AI agent

Abstract

The application provides an AI intelligent agent, a main chip and a computing power chip adopt a horizontal separation layout, heat is quickly transferred from the main chip to the heat dissipation fins through the heat conduction boss and the heat dissipation base by using the conduction heat dissipation principle, and the heat of the computing power chip is transferred to the heat dissipation fins close to the second air vent (i.e. the air outlet) through the heat pipe and the heat dissipation base by using the heat pipe heat dissipation principle. In this way, the horizontal stacking design method of staggered separation of different chips is adopted, the heat of different places is quickly transferred to the aluminum heat dissipation fins through the modular heat dissipation module, the heat sources of different chips are separately controlled, the current two-chip series heat dissipation mode is improved, the heat of the computing power chip cannot be directly conducted to the main chip, the overheating and frequency reduction problem caused by the superimposed heat received by the main chip is completely avoided, the traditional vertical stacking series heat conduction structure is completely abandoned, and the AI intelligent agent can balance the heat dissipation effect and the service life of the equipment.

Description

Technical Field

[0001] This invention relates to the field of AI intelligent agent technology, and in particular to an AI intelligent agent. Background Technology

[0002] With the rapid iteration of artificial intelligence technology, AI computing power products have been widely used in scenarios such as large model training, industry intelligentization, and C-end home AI applications, resulting in an exponential surge in computing power demand. Currently, consumer AI intelligent agent products with high computing power modules are gradually entering home scenarios. In addition to conventional main chips, these products are also equipped with high-power computing chips, which can switch from idle to full-load state within seconds during operation, generating significant thermal shock. This places extremely high demands on the temperature control efficiency, noise reduction performance, and appearance compatibility of the heat dissipation system.

[0003] Existing heat dissipation solutions for similar products mostly employ a vertically tandem stacked structure. This structure directly transfers the heat from the main chip to the computing chip via thick thermally conductive silicone, and then, together with the heat from the computing chip, transfers it to a copper heatsink via the same silicone. A fan draws in cool air from the top of the product, forcibly dissipating the heat through exposed aluminum fins on the outer casing. While this approach achieves basic heat dissipation to some extent, it suffers from the following drawbacks in practical applications: Firstly, chips with different heat outputs are connected in series for heat conduction. In addition to the heat generated by its own operation, the main chip with weaker temperature resistance will also receive additional heat from the computing chip. This can easily lead to overheating and frequency reduction of the main chip, or even long-term exposure to an overheated environment, resulting in a significant reduction in lifespan and product damage. Secondly, the vertical stacking structure significantly increases the overall height of the device, severely limiting the design space for consumer products. At the same time, the top air intake design makes it easy for dust to directly enter the device. After long-term use, the fan accumulates dust, the air intake decreases, and the heat is trapped inside the device and cannot be discharged, directly affecting the full release of chip performance.

[0004] Therefore, there is an urgent need to design an AI agent that balances heat dissipation and equipment lifespan. Summary of the Invention

[0005] This invention provides an AI agent to solve the problem that existing AI agents cannot simultaneously achieve good heat dissipation and device lifespan.

[0006] An AI intelligent agent includes a housing, a PCBA module, and a heat dissipation module; The PCBA module and the heat dissipation module are stacked and installed inside the housing in a vertical direction; the first side of the housing is provided with a first ventilation opening communicating with the interior, and the second side of the housing is provided with a second ventilation opening communicating with the interior; The PCBA module integrates a main chip and a computing chip arranged horizontally at intervals; the heat dissipation module includes a heat dissipation base, heat dissipation fins, and heat pipes; the heat dissipation base is mounted on the PCBA module, and the heat dissipation base is provided with a thermally conductive protrusion, which is attached to the main chip by thermal grease; the heat dissipation fins are mounted on the heat dissipation base, and the heat pipe is disposed between the heat dissipation base and the heat dissipation fins, with the first end of the heat pipe being disposed opposite to the computing chip, and the second end of the heat pipe being located in the area of ​​the heat dissipation fins near the second vent.

[0007] Preferably, the heat pipe includes an evaporation section arranged in a front-to-back direction and a condensation section extending from one end of the evaporation section in a left-to-right direction. The evaporation section is disposed opposite to the computing chip, and the end of the condensation section away from the evaporation section is located in the area of ​​the heat dissipation fins near the second vent.

[0008] Preferably, the heat dissipation base is provided with a plurality of first connecting posts arranged at intervals along the circumferential direction, and the PCBA module is provided with a plurality of first connecting holes arranged at intervals along the circumferential direction, with each first connecting post inserted into a first connecting hole; the AI ​​intelligent agent also includes a plurality of first fasteners, with each first connecting post locked onto the PCBA module by a first fastener. The housing is provided with a plurality of second connecting posts arranged at intervals along the circumferential direction, and the PCBA module is also provided with a plurality of second connecting holes arranged at intervals along the circumferential direction, with each second connecting post inserted into a second connecting hole; the AI ​​intelligent agent also includes a plurality of second fasteners, with each second connecting post locked onto the PCBA module by a second fastener.

[0009] Preferably, the AI ​​intelligent agent further includes a fan module; the fan module is installed inside the housing, dividing the internal cavity of the housing into a mounting cavity and a heat dissipation cavity in the left-right direction; the PCBA module and the heat dissipation module are located in the mounting cavity, the first vent is connected to the mounting cavity, and the second vent is connected to the heat dissipation cavity; The air inlet of the fan module faces the mounting cavity, and the air outlet of the fan module faces the heat dissipation cavity, so as to guide the heat in the mounting cavity into the heat dissipation cavity and then discharge it from the second vent.

[0010] Preferably, the housing is provided with a guide rail and a fixing post arranged in the vertical direction near the second ventilation opening; The fan module includes a fan bracket and at least one fan; the fan bracket is inserted into the guide rail and fixed to the fixing post by a third fastener, dividing the internal cavity of the housing into a mounting cavity and a heat dissipation cavity in the left-right direction; Each of the aforementioned fans is mounted on the fan bracket, with the air inlet of the fan facing the mounting cavity and the air outlet of the fan facing the heat dissipation cavity.

[0011] Preferably, the fan bracket includes a support plate and a fixing plate extending from one side edge of the support plate in a direction perpendicular to the support plate; the support plate is inserted into the guide rail, and the fixing plate is fixed to the fixing post by a third fastener.

[0012] Preferably, the outer casing includes a housing and a cover, wherein the cover is detachably connected to the housing.

[0013] Preferably, the housing is provided with a plurality of third connecting posts arranged at intervals along the circumferential direction, and the inner side of the housing cover is provided with a plurality of fourth connecting posts arranged at intervals along the circumferential direction, each of the third connecting posts being connected to a fourth connecting post; the AI ​​intelligent body also includes a plurality of fourth fasteners, each of the fourth connecting posts being locked to a third connecting post by a fourth fastener.

[0014] Preferably, the AI ​​intelligent agent further includes a sealing baffle, which is installed on the fan module and abuts against the inner wall of the housing to prevent heat from flowing back into the mounting cavity from the heat dissipation cavity.

[0015] Preferably, the AI ​​agent further includes a control module and a temperature sensor; the temperature sensor is connected to the main chip and the computing chip respectively, and is used to collect temperature data of the two chips in real time; the control module is electrically connected to the temperature sensor and the fan module respectively, and controls the operation of the fan module according to the temperature data collected in real time by the temperature sensor.

[0016] The AI ​​agent provided in this invention features a horizontally separated layout for the main chip and computing chip. Heat is rapidly transferred from the main chip to the heat sink fins via thermal guide bumps and a heat dissipation base, utilizing conduction heat dissipation. Simultaneously, heat is transferred from the computing chip to the heat sink fins near the second ventilation port (i.e., the exhaust port) via heat pipes and the heat sink base. This horizontally stacked design, with different chips staggered, utilizes a modular heat dissipation module to rapidly transfer heat from different locations to the aluminum heat sink fins. This separate heat source management for different chips improves upon the current series-connected heat dissipation method. Heat from the computing chip is not directly conducted to the main chip, completely avoiding overheating and frequency reduction issues caused by the main chip receiving accumulated heat. This completely eliminates the traditional vertically stacked series heat conduction structure, allowing the AI ​​agent to balance heat dissipation and device lifespan. The horizontal layout significantly reduces the overall height of the device, decreasing its thickness compared to traditional stacking solutions. This provides ample design space for consumer products, adapting to various slim and lightweight designs such as desktop ornaments and smart home integrations. The side-in, side-out ventilation path, combined with a dust filter at the inlet, blocks external dust from entering the interior, reducing dust accumulation on the fins and effectively controlling the airflow attenuation rate, maintaining stable heat dissipation efficiency even after long-term use. The combination of an aluminum heat sink base with copper heat pipes and aluminum fins balances thermal conductivity with lightweight characteristics, reducing the overall weight of the cooling module and lowering cooling costs. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is an axonometric view of an AI agent in one embodiment of the present invention; Figure 2 This is a first exploded view of the AI ​​agent in one embodiment of the present invention; Figure 3 This is a second exploded view of the AI ​​agent in one embodiment of the present invention; Figure 4 This is a cross-sectional view of an AI agent in one embodiment of the present invention; Figure 5 This is an exploded view of the PCBA module and the heat dissipation module in one embodiment of the present invention; Figure 6 This is an isometric view of a heat dissipation base according to an embodiment of the present invention; Figure 7 This is an exploded view of a fan bracket in one embodiment of the present invention.

[0019] The components include: 1. Outer shell; 101. Housing; 102. Shell cover; 2. PCBA module; 201. Main chip; 202. Computing chip; 3. Heat dissipation module; 31. Heat dissipation base; 32. Heat dissipation fins; 33. Heat pipe; 331. Evaporation section; 332. Condensation section; 34. Thermally conductive boss; 35. Mounting slot; 4. First vent; 5. Second vent; 6. First connecting post; 7. First connecting hole; 8. First fastener; 9. Second connecting post; 10. Second connecting hole; 11. Second fastener; 12. Fan module; 121. Fan bracket; 1211. Support plate; 1212. Fixing plate; 122. Fan; 13. Guide rail; 14. Fixing post; 15. Third fastener; 16. Third connecting post; 17. Fourth connecting post; 18. Fourth fastener; 19. Filter screen; 20. Wind deflector; 21. Foot; 22. Anti-slip buffer pad; 23. Battery cover; 24. Speaker; 25. Sealing baffle; 26. Fifth connecting post; 27. Fixing hole; 28. Fifth fastener. Detailed Implementation

[0020] To make the technical problems, technical solutions, and beneficial effects solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0021] In the description of this application, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0022] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0023] This invention provides an AI agent, referring to... Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 The AI ​​intelligent entity includes a housing 1, a PCBA module 2, and a heat dissipation module 3. The PCBA module 2 and the heat dissipation module 3 are stacked vertically inside the housing 1. The first side of the housing 1 has a first ventilation port 4 communicating with the interior, and the second side of the housing 1 has a second ventilation port 5 communicating with the interior. The PCBA module 2 integrates a main chip 201 and a computing chip 202 arranged horizontally at intervals. The heat dissipation module 3 includes a heat dissipation base 31, heat dissipation fins 32, and a heat pipe 33. The heat dissipation base 31 is mounted on the PCBA module 2, and the heat dissipation base 31 has a thermally conductive protrusion 34, which is attached to the main chip 201 by thermal grease. The heat dissipation fins 32 are mounted on the heat dissipation base 31, and the heat pipe 33 is disposed between the heat dissipation base 31 and the heat dissipation fins 32. The first end of the heat pipe 33 is disposed opposite to the computing chip 202, and the second end of the heat pipe 33 is located in the area of ​​the heat dissipation fins 32 near the second ventilation port 5.

[0024] As an example, the AI ​​agent includes a housing 1, a PCBA module 2, and a heat dissipation module 3. The housing 1 has an internal cavity, and the PCBA module 2 and heat dissipation module 3 are stacked parallel to each other vertically within the internal cavity. A first ventilation opening 4 is located on the left side of the housing 1, and a second ventilation opening 5 is located on the right side. Both ventilation openings are directly connected to the internal cavity, allowing heat to escape through both openings. Alternatively, one ventilation opening (air intake) can draw in cool air, while the other (air outlet) can expel heat, forming a continuous horizontal ventilation path for effective heat dissipation of the AI ​​agent. Furthermore, a removable filter 19 is embedded in the housing 1 near the first ventilation opening 4 via a slot. Sealing foam is provided at the edges to ensure complete contact with the inner wall of the housing 1, preventing external dust from entering the device and thus avoiding interference with the full performance of the chip. PCBA module 2 is an FR4 fiberglass circuit board, which integrates a main chip 201 and a computing chip 202 arranged horizontally at intervals. The main chip 201 is the intelligent agent control core, and the computing chip 202 is an AI computing acceleration chip. The heat dissipation module 3 includes three parts: a heat dissipation base 31, heat dissipation fins 32, and heat pipes 33. The heat dissipation base 31 is made of AL6063 material through an integrated extrusion molding process. The lower surface of the heat dissipation base 31 is locked and fixed to the PCBA module 2 by screws and / or snaps. The heat dissipation fins 32 are made of AL1100 through an integrated cutting process. They consist of 37 fins arranged at intervals along the front-back direction. The thickness of a single fin is 0.5mm, the overall height of the fins is 30mm, and the interval between two adjacent fins is set to 3mm. All fins are welded and fixed to the upper surface of the heat dissipation base 31 through a reflow soldering process. The overall ventilation channel is completely aligned with the grille positions of the first ventilation port 4 and the second ventilation port 5. Air can pass directly through all the fin gaps in the lateral direction without any additional airflow obstruction structure. A thermally conductive protrusion 34, matching the contour of the main chip 201, is integrally stamped on the heat dissipation base 31 at the position corresponding to the main chip 201. During assembly, high thermal conductivity silicone grease is filled between the thermally conductive protrusion 34 and the upper surface of the main chip 201 to achieve a completely gapless fit with the main chip 201. The heat dissipation of the main chip 201 is achieved by using the principle of conduction heat dissipation, which can quickly transfer the heat at the main chip 201 to the heat dissipation fins 32.A heat pipe 33 is disposed between the heat sink base 31 and the heat sink fins 32. Specifically, a mounting groove 35 is formed on the upper surface of the heat sink base 31. The mounting groove 35 extends laterally from the area directly above the computing chip 202 to the area of ​​the heat sink fins 32 near the second vent 5. The heat pipe 33 is an L-shaped long heat pipe with a diameter of 8mm and made of CU1020 material, which is embedded inside the mounting groove 35. The bottom of the heat pipe 33 is in complete contact with the metal surface of the base below through thermal grease. The first end of the heat pipe 33 is connected to the upper surface of the computing chip 202 through a thermal pad for heat conduction. The second end of the heat pipe 33 extends to the area of ​​the heat sink fins 32 near the second vent 5 (i.e., the air outlet), and its length covers multiple heat sink fins 32. The installation position of 2 utilizes the heat pipe cooling principle. The working fluid inside the heat pipe evaporates and absorbs heat under the influence of the heat source. When the vapor encounters the cold end pipe wall, it liquefies into liquid and releases a large amount of heat. This liquid is absorbed by the heat dissipation fins 32, and the cooled liquid flows back to the heat source end, continuously circulating. This quickly transfers heat from one end to the heat dissipation fins 32 at the other end, thus rapidly transferring heat from the computing chip 202 to the heat dissipation fins 32 near the second vent 5 (i.e., the air outlet). This avoids the problem of heat accumulation in the middle of the heat dissipation base 31. The heat pipe 33 has a higher thermal conductivity than traditional methods, significantly extending the overall lifespan of the AI ​​intelligent device, reducing the generation of electronic waste, and possessing outstanding long-term use value.

[0025] In this example, the main chip 201 and the computing chip 202 are arranged horizontally separately. The heat is quickly transferred from the main chip 201 to the heat sink 32 through the heat conduction principle via the heat-conducting protrusion 34 and the heat sink base 31. At the same time, the heat is transferred from the computing chip 202 to the heat sink 32 near the second ventilation port 5 (i.e., the air outlet) through the heat pipe 33 and the heat sink base 31. This arrangement, which uses a horizontal stacking design with different chips staggered, uses a modular heat dissipation module to quickly transfer all the heat from different places to the aluminum heat sink fins. It separates and manages the heat source of different chips, improving the current series heat dissipation method of two chips. The heat of the computing chip 202 will not be directly conducted to the main chip 201, completely avoiding the overheating and frequency reduction problem caused by the main chip 201 receiving superimposed heat. It completely abandons the traditional vertical stacking series heat conduction structure, so that the AI ​​agent can take into account both heat dissipation effect and device lifespan. The horizontal layout significantly reduces the overall vertical height of the device, resulting in a thinner overall design compared to traditional stacked solutions. This provides ample design flexibility for consumer products, accommodating various slim and lightweight designs such as desktop ornaments and smart home integrations. The side-in, side-out ventilation path, coupled with a dust filter at the inlet, effectively blocks external dust from entering the interior, reducing dust accumulation on the fins and controlling airflow attenuation, ensuring stable heat dissipation efficiency even after long-term use. The combination of an aluminum heatsink base with copper heat pipes and aluminum fins balances thermal conductivity with lightweight characteristics, reducing the overall weight of the cooling module and lowering cooling costs.

[0026] In one embodiment, reference is made to Figure 5 The heat pipe 33 includes an evaporation section 331 arranged in the front-to-back direction and a condensation section 332 extending from one end of the evaporation section 331 in the left-to-right direction. The evaporation section 331 is arranged opposite to the computing chip 202, and the end of the condensation section 332 away from the evaporation section 331 is located in the area of ​​the heat sink fin 32 near the second vent 5.

[0027] As an example, the heat pipe 33 is divided into an evaporation section 331 and a condensation section 332. The evaporation section 331 is arranged along the front-to-back direction and is positioned opposite the computing chip 202 to facilitate the absorption of heat generated by the computing chip 202. The condensation section 332 is arranged along the left-to-right direction, with the end of the condensation section 332 away from the evaporation section 331 located in the area of ​​the heat dissipation fins 32 near the second vent 5. This facilitates the transfer of heat absorbed by the evaporation section 331 to the heat dissipation fins 32 near the air outlet area. The heat transfer path has no redundant links, effectively improving heat dissipation efficiency compared to ordinary direct heat pipes. The phase change working fluid inside the heat pipe 33 achieves self-driven heat conduction through a gas-liquid phase change cycle, eliminating the need for additional power components such as heat pumps. The operation is free of mechanical vibration and generates no additional noise, making it suitable for quiet use in home environments.

[0028] In one embodiment, reference is made to Figure 2 , Figure 5 and Figure 6 The heat dissipation base 31 is provided with a plurality of first connecting posts 6 arranged at intervals along the circumferential direction, and the PCBA module 2 is provided with a plurality of first connecting holes 7 arranged at intervals along the circumferential direction. Each first connecting post 6 is inserted into a first connecting hole 7. The AI ​​intelligent body also includes a plurality of first fasteners 8, and each first connecting post 6 is locked to the PCBA module 2 by a first fastener 8. The housing 1 is provided with a plurality of second connecting posts 9 arranged at intervals along the circumferential direction, and the PCBA module 2 is also provided with a plurality of second connecting holes 10 arranged at intervals along the circumferential direction. Each second connecting post 9 is inserted into a second connecting hole 10. The AI ​​intelligent body also includes a plurality of second fasteners 11, and each second connecting post 9 is locked to the PCBA module 2 by a second fastener 11.

[0029] As an example, a cylindrical first connecting post 6 is integrally formed at each of the four corners of the heat dissipation base 31. A threaded hole is opened in the center of the connecting post, and a first connecting hole 7 is opened at the corresponding position of the PCBA module 2. The four first connecting posts 6 pass through the corresponding first connecting holes 7, and are then locked and fixed from the back of the PCBA module 2 by four first fasteners 8 (screws). At the same time, a second connecting post 9 is integrally formed at each of the four corners of the inner top surface of the outer shell 1. A second connecting hole 10 is opened at the corresponding position of the outer periphery of the PCBA module 2, and four second fasteners 11 lock the PCBA module 2 onto the second connecting posts 9, achieving double-layer independent fixation. With this configuration, the heat dissipation base 31 and the PCBA module 2 are pre-positioned through the four-corner alignment connection structure. No additional tooling calibration is required during the assembly process, improving assembly efficiency. At the same time, it ensures that the contact pressure between the heat-conducting protrusion 34 and the main chip 201 is uniform, avoiding excessive local pressure that damages the chip, or insufficient pressure that increases the thermal gap. PCBA module 2 is fixed to the outer casing 1 via a four-corner alignment connection structure. The installation stress of the heat dissipation module 3 is not directly transmitted to the chip pads, reducing the chip pad desoldering rate and significantly improving product reliability. The dual-layer independent fixing structure allows for a pre-reserved heat dissipation gap between PCBA module 2 and the inner bottom wall of outer casing 1. The air in the heat dissipation gap can form convection to carry away the heat from the components on the back of PCBA module 2, further reducing the overall internal ambient temperature.

[0030] In one embodiment, reference is made to Figure 3 and Figure 7The AI ​​intelligent agent also includes a fan module 12; the fan module 12 is installed inside the housing 1, dividing the internal cavity of the housing 1 into a mounting cavity and a heat dissipation cavity in the left-right direction; the PCBA module 2 and the heat dissipation module 3 are located in the mounting cavity, the first vent 4 is connected to the mounting cavity, and the second vent 5 is connected to the heat dissipation cavity; the air inlet surface of the fan module 12 faces the mounting cavity, and the air outlet surface of the fan module 12 faces the heat dissipation cavity, which is used to guide the heat in the mounting cavity into the heat dissipation cavity and then exhaust it from the second vent 5.

[0031] As an example, the fan module 12 is vertically installed inside the right side of the housing 1, completely dividing the internal cavity of the housing 1 into a mounting cavity on the left and a heat dissipation cavity on the right. The PCBA module 2 and the heat dissipation module 3 are both housed in the mounting cavity on the left. The first vent 4 is directly connected to the mounting cavity, and the second vent 5 is connected to the heat dissipation cavity on the right. The air intake surface of the fan module 12 faces the mounting cavity on the left, and the air outlet surface faces the heat dissipation cavity on the right. During operation, all the hot air in the mounting cavity is drawn into the heat dissipation cavity and then quickly discharged outside the machine through the second vent 5. With this configuration, the dual-cavity structure with left and right separation forms an independent heat dissipation airflow channel. After entering from the first vent 4 on the left, the cool air first flows over the surface of the main chip 201 and the computing chip 202 to remove heat, and then is uniformly pressurized and discharged by the fan. This completely avoids the problem of disordered circulation of hot air inside the traditional solution, and improves the utilization rate of the airflow channel. The fan module 12 is located on the exhaust side downstream of the chip. Compared to traditional blowing-type cooling, the suction-type cooling provides a more uniform airflow distribution on the chip surface, eliminating localized airflow blind spots and preventing excessive temperature differences between the main chip 201 and the computing chip 202, thus avoiding the formation of localized hot spots. The fan module 12 uses a 5015 DC silent fan housed in an independent cooling chamber. Vibrations generated during operation are not directly transmitted to the PCBA module 2, reducing overall operating noise and meeting the quiet operation requirements for home use.

[0032] In this example, the heat on the heat dissipation fins 32 of the heat dissipation module 3 can be forcibly drawn into the heat dissipation cavity by the fan module 12, preventing heat backflow. This creates a reliable, actively propelled airflow over the heating surface. Specifically, the forced airflow from the fan module 12 across the heating surface of the PCBA module 2 continuously replaces the heated air with cooler air, quickly carrying away heat from the mounting cavity into the heat dissipation cavity. The heat is then exhausted to the outside through the second vent 5, i.e., the exhaust port, achieving efficient heat dissipation for the entire AI intelligent device and meeting performance requirements. Furthermore, to meet manufacturing process requirements, the heat dissipation module 3 and fan module 12 are modularly designed, enabling rapid and efficient assembly of each module.

[0033] In one embodiment, reference is made to Figure 2 , Figure 4 and Figure 7 Inside the outer casing 1, near the second vent 5, there is a guide rail 13 and a fixing post 14 arranged in the vertical direction; the fan module 12 includes a fan bracket 121 and at least one fan 122; the fan bracket 121 is inserted into the guide rail 13 and fixed to the fixing post 14 by a third fastener 15, dividing the internal cavity of the outer casing 1 into a mounting cavity and a heat dissipation cavity in the left-right direction; each fan 122 is mounted on the fan bracket 121, with the air inlet surface of the fan 122 facing the mounting cavity and the air outlet surface of the fan 122 facing the heat dissipation cavity.

[0034] As an example, two vertically extending guide rails 13 are symmetrically machined on the front and rear sidewalls of the housing 1 near the second vent 5. The groove width of the guide rails 13 matches the side thickness of the fan bracket 121. A cylindrical fixing post 14 with threaded holes is integrally formed on the side of the guide rails 13. The fan module 12 includes a plastic fan bracket 121 and two side-by-side silent fans 122. The front and rear sidewalls of the fan bracket 121 are inserted vertically into the guide rails 13. After sliding into place along the guide rails 13, the fan bracket 121 is locked to the fixing post 14 by two third fasteners 15, realizing the quick positioning and installation of the fan module 12. This design, with the fan bracket 121 employing a rail-type plug-in structure, eliminates the need for alignment and calibration during assembly, allowing for installation by a single person. For later maintenance and disassembly, it can be simply pulled out along the rail 13 without disassembling other internal components, thus improving maintenance efficiency. The rail structure provides rigid support for the fan bracket 121, completely constraining the vibration of the fan 122 during high-speed operation, reducing resonance noise and preventing bracket loosening or displacement even after prolonged operation. The dual-fan side-by-side layout allows for flexible configuration based on cooling requirements. Under low loads, a single fan can meet the cooling needs, while under high loads, both fans start simultaneously, maximizing airflow while controlling noise.

[0035] In one embodiment, reference is made to Figure 7 The fan bracket 121 includes a support plate 1211 and a fixing plate 1212 extending from one side edge of the support plate 1211 in a direction perpendicular to the support plate 1211; the support plate 1211 is inserted into the guide rail 13, and the fixing plate 1212 is fixed to the fixing post 14 by a third fastener 15.

[0036] As an example, the main body of the fan bracket 121 is a rectangular support plate 1211. The outline dimensions of the support plate 1211 perfectly match the internal cross-section of the outer shell 1. The right edge of the support plate 1211 is bent vertically to the right at 90° to form a fixing plate 1212. Two screw holes are opened on the surface of the fixing plate 1212 to align with the fixing posts 14. The front and rear sides of the support plate 1211 are inserted into the corresponding guide rails 13. After sliding along the guide rails to the limit position, the surface of the fixing plate 1212 is completely in contact with the fixing posts 14. The entire fan bracket 121 is locked and fixed by a third fastener 15 passing through the fixing plate 1212. With this configuration, the L-shaped fan bracket 121 simultaneously achieves the functions of insertion guidance and locking fixation. The support plate 1211 completely covers the internal cross-section of the outer shell 1, thoroughly sealing the gap between the two cavities and preventing hot air from flowing back into the mounting cavity from the gap, thus greatly improving the air duct sealing performance. The integrated bending and forming process of the support plate 1211 and the fixing plate 1212 improves the structural strength compared to the separate assembly structure, and will not deform or crack even under long-term vibration of the fan 122. The locking position is located on the outer fixing plate 1212, providing ample space for assembly operations. The screw tightening process will not touch the internal fan blades, completely avoiding fan damage caused by assembly errors. The support plate 1211 has a fan mounting slot, with a fifth connecting post 26 located diagonally opposite the fan mounting slot. Each of the four corners of the fan 122 has a mounting hole 27. The fan 122 is pre-installed on the diagonally located fifth connecting post 26, and then locked using the fifth fastener 28 to securely mount the fan 122 onto the fan bracket 121. The length of the fifth connecting post 26 is 0.5mm less than the thickness of the fan 122 to prevent the fifth connecting post 26 from protruding and occupying installation space.

[0037] In one example, the connecting column mentioned above can be set as a guide and positioning column, or as a support and fixing column, or both can be used in combination. During installation, the connecting column serves both the guiding and positioning function and the support and fixing function.

[0038] In one embodiment, reference is made to Figure 1 and Figure 2 The outer casing 1 includes a housing 101 and a cover 102, and the cover 102 is detachably connected to the housing 101.

[0039] As an example, the outer casing 1 consists of two parts: a housing 101 and a cover 102, which are detachably connected by at least one of the following methods: screwing, snap-fitting, and adhesive bonding. For instance, a matching snap-fit ​​alignment structure is provided at the mating edges of the housing 101 and the cover 102, while the detachable connection is achieved through hidden screws on the side. This allows for complete disassembly of the entire machine without the need for special tools, facilitating subsequent internal cleaning and maintenance. This design makes the outer casing 1 a split-type structure, significantly reducing the difficulty of production and assembly. All internal components can be installed from the bottom opening, improving production and assembly efficiency and reducing the defect rate. The detachable design allows users to independently open the outer casing 1 to clean the internal filter 19 and fin dust without returning the product to the factory for maintenance, greatly extending the overall service life of the product.

[0040] In one embodiment, reference is made to Figure 2 , Figure 3 and Figure 4 The housing 101 is provided with a plurality of third connecting posts 16 arranged at intervals along the circumferential direction, and the inner side of the cover 102 is provided with a plurality of fourth connecting posts 17 arranged at intervals along the circumferential direction. Each third connecting post 16 is connected to a fourth connecting post 17. The AI ​​intelligent body also includes a plurality of fourth fasteners 18, and each fourth connecting post 17 is locked to a third connecting post 16 by a fourth fastener 18.

[0041] As an example, third connecting posts 16 extend downward from the four corners inside the housing 101, and fourth connecting posts 17 extend upward from the corresponding positions inside the cover 102. Coaxial threaded holes are pre-drilled at the centers of the two sets of connecting posts, and four fourth fasteners 18 pass through the outside of the cover 102 to lock and fix them together. This configuration, with its evenly distributed connecting posts, ensures a uniform distribution of the locking stress between the cover 102 and the housing 101, improving the overall structural strength of the outer shell. This makes the outer shell less prone to cracking and deformation during drop tests, and significantly enhances the impact resistance of the internal components. Furthermore, in the above embodiment, the second connecting post 9, located inside the outer shell, is positioned on the inner top wall of the housing 101.

[0042] In one embodiment, reference is made to Figure 3 The inner side of the cover 102 is provided with a wind baffle 20, which abuts against the fan module 12. This arrangement further seals the gap of the heat dissipation cavity by the wind baffle 20, making the heat dissipation cavity a sealed cavity, completely eliminating the problem of air leakage in the air duct, and improving the utilization rate of heat dissipation air volume.

[0043] In one embodiment, reference is made to Figure 2 and Figure 4The outer side of the cover 102 is provided with feet 21 opposite to the fourth connecting post 17, and each foot 21 is embedded with an anti-slip buffer pad 22. The anti-slip buffer pad 22 prevents the whole machine from sliding when placed on the table, and at the same time buffers the vibration transmitted from the table, further reducing the operating noise of the whole machine. The cover 102 has a removable battery cover 23, which houses a rechargeable backup battery and integrates a full-range speaker as an audio speaker 24. The integrated backup battery and audio speaker functions allow the AI ​​intelligent agent to run the voice interaction function offline without an external power supply, expanding the product's usage scenarios. It can realize voice broadcast, music playback and other functions without the need for an additional external speaker, improving the integration of the product and the user experience.

[0044] In one embodiment, reference is made to Figure 2 , Figure 3 , Figure 4 and Figure 7 The AI ​​intelligent agent also includes a sealing baffle 25, which is installed on the fan module 12 and abuts against the inner wall of the housing 1 to prevent heat from flowing back into the installation cavity.

[0045] As an example, the sealing baffle 25 is made of high-temperature resistant silicone material and is adhered to the surface of the fixing plate 1212 of the fan bracket 121 using adhesive. The four edges of the baffle elastically abut against the inner walls of the front and rear sides and the left side of the outer casing 1, completely sealing all assembly gaps between the fan bracket 121 and the inner wall of the outer casing 1, blocking the path of hot air in the heat dissipation cavity back to the left mounting cavity. With this configuration, the sealing baffle 25 completely eliminates air leakage gaps in the air duct, and the airflow output by the fan is used entirely to exhaust hot air outside the machine, preventing the problem of hot air short-circuiting and backflow, further improving the overall heat dissipation efficiency. The sealing baffle also has a shock absorption function, absorbing slight vibrations during fan operation and preventing vibrations from being directly transmitted to the outer casing to generate resonance noise, further optimizing the overall quietness of the machine.

[0046] In one embodiment, the AI ​​agent further includes a control module and a temperature sensor; the temperature sensor is connected to the main chip 201 and the computing chip 202 respectively, and is used to collect temperature data of the two chips in real time; the control module is electrically connected to the temperature sensor and the fan module 12 respectively, and controls the fan module 12 to work according to the temperature data collected in real time by the temperature sensor.

[0047] As an example, two NTC temperature sensors are attached to the surfaces of the main chip 201 and the computing chip 202 respectively using thermally conductive adhesive. This allows for real-time acquisition of the operating temperature data of both chips. The control module uses an independent MCU control chip, which reads the temperature sensor signals through the ADC port and employs a preset three-level speed control strategy: when the average temperature of the two chips is below 45℃, the fan stops; when the temperature is between 45℃ and 65℃, the fan runs at 50% speed; and when the temperature is above 65℃, the fan runs at 100% speed. This setup allows for real-time temperature monitoring and precise understanding of the heating status of the two chips. Compared to traditional solutions that only monitor the ambient temperature of the entire machine, this improves temperature control accuracy and completely avoids overheating warnings. The independent temperature control logic does not occupy the main chip's computing resources, thus not increasing the main chip's load. It can also anticipate thermal shocks to the computing chip and increase the fan speed before the computing chip reaches full load, achieving seamless temperature control and preventing sudden temperature changes from affecting product stability. A heat dissipation mechanism for dynamically managing internal heat is provided. Depending on the heat generated by the intelligent agent when performing different functions or combined tasks, a fan mechanism with different speeds can be activated to ensure that the noise level of the product can be dynamically controlled.

[0048] Currently, products on the market use a vertically connected stacked design. While this can achieve heat dissipation, it's not very effective at quickly dispersing different types of heat, easily leading to heat buildup. Furthermore, the powerful airflow from a single top fan is susceptible to problems due to dust accumulation, the top being covered, and the fan's lifespan, preventing heat from being effectively dissipated. In addition, the overall industrial-grade appearance of these products makes them difficult to adapt to the application trends of consumer products.

[0049] The specific assembly process of each component in the AI ​​intelligent body is as follows: First, the dual fans are fixed to the fan bracket 121 by the fifth connecting post 26 set diagonally, and then fixed with the fifth fastener 28. Then, the fans are inserted and assembled by the round hole of the fan bracket 121 and the two front and rear guide rails 13 and the fixing post 14 set in the housing 101. Then, the sealing baffle 25 is attached and fixed with the third fastener 15, thereby dividing the internal cavity of the whole machine into the installation cavity and the closed heat dissipation cavity. Next, the heat dissipation module 3 is inserted into the first connecting hole 7 of the PCBA module 2 by the first connecting post 6 and fixed with the first fastener 8 to form the PCBA whole assembly with the heat dissipation module 3. Then, the second connecting post 9 of the housing 101 is inserted into the second connecting hole 10 of the PCBA module 2 and fixed with the second fastener 11. Finally, the cover 102 is assembled on the housing 101, thereby realizing the assembly of the entire product.

[0050] The heat dissipation system combination design of this application effectively solves the heat dissipation path of different heat sources without affecting their stacking. In particular, it effectively protects the high-power computing chip 202 by utilizing heat transfer and circulating heat dissipation, ensuring stable performance. It also provides a novel horizontal heat dissipation stacking design, placing the air inlet and outlet on the side of the product. A silent dual-fan design is used to draw the total heat into a designated enclosed space, where it is then dissipated through the outlet. This stacking solution better meets the design constraints of consumer products, making them more suitable for home use. Furthermore, the heat dissipation system of this application is modular, allowing for simpler and more convenient production and installation, and can be quickly adapted to different high-power computing products (such as mini PCs, smart high-end set-top boxes, and HD media players). This application employs a horizontally separated chip stacking and a heat dissipation measure that combines heat pipes with the heat source (computing chip 202), and utilizes a modular dual-fan architecture with dynamically adjustable airflow for combined heat dissipation. This minimalist design solves the core function of high-power heat release in the product, while the side-inlet and side-outlet airflow design allows for perfect definition of various appearances and greatly increases the design options for consumer-grade product styling, thereby improving the core functional indicators of the entire product and increasing its competitiveness.

[0051] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. An AI intelligent agent, characterized in that, Includes the casing, PCBA module, and heat dissipation module; The PCBA module and the heat dissipation module are stacked and installed inside the housing in a vertical direction; the first side of the housing is provided with a first ventilation opening communicating with the interior, and the second side of the housing is provided with a second ventilation opening communicating with the interior; The PCBA module integrates a main chip and a computing chip arranged horizontally at intervals; the heat dissipation module includes a heat dissipation base, heat dissipation fins, and heat pipes; the heat dissipation base is mounted on the PCBA module, and the heat dissipation base is provided with a thermally conductive protrusion, which is attached to the main chip by thermal grease; the heat dissipation fins are mounted on the heat dissipation base, and the heat pipe is disposed between the heat dissipation base and the heat dissipation fins, with the first end of the heat pipe being disposed opposite to the computing chip, and the second end of the heat pipe being located in the area of ​​the heat dissipation fins near the second vent.

2. The AI ​​agent according to claim 1, characterized in that, The heat pipe includes an evaporation section arranged in a front-to-back direction and a condensation section extending from one end of the evaporation section in a left-to-right direction. The evaporation section is disposed opposite to the computing chip, and the end of the condensation section away from the evaporation section is located in the area of ​​the heat dissipation fins near the second vent.

3. The AI ​​agent according to claim 1, characterized in that, The heat dissipation base is provided with a plurality of first connecting posts arranged at intervals along the circumferential direction, and the PCBA module is provided with a plurality of first connecting holes arranged at intervals along the circumferential direction. Each first connecting post is inserted into a first connecting hole. The AI ​​intelligent agent also includes a plurality of first fasteners, and each first connecting post is locked to the PCBA module by a first fastener. The housing is provided with a plurality of second connecting posts arranged at intervals along the circumferential direction, and the PCBA module is also provided with a plurality of second connecting holes arranged at intervals along the circumferential direction, with each second connecting post inserted into a second connecting hole; the AI ​​intelligent agent also includes a plurality of second fasteners, with each second connecting post locked onto the PCBA module by a second fastener.

4. The AI ​​agent according to claim 1, characterized in that, The AI ​​intelligent agent also includes a fan module; the fan module is installed inside the housing, dividing the internal cavity of the housing into a mounting cavity and a heat dissipation cavity in the left-right direction; the PCBA module and the heat dissipation module are located in the mounting cavity, the first vent is connected to the mounting cavity, and the second vent is connected to the heat dissipation cavity; The air inlet of the fan module faces the mounting cavity, and the air outlet of the fan module faces the heat dissipation cavity, so as to guide the heat in the mounting cavity into the heat dissipation cavity and then discharge it from the second vent.

5. The AI ​​agent according to claim 4, characterized in that, The housing is provided with a guide rail and a fixing post arranged in the vertical direction near the second ventilation opening; The fan module includes a fan bracket and at least one fan; the fan bracket is inserted into the guide rail and fixed to the fixing post by a third fastener, dividing the internal cavity of the housing into a mounting cavity and a heat dissipation cavity in the left-right direction; Each of the aforementioned fans is mounted on the fan bracket, with the air inlet of the fan facing the mounting cavity and the air outlet of the fan facing the heat dissipation cavity.

6. The AI ​​agent according to claim 5, characterized in that, The fan bracket includes a support plate and a fixing plate extending from one side edge of the support plate in a direction perpendicular to the support plate; the support plate is inserted into the guide rail, and the fixing plate is fixed to the fixing post by a third fastener.

7. The AI ​​agent according to claim 1, characterized in that, The outer casing includes a housing and a cover, the cover being detachably connected to the housing.

8. The AI ​​agent according to claim 7, characterized in that, The housing is provided with a plurality of third connecting posts arranged at intervals along the circumferential direction, and the inner side of the housing cover is provided with a plurality of fourth connecting posts arranged at intervals along the circumferential direction. Each of the third connecting posts is connected to a fourth connecting post. The AI ​​intelligent agent also includes a plurality of fourth fasteners, and each of the fourth connecting posts is locked to a third connecting post by a fourth fastener.

9. The AI ​​agent according to claim 4, characterized in that, The AI ​​intelligent agent also includes a sealing baffle, which is installed on the fan module and abuts against the inner wall of the housing to prevent heat from flowing back into the mounting cavity from the heat dissipation cavity.

10. The AI ​​agent according to claim 4, characterized in that, The AI ​​agent also includes a control module and a temperature sensor; the temperature sensor is connected to the main chip and the computing chip respectively, and is used to collect temperature data of the two chips in real time; the control module is electrically connected to the temperature sensor and the fan module respectively, and controls the operation of the fan module according to the temperature data collected in real time by the temperature sensor.

Images