Filter matching circuit, carrier aggregation circuit and radio frequency device in carrier aggregation

Abstract

The application relates to the technical field of wireless communication, in particular to a filter matching circuit, a carrier aggregation circuit and a radio frequency device in carrier aggregation. The filter matching circuit comprises: multiple groups of filter sub-circuits, each group of the filter sub-circuits at least comprising: an input impedance matching circuit, a filter element and an output impedance matching circuit connected in series; the input impedance matching circuit at least comprising an input matching element grounded, and an output end of the output impedance matching circuit being used for connecting a low-noise amplifier; and a radio frequency switch comprising multiple switch pins and an impedance matching pin, the switch pins being respectively connected to each of the filter sub-circuits, the impedance matching pin being grounded, and the impedance matching pin being connected to a second impedance matching element, the second impedance matching element being electrically connected to a non-grounded end of the input matching element. The application provides a carrier aggregation circuit capable of improving the overall performance of a multi-path conduction mode.

Description

Technical Field

[0001] This application relates to the field of wireless communication technology, and more specifically, to a filter matching circuit, a carrier aggregation circuit, and a radio frequency device in carrier aggregation. Background Technology

[0002] 5G communication systems require carrier aggregation functionality in the radio frequency front-end, which helps improve communication capacity. Figure 1 (a) is a traditional single-channel conduction mode carrier aggregation circuit. Figure 1 (b) is a traditional carrier aggregation circuit with multiple conduction mode. Figure 1 (b) Use a single-pole multi-throw switch to simultaneously turn on multiple filters to simultaneously output signals of different frequency bands to subsequent RF devices.

[0003] The filter requires several impedance matching components to ensure that both the input and output impedances reach 50 ohms simultaneously, necessitating precise design of the connection between the switch and the filter. Figure 1 (a) and Figure 1 The impedance matching components L01, L02, L05, L06 in (b), and the impedance matching devices L03, L04, L07, L08 between the filter and the next stage are necessary to ensure optimal module performance. Figure 1 (b) In the multi-channel conduction mode, the simultaneous operation of multiple filters can cause impedance matching devices to interfere with each other, resulting in impedance matching failing to achieve optimal performance. Figure 1 L01 and L02 in (a) Figure 1 (b) may not minimize the link insertion loss.

[0004] The traditional approach is to adjust the internal impedance matching device, for example by adjusting... Figure 1 (a) and Figure 1 (b) L01, L02, L05, and L06 improve multi-channel performance by sacrificing single-channel performance and / or modifying the filter design, but this may result in a slight decrease in overall performance compared to the ideal state.

[0005] Therefore, there is an urgent need for a carrier aggregation circuit that can improve the overall performance of multi-channel conduction mode. Summary of the Invention

[0006] To address the aforementioned technical problems, this application provides a filter matching circuit, a carrier aggregation circuit, and a radio frequency device for carrier aggregation.

[0007] A first aspect of this application provides a filter matching circuit in carrier aggregation, comprising: Multiple sets of filter sub-circuits, each set of filter sub-circuits including at least: an input impedance matching circuit, a filter element and an output impedance matching circuit connected in series; the input impedance matching circuit includes at least one grounded input matching element, and the output terminal of the output impedance matching circuit is used to connect to a low-noise amplifier; The radio frequency switch includes multiple switching pins and impedance matching pins. The switching pins are respectively connected to each of the filter sub-circuits. The impedance matching pins are grounded and connected to a second impedance matching element. The second impedance matching element is electrically connected to the non-grounded terminal of the input matching element.

[0008] In one optional embodiment of this application, the second impedance matching element is a second impedance matching inductor, the first end of the first impedance matching inductor is electrically connected to the impedance matching pin, and the second end of the second impedance matching inductor is electrically connected to the non-grounded end of the input matching element.

[0009] In an optional embodiment of this application, the input impedance matching circuit includes at least: A first inductor element, wherein a first end of the first inductor element is electrically connected to the switch pin of the radio frequency switch, and a second end of the first inductor element is grounded; The second inductor has its first end electrically connected to the first end of the first inductor, and its second end electrically connected to the input end of the filter element.

[0010] In an optional embodiment of this application, the output impedance matching circuit includes at least: The third inductor element, wherein the first end of the third inductor element is electrically connected to the output end of the filter element; The fourth inductor has its first end electrically connected to the second end of the third inductor and an external low-noise amplifier, and its second end is grounded.

[0011] In one optional embodiment of this application, the radio frequency switch includes a plurality of impedance matching pins, each of the impedance matching pins being connected to a second impedance matching element, and each of the second impedance matching elements being grounded.

[0012] In one optional embodiment of this application, the impedance matching values ​​corresponding to the multiple sets of second impedance matching elements are not completely the same, and the impedance matching values ​​corresponding to the multiple sets of second impedance matching elements correspond one-to-one with the impedance matching values ​​corresponding to the conduction modes of the multiple sets of filter sub-circuits.

[0013] In one optional embodiment of this application, the conduction modes of the multiple sets of filter sub-circuits include at least one of B3+B66+B41, B40+B41, and B39+B41.

[0014] In one optional embodiment of this application, in the case of single-channel conduction, the input matching element is turned on and the impedance matching pin is grounded; in the case of multiple-channel conduction, the input matching element is turned off and the impedance matching pin is turned on.

[0015] A second aspect of this application provides a carrier aggregation circuit, comprising at least: The filter matching circuit described in any of the preceding items.

[0016] A third aspect of the embodiments of this application provides a radio frequency device, comprising at least: Carrier aggregation circuit as described in any of the preceding items. This application provides a filter matching circuit in carrier aggregation, comprising: multiple sets of filter sub-circuits, each set of filter sub-circuits including at least: an input impedance matching circuit, a filter element, and an output impedance matching circuit connected in series; the input impedance matching circuit includes at least one grounded input matching element, and the output terminal of the output impedance matching circuit is used to connect to a low-noise amplifier; an RF switch including multiple switch pins and impedance matching pins, the switch pins being respectively connected to each of the filter sub-circuits, the impedance matching pins being grounded, and the impedance matching pins being connected to a second impedance matching element, the second impedance matching element being electrically connected to the non-grounded terminal of the input matching element. The matching pins can be used when a single path is on, and turned off when multiple paths are on, thereby keeping the impedance matching state of the filter element's input terminal unchanged under different states, greatly improving the overall performance of the multi-path on-mode. In other words, this application provides a filter matching circuit in a carrier aggregation circuit. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 (a) is a traditional single-channel conduction mode carrier aggregation circuit; Figure 1 (b) is a traditional carrier aggregation circuit with multiple conduction mode; Figure 2 This application provides a schematic diagram of a filter matching circuit structure in carrier aggregation according to one embodiment; Figure 3 This is a schematic diagram of a filter matching circuit structure in carrier aggregation, provided as another embodiment of this application. Wherein: 10. Filter matching circuit; 100. Filter sub-circuit; 110. Input impedance matching circuit; L1. First inductor; L2. Second inductor; L3. Third inductor; L4. Fourth inductor; 120. Filter element; 130. Output impedance matching circuit; 200. RF switch; 210. First impedance matching element; 220. Second impedance matching element. Detailed Implementation

[0018] In the process of developing this application, the applicant discovered that there is an urgent need for a filter matching circuit in a carrier aggregation circuit that can improve the overall performance of the multi-channel conduction mode.

[0019] To address the aforementioned problems, this application provides a filter matching circuit, a carrier aggregation circuit, and a radio frequency (RF) device for carrier aggregation. To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description, through embodiments and in conjunction with the accompanying drawings, provides a further detailed explanation of the filter matching circuit, carrier aggregation circuit, and RF device for carrier aggregation. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0020] The serial numbers assigned to components in this document, such as "first" and "second," are used solely to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages). It should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used solely for the convenience of describing this application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0021] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature. Please see Figure 2This application provides a filter matching circuit 10 in carrier aggregation, including: multiple sets of filter sub-circuits 100 and radio frequency switches 200, wherein: Each of the aforementioned filter sub-circuits 100 is used for signal filtering to provide different frequency bands or combinations of frequency bands, including but not limited to any combination of frequency bands such as B3, B39, B40, B41, and B66. It should be explained that B3, B39, B40, B41, and B66 are LTE / 5G frequency band numbers defined by 3GPP (3GPP, the international telecommunications standards organization). Each frequency band corresponds to a specific range of radio frequencies. For example, B40 is mainly used in China Mobile's indoor and hotspot areas, with a frequency band of 2300-2400MHz; while B41 is in the 2500-2690MHz range. Frequency band combinations, such as B3+B66+B41, B40+B41, and B39+B41, etc., for example, B3+B66+B41 is a three-carrier aggregation (3CC) combination, which can provide much higher network speeds than a single frequency band. Generally, this means that the mobile phone needs to use the carriers of these three frequency bands simultaneously for data transmission.

[0022] Each group of filter sub-circuits 100 includes at least: an input impedance matching circuit 110, a filter element 120, and an output impedance matching circuit 130 connected in series.

[0023] The input impedance matching circuit 110 includes at least one grounded input matching element, and the output terminal of the output impedance matching circuit 130 is used to connect to a low-noise amplifier. The input matching element can be any inductor or other electronic component, as long as it can perform the function of impedance input matching.

[0024] The filter element 120 is a functional device in the filter sub-circuit 100, used for signal filtering to provide different frequency bands or combinations of frequency bands. The filter element 120 can be a filter of different models or frequency bands. Each filter sub-circuit 100 is equipped with one or more sets of filters, which can be determined according to the actual required frequency band and conduction mode. This application embodiment does not impose specific limitations; the filters can be flexibly selected or configured according to actual conditions, as long as the purpose of signal frequency band filtering can be achieved.

[0025] The output terminal of the output impedance matching circuit 130 is used to connect to a low-noise amplifier. The output impedance matching circuit 130 is used to achieve impedance matching with the input impedance. The output impedance matching circuit 130 can be composed of components such as inductors, and this application embodiment does not make specific limitations.

[0026] The RF switch 200 includes at least two types of pins: a switch pin 1 and an additional impedance matching pin 2. Each pin has functions such as conduction, open circuit, and grounding. There are multiple switch pins, and there can be one or more impedance matching pins 2. Each switch pin is connected to each of the filter sub-circuits 100. In this embodiment, each pin of the RF switch 200 is internally grounded when disconnected. This internal grounding means that through the internal grounding of the RF switch 200, the switch pin 1 and impedance matching pin 2 can be connected to or disconnected from the input terminal of the RF switch 200. When disconnected, the switch pin 1 and impedance matching pin 2 are grounded; optionally, the switch pin 1 and impedance matching pin 2 are floating. Simultaneously, the impedance matching pin is connected to a second impedance matching element 220, which is electrically connected to the non-grounded terminal of the first input impedance matching element; optionally, there is one and only one second impedance matching element 220. In an optional embodiment of this application, in the case of single-channel conduction, the switch pin 1 connected to the first input impedance matching element is turned on, and the impedance matching pin 2 is grounded; in the case of multiple-channel conduction, the switch pin 1 is turned off, and the impedance matching pin 2 is turned on. That is, in the case of single-channel conduction, pin 1 is turned on, and pin 2 is grounded, that is, both the first filter sub-circuit 100 and the second impedance matching element 220 are grounded, and the input impedance matching circuit 110 and the second impedance matching element 220 form a parallel scheme as part of the filter matching when single-channel conduction is performed, thereby outputting an input matching impedance adapted to the single-channel conduction mode.

[0027] When multiple inputs are on, pin 1 is off and pin 2 is on. Current flows directly from pin 2 through the second impedance matching element 220 until it flows into the first input impedance matching element and the second input impedance matching element.

[0028] At this point, the equivalent structure of the circuit is a T-type matching of the first filter element 120. That is, the input of filter element 120 is first connected in series with the second input impedance matching element, then in parallel with the first input impedance matching element, then in series with the second impedance matching element 220, and then through pin 2 to the RF switch 200. When multiple paths are on, the current T-type matching network is then connected in parallel with the second filter element 120 and the second T-type matching network (not shown in the figure). The passband input impedance of the first filter element 120 is exactly the same as when it is on single path (first connected in series with the second input impedance matching element, then in parallel with the first input impedance matching element and the second impedance matching element 220), and it has been adjusted to the optimal state when it is on single path. Thus, the best impedance matching can be obtained. The specific matching value and matching method can be flexibly designed according to the characteristics of different filters. This application does not impose specific limitations on the embodiments.

[0029] It should be explained that the number of impedance matching pins 2 can be one or more. One impedance matching pin 2 is configured for each group of filter sub-circuits 100 to adapt to different multiplexing modes. If the performance of two or more groups of filter sub-circuits 100 is similar, two or more groups of filter sub-circuits 100 can share one impedance matching pin 2, and each impedance matching pin 2 is connected to one and only one second impedance matching element 220.

[0030] In summary, the embodiments of this application use the first impedance matching element 210 and the matching pin in both single-channel and multi-channel conduction, so that the impedance matching state of the input terminal of the filter element 120 remains unchanged in different states, which greatly improves the overall performance of the multi-channel conduction mode. That is, the embodiments of this application provide a filter matching circuit 10 in a carrier aggregation circuit.

[0031] Please continue reading Figure 2 In an optional embodiment of this application, the second impedance matching element 220 is a second impedance matching inductor, the first end of the second impedance matching inductor is electrically connected to the impedance matching pin 2, and the second end of the second impedance matching inductor is electrically connected to the non-grounded end of the first input impedance matching element.

[0032] The dual impedance matching element 220 described in this embodiment uses a second impedance matching inductor. The inductor is used for signal reception and preliminary filtering, while also providing corresponding input impedance matching. This avoids the introduction of too many components, further reducing circuit cost and simplifying the circuit structure.

[0033] Please continue reading Figure 2 In an optional embodiment of this application, the input impedance matching circuit 110 includes at least: a first inductor L1 and a second inductor L2, wherein: The first inductor element L1 serves as the first impedance matching inductor; that is, in this embodiment, the first impedance matching inductor is implemented using an inductor element. The first terminal of the first inductor element L1 is electrically connected to the switch pin 1 of the RF switch 200, and the second terminal of the first inductor element L1 is grounded. The first end of the second inductor L2 is electrically connected to the first end of the first inductor L1, and the second end of the second inductor L2 is electrically connected to the input end of the filter element 120.

[0034] In this application embodiment, the inductance value, impedance value, connection order, etc. of the first inductor L1 and the second inductor L2 are not specifically limited. They can be flexibly selected and set according to the actual situation, as long as a matching input impedance can be provided.

[0035] Please continue reading Figure 2 In an optional embodiment of this application, the output impedance matching circuit 130 includes at least: a third inductor L3 and a fourth inductor L4, wherein: The first end of the third inductor L3 is electrically connected to the output end of the filter element 120; The first terminal of the fourth inductor L4 is connected to the second terminal of the third inductor L3 and an external low-noise amplifier, respectively. Figure 2 (Not shown in the image) Electrically connected, the second terminal of the fourth inductor L4 is grounded.

[0036] After entering through the antenna, the signal from the RF front-end passes through a multiplexer, then a corresponding filter, followed by a low-noise amplifier (LNA), then a transceiver, and finally a baseband processor. In this embodiment, both the single-mode filter element 120 and the multi-mode filter element 120 are located after the RF switch 200 and before the LNA.

[0037] In this embodiment, the inductance and impedance values ​​of the third inductor L3 and the fourth inductor L4 are not specifically limited. They can be flexibly selected and set according to the actual situation, as long as a matching input impedance can be provided.

[0038] Please continue reading Figure 2 In one optional embodiment of this application, the radio frequency switch 200 includes a plurality of impedance matching pins 2, each of the impedance matching pins 2 being connected to a second impedance matching element 220, and each of the second impedance matching elements 220 being grounded.

[0039] In one optional embodiment of this application, the impedance matching values ​​corresponding to the multiple sets of second impedance matching elements 220 are not completely the same, and the impedance matching values ​​corresponding to the multiple sets of second impedance matching elements 220 correspond one-to-one with the impedance matching values ​​corresponding to the conduction modes of the multiple sets of filter sub-circuits 100.

[0040] That is, each group of filter sub-circuits 100 is configured with an impedance matching pin to accommodate different multiplexing modes. If the performance of two or more groups of filter sub-circuits 100 is similar, two or more groups of filter sub-circuits 100 can share a single impedance matching pin 2, thereby reducing the number of components used and saving component space while ensuring performance. It should be noted that each impedance matching pin 2 is connected to one and only one second impedance matching element 220.

[0041] In one optional embodiment of this application, the conduction modes of the multiple filter sub-circuits 100 include at least one of B3+B66+B41, B40+B41, and B39+B41.

[0042] This application provides at least three operating modes: B3+B66+B41, B40+B41, and B39+B41. The frequency band information and main uses of each operating mode are shown in Table 1 below: Table 1

[0043] This frequency band combination determines the upper limit of network speed in different network environments. The allocation and use of these frequency bands are based on global and regional spectrum management policies. For example, China Mobile mainly uses TDD bands such as B39, B40, and B41, while B3 and B66 are internationally used FDD bands, which are also widely deployed in China Unicom and China Telecom networks.

[0044] Please see Figure 3 This application provides another filter matching circuit 10 in carrier aggregation, in which the second impedance matching element 220 connected to the impedance matching pin 2 is replaced with a first impedance matching element 210, and the connection relationship of the first impedance matching element 210 is set such that the second terminal of the first impedance matching element 210 is grounded. The specific structure of this filter matching circuit 10 in carrier aggregation is as follows: Please see Figure 3 The filter matching circuit 10 in the carrier aggregation includes: multiple sets of filter sub-circuits 100 and RF switches 200, wherein: Each of the aforementioned filter sub-circuits 100 is used for signal filtering to provide different frequency bands or combinations of frequency bands, including but not limited to any combination of frequency bands such as B3, B39, B40, B41, and B66. It should be explained that B3, B39, B40, B41, and B66 are LTE / 5G frequency band numbers defined by 3GPP (3GPP, the international telecommunications standards organization). Each frequency band corresponds to a specific range of radio frequencies. For example, B40 is mainly used in China Mobile's indoor and hotspot areas, with a frequency band of 2300-2400MHz; while B41 is in the 2500-2690MHz range. Frequency band combinations, such as B3+B66+B41, B40+B41, and B39+B41, etc., for example, B3+B66+B41 is a three-carrier aggregation (3CC) combination, which can provide much higher network speeds than a single frequency band. Generally, this means that the mobile phone needs to use the carriers of these three frequency bands simultaneously for data transmission.

[0045] Each of the filter sub-circuits 100 includes at least: an input impedance matching circuit 110, a filter element 120, and an output impedance matching circuit 130 connected in series.

[0046] The input impedance matching circuit 110 refers to a circuit composed of inductors and other components used for matching input impedance. The input impedance matching circuit 110 includes at least a grounded first input impedance matching element. This first input impedance matching element can be any inductor or other electronic component, as long as it can perform the function of impedance input matching.

[0047] The filter element 120 is a functional device in the filter sub-circuit 100, used for signal filtering to provide different frequency bands or combinations of frequency bands. The filter element 120 can be a filter of different models or frequency bands. Each filter sub-circuit 100 is equipped with one or more sets of filter elements 120, which can be determined according to the actual required frequency band and conduction mode. This application embodiment does not impose specific limitations; the elements can be flexibly selected or configured according to actual conditions, as long as the purpose of signal frequency band filtering can be achieved.

[0048] The output terminal of the output impedance matching circuit 130 is used to connect to a low-noise amplifier. The output impedance matching circuit 130 is used to achieve impedance matching with the input impedance. The output impedance matching circuit 130 can be composed of components such as inductors. This application embodiment does not make specific limitations.

[0049] The RF switch 200 includes at least two types of pins: switch pins and additional impedance matching pins 2, such as... Figure 2 Pin 1 and impedance matching pin 2 are as follows: Figure 2 Pin 2 in the circuit has functions such as conduction, open circuit, and grounding. There are multiple switching pins, and the impedance matching pin 2 can be one or more. Each switching pin is connected to each of the filter sub-circuits 100. Generally, all pins of a switching device are grounded. In this embodiment, the impedance matching pin 2 is selectively grounded. Other switching pins can be selectively grounded or ungrounded according to actual safety requirements. Simultaneously, the impedance matching pin 2 is connected to a first impedance matching element 210. Optionally, there is one and only one first impedance matching element 210. Both the first impedance matching element 210 and the first input impedance matching element are grounded, i.e., they are connected in parallel. In an optional embodiment of this application, the first impedance matching element 210 is turned on when only one path is on; and turned off when multiple paths are on. Specifically: When in operation, if the current conduction mode is single-channel conduction mode, the switch pin 1 connected to the first filter sub-circuit 100 in the RF switch 200 is turned on, and the impedance matching pin 2 connected to the first impedance matching element 210 is also turned on. The first impedance matching element 210 is connected to ground in parallel. The input impedance matching circuit 110 and the impedance matching element 210 together determine the input impedance of the filter element 120 to meet the requirements of the filter element 120 in single-channel operation mode. If the current conduction mode is a multi-channel conduction mode, the switch pin 1 of the RF switch 200 connected to the first filter sub-circuit 100 is turned on, and the switch pin 1 connected to the other filter sub-circuits 100 is turned on. Figure 3 (Not shown in the diagram) When impedance matching pin 2 is off, the first input impedance matching element in the first filter sub-circuit 100 is connected in parallel with the input impedance matching circuit 110 in other filter sub-circuits 100, forming a parallel impedance to satisfy the input impedance matching of the first filter sub-circuit 100. In the current state, impedance matching pin 2 is off, and correspondingly, the first impedance matching element 210 is not used. Similarly, the first input impedance matching element in other filter sub-circuits 100 is connected in parallel with other impedance matching elements to form corresponding parallel impedances to satisfy the input impedance matching of the corresponding filter sub-circuit 100, thereby keeping the impedance matching state of the input terminal of the filter element 120 unchanged under different states.

[0050] It should be explained that the number of impedance matching pins 2 can be one or more. One impedance matching pin 2 is configured for each group of filter sub-circuits 100 to adapt to different multiple conduction modes. If the performance of two or more groups of filter sub-circuits 100 is similar, two or more groups of filter sub-circuits 100 can share one impedance matching pin 2, and each impedance matching pin 2 is connected to one and only one first impedance matching element 210.

[0051] In summary, the embodiments of this application can use the matching pin when a single channel is on and turn it off when multiple channels are on, thereby keeping the impedance matching state of the input terminal of the filter element 120 unchanged under different states, which greatly improves the overall performance of the multi-channel on mode. That is, the embodiments of this application provide a filter matching circuit 10 in a carrier aggregation circuit.

[0052] One embodiment of this application provides a carrier aggregation circuit, which includes at least the filter matching circuit 10 as described in any of the preceding claims.

[0053] The beneficial effects of the filter matching circuit 10 have been described in detail in the above embodiments and will not be repeated here.

[0054] One embodiment of this application provides a radio frequency device, characterized in that it includes at least: a carrier aggregation circuit as described in any of the preceding claims.

[0055] The beneficial effects of this carrier aggregation circuit have been described in detail in the above embodiments and will not be repeated here.

[0056] It should be understood that although the steps in the flowchart are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order constraint on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the diagram may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0057] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A filter matching circuit in carrier aggregation, characterized in that, include: Multiple sets of filter sub-circuits, each set of filter sub-circuits including at least: an input impedance matching circuit, a filter element and an output impedance matching circuit connected in series; The input impedance matching circuit includes at least one grounded input matching element, and the output terminal of the output impedance matching circuit is used to connect to a low-noise amplifier. The radio frequency switch includes multiple switching pins and impedance matching pins. The switching pins are respectively connected to each of the filter sub-circuits. The impedance matching pins are grounded and connected to a second impedance matching element. The second impedance matching element is electrically connected to the non-grounded terminal of the input matching element.

2. The filter matching circuit in carrier aggregation according to claim 1, characterized in that, The second impedance matching element is a second impedance matching inductor. The first end of the first impedance matching inductor is electrically connected to the impedance matching pin, and the second end of the second impedance matching inductor is electrically connected to the non-grounded end of the input matching element.

3. The filter matching circuit in carrier aggregation according to claim 1, characterized in that, The input impedance matching circuit includes at least: A first inductor element, wherein a first end of the first inductor element is electrically connected to the switch pin of the radio frequency switch, and a second end of the first inductor element is grounded; The second inductor has its first end electrically connected to the first end of the first inductor, and its second end electrically connected to the input end of the filter element.

4. The filter matching circuit in carrier aggregation according to claim 1, characterized in that, The output impedance matching circuit includes at least: The third inductor element, wherein the first end of the third inductor element is electrically connected to the output end of the filter element; The fourth inductor has its first end electrically connected to the second end of the third inductor and an external low-noise amplifier, and its second end is grounded.

5. The filter matching circuit in carrier aggregation according to claim 1, characterized in that, The radio frequency switch includes multiple impedance matching pins, each of which is connected to a second impedance matching element, and each second impedance matching element is grounded.

6. The filter matching circuit in carrier aggregation according to claim 1, characterized in that, The impedance matching values ​​corresponding to the multiple sets of second impedance matching elements are not completely the same, and the impedance matching values ​​corresponding to the multiple sets of second impedance matching elements correspond one-to-one with the impedance matching values ​​corresponding to the conduction modes of the multiple sets of filter sub-circuits.

7. The filter matching circuit in carrier aggregation according to claim 1, characterized in that, The conduction modes of the multiple filter sub-circuits include at least one of B3+B66+B41, B40+B41, and B39+B41.

8. The filter matching circuit in carrier aggregation according to claim 1, characterized in that, When a single path is on, the input matching element is on and the impedance matching pin is grounded; when multiple paths are on, the input matching element is off and the impedance matching pin is on.

9. A carrier aggregation circuit, characterized in that, At least including: The filter matching circuit as described in any one of claims 1-8.

10. A radio frequency device, characterized in that, At least including: The carrier aggregation circuit as described in claim 9.

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