A heat dissipation and antenna integrated vertical polarization omnidirectional radiation antenna

Abstract

The application relates to a heat dissipation and antenna integrated vertical polarization omnidirectional radiation antenna, belonging to the technical field of wireless communication and antennas. The antenna comprises a metal radiation patch, a metal grounding plate, a metal heat dissipation fin array, a metal grounding fixing screw and a coaxial feeding device. The metal radiation patch is composed of a main radiation patch and a rectangular ring-shaped parasitic patch, the two are coupled through a gap, a double resonance working mode is excited to expand the bandwidth. The metal heat dissipation fin array is vertically fixed on the grounding plate and comprises support heat dissipation fins for bearing the radiation patch and auxiliary heat dissipation fins for enhancing the heat dissipation area; the support heat dissipation fins actively control the ground current through electrical connection with the radiation patch to form stable omnidirectional radiation. The application realizes the integration of the heat dissipation and radiation functions, ensures efficient heat dissipation, obtains wideband, vertical polarization omnidirectional radiation performance, and has a simple and solid structure and is convenient to process, and is suitable for modern wireless communication equipment with high integration and heat dissipation requirements.

Description

Technical Field

[0001] This invention belongs to the field of wireless communication, antenna and electronic equipment thermal management technology, and relates to a vertically polarized omnidirectional radiating antenna that integrates heat dissipation and antenna. Background Technology

[0002] In wireless electronic devices, the radio frequency front-end, power module, power amplifier, processing chip, and other high-power electronic components typically generate heat during operation. To ensure the long-term stable operation of electronic devices, heat sinks, heat dissipation fins, thermally conductive metal housings, heat spreaders, or other thermal management components are usually installed inside or outside the device.

[0003] The aforementioned heat dissipation structures are typically made of metals with high thermal conductivity, such as aluminum, aluminum alloys, copper, and copper alloys. While possessing excellent thermal conductivity, they also exhibit strong electrical conductivity. Therefore, in electronic devices with wireless communication capabilities, the heat dissipation structure not only performs the functions of heat transfer and dissipation but also participates in the electromagnetic field distribution inside and around the device, influencing the antenna's resonant frequency, input impedance, radiation efficiency, polarization characteristics, and radiation pattern.

[0004] In traditional designs, heat sinks are primarily designed based on heat dissipation area, airflow channels, mechanical strength, installation methods, and manufacturing processes, while antennas are designed and installed as relatively independent radio frequency radiating components. The two are typically designed and optimized separately. However, in actual system environments, the distance between the antenna and the heat sink is often quite short. The metal surface, edges, fins, mounting holes, and connection structures of the heat sink can alter the surface current distribution and near-field distribution near the antenna, leading to antenna resonant frequency shifts, input impedance changes, decreased radiation efficiency, or radiation pattern distortion.

[0005] Vertically polarized omnidirectional antennas can create relatively stable horizontal communication coverage around equipment, making them suitable for applications such as mobile terminals, vehicle-mounted devices, wireless sensor nodes, industrial communication equipment, unmanned platforms, wireless access devices, and base station auxiliary equipment. Common vertically polarized omnidirectional antennas include monopole antennas, dipole antennas, sleeve antennas, whip antennas, and printed monopole antennas. These antennas typically require a radiator of a specific length, a grounding structure, and installation clearance to achieve the desired impedance matching and radiation performance.

[0006] In compact wireless electronic devices equipped with heat sinks, the installation of traditional vertically polarized omnidirectional antennas is easily limited by the heat dissipation structure. On the one hand, heat sinks usually occupy a relatively critical space in the device, making it difficult for the antenna to obtain an ideal installation height and clearance area; on the other hand, the metal fins, edges, mounting holes, and connection structures on the surface of the heat sink can introduce additional parasitic coupling, resulting in an uneven horizontal radiation pattern of the antenna, increased cross-polarization, or a shift in the operating frequency band.

[0007] To mitigate the impact of heat dissipation structures on antenna performance, existing solutions typically employ methods such as increasing the distance between the antenna and the heat sink, adding insulating components, changing the antenna's mounting location, using an external antenna, or installing an additional matching network. However, these methods generally increase the overall structural complexity and assembly costs, occupy limited internal or external installation space, and hinder the development of wireless electronic devices towards miniaturization, high integration, and compact structures. External antennas or additional isolation structures may also affect the device's appearance consistency, mechanical reliability, and environmental adaptability.

[0008] While some existing antenna integration solutions attempt to combine the antenna with a metal casing, bracket, or other structural components, most solutions focus on antenna installation and fixation, shared structures, or partial reuse of metal structures. They often fail to adequately consider the electromagnetic relationship between the heat sink's metal substrate, heat dissipation fins, slotted structures, columnar structures, and other heat dissipation structures and the vertically polarized omnidirectional antenna. This is especially true when the heat sink has fin arrays, slotted structures, non-uniform arrangements, or irregular shapes. Treating the heat sink merely as an independent heat dissipation component can easily turn it into an uncertain metallic environment that affects antenna performance, making it difficult to simultaneously achieve optimal heat dissipation performance, antenna installation space, and vertically polarized omnidirectional radiation performance.

[0009] Therefore, there is still a significant structural and performance contradiction between the antenna structure and the heat dissipation structure in existing wireless electronic devices. There is an urgent need to propose a radiation device that can integrate the heat dissipation structure with the vertically polarized omnidirectional antenna. This device can meet the heat dissipation requirements of electronic devices, reduce the dependence of independent antennas on additional installation space and electromagnetic clearance, and reduce the uncertain influence of the heat dissipation structure on the antenna resonance state and radiation characteristics, thereby improving the space utilization and structural integration of wireless electronic devices. Summary of the Invention

[0010] The purpose of this invention is to solve the problems of mutual space occupation and mutual coupling interference between heat dissipation structures and antenna structures in compact wireless electronic devices, and to provide a vertically polarized omnidirectional radiating antenna that integrates heat dissipation and antenna. This invention sets at least a portion of the heat dissipation fins in the heat dissipation fin array as conductive support structures and RF current return structures for the radiating components, enabling the heat dissipation structure to simultaneously perform heat transfer, mechanical support, RF grounding, short-circuit loading, and electromagnetic field modulation functions. Furthermore, this invention generates at least two resonant modes through gap coupling between the directly excited radiating conductor and the peripherally coupled radiating conductor, and uses the supporting heat dissipation fins to adjust the corresponding RF current paths, causing multiple resonant modes to approach each other or partially overlap in frequency. This achieves wideband, vertical polarization, and horizontal omnidirectional radiation while maintaining heat dissipation performance.

[0011] To achieve the above objectives, the present invention adopts the following technical solution: A vertically polarized omnidirectional radiating antenna integrating heat dissipation and antenna is provided, comprising a metal radiating patch 1, a metal ground plane 2, a metal heat dissipation fin array 3, a metal grounding fixing screw 4, and a coaxial feeding device 5.

[0012] The metal ground plane 2 constitutes the radio frequency grounding reference surface of the vertically polarized omnidirectional radiating antenna and serves as the mechanical mounting substrate and main heat-conducting substrate of the metal heat sink array 3.

[0013] The metal heat dissipation fin array 3 is disposed on one side of the metal grounding plate 2, and includes multiple metal heat dissipation fins spaced apart from each other. The metal heat dissipation fin array 3 and the metal grounding plate 2 together form a composite grounding structure that has both heat conduction and electromagnetic functions.

[0014] The metal radiating patch 1 is disposed on the side of the metal heat sink fin array 3 away from the metal ground plane 2. The metal radiating patch 1 includes a rectangular main radiating patch 1-1 and a rectangular annular parasitic patch 1-2 disposed around the rectangular main radiating patch 1-1, wherein the rectangular main radiating patch 1-1 is provided with a first power supply through hole 1-3.

[0015] The coaxial power supply device 5 includes an inner conductor and an outer conductor. The inner conductor of the coaxial power supply device 5 is electrically connected to the first power supply through hole 1-3, and the outer conductor of the coaxial power supply device 5 is electrically connected to the metal grounding plate 2.

[0016] Furthermore, a continuous or discontinuous coupling gap is formed between the rectangular main radiating patch 1-1 and the rectangular annular parasitic patch 1-2, so that the radio frequency near field generated by the rectangular main radiating patch 1-1 can be coupled to the rectangular annular parasitic patch 1-2 through the coupling gap.

[0017] Furthermore, the metal ground plane 2 is provided with a second power supply through hole 2-1 through which the inner conductor of the coaxial power supply device 5 passes. The second power supply through hole 2-1 is provided correspondingly to the first power supply through hole 1-3.

[0018] Furthermore, at least some of the metal heat dissipation fins in the metal heat dissipation fin array 3 constitute supporting heat dissipation fins 3-1, and the remaining metal heat dissipation fins constitute auxiliary heat dissipation fins 3-2. The supporting heat dissipation fins 3-1 are used to support the metal radiating patch 1. At least some of the supporting heat dissipation fins 3-1 form mechanical and electrical connections with the rectangular main radiating patch 1-1 and / or the rectangular annular parasitic patch 1-2, so that the corresponding radiating patch forms an RF current return path or a short-circuit loading path between the supporting heat dissipation fins 3-1 and the metal ground plane 2.

[0019] Furthermore, the metal radiating patch 1 is provided with a first fixing screw through hole 1-4, and the metal grounding plate 2 is provided with a second fixing screw through hole 2-2. The metal grounding fixing screw 4 fixes the metal radiating patch 1, the supporting heat dissipation fins 3-1, and the metal grounding plate 2 through the corresponding first fixing screw through hole 1-4 and second fixing screw through hole 2-2.

[0020] When the rectangular main radiating patch 1-1 is electrically connected to the metal ground plane 2 through the supporting heat sink 3-1, the first power feed through hole 1-3 on the rectangular main radiating patch 1-1 and the electrical connection position of the supporting heat sink 3-1 are spaced apart from each other, so that the radio frequency current input to the rectangular main radiating patch 1-1 forms a radio frequency current path with a predetermined equivalent electrical length along the rectangular main radiating patch 1-1, the supporting heat sink 3-1 and the metal ground plane 2.

[0021] Furthermore, the rectangular main radiating patch 1-1 forms a first resonant mode under the direct excitation of the coaxial feed device 5, and the rectangular annular parasitic patch is subjected to near-field coupling excitation through the coupling gap and forms a second resonant mode.

[0022] By adjusting the structural parameters between the rectangular main radiating patch 1-1, the rectangular annular parasitic patch 1-2, the coupling gap, and the supporting heat dissipation fins 3-1, the first resonant mode and the second resonant mode are brought closer to each other or partially overlapped in frequency, thereby expanding the impedance operating bandwidth of the vertically polarized omnidirectional radiating device.

[0023] Furthermore, the heat dissipation fins 3-1 are also used to regulate the radio frequency current return path of the rectangular main radiating patch 1-1 and the rectangular annular parasitic patch 1-2, as well as the current distribution on the metal ground plane 2 and the metal heat dissipation fin array 3.

[0024] By setting the number, position, height, distribution, and electrical connection status of the supporting heat dissipation fins 3-1, the vertically polarized omnidirectional radiation device can form a vertically polarized omnidirectional or near-omnidirectional radiation pattern in the azimuth plane surrounding its vertical axis.

[0025] Furthermore, the rectangular main radiating patch 1-1 and the rectangular annular parasitic patch 1-2 are horizontally coplanar planar metal conductors. Specifically: The rectangular main radiating patch 1-1 is located in the middle of the metal radiating patch 1, serving as a direct excitation radiating unit. The first feed via 1-3 is located in the middle region of the rectangular main radiating patch 1-1, preferably at or near the geometric center of the rectangular main radiating patch 1-1.

[0026] A rectangular annular parasitic patch 1-2 is disposed around the rectangular main radiating patch 1-1 and maintains a predetermined distance from the rectangular main radiating patch 1-1.

[0027] The rectangular annular parasitic patch 1-2 can be a continuous annular structure with a rectangular central opening, a discontinuous annular structure with one or more breaks, or an outer coupling structure composed of multiple parasitic radiation units spaced apart from each other.

[0028] The coupling gap between the rectangular main radiating patch 1-1 and the rectangular annular parasitic patch 1-2 forms a capacitive coupling path, enabling the rectangular annular parasitic patch 1-2 to be excited through near-field coupling.

[0029] By adjusting the width of the coupling gap, the ring width of the rectangular annular parasitic patch 1-2, the outer dimensions of the rectangular main radiating patch 1-1, the inner and outer contour dimensions of the rectangular annular parasitic patch 1-2, and the corresponding grounding connection positions, the resonant frequency, coupling strength, and impedance matching state of the first and second resonant modes can be adjusted.

[0030] The rectangular main radiating patch 1-1 is not limited to a rectangular structure; it can also be circular, elliptical, polygonal, or other planar conductive structures.

[0031] The rectangular annular parasitic patch 1-2 is not limited to a rectangular annular structure; it can also be a circular annular, elliptical annular, polygonal annular, fan-shaped annular, discontinuous annular, or an outer coupling structure composed of multiple parasitic units.

[0032] The rectangular main radiating patch 1-1 and the rectangular annular parasitic patch 1-2 can be set on the same plane, or a predetermined height difference can be set according to the equipment installation space, impedance matching and radiation performance requirements.

[0033] The first fixing screw through hole 1-4 is located at the edge area of ​​the rectangular main radiating patch 1-1 and the rectangular annular parasitic patch 1-2, for the metal grounding fixing screw 4 to pass through.

[0034] The metal ground plane 2 is a planar plate structure or a conductive structure adapted to the installation space of electronic equipment.

[0035] The metal ground plane 2 includes a second power supply through hole 2-1 and a second fixing screw through hole 2-2.

[0036] The second power supply through-hole 2-1 is used for the inner conductor of the coaxial power supply device 5 to pass through. The outer conductor of the coaxial power supply device 5 is electrically connected to the lower surface of the metal ground plane 2, the conductive area around the second power supply through-hole 2-1, or the mounting flange of the coaxial power supply device 5.

[0037] The wall of the second power supply through-hole 2-1 maintains an insulating gap with the inner conductor of the coaxial power supply device 5 to prevent the inner conductor of the coaxial power supply device 5 from being directly short-circuited with the metal grounding plate 2.

[0038] The second fixing screw through hole 2-2 is used to cooperate with the first fixing screw through hole 1-4 and the metal grounding fixing screw 4 to fix and connect the metal radiation patch 1, the supporting heat dissipation fins 3-1 and the metal grounding plate 2.

[0039] The metal ground plane 2 serves as the overall radio frequency grounding reference surface of the vertically polarized omnidirectional radiation device, and also as the mounting substrate, mechanical bearing substrate, and main heat-conducting substrate of the metal heat sink array 3.

[0040] The length, width, thickness and outer contour of the metal grounding plate 2 can be determined together based on the target operating frequency band, heat dissipation power, mechanical strength and equipment installation space.

[0041] The metal heat dissipation fin array 3 is disposed on the metal ground plane 2 and consists of multiple conductive heat dissipation fins.

[0042] The metal heat sink array 3 includes supporting heat sink 3-1 and auxiliary heat sink 3-2.

[0043] The heat dissipation fins 3-1 are used to support the metal radiating patch 1, and form a mechanical and electrical connection with the rectangular main radiating patch 1-1 and / or the rectangular annular parasitic patch 1-2 through a metal grounding fixing screw 4, a welding structure, a riveting structure, a pressing structure, or an integral molding structure.

[0044] The auxiliary heat dissipation fins 3-2 are mainly used to increase the heat dissipation surface area and can be spaced apart from the metal radiating patch 1.

[0045] In one embodiment, the height of the supporting heat dissipation fin 3-1 is greater than the height of the auxiliary heat dissipation fin 3-2, so that the metal radiating patch 1 is supported by the supporting heat dissipation fin 3-1 and maintains a predetermined gap with the auxiliary heat dissipation fin 3-2.

[0046] The height difference between the supporting heat sink 3-1 and the auxiliary heat sink 3-2 is an adjustable parameter. By adjusting the height difference, the height of the metal radiating patch 1 relative to the metal ground plane 2, the equivalent RF inductance of the supporting heat sink 3-1, and the equivalent electrical length of the corresponding RF current path can be changed, thereby adjusting the resonant frequency and input impedance of the device.

[0047] The heat dissipation fin 3-1 can be connected only to the rectangular main radiating patch 1-1, only to the rectangular annular parasitic patch 1-2, or to both the rectangular main radiating patch 1-1 and the rectangular annular parasitic patch 1-2.

[0048] Different supporting heat dissipation fins 3-1 can also be configured as first supporting heat dissipation fins and second supporting heat dissipation fins according to their electromagnetic functions. Among them, the first supporting heat dissipation fin is used to form the radio frequency current return path of the rectangular main radiating patch 1-1, and the second supporting heat dissipation fin is used to form the radio frequency current return path of the rectangular annular parasitic patch 1-2.

[0049] The cross-section of the metal heat dissipation fins in the metal heat dissipation fin array 3 is not limited to rectangles; it can also be trapezoidal, triangular, arc-shaped, wave-shaped, sawtooth-shaped, or other irregular cross-sections.

[0050] The arrangement of the metal heat sink array 3 on the metal ground plane 2 is not limited to a periodic arrangement with equal spacing. It can also be arranged with non-uniform intervals, partitioned arrangement or localized dense arrangement according to the distribution of heat sources inside the electronic device, heat dissipation air duct and installation space.

[0051] The metal grounding fixing screw 4 is used to fix the metal radiating patch 1 to the top of the supporting heat dissipation fin 3-1 and to establish an electrical connection between the metal radiating patch 1, the supporting heat dissipation fin 3-1 and the metal grounding plate 2.

[0052] The metal grounding fixing screw 4 passes through the corresponding first fixing screw through hole 1-4 in sequence and is connected to the supporting heat dissipation fin 3-1 and the metal grounding plate 2.

[0053] The metal grounding fixing screw 4 has the functions of mechanical fastening, electrical connection and heat conduction.

[0054] In other embodiments, the metal grounding fixing screw 4 can be replaced by a welded part, a conductive rivet, a conductive post, a crimping part, or a conductive connection part integrally formed with the supporting heat dissipation fins 3-1.

[0055] The coaxial power supply device 5 is installed on the side of the metal ground plane 2 away from the metal radiating patch 1, and includes an inner conductor and an outer conductor.

[0056] The outer conductor of the coaxial power supply device 5 is electrically connected to the metal ground plane 2. The inner conductor of the coaxial power supply device 5 passes through the second power supply through-hole 2-1 on the metal ground plane 2 and extends to the location of the metal radiating patch 1.

[0057] The top end of the inner conductor of the coaxial power supply device 5 is welded, crimped, or connected to the first power supply through hole 1-3 on the rectangular main radiating patch 1-1 by other conductive means to form the direct excitation point of the rectangular main radiating patch 1-1.

[0058] When the rectangular main radiating patch 1-1 is electrically connected to the metal ground plane 2 through the supporting heat sink 3-1, the first power feed through-hole 1-3 is separated from the corresponding ground connection position. The distance between the first power feed through-hole 1-3 and the ground connection position is used to adjust the input impedance and equivalent RF current path of the rectangular main radiating patch 1-1.

[0059] In addition to the coaxial power supply device 5, probe power supply structure, microstrip power supply structure, stripline power supply structure or coupling power supply structure can also be adopted according to the structure of the electronic equipment.

[0060] The working principle of this invention is as follows: A radio frequency (RF) signal is input to the rectangular main radiating patch 1-1 via a coaxial feed device 5, causing a first surface current distribution and generating a first resonant mode on the rectangular main radiating patch 1-1. When a short-circuit loading path is provided between the rectangular main radiating patch 1-1 and the metal ground plane 2, the RF current propagates from the first feed via 1-3 along the rectangular main radiating patch 1-1 to the corresponding ground connection position, and then flows to the metal ground plane 2 via the supporting heat sink 3-1. The first feed via 1-3 on the rectangular main radiating patch 1-1, the ground connection position, and the height and cross-sectional dimensions of the supporting heat sink 3-1 jointly determine the equivalent electrical length, equivalent inductance, and input impedance of the first RF current path. The RF near-field generated by the rectangular main radiating patch 1-1 is coupled to the rectangular annular parasitic patch 1-2 through a coupling gap, causing a second surface current distribution and generating a second resonant mode on the rectangular annular parasitic patch 1-2. The rectangular annular parasitic patch 1-2 forms an RF current return path with the metal ground plane 2 through the corresponding supporting heat sink 3-1. The external dimensions, coupling gap, grounding connection position of the rectangular annular parasitic patch 1-2 and the structural parameters of the corresponding supporting heat dissipation fins 3-1 jointly affect the resonant frequency and impedance characteristics of the second resonant mode.

[0061] Wideband impedance matching can be achieved by bringing the first and second resonant modes close to or partially overlapping each other in frequency. The supporting heat sink fins 3-1 extend away from the metal ground plane 2, and the radio frequency current on them has a current component distributed along the extending direction. When the metal ground plane 2 is horizontal, the radio frequency current on the supporting heat sink fins 3-1 has a vertical current component. By symmetrically or approximately symmetrically arranging multiple supporting heat sink fins 3-1, the device can form a vertically polarized omnidirectional or approximately omnidirectional radiation pattern in the horizontal plane. Simultaneously, the heat generated by the heat-generating components in the electronic device can be transferred to the metal heat sink fin array 3 via the metal ground plane 2 and dissipated outwards through at least one of natural convection, forced convection, and thermal radiation.

[0062] Therefore, the metal ground plane 2 and the metal heat sink array 3 participate in heat transfer and radio frequency current regulation simultaneously, realizing the integration of heat dissipation structure and antenna structure in physical space and electromagnetic function.

[0063] The innovative aspects of this invention are analyzed as follows: 1) Supporting heat sinks and auxiliary heat sinks are set in the same heat sink array. The supporting heat sinks simultaneously support the radiating patch, conduct heat, and provide RF return / short circuit function from the radiating patch to the ground plane. The auxiliary heat sinks are spaced apart from the radiating patch, thereby realizing the coordinated configuration of thermal and RF functions inside the heat dissipation structure.

[0064] 2) The central main radiating patch is directly fed, while the peripheral parasitic radiating patches are excited by gap coupling. The selected supporting heat dissipation fins form corresponding grounding return paths, so that the coupling paths between patches and the short-circuit loading paths of the fins jointly participate in the formation and regulation of multiple resonant modes.

[0065] 3) Multiple supporting heat dissipation fins are distributed circumferentially along the radiating structure, forming multiple vertical radio frequency current paths between the radiating patch and the ground plane. The circumferential current and electromagnetic field distribution are controlled by the number, position and distribution of the fins to achieve vertically polarized omnidirectional or near-omnidirectional radiation.

[0066] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) Improve structural integration and space utilization. By using some heat dissipation fins as conductive supports, RF return current and short-circuit loading structures for the radiating patch, the heat dissipation structure and the antenna structure share space and components, reducing the need for independent antennas and additional support structures.

[0067] (2) Balancing heat dissipation performance and antenna performance. While supporting the heat dissipation fins to perform radio frequency functions, the auxiliary heat dissipation fins continue to be used to increase the heat dissipation area, so that the heat dissipation fin array can participate in antenna operation while maintaining heat dissipation capacity, thereby reducing the uncertain impact of the heat dissipation structure on antenna performance.

[0068] (3) Expanding the antenna operating bandwidth. Through the coupling between the main radiating patch and the peripheral parasitic radiating patch, as well as the short-circuit loading and RF return path formed by the supporting heat sink fins, multiple resonant modes are adjusted together, so that multiple resonant frequencies are close to each other or partially overlap, thereby obtaining a wider impedance operating bandwidth.

[0069] (4) Improve vertical polarization omnidirectional radiation performance. Multiple supporting heat dissipation fins form radio frequency current paths distributed along the height direction between the radiating patch and the metal ground plane. By controlling the current and electromagnetic field distribution through their number, position and circumferential distribution, it is beneficial to obtain a vertical polarization omnidirectional or near-omnidirectional radiation pattern.

[0070] (5) Improve the adjustability of antenna parameters. By adjusting the height, position, number of supporting heat sink fins and their connection relationship with different radiating patches, the RF current path, resonant frequency, input impedance and radiation pattern can be adjusted in a coordinated manner, thereby improving the antenna's adaptability to different operating frequency bands and equipment structures. Attached Figure Description

[0071] Figure 1 This is a simulation diagram of the antenna structure of this invention; Figure 2 This is a magnified view of a portion of the metal radiation patch 1; Figure 3 This is a partial enlarged view of the metal ground plane 2 and the metal heat dissipation fin array 3; Figure 4 This is a simulation curve of the reflection coefficient of this invention; Figure 5 This is the xoy plane gain curve simulated in this invention; Figure 6 This is the simulation pattern of the xoy plane at 5.4 GHz according to the present invention; In the diagram: 1. Metal radiating patch; 2. Metal ground plane; 3. Metal heat dissipation fin array; 4. Metal grounding fixing screw; 1-1 Rectangular main radiating patch; 1-2 Rectangular annular parasitic patch; 1-3 First power supply through hole; 1-4 First fixing screw through hole; 2-1 Second power supply through hole; 2-2 Second fixing screw through hole; 3-1 Supporting heat dissipation fins; 3-2 Auxiliary heat dissipation fins. Detailed Implementation

[0072] The present invention will be further described below with reference to specific implementation examples.

[0073] The vertically polarized omnidirectional antenna is based on a heat sink structure and consists of four parts: a metal radiating patch 1, a metal ground plane 2, a metal heat sink fin array 3, and a metal grounding fixing screw 4.

[0074] The metal radiating patch 1 consists of a rectangular main radiating patch 1-1 and a rectangular annular parasitic patch 1-2, both arranged horizontally and coplanarly. The rectangular main radiating patch 1-1 is located at the center, and its dimensions are designed based on the operating frequency of 5.4GHz, specifically 20mm. 20 mm; Rectangular annular parasitic patches 1-2 surround the outer side of the main radiating patch, with an outer edge dimension of 48 mm. 40 mm, inner edge dimension is 34 mm 28 mm. The main radiating patch and the parasitic patch are coupled through a preset annular gap. By optimizing the size of this gap, the coupling strength and relative position of the dual resonant frequency can be precisely controlled, which is the core design parameter for achieving broadband impedance matching.

[0075] The high thermal conductivity metal ground plane 2 is made of aluminum alloy, with a thickness of 2 mm, a length of 50 mm, and a width of 42 mm. It serves as the overall grounding reference surface for the antenna, the mechanical mounting substrate, and the main heat-conducting substrate. The metal heat sink array 3 is vertically fixed to the metal ground plane 2, and all fins have the same rectangular cross-section (2.7 mm²). 1 mm (height difference as below), arranged periodically along the length of the ground plane, with a horizontal spacing of 2.4 mm and a vertical spacing of 1.5 mm, forming a regular grooved radiator structure.

[0076] The metal heat sink array 3 is divided into two types: supporting heat sink fins 3-1 with a height of 5.5mm, whose top platform is used to support and fix the metal radiating patch 1; and auxiliary heat sink fins 3-2 with a height of 4.2mm, which focus on increasing the heat dissipation area. In this embodiment, four supporting heat sink fins 3-1 are symmetrically arranged at the four corners of the rectangular main radiating patch 1-1, and 36 supporting heat sink fins 3-1 are located in the outermost layer, supporting the rectangular annular parasitic patch 1-2 to ensure mechanical stability; the auxiliary heat sink fins 3-2 are evenly distributed among the supporting fins. The supporting heat sink fins 3-1, through electrical connection with the radiating patch, actively participate in and regulate the current distribution of the antenna ground plane, which is key to forming a stable omnidirectional radiation pattern.

[0077] The power supply adopts a center-feed method. The outer conductor of the 50 Ω SMA coaxial power supply device 5 is connected to the second power supply through-hole 2-1 on the metal ground plane 2. After passing through the ground plane, the inner conductor is welded to the first power supply through-hole 1-3 located at the center of the rectangular main radiating patch 1-1. The metal grounding fixing screws 4 include metal grounding screws for the rectangular main radiating patch 1-1 and metal grounding screws for the rectangular annular parasitic patch 1-2, a total of 8 screws (2 at each of the four corners), which fasten the metal radiating patch 1 to the top of the supporting heat sink fin 3-1 to ensure the reliability and stability of the electrical connection. The screws are M1.6 size and made of stainless steel.

[0078] refer to Figure 4 The reflection coefficient diagram for the conformal vertically polarized omnidirectional antenna with heat sink simulation is provided by... Figure 4 It can be seen that by exciting the dual-resonance operating mode through capacitive gap coupling between the driving patch and the annular parasitic patch, the impedance bandwidth of the antenna is 5.14 GHz-6.81 GHz. Figure 5 The gain plot of the conformal vertically polarized omnidirectional antenna with heat sink simulation is derived from... Figure 5 It can be seen that the highest gain within the antenna's operating bandwidth is greater than 3.5 dBi, and the peak gain reaches 5.0 dBi.

[0079] refer to Figure 6 This is the horizontal plane normalized radiation pattern of the conformal vertically polarized omnidirectional antenna with a heat sink at 5.4 GHz. Figure 6 It can be seen that the antenna exhibits good omnidirectional coverage characteristics in the horizontal plane, with a non-circularity of less than 3 dB, which meets the application requirements of omnidirectional communication systems.

[0080] The embodiments described above are merely illustrative of the implementation of the present invention, but should not be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made to the height distribution of the heat sink fins, the geometry of the radiating patches, and the ring width and gap size of the parasitic patches. For example, the rectangular radiating patches can be changed to circular or elliptical shapes, or the rectangular annular parasitic patches can be changed to polygonal rings or fan-shaped ring structures. These all fall within the protection scope of the present invention.

Claims

1. A vertically polarized omnidirectional radiating antenna that integrates heat dissipation and antenna design, characterized in that, The vertically polarized omnidirectional radiating antenna includes a metal radiating patch (1), a metal ground plane (2), a metal heat sink array (3), a metal grounding fixing screw (4), and a coaxial feeding device (5). The metal ground plane (2) constitutes the radio frequency grounding reference surface of the vertically polarized omnidirectional radiating antenna and serves as the mechanical mounting substrate and main heat-conducting substrate of the metal heat sink array (3). The metal heat dissipation fin array (3) is disposed on one side of the metal grounding plate (2) and includes multiple metal heat dissipation fins spaced apart from each other; the metal heat dissipation fin array (3) and the metal grounding plate (2) together constitute a composite grounding structure with both heat conduction and electromagnetic functions; The metal radiating patch (1) is disposed on the side of the metal heat sink fin array (3) away from the metal ground plane (2); the metal radiating patch (1) includes a rectangular main radiating patch (1-1) and a rectangular annular parasitic patch (1-2) disposed around the rectangular main radiating patch (1-1), wherein the rectangular main radiating patch (1-1) is provided with a first power supply through hole (1-3); The coaxial power supply device (5) includes an inner conductor and an outer conductor. The inner conductor of the coaxial power supply device (5) is electrically connected to the first power supply through hole (1-3), and the outer conductor of the coaxial power supply device (5) is electrically connected to the metal grounding plate (2). The metal radiating patch (1), metal heat dissipation fins and metal grounding plate (2) are fixedly connected by metal grounding fixing screws (4).

2. The integrated heat dissipation and antenna vertical polarization omnidirectional radiating antenna according to claim 1, characterized in that, In the vertically polarized omnidirectional radiating antenna: A continuous or discontinuous coupling gap is formed between the rectangular main radiating patch (1-1) and the rectangular annular parasitic patch (1-2), so that the radio frequency near field generated by the rectangular main radiating patch (1-1) can be coupled to the rectangular annular parasitic patch (1-2) through the coupling gap; The metal ground plane (2) is provided with a second power supply through hole (2-1) through which the inner conductor of the coaxial power supply device (5) passes; the second power supply through hole (2-1) is provided in correspondence with the first power supply through hole (1-3); At least some of the metal heat dissipation fins in the metal heat dissipation fin array (3) constitute supporting heat dissipation fins (3-1), and the remaining metal heat dissipation fins constitute auxiliary heat dissipation fins (3-2); the supporting heat dissipation fins (3-1) are used to support the metal radiating patch (1); at least some of the supporting heat dissipation fins (3-1) form mechanical and electrical connections with the rectangular main radiating patch (1-1) and / or the rectangular annular parasitic patch (1-2), so that the corresponding radiating patch forms a radio frequency current return path or a short-circuit loading path between the supporting heat dissipation fins (3-1) and the metal ground plane (2); The metal radiating patch (1) is provided with a first fixing screw through hole (1-4), and the metal grounding plate (2) is provided with a second fixing screw through hole (2-2); the metal grounding fixing screw (4) fixes the metal radiating patch (1), the supporting heat dissipation fins (3-1) and the metal grounding plate (2) through the corresponding first fixing screw through hole (1-4) and second fixing screw through hole (2-2).

3. The integrated heat dissipation and antenna vertical polarization omnidirectional radiating antenna according to claim 2, characterized in that, When the rectangular main radiating patch (1-1) is electrically connected to the metal ground plane (2) through the supporting heat sink fin (3-1), the first power feed via (1-3) on the rectangular main radiating patch (1-1) and the electrical connection position of the supporting heat sink fin (3-1) are spaced apart from each other, so that the radio frequency current input to the rectangular main radiating patch (1-1) forms a radio frequency current path with a predetermined equivalent electrical length along the rectangular main radiating patch (1-1), the supporting heat sink fin (3-1) and the metal ground plane (2).

4. The integrated heat dissipation and antenna vertical polarization omnidirectional radiating antenna according to claim 3, characterized in that, In the vertically polarized omnidirectional radiating antenna: The rectangular main radiating patch (1-1) forms a first resonant mode under the direct excitation of the coaxial feed device (5), and the rectangular annular parasitic patch is subjected to near-field coupling excitation through the coupling gap and forms a second resonant mode. By adjusting the structural parameters between the rectangular main radiating patch (1-1), the rectangular annular parasitic patch (1-2), the coupling gap, and the supporting heat dissipation fins (3-1), the first resonant mode and the second resonant mode are brought close to each other or partially overlapped in frequency, thereby expanding the impedance operating bandwidth of the vertically polarized omnidirectional radiating device.

5. The integrated heat dissipation and antenna vertical polarization omnidirectional radiating antenna according to claim 4, characterized in that, The supporting heat sink fins (3-1) are also used to regulate the radio frequency current return path of the rectangular main radiating patch (1-1) and the rectangular annular parasitic patch (1-2), as well as the current distribution on the metal ground plane (2) and the metal heat sink fin array (3); By setting the number, position, height, distribution, and electrical connection status of the supporting heat dissipation fins (3-1), the vertically polarized omnidirectional radiation device can form a vertically polarized omnidirectional or near-omnidirectional radiation pattern in the azimuth plane surrounding its vertical axis.

6. The integrated heat dissipation and antenna vertical polarization omnidirectional radiating antenna according to claim 5, characterized in that, The rectangular main radiating patch (1-1) and the rectangular annular parasitic patch (1-2) are planar metal conductors arranged horizontally and coplanarly; specifically: The rectangular main radiating patch (1-1) is located in the middle of the metal radiating patch (1) and serves as a direct excitation radiating unit; the first feed via (1-3) is located in the middle region of the rectangular main radiating patch (1-1), preferably at or near the geometric center of the rectangular main radiating patch (1-1). A rectangular annular parasitic patch (1-2) is disposed around the rectangular main radiating patch (1-1) and maintains a predetermined distance from the rectangular main radiating patch (1-1); The rectangular annular parasitic patch (1-2) is a continuous annular structure with a rectangular central opening, or a discontinuous annular structure with one or more breaks, or an outer coupling structure composed of multiple parasitic radiation units spaced apart from each other. The coupling gap between the rectangular main radiating patch (1-1) and the rectangular annular parasitic patch (1-2) forms a capacitive coupling path, enabling the rectangular annular parasitic patch (1-2) to be excited through near-field coupling; By adjusting the width of the coupling gap, the ring width of the rectangular annular parasitic patch (1-2), the outer dimensions of the rectangular main radiating patch (1-1), the inner and outer contour dimensions of the rectangular annular parasitic patch (1-2), and the corresponding grounding connection positions, the resonant frequencies, coupling strength, and impedance matching states of the first and second resonant modes can be adjusted.

7. The integrated heat dissipation and antenna vertical polarization omnidirectional radiating antenna according to claim 6, characterized in that, In the metal radiation patch (1): The rectangular main radiating patch (1-1) is not limited to a rectangular structure, or may adopt a circular, elliptical, polygonal or other planar conductive structure; The rectangular ring-shaped parasitic patch (1-2) is not limited to a rectangular ring structure, but may also adopt a circular ring, elliptical ring, polygonal ring, fan-shaped ring, discontinuous ring or an outer coupling structure composed of multiple parasitic units; The rectangular main radiating patch (1-1) and the rectangular annular parasitic patch (1-2) are set on the same plane, or a predetermined height difference is set according to the equipment installation space, impedance matching and radiation performance requirements; When the rectangular main radiating patch (1-1) is electrically connected to the metal ground plane (2) through the supporting heat sink fins (3-1), the first power feed through hole (1-3) is separated from the corresponding ground connection position; the distance between the first power feed through hole (1-3) and the ground connection position is used to adjust the input impedance and equivalent radio frequency current path of the rectangular main radiating patch (1-1).

8. The integrated heat dissipation and antenna vertical polarization omnidirectional radiating antenna according to claim 7, characterized in that, In the metal grounding plate (2): The metal ground plane (2) is a planar plate structure or a conductive structure adapted to the installation space of electronic equipment; The wall of the second feed hole (2-1) maintains an insulating gap with the inner conductor of the coaxial feed device (5); The metal ground plane (2) serves as the overall radio frequency grounding reference surface of the vertically polarized omnidirectional radiation device, and also as the mounting substrate, mechanical bearing substrate and main heat-conducting substrate of the metal heat sink array (3). The length, width, thickness and outer contour of the metal grounding plate (2) are determined together based on the target operating frequency band, heat dissipation power, mechanical strength and equipment installation space.

9. The integrated heat dissipation and antenna vertical polarization omnidirectional radiating antenna according to claim 8, characterized in that, In the metal heat dissipation fin array (3): The height of the supporting heat dissipation fin (3-1) is greater than the height of the auxiliary heat dissipation fin (3-2), so that the metal radiating patch (1) is supported by the supporting heat dissipation fin (3-1) and maintains a predetermined gap with the auxiliary heat dissipation fin (3-2); The height difference between the supporting heat dissipation fins (3-1) and the auxiliary heat dissipation fins (3-2) is an adjustable parameter; by adjusting the height difference, the resonant frequency and input impedance of the vertically polarized omnidirectional radiating antenna can be adjusted. The heat dissipation fins (3-1) are connected only to the rectangular main radiating patch (1-1), or only to the rectangular annular parasitic patch (1-2), or to both the rectangular main radiating patch (1-1) and the rectangular annular parasitic patch (1-2). Different supporting heat dissipation fins (3-1) can be configured as the first supporting heat dissipation fin and the second supporting heat dissipation fin respectively according to their electromagnetic functions; wherein, the first supporting heat dissipation fin is used to form the radio frequency current return path of the rectangular main radiating patch (1-1), and the second supporting heat dissipation fin is used to form the radio frequency current return path of the rectangular annular parasitic patch (1-2). The cross-section of the metal heat dissipation fins in the metal heat dissipation fin array (3) is not limited to rectangle, but includes trapezoidal, triangular, arc, wave, sawtooth or other irregular cross-sections; The arrangement of the metal heat sink array (3) on the metal ground plane (2) is not limited to a periodic arrangement with equal spacing. It can also be arranged with non-uniform intervals, partitioned arrangement or local densification arrangement according to the distribution of heat sources inside the electronic device, heat dissipation air duct and installation space.

10. A vertically polarized omnidirectional radiating antenna integrating heat dissipation and antenna as described in claim 9, characterized in that, In the vertically polarized omnidirectional radiating antenna: The metal grounding fixing screw (4) can be replaced by a welded part, a conductive rivet, a conductive post, a crimping part, or a conductive connection part integrally formed with the supporting heat dissipation fins (3-1); In addition to the coaxial power supply device (5), probe power supply structure, microstrip power supply structure, stripline power supply structure or coupling power supply structure can also be adopted according to the structure of the electronic equipment.

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