 This is a schematic diagram of the stacked structure of the first PFC in the embodiments of this application; Figure 4 This is a schematic diagram of the stacked structure of the second FPC in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of the first PFC in the embodiments of this application; Figure 6 This is a schematic diagram of the structure of the second PFC in the embodiments of this application.

[0019] Explanation of reference numerals in the attached figures: 1. Side-key FPC; 2. Side-key area; 3. Mid-frame area; 4. Side-key structure; 10. First FPC; 11. First flexible substrate; 111. First conductive layer; 112. First insulating layer; 1121. First window; 12. First insulating reinforcement; 13. First adhesive layer; 14. Welding area; 20. Second FPC; 21. Second flexible substrate; 211. Third conductive layer; 212. Second insulating layer; 213. Fourth conductive layer; 22. Second insulating reinforcement; 23. Second adhesive layer; 24. First cover film; 25. Solder pad. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0022] The electronic device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0023] See Figures 1 to 6 This application provides an electronic device including a side key structure 4 and a side key FPC1 connected to each other. The electronic device has a side key region 2 and a middle frame region 3. The side key structure 4 is disposed in the side key region 2, and the side key FPC1 is disposed in the side key region 2 and the middle frame region 3. The side key FPC1 includes a first FPC10, which is disposed within the side key region 2. The first FPC10 includes a first flexible substrate 11, a first insulating reinforcement 12, and a first adhesive layer 13. The first flexible substrate 11 and the first insulating reinforcement are stacked, and the first adhesive layer 13 is disposed between the first flexible substrate 11 and the first insulating reinforcement 12. The first adhesive layer 13 is connected to the first flexible substrate 11 and the first insulating reinforcement 12 respectively.

[0024] In practical applications, electronic devices have a mid-frame, which typically connects the display screen and back cover, supports core components such as the motherboard and battery, and ensures the overall structural strength and rigidity of the device. Additionally, a side button area 2 is provided to accommodate side buttons, such as volume buttons and power buttons. Specifically, mounting slots or through holes are formed in the mid-frame, and the side button structure 4 is installed within this independent space. The side button structure 4 is the physical component that the user's fingers contact, used to receive external pressing force and transmit it. The side button FPC1 integrates conductive contacts or haptic switches, usually located on the inner side of the side button structure 4. When the side button structure 4 is pressed, it compresses a specific area on the side button FPC1, thereby generating an electrical signal.

[0025] In this embodiment, one end of the side button FPC1 is located in the side button region 2 and connected to the side button structure 4, while the other end is located in the mid-frame region 3 and connected to the motherboard of the electronic device. The first FPC10 is located within the side button region 2, and its thickness affects the overall width of the electronic device. In this embodiment, the first FPC10 includes a first flexible substrate 11, a first insulating reinforcement 12, and a first adhesive layer 13. In terms of lamination, the first insulating reinforcement 12 and the first flexible substrate 11 are tightly bonded together via the first adhesive layer 13. Specifically, a hot-pressing process can be used to fill and wrap the circuit body on the first flexible substrate 11 with the first adhesive layer 13, thereby replacing the traditional cover film to achieve insulation protection and mechanical support for the circuit. This embodiment, considering the limited number of side button FPC1 devices and solder pads 25, also abandons the traditional mold-opening process and instead uses laser ablation technology to remove insulating material at specific locations after lamination, such as side button contacts or connection ends, to form an opening.

[0026] In this embodiment, for side button applications with fewer pads 25, the above design significantly reduces the thickness of the first FPC 10. By removing the traditional cover film layer, the assembly thickness of the side button area 2 is effectively reduced, meeting the stringent requirements of electronic devices for narrow side space and high integration. Simultaneously, using laser ablation instead of traditional cover film bonding not only avoids the risk of bonding misalignment or wrinkles caused by opening windows, but also significantly improves the accuracy and edge quality of the exposed pads 25. Furthermore, the first insulating reinforcement 12, in conjunction with the first adhesive layer 13, provides pressure protection for the circuitry, enhancing the rigidity of the first FPC 10 in the side button area 2. This prevents the circuitry from breaking or peeling under frequent pressing, while also ensuring a crisp and consistent pressing feel for the side button structure 4, effectively improving product reliability and yield.

[0027] It should be noted that mobile electronic devices can be mobile phones, tablets, laptops, handheld computers, in-vehicle electronic devices, wearable devices, ultra-mobile personal computers (UMPCs), netbooks, or personal digital assistants (PDAs), etc., while non-mobile electronic devices can be personal computers (PCs), televisions (TVs), ATMs, or self-service machines, etc. The embodiments of this application do not impose specific limitations.

[0028] It should be noted that the electronic devices in the embodiments of the present invention include the mobile electronic devices and non-mobile electronic devices described above.

[0029] Optionally, in this embodiment of the application, the first flexible substrate 11 includes a first conductive layer 111 and a first insulating layer 112, the first conductive layer 111 and the first insulating layer 112 are stacked, and the first conductive layer 111 and the first adhesive layer 13 are connected.

[0030] In this embodiment, considering the limited number of side-key FPC1 devices and sparse pads 25, the first flexible substrate 11 and the first insulating reinforcement 12 are directly integrated. Specifically, the first flexible substrate 11 is composed of a first conductive layer 111 (i.e., a circuit layer) and a first insulating layer 112 (i.e., a substrate layer) stacked together. The side surface of the first conductive layer 111 facing away from the first insulating layer 112 is directly laminated with the first insulating reinforcement 12 through the first adhesive layer 13 to achieve the connection between the two. It can be understood that the first adhesive layer 13 not only serves as a connection but also replaces the function of the traditional cover film, wrapping the circuit body of the first conductive layer 111. Furthermore, the above arrangement abandons the traditional mold bonding process and instead utilizes laser ablation technology to precisely penetrate the first insulating reinforcement 12 and the first adhesive layer 13, forming an opening at a specific location to expose the area of ​​the first conductive layer 111 that can be soldered.

[0031] In this embodiment, the above-mentioned configuration achieves a balance between thinning the first FPC 10 and high reliability. Addressing the characteristic of a small number of pads 25 and relatively low requirements for the support strength provided by the first FPC 10, firstly, by omitting the traditional cover film layer, the first insulating reinforcement 12 and the first adhesive layer 13 are directly used to protect and support the first conductive layer 111, significantly reducing the overall thickness of the first FPC 10, making it suitable for the extremely limited space of the side key area 2. Secondly, laser ablation is used instead of the traditional patterned bonding of the cover film, effectively solving the alignment deviation and edge warping problems that easily occur during the manufacturing process of small-sized first FPC 10s with few pads 25, greatly improving processing accuracy and production yield. Furthermore, the first adhesive layer 13 can be directly bonded to the surface of the first conductive layer 111, fully filling the line gaps during hot pressing. Combined with the rigid first insulating reinforcement 12, it not only provides excellent insulation and moisture protection for the lines but also enhances the mechanical strength of the side key area 2, ensuring consistent feel and structural stability of the side keys under long-term pressing.

[0032] It should be noted that the first conductive layer 111 can be made of copper, and the first insulating layer 112 can be made of polyimide.

[0033] Optionally, in this embodiment of the application, the side key FPC1 further includes a second FPC20, and the second FPC20 and the first FPC10 are independent of each other and electrically connected.

[0034] In this embodiment, the side-key FPC1 adopts a split architecture, specifically including a first FPC10 and a second FPC20 that are independent of each other. Specifically, the first FPC10 and the second FPC20 are physically separate units, each with its own flexible substrate and circuit design. However, they achieve signal interconnection through specific connection processes, such as soldering, conductive adhesive bonding, or connector insertion. This arrangement splits the originally integrated, irregular FPC into two independent physical entities. During the panelization stage of manufacturing, because the first FPC10 and the second FPC20 have relatively regular shapes, or can be optimized through symmetrical or staggered arrangement, they can be arranged in a high-density configuration on the substrate, thereby significantly reducing the unused edge areas of the substrate.

[0035] Furthermore, traditional side-key FPC1s, due to their elongated or irregular shapes, often cannot be tightly arranged during panelization, resulting in significant substrate waste and a low panelization rate in the industry. This design decomposes the complex graphic, allowing the first FPC10 and the second FPC20 to be flexibly arranged like building blocks, such as in an array or in a mirror symmetrical arrangement, effectively filling gaps.

[0036] Furthermore, although splitting the side-key FPC1 into two parts and then electrically connecting them increases assembly costs, this cost increase is roughly balanced by the material savings. After offsetting each other, the overall manufacturing cost is significantly lower than the traditional one-piece irregular design, achieving the goal of cost reduction and efficiency improvement.

[0037] It should be noted that the second FPC20 is generally set in an area outside the side button area 2, such as within the middle frame area 3.

[0038] Optionally, in this embodiment, the second FPC20 includes a second flexible substrate 21, a second insulating reinforcement 22, a second adhesive layer 23, and a first cover film 24. The first cover film 24, the second flexible substrate 21, and the second insulating reinforcement 22 are stacked sequentially. The second adhesive layer 23 is disposed between the second flexible substrate 21 and the second insulating reinforcement 22, and the second adhesive layer 23 is connected to the second flexible substrate 21 and the second insulating reinforcement 22 respectively.

[0039] In this embodiment, although the second FPC20 is used in conjunction with the first FPC10, the first cover film 24 is retained in the layered design. Understandably, the second FPC20 may undertake more complex wiring, connect to the motherboard, or be located in areas requiring higher insulation protection. Specifically, the second insulation reinforcement 22 (e.g., FR-4, Flame Retardant Grade 4, referring to an insulating substrate composed of epoxy resin and fiberglass cloth with a flame retardant grade of 4) serves as the bottom support and is tightly bonded to one side of the second flexible substrate 21 via the second adhesive layer 23. This connection method is consistent with the design logic of the first FPC10, ensuring the rigid support of the side key FPC1 during assembly. Unlike the first FPC10, the second FPC20 covers the other side of the second flexible substrate 21, i.e., the surface of the circuit layer, with the first cover film 24. In other words, the circuit protection of the second FPC20 employs multiple layers of protection: the bottom reinforcement, the second adhesive layer 23, and the first cover film 24.

[0040] In this embodiment, the second FPC 20 typically transmits the side button signals to the motherboard, and its wiring may be denser or longer than that of the first FPC 10. By retaining the first cover film 24, excellent insulation and bending resistance can be provided on the top layer, preventing short circuits during assembly or use. Simultaneously, the second insulating reinforcement 22 on the bottom layer, in conjunction with the second adhesive layer 23, provides the necessary rigidity and dimensional stability for the second FPC 20, ensuring its positioning accuracy within the side button structure 4.

[0041] Furthermore, although the first FPC10 adopts a thinning design by removing the cover film, the second FPC20, which is provided with the first cover film 24, is located in the middle frame area 3. The second FPC20 retains the first cover film 24 to meet different design requirements, such as more complex circuit routing, and retains a certain degree of traditional reliability for the side key FPC1.

[0042] Optionally, in this embodiment, the second flexible substrate 21 includes a second conductive layer, a second insulating layer 212 and a third conductive layer 211. The first conductive layer 111, the second insulating layer 212 and the third conductive layer 211 are stacked sequentially. The third conductive layer 211 is connected to the first cover film 24, and the second conductive layer and the second adhesive layer 23 are connected. In this embodiment, the second flexible substrate 21 has a double-layer conductive structure. Specifically, the second flexible substrate 21 uses a second insulating layer 212 as a medium, and a second conductive layer and a third conductive layer 211 are respectively disposed on both sides. In terms of the stacking relationship, the top third conductive layer 211 is connected to the first cover film 24, that is, the first cover film 24 provides flexible insulation protection for the third conductive layer 211, while the bottom second conductive layer can be connected to the second insulating reinforcement 22 by direct bonding of the second adhesive layer 23. The above arrangement makes the second FPC 20 form an asymmetrical stacked system, with a flexible circuit protection layer on top and a rigid circuit support layer below.

[0043] In this embodiment, by employing a double-layer conductive layer design, double-sided wiring is achieved without increasing the thickness of the second FPC20. Simultaneously, the differentiated design of the top coating and the bottom reinforcement optimizes functionality. Understandably, the first coating film 24 on the top layer utilizes its excellent flexibility to protect the third conductive layer 211 from external impacts and bending fractures. The second adhesive layer 23 on the bottom layer, in conjunction with the second insulating reinforcement 22, provides a robust and rigid base for the second FPC20, preventing warping during welding or assembly.

[0044] It should be noted that the second conductive layer and the third conductive layer 211 can be made of copper; the second insulating layer 212 can be made of polyimide.

[0045] Optionally, in an embodiment of this application, at least one first opening 1121 is provided on the first insulating layer 112, and at least a portion of the first conductive layer 111 is exposed through the first opening 1121 to form a welding area 14.

[0046] In this embodiment, at least one first opening 1121, i.e., a through hole or a hollow area, is formed on the first insulating layer 112, which serves as the core of the substrate. The position of the first opening 1121 corresponds to a specific area of ​​the first conductive layer 111. Through the above-mentioned opening structure, the surface of the first conductive layer 111 is selectively exposed and is no longer covered by the first insulating layer 112, thereby forming an exposed welding area 14. The above arrangement allows the first conductive layer 111 to be firmly pressed against the external first insulating reinforcement 12 through the first adhesive layer 13, while also remaining open at the specific first opening 1121 to allow for electrical connection with the independent second FPC 20.

[0047] In this embodiment, by creating a first window 1121 on the first insulating layer 112, it is achieved that while retaining the overall rigid support provided by the first insulating reinforcement 12, the welding area 14 is free of any excess insulating layer obstruction. This means that the welding area 14 can be directly exposed for welding, without the need to create a window on the cover film as in traditional processes. This further eliminates potential warping or thickness accumulation at the edges of the cover film, achieving a smooth and thinned welding area 14. Furthermore, when the first FPC 10 is connected to the second FPC 20 or the motherboard, such as during welding, the edge of the window can serve as a visual alignment reference or as a limiting groove for solder flow. According to the aforementioned laser ablation process, the window edges in this application are neat and burr-free, effectively preventing short circuits caused by solder bridging during the welding process.

[0048] Optionally, in this embodiment, the first FPC10 includes a first end and a second end disposed opposite to each other, and the welding area 14 is disposed at the first end or the second end.

[0049] In this embodiment, the first FPC 10 has a first end and a second end that are disposed opposite to each other. It is understood that the first FPC 10 can be elongated or have a specific shape. The welding area 14 is located at the end region of either the first or second end. That is, the electrical connection interface of the first FPC 10 is located at its structural end, not in the middle region. This arrangement makes the first FPC 10 form a clearly defined signal input end, which is generally used for docking with the second FPC 20, while the remaining portion of the first FPC 10 is mainly used for line transmission and the implementation of the side key structure 4 function.

[0050] In this embodiment, the welding area 14 is located at the end, allowing the first FPC10 to be arranged in a close, end-to-end or mirror-symmetrical configuration during panel assembly. Since the connection point is located at the edge, the panel separation operation can be performed outside the welding area 14, avoiding damage to the welding area 14 due to panel separation stress. Furthermore, during end welding of the first FPC10, tools can directly approach the welding area 14 from the side or end of the first FPC10 without being obstructed by the mechanical structure of the side key structure 4. This end welding method reduces assembly difficulty and improves production efficiency.

[0051] Optionally, in this embodiment, the second FPC20 further includes at least two pads 25, which are electrically connected to the second flexible substrate 21.

[0052] In this embodiment, the second FPC 20 not only includes the aforementioned second conductive layer and third conductive layer 211, but also further includes at least two pads 25. These pads 25 are electrically connected to the second flexible substrate 21 through vias or direct lamination. The pads 25 are typically distributed at the connection ends of the second FPC 20, such as the tail end connected to the first FPC 10, forming a row of electrical contacts for transmitting data signals.

[0053] In this embodiment, modern electronic devices require the transmission of complex signals, and the side key structure 4 is often more than just a simple mechanical switch. The design of at least two pads 25 allows the second FPC 20 to simultaneously carry power and signal lines. Through the wiring capabilities of the second and third conductive layers 211, these pads 25 can distribute different signals to different circuit layers, avoiding the limitations of single-line transmission and meeting the multi-functional integration requirements of the side key structure 4. Compared to single-point soldering, setting at least two pads 25 forms an array connection. When the second FPC 20 is soldered to the motherboard or the first FPC 10, multiple solder points share the external stress, significantly enhancing the mechanical strength of the connection, preventing the pads 25 from peeling or breaking due to excessive force at a single point, and improving the durability of the product.

[0054] Optionally, in this embodiment, the second FPC20 includes a third end and a fourth end disposed opposite to each other, and at least two pads 25 are disposed on the third end or the fourth end.

[0055] In this embodiment, the second FPC 20 has a third end and a fourth end arranged opposite to each other. It is understood that the second FPC 20 can be elongated or have a specific shape, and at least two pads 25 are disposed at the third or fourth end. Furthermore, at least two pads 25 are concentrated in the end region of the third or fourth end. This means that the electrical interface of the second FPC 20 is located at its physical edge. This arrangement allows one end of the second FPC 20, such as the third end, to be dedicated to multi-point electrical connections with the first FPC 10, while the other end (such as the fourth end) may be used for electrical connections with the motherboard. The concentrated arrangement of the pads 25 at the ends, combined with the double-layer conductive structure of the second FPC 20, enables efficient signal transfer from the side key area 2 to the motherboard.

[0056] Optionally, in this embodiment, the welding area 14 and the pad 25 are welded.

[0057] In the embodiments of this application, the soldering area 14 and the solder pad 25 can be laser soldered with through-hole soldering, or can be soldered using methods not limited to BTB (Board-to-Board) bonding, ZIF (Zero Insertion Force) bonding, SMT (Surface Mount Technology Soldering), etc.

[0058] In this embodiment, splitting the side button FPC1 into independent first FPC10 and second FPC20 improves the panelization ratio. Compared to using connectors, direct soldering eliminates the height and footprint of the connector itself. The direct fusion of the soldering area 14 and the pad 25 ensures that the thickness at the connection is determined solely by the solder layer, significantly reducing the space occupied by the first FPC10 in the side button area 2. This is crucial for side button applications that pursue extreme thinness (such as side fingerprint sensors and ultra-thin side buttons), and also avoids the risk of loosening or poor contact that may occur during connector insertion and removal.

[0059] It should be noted that the thickness of the side button area 2 in this application can be reduced by about 0.03mm compared to the original design, providing more space for the battery. The battery benefit can be roughly calculated as: battery density * battery thickness * 0.03mm.

[0060] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0061] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, The electronic device includes a side key structure (4) and a side key FPC (1) that are interconnected. The electronic device has a side key area (2) and a middle frame area (3). The side key structure (4) is disposed in the side key area (2), and the side key FPC (1) is disposed in the side key area (2) and the middle frame area (3). The side button FPC (1) includes a first FPC (10), which is disposed within the side button area (2); The first FPC (10) includes a first flexible substrate (11), a first insulating reinforcement (12) and a first adhesive layer (13). The first flexible substrate (11) and the first insulating reinforcement are stacked together. The first adhesive layer (13) is disposed between the first flexible substrate (11) and the first insulating reinforcement (12). The first adhesive layer (13) is connected to the first flexible substrate (11) and the first insulating reinforcement (12) respectively.

2. The electronic device according to claim 1, characterized in that, The first flexible substrate (11) includes a first conductive layer (111) and a first insulating layer (112), the first conductive layer (111) and the first insulating layer (112) are stacked, and the first conductive layer (111) and the first adhesive layer (13) are connected.

3. The electronic device according to claim 1, characterized in that, The side key FPC (1) further includes a second FPC (20), which is independent of and electrically connected to the first FPC (10).

4. The electronic device according to claim 3, characterized in that, The second FPC (20) includes a second flexible substrate (21), a second insulating reinforcement (22), a second adhesive layer (23), and a first cover film (24). The first cover film (24), the second flexible substrate (21), and the second insulating reinforcement (22) are stacked in sequence. The second adhesive layer (23) is disposed between the second flexible substrate (21) and the second insulating reinforcement (22). The second adhesive layer (23) is connected to the second flexible substrate (21) and the second insulating reinforcement (22) respectively.

5. The electronic device according to claim 1, characterized in that, The second flexible substrate (21) includes a second conductive layer, a second insulating layer (212) and a third conductive layer (211). The first conductive layer (111), the second insulating layer (212) and the third conductive layer (211) are stacked in sequence. The third conductive layer (211) is connected to the first cover film (24), and the second conductive layer is connected to the second adhesive layer (23).

6. The electronic device according to claim 2, characterized in that, The first insulating layer (112) has at least one first opening (1121), and at least a portion of the first conductive layer (111) is exposed through the first opening (1121) to form a welding area (14).

7. The electronic device according to claim 6, characterized in that, The first FPC (10) includes a first end and a second end disposed opposite to each other, and the welding area (14) is disposed at the first end or the second end.

8. The electronic device according to claim 4, characterized in that, The second FPC (20) also includes at least two pads (25) that are electrically connected to the second flexible substrate (21).

9. The electronic device according to claim 8, characterized in that, The second FPC (20) includes a third end and a fourth end disposed opposite to each other, and at least two of the pads (25) are disposed on the third end or the fourth end.

10. The electronic device according to claim 9, characterized in that, The welding area (14) and the welding pad (25) are welded.

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