Liquid cooling heat dissipation device and electronic equipment

Abstract

The application discloses a liquid cooling heat dissipation device and electronic equipment, and relates to the technical field of liquid cooling heat dissipation, which comprises at least one phase change uniform temperature plate, a phase change cavity filled with a liquid absorption core structure is formed in the phase change uniform temperature plate; a cold plate assembly is sealingly connected to one side of the phase change uniform temperature plate and cooperates with opposite side walls of the two phase change uniform temperature plates to jointly enclose a liquid cooling heat dissipation flow channel, the cold plate assembly is provided with a liquid inlet and a liquid outlet which are in communication with the liquid cooling heat dissipation flow channel; and a heat conduction part is arranged on the other side of the phase change uniform temperature plate. One of the cold plate assemblies is sealingly connected to one side of the phase change uniform temperature plate, and the liquid cooling heat dissipation flow channel is directly enclosed by the cold plate assembly and the phase change uniform temperature plate, the phase change cycle in the phase change uniform temperature plate relies on the latent heat of vaporization of a working medium to transfer heat, and the heat is taken away by the flowing of cooling liquid in the liquid cooling heat dissipation flow channel between the cold plate assembly and the phase change uniform temperature plate, and the technical effect that the heat conduction efficiency is much higher than that of pure metal plate material is achieved.

Description

Technical Field

[0001] This application relates to the field of liquid cooling technology, and more particularly to a liquid cooling device and electronic equipment. Background Technology

[0002] With the rapid development of electronic equipment technology, the heat generated during the operation of electronic devices continues to increase, making overall heat dissipation increasingly difficult. If the heat generated by the equipment cannot be dissipated in a timely manner, insufficient heat dissipation will cause abnormally high local temperatures in the electronic equipment, which can easily lead to abnormal equipment operation. In severe cases, it can even cause system crashes, hardware damage, and other failures, posing a direct threat to the reliability of equipment operation. Liquid cooling technology is suitable for the heat dissipation conditions of various types of electronic equipment such as servers, switching equipment, and storage devices, and is widely used in the field of high-power devices.

[0003] Liquid cooling plates offer significant advantages such as high heat exchange efficiency and low operating noise, making them a mainstream heat dissipation solution for high-power electronic devices. The heat dissipation structure of electronic devices generally adopts a design approach of matching a single heat source with a single cooling plate, meaning that each heat source is equipped with a separate liquid cooling plate. This not only occupies a considerable amount of internal chassis height space but also increases the overall piping complexity of the liquid cooling system. Consequently, the heat dissipation effect is difficult to adapt to the high-performance heat dissipation requirements of electronic devices, and it is difficult to balance compact installation space with high-power heat dissipation needs. Summary of the Invention

[0004] This application provides a liquid cooling heat dissipation device and electronic device to at least solve the problems of low heat dissipation efficiency and space occupation of liquid cooling heat dissipation devices for heat dissipation of circuit boards in limited height space in the related art.

[0005] This application provides a liquid cooling heat dissipation device, including: At least one phase change heat spreader, wherein a phase change cavity filled with a liquid-absorbing core structure is formed inside the phase change heat spreader; A cold plate assembly is sealed to one side of the phase change heat exchange plate and cooperates with the opposite side wall of the phase change heat exchange plate to form a liquid cooling heat dissipation channel. The cold plate assembly is provided with an inlet and an outlet that communicate with the liquid cooling heat dissipation channel. A heat-conducting part is provided on the other side of the phase change heat exchange plate.

[0006] This application also provides an electronic device, including a chassis, at least one circuit board, and the liquid cooling heat dissipation device described above. The circuit board and the liquid cooling heat dissipation device are disposed inside the chassis, and the circuit board is connected to the other side of the liquid cooling heat dissipation device.

[0007] This application involves sealing one of the cold plate components to one side of the phase change heat exchanger plate. The cold plate component and the phase change heat exchanger plate directly enclose each other to form a liquid cooling heat dissipation channel. The phase change cycle inside the phase change heat exchanger plate relies on the latent heat of vaporization of the working fluid to transfer heat, resulting in a thermal conductivity far exceeding that of pure metal plates. This allows for rapid heat dissipation from the circuit board to the entire heat exchange side of the phase change heat exchanger plate, preventing localized overheating of hot spots on the circuit board. Simultaneously, the coolant is confined within the liquid cooling heat dissipation channel space between the cold plate component and the phase change heat exchanger plate. The coolant and the phase change working fluid inside the phase change chamber are completely isolated from each other. Even if leakage occurs in the liquid cooling heat dissipation channel, the coolant will not infiltrate the interior of the phase change chamber, preventing liquid contamination of the phase change chamber and causing phase change heat exchanger plate failure, thus improving the overall operational reliability of the liquid cooling heat dissipation device. It can be configured with a single phase change heat exchanger to achieve heat dissipation on one side, or with two phase change heat exchangers, with the cold plate assembly sandwiched between the two phase change heat exchangers to achieve heat dissipation on both sides simultaneously. The architecture has good adaptability and flexibility, and can be selected according to the actual number of heat sources. Attached Figure Description

[0008] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 A schematic diagram of a liquid cooling heat dissipation device provided in an embodiment of this application; Figure 2 Provided for the embodiments of this application Figure 1 A sectional view along the section line; Figure 3 A schematic diagram of an exploded structure of a liquid cooling heat dissipation device provided in an embodiment of this application; Figure 4 A schematic diagram of a structural explosion of a phase change heat spreader provided in an embodiment of this application; Figure 5 A schematic diagram of a partial structure of a phase change heat exchanger provided in an embodiment of this application; Figure 6 Provided for the embodiments of this application Figure 5 A schematic diagram from a three-dimensional perspective; Figure 7 A schematic diagram of a flow channel partition structure provided in an embodiment of this application; Figure 8 Provided for the embodiments of this application Figure 7 A schematic diagram from a three-dimensional perspective; Figure 9A schematic diagram of another flow channel partition structure provided in the embodiments of this application; Figure 10 Provided for the embodiments of this application Figure 9 A schematic diagram from a three-dimensional perspective.

[0010] The above figures include the following reference numerals: 1. Phase change heat spreader; 11. Phase change shell plate; 111. Substrate; 112. Enclosure plate; 12. Phase change cover plate; 13. Liquid absorption core structure; 131. First capillary network layer; 132. Phase change support column; 1321. First support column; 1322. Second support column; 1323. Third support column; 133. Second capillary network layer; 14. Thermally conductive part; 101. Phase change cavity; 1011. First region; 1012. Second region; 2. Cold plate assembly; 21. Cold plate frame; 211. Liquid inlet connector; 212. Liquid outlet connector; 22. Flow channel partition structure; 23. First quick connector; 24. Second quick connector; 25. Liquid inlet pipe; 26. Liquid outlet pipe; 201, receiving cavity; 2011, liquid cooling heat dissipation channel. Detailed Implementation

[0011] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0012] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0013] The terms “installation,” “connection,” and “linkage” should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. The terms “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable deviation range, which is determined by a person skilled in the art taking into account the measurement under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For a person skilled in the art, the specific meaning of the above terms in this application can be understood on a case-by-case basis.

[0014] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0015] The embodiments of this application provide a liquid cooling heat dissipation device, and the device is described in detail in conjunction with its structure and working principle.

[0016] like Figures 1 to 10 As shown in the figure, this application provides a liquid cooling heat dissipation device for heat dissipation of circuit boards in electronic devices, especially suitable for heat dissipation of circuit boards with chips.

[0017] like Figures 1 to 3 As shown, the liquid cooling device includes at least one phase change heat spreader 1 and a cold plate assembly 2. The number of phase change heat spreaders 1 can be one or two. A phase change cavity 101 filled with a liquid-absorbing core structure 13 is formed inside the phase change heat spreader 1. The liquid-absorbing core structure 13 is a porous metal structure sintered and fixed to the inner wall of the phase change cavity 101 and possessing capillary adsorption capability. The phase change cavity 101 is filled with a phase change working fluid. The phase change heat spreader 1 is a vacuum-sealed metal plate. A heat-conducting part 14 is used to directly adhere to the heat-generating circuit board. The cold plate assembly 2 is sealed to one side of the phase change heat spreader 1 and cooperates with the opposite sidewall of the phase change heat spreader 1 to jointly form a liquid cooling heat dissipation channel 2011. A heat-conducting part 14 is provided on the other side of the phase change heat spreader 1 for contact heat dissipation of the circuit board. The cold plate assembly 2 is a sealed frame structure for carrying the flow of coolant. The cold plate assembly 2 has an inlet and an outlet communicating with the liquid cooling heat dissipation channel 2011. The inlet is where the low-temperature coolant flows into the liquid cooling heat dissipation channel 2011, and the outlet is where the high-temperature coolant, after absorbing heat, flows out of the liquid cooling heat dissipation channel 2011.

[0018] In this embodiment, one of the cold plate components 2 is sealed and connected to one side of the phase change heat exchange plate 1. The cold plate component 2 and the phase change heat exchange plate 1 directly enclose each other to form a liquid cooling heat dissipation channel 2011. The phase change cycle inside the phase change heat exchange plate 1 relies on the latent heat of vaporization of the working fluid to transfer heat. The thermal conductivity is much higher than that of pure metal plates, which can quickly diffuse the heat of the circuit board to the entire heat exchange side of the phase change heat exchange plate 1, avoiding the problem of local hot spots on the circuit board with excessively high temperatures. At the same time, the coolant is confined to the space of the liquid cooling heat dissipation channel 2011 between the cold plate component 2 and the phase change heat exchange plate 1. The coolant and the phase change working fluid inside the phase change cavity 101 are completely isolated from each other. Even if the liquid cooling heat dissipation channel 2011 leaks, the coolant will not invade the interior of the phase change cavity 101, avoiding liquid contamination of the phase change cavity 101 and causing the phase change heat exchange plate 1 to fail, thus improving the overall operational reliability of the liquid cooling heat dissipation device.

[0019] This embodiment can be configured with a single phase change heat exchanger 1 to achieve heat dissipation on one side, or with two phase change heat exchangers 1, with the cold plate assembly 2 sandwiched between the two phase change heat exchangers 1 to achieve heat dissipation on both sides simultaneously. The architecture has good adaptability and flexibility, and can be selected according to the actual number of heat sources.

[0020] In some embodiments, the liquid cooling heat dissipation device is a sandwich-type chip heat dissipation structure employing a dual-phase change heat dissipation plate 1 sandwiching an intermediate liquid cooling heat dissipation channel 2011. The overall stacking height of the liquid cooling heat dissipation device and the two-layer circuit board is adapted to the limited vertical installation space inside the 1U form factor chassis of the electronic device. The two phase change heat dissipation plates 1 are spaced apart. The cold plate assembly 2 is disposed between the two phase change heat dissipation plates 1. The opposite sides of the two phase change heat dissipation plates 1 are provided with heat-conducting parts 14.

[0021] This embodiment eliminates the need for separate liquid-cooled cooling plates for the upper and lower sides of the cold plate assembly 2 by placing two independent phase change heat exchangers 1 on the upper and lower sides respectively. This saves the need for separate housing thicknesses for two independent cold plates, two sets of piping connection structures, and corresponding installation clearances. Within the limited vertical installation space, simultaneous heat dissipation of the upper and lower circuit boards is achieved directly. Each of the two phase change heat exchangers 1 has an independent sealed phase change cavity 101. The phase change circulation processes on the upper and lower sides are completely independent and do not interfere with each other, preventing the problem of heat dissipation failure on the other side due to a failure of one side's phase change cavity 101. At the same time, the entire structure only uses one set of shared liquid cooling channels 2011, which significantly reduces the power consumption of the coolant flow and effectively controls the energy consumption cost during long-term operation.

[0022] When the circuit board is a chip-embedded circuit board, the heat-conducting part 14 is attached to the chip on the circuit board. The solution in this embodiment significantly improves the chip placement density per unit space, fully adapting to the stacking installation requirements of high-density AI server 1U chassis. Here, 1U (Unit) is the unit of measurement for the height of the server chassis, 1U = 44.45mm.

[0023] The heat generated by the circuit boards on the upper and lower sides is first conducted rapidly through the heat-conducting part 14 along the phase change heat exchange plate 1 to the liquid-absorbing core structure 13 inside the phase change cavity 101. The liquid phase change working fluid adsorbed in the liquid-absorbing core structure 13 absorbs heat and quickly boils and vaporizes. Under the action of a small pressure difference inside the phase change cavity 101, the vaporized working fluid flows towards the low-temperature side wall near the cold plate assembly 2. When the gaseous working fluid comes into contact with the side wall of the phase change heat exchange plate 1 near the liquid cooling heat dissipation channel 2011, it transfers all the heat it carries to the side wall. The gaseous working fluid cools down and condenses back into liquid. Under the action of the capillary adsorption force of the liquid-absorbing core structure 13, the condensed liquid working fluid flows back to the high-temperature area near the heat-conducting part 14 and absorbs the heat of the circuit board again to vaporize. This forms a continuous gas-liquid two-phase circulation, which quickly and evenly diffuses the heat concentrated locally on the circuit board to the entire heat exchange surface of the phase change heat exchange plate 1.

[0024] At the same time, the low-temperature coolant supplied by the external liquid supply system flows into the liquid cooling heat dissipation channel 2011 from the inlet. During the flow, it directly contacts the opposite sidewalls of the upper and lower phase change heat dissipation plates 1, carrying away all the heat transferred from the two phase change heat dissipation plates 1. The coolant, after absorbing the heat, flows out from the outlet, carrying the heat out of the heat dissipation device and completing the entire heat dissipation cycle. The upper and lower phase change heat dissipation plates 1 independently complete their internal phase change cycles without interfering with each other, while sharing the same set of liquid cooling heat dissipation channels 2011 in the middle to complete heat exchange.

[0025] The overall shape of the two phase change heat spreaders 1 can be rectangular, or it can be replaced with a circular, elliptical, or irregular polygonal structure to accommodate irregularly shaped chips, depending on the actual installation scenario. The phase change working fluid filled inside the phase change cavity 101 can be selected from deionized water, methanol, ethanol, or low-boiling-point fluoride working fluids, depending on the different operating temperature ranges.

[0026] In some embodiments, the cold plate assembly 2 includes a cold plate frame 21 and a flow channel partition structure 22. The cold plate frame 21 is placed between two phase change heat exchange plates 1 and is sealed to the opposite sidewalls of the two phase change heat exchange plates 1, forming a receiving cavity 201. The flow channel partition structure 22 is disposed within the receiving cavity 201 and has multiple spaced partition walls. The flow channel partition structure 22 is a split or integrally formed flow guiding member disposed inside the receiving cavity 201. The multiple partition walls abut against the opposite sidewalls of the two phase change heat exchange plates 1, separating multiple independent and side-by-side liquid cooling heat dissipation channels 2011 between the two phase change heat exchange plates 1.

[0027] In this embodiment, the receiving cavity 201 is divided into multiple independent, small liquid-cooled heat dissipation channels 2011 by the flow channel partition structure 22, which significantly increases the effective heat exchange area between the coolant and the sidewall of the phase change heat exchange plate 1, and the overall heat dissipation capacity is significantly improved. Multiple independent parallel flow channels make the flow velocity distribution of the coolant more uniform throughout the receiving cavity 201, and there will be no dead zones where the coolant flow velocity is too fast in some areas or the coolant flow is almost stagnant in some areas. The heat exchange uniformity of the entire heat exchange surface is greatly improved, and the heat exchange capacity of different areas of the upper and lower phase change heat exchange plates 1 remains highly consistent. There will be no problem of insufficient heat exchange capacity in some areas leading to phase change circulation obstruction, which further enhances the temperature uniformity of the entire heat dissipation device.

[0028] The partition wall simultaneously abuts between the upper and lower phase change heat exchange plates 1, providing a large number of intermediate support points for the two phase change heat exchange plates 1, which greatly improves the deformation resistance of the phase change cavity 101 of the phase change heat exchange plate 1 and enhances the structural reliability of the entire heat dissipation device.

[0029] The cold plate frame 21 can be a rectangular frame structure, integrally connected to the two phase change heat spreaders 1 by welding. The axial height of the cold plate frame 21 is equal to the spacing between the two phase change heat spreaders 1. The partition walls are vertical plate structures. Preferably, the partition walls are evenly spaced.

[0030] like Figure 3 As shown, the liquid inlet and outlet are located at opposite ends of the cold plate frame 21. Multiple liquid cooling channels 2011 extend along the direction from the liquid inlet to the liquid outlet (first direction), specifically either a straight channel path or an S-shaped curved channel path. The multiple liquid cooling channels 2011 are spaced apart along a second direction, which intersects the first direction. Preferably, the second direction is perpendicular to the first direction.

[0031] After the coolant enters through the inlet, it can flow into each liquid cooling channel 2011, flow along the extension direction of the channel, and then converge at the outlet to be discharged outward.

[0032] In this embodiment, the inlet and outlet are arranged at opposite ends of the cold plate frame 21. The liquid cooling channels 2011 extend from the inlet to the outlet, and the coolant flows unidirectionally through all the liquid cooling channels 2011. The flow direction is consistent with the mainstream fluid direction, reducing the turning loss during fluid flow and lowering the flow pressure loss inside the entire cold plate assembly 2. The inlet and outlet of each liquid cooling channel 2011 are connected to the converging areas at both ends, which is beneficial for distributing the flow rate to each liquid cooling channel 2011. The coolant flow rate difference between each liquid cooling channel 2011 is small, further ensuring the uniformity of the entire heat exchange and cooling. At the same time, the inlet and outlet are located on the side of the cold plate frame 21 and do not protrude in the stacking direction, avoiding the occupation of the vertical height between the two phase change heat exchange plates 1 and on the outside. This adapts to the narrow internal space of the 1U chassis and facilitates the assembly of the entire heat dissipation device in height-restricted nodes.

[0033] like Figures 7 to 8 As shown, the multiple partition walls of the flow channel partition structure 22 are horizontal shovel-shaped structures that extend along the coolant flow direction and are arranged at intervals. The upper and lower end faces of the multiple partition walls are completely attached to the opposite side walls of the two phase change heat exchange plates 1, forming multiple straight liquid cooling heat dissipation channels 2011.

[0034] like Figures 9 to 10 As shown, the multiple partition walls of the flow channel partition structure 22 are staggered sawtooth structures, which together form multiple S-shaped curved liquid cooling heat dissipation channels 2011.

[0035] The flow channel partition structure 22 includes multiple flow dividers, which are disposed between the liquid inlet of the receiving cavity 201 and the multiple partition walls. The flow dividers include first flow dividers and second flow dividers. The multiple first flow dividers extend outward from the liquid inlet in a fan shape, forming multiple first guide channels between the multiple first flow dividers. The first guide channels face the liquid cooling heat dissipation channel 2011 in the middle of the second direction. In the second direction, the multiple second flow dividers are located on both sides of all the first flow dividers, forming multiple second guide channels between the multiple second flow dividers. The inlets of the multiple second guide channels face the sidewalls of the first flow dividers and are spaced apart. The ends of the multiple second guide channels extend away from the first flow dividers along the second direction and then bend towards the liquid cooling heat dissipation channel 2011, guiding the liquid to flow to other liquid cooling heat dissipation channels 2011.

[0036] In the S-shaped liquid cooling channel 2011, the flow of the cooling medium disrupts the fluid boundary layer, increasing the turbulence coefficient of the interfacial thermal boundary layer and enhancing its heat transfer efficiency. However, this increased boundary layer turbulence coefficient also leads to increased internal eddies and flow resistance. At the same flow rate (1.5 L / min), the straight-through liquid cooling channel 2011 has a 18.6% lower heat transfer efficiency and a 24.5% lower pressure loss compared to the S-shaped channel 2011.

[0037] like Figures 3 to 4 As shown, an inlet connector 211 and an outlet connector 212, which communicate with the receiving cavity 201, are fixed on the cold plate frame 21. The inlet is formed on the inlet connector 211, and the outlet is formed on the outlet connector 212. The inlet connector 211 is connected to an inlet pipe 25 through a first quick-connect connector 23, and the outlet connector 212 is connected to a drain pipe 26 through a second quick-connect connector 24. The first quick-connect connector 23 and the second quick-connect connector 24 are quick-plug connectors.

[0038] In this embodiment, the cold plate frame 21 is equipped with independent liquid inlet connectors 211 and liquid outlet connectors 212, which facilitates connection with external pipelines. The first quick connector 23 and the second quick connector 24 enable quick plug-in connection of pipelines. During the maintenance of the server and the replacement of faulty parts, only the two quick connectors need to be disconnected to disassemble the liquid cooling heat dissipation device as a whole, which greatly reduces the difficulty of disassembly and maintenance of the equipment.

[0039] The inlet connector 211 and outlet connector 212 are metal connector components, fixed to the side wall of the cold plate frame 21 by welding. The internal through holes of the inlet connector 211 and outlet connector 212 are interconnected with the receiving cavity 201. The inlet connector 211 and outlet connector 212 are female connectors, and the first quick connector 23 and the second quick connector 24 are male connectors.

[0040] In some embodiments, the phase change heat spreader 1 includes a phase change shell plate 11 and a phase change cover plate 12. A cavity is formed on one side of the phase change shell plate 11. The phase change cover plate 12 is connected to one side of the phase change shell plate 11, closing the cavity to form a phase change cavity 101. A liquid-absorbing core structure 13 extends and connects between the phase change shell plate 11 and the phase change cover plate 12.

[0041] In this embodiment, the phase change shell plate 11 has a recessed cavity that is sealed with the phase change cover plate 12 to form a phase change cavity 101, which has a simple structure and is easy to manufacture. The liquid suction core structure 13 is connected between the phase change shell plate 11 and the phase change cover plate 12, which can ensure that the condensed liquid working fluid flows back smoothly to the heated phase change cover plate 12 side, ensuring the continuous operation of the phase change cycle.

[0042] The phase change shell plate 11 and phase change cover plate 12 can be made of high thermal conductivity materials such as pure copper and oxygen-free copper, or high thermal conductivity composite metal materials such as diamond-copper composite material and graphene-copper composite material to further improve the thermal conductivity of the solid wall surface. The phase change shell plate 11 includes a substrate 111 and a surrounding plate 112. The substrate 111 is connected to one axial end of the surrounding plate 112 near the cold plate assembly 2.

[0043] The heat-conducting part 14 is disposed on the outer wall of the phase change cover plate 12 away from the phase change shell plate 11. The heat-conducting part 14 is a thermal grease or a thermal pad. Preferably, the heat-conducting part 14 is a thermal grease, which is attached to the chip. After the phase change shell plate 11 and the phase change cover plate 12 are welded and sealed to form the phase change cavity 101, the phase change cavity 101 needs to be evacuated, then a certain amount of phase change working fluid is filled in, and finally the filling port is sealed and welded.

[0044] The heat from the heating chip is transferred to the outer surface of the phase change cover plate 12 through the heat conduction part 14. After the heat is conducted into the phase change cover plate 12, it is transferred to the liquid wick structure 13 inside the phase change cavity 101. The liquid phase change working fluid adsorbed inside the liquid wick structure 13 evaporates into a gaseous state when heated. The gaseous working fluid diffuses freely inside the phase change cavity 101, transferring heat to the inner surface of the phase change shell plate 11. The gaseous working fluid condenses on the inner surface of the phase change shell plate 11 when it encounters cold, releasing heat. The heat is transferred to the coolant in the receiving cavity 201 of the cold plate assembly 2 through the phase change shell plate 11.

[0045] The liquid-absorbing core structure 13 extends and connects between two opposing sidewalls of the phase change cavity 101 along its height direction. The height direction of the phase change cavity 101 is the direction in which the phase change shell plate 11 and the phase change cover plate 12 are opposite to each other, which is also the thickness direction of the phase change heat spreader 1. One side of the liquid-absorbing core structure 13 is attached and fixed to the sidewall of the phase change cavity 101 near the heat-conducting part 14, and the other side is attached and fixed to the sidewall of the phase change cavity 101 near the cold plate assembly 2. The liquid-absorbing core structure 13 has no obstruction in the height direction of the phase change cavity 101, and the capillary pores of the liquid-absorbing core structure 13 are interconnected along the height direction, so that the liquid working fluid can be transported along the liquid-absorbing core structure 13 in the height direction of the phase change cavity 101.

[0046] In this embodiment, by connecting the wicking structure 13 to the two opposite sidewalls along the height of the phase change cavity 101, a continuous capillary transport channel is constructed. The condensed liquid phase change working fluid can directly flow back from the cooled sidewall (phase change shell plate 11) to the heated sidewall (phase change cover plate 12) along the wicking structure 13, avoiding the situation where the liquid working fluid is stuck on the cooled sidewall and cannot flow back. This ensures that the heated sidewall can continuously receive liquid working fluid replenishment under high heat load conditions, reducing the risk of dry areas appearing inside the phase change cavity 101 and ensuring the stable heat transfer capacity of the phase change heat spreader 1. At the same time, the fully connected wicking structure 13 can also support the two opposite sidewalls of the phase change cavity 101, resisting the inward deformation of the phase change cavity 101 wall surface caused by external pressure, maintaining the vapor flow space inside the phase change cavity 101, ensuring that the gaseous working fluid can diffuse and flow normally, and ensuring the continuous and effective operation of the phase change heat transfer cycle.

[0047] like Figures 4 to 6 As shown, the liquid absorption core structure 13 includes a first capillary network layer 131, a second capillary network layer 133, and a phase change support column 132.

[0048] The first capillary network layer 131 and the second capillary network layer 133 are sequentially disposed on two opposite sidewalls of the phase change cavity 101 along the height direction. The phase change support column 132 extends between the first capillary network layer 131 and the second capillary network layer 133, and is sintered and fixedly connected to the two opposite sidewalls of the phase change cavity 101 along the height direction. The first capillary network layer 131 is sintered and fixed on the phase change cover plate 12, and the second capillary network layer 133 is sintered and fixed on the phase change shell plate 11. The first capillary network layer 131 and the second capillary network layer 133 themselves have a large number of tiny capillary pores, and the phase change support column 132 also has interconnected porous capillary pores inside. The pores of the three layers are interconnected, forming a complete capillary transport network.

[0049] In this embodiment, the first capillary network layer 131 and the second capillary network layer 133 are sintered and fixed to the two opposite sidewalls of the phase change cavity 101, respectively, to perform the functions of liquid storage and absorption on the evaporation side and capture of condensate on the condensation side. The phase change support column 132 is erected between the two capillary network layers and sintered and fixed. On the one hand, it provides mechanical support to maintain the steam flow space inside the phase change cavity 101 and prevents the cavity from collapsing under pressure and causing the steam passage to be blocked. On the other hand, the phase change support column 132 itself has porous capillary pores that connect the two capillary network layers to form a continuous liquid working fluid return channel, realizing the capillary transport of condensate from the condensation side to the evaporation side. This ensures that the evaporation side can continuously obtain liquid working fluid replenishment under high heat load and reduces the risk of dry burning failure.

[0050] The first capillary network layer 131, the second capillary network layer 133, and the phase change support column 132 are connected as a whole by sintering process. The interface is tightly bonded, the pore connectivity is good, the capillary driving force can be effectively transmitted, the flow resistance in the capillary transport process is reduced, and the phase change heat dissipation plate 1 can stably output uniform heat dissipation capability under high power consumption chip conditions.

[0051] The phase change support column 132 is a porous columnar component formed by sintering copper powder, which also serves as a heat conduction element. One end of the phase change support column 132 is sintered and bonded to the first capillary network layer 131, and the other end is sintered and bonded to the second capillary network layer 133. Both ends of the phase change support column 132 are further sintered into one piece with the two opposite sidewalls of the phase change cavity 101. The phase change support columns 132 are arrayed between the two capillary network layers, providing both mechanical support and a channel for transporting the liquid working fluid. The cross-section of the phase change support column 132 can be circular, square, or irregularly shaped.

[0052] The phase change cavity 101 is internally divided into a first region 1011 and a second region 1012. The projection of the heat-conducting part 14 is located within the first region 1011, and the second region 1012 is located on the outer periphery of the first region 1011. A first capillary network layer 131 and a second capillary network layer 133 are both distributed within the first region 1011 and the second region 1012, ensuring that the opposite sidewalls of the entire phase change cavity 101 have basic capillary liquid storage capacity. Multiple phase change support columns 132 are distributed within the first region 1011 and the second region 1012.

[0053] The density of phase change support columns 132 in the first region 1011 is greater than that in the second region 1012. The first region 1011 has a greater number of phase change support columns 132 per unit area.

[0054] In this embodiment, a higher density of phase change support pillars 132 is used in the first region 1011 corresponding to the core heat source projection of the circuit board. This is matched with the higher working fluid evaporation consumption rate in this region, increasing the capillary transport capacity of this region. Under the high load and high heat flux conditions of the chip, the condensed liquid working fluid can be quickly replenished to the first region 1011 with high heat input, reducing the probability of local dry areas in the first region 1011 and increasing the ultimate heat flux density that the phase change heat spreader 1 can withstand. The second region 1012 uses relatively sparse phase change support pillars 132. Under the premise of meeting the basic support and capillary transport capacity, the number of phase change support pillars 132 used is reduced, saving sintering raw materials and reducing the processing cost of the phase change heat spreader 1.

[0055] The first capillary network layer 131 and the second capillary network layer 133 completely cover the first region 1011 and the second region 1012, ensuring that the entire inner wall of the phase change cavity 101 has the ability to capture condensed liquid working fluid, providing a sufficient source of liquid working fluid for the high-density phase change support column 132, further improving the adaptability of the phase change heat spreader 1 to non-uniform heat flow heat sources, improving the heat dissipation capacity of local chips on the circuit board, and improving the reliability of chip operation.

[0056] The outline of the first region 1011 can be adapted to the outline of the chip corresponding to the heat-conducting part 14. The chip is rectangular, and the first region 1011 is set as a rectangle.

[0057] The capillary density of the first capillary network layer 131 in the first region 1011 is greater than that in the second region 1012. Similarly, the capillary density of the second capillary network layer 133 in the first region 1011 is greater than that in the second region 1012. In other words, the two capillary network layers in the first region 1011 employ a dense capillary structure to enhance the liquid storage capacity and capillary driving force of that region, while the capillary network layer in the second region 1012 has relatively sparse capillaries, sufficient only for basic liquid storage.

[0058] For the first region 1011 corresponding to the heat source projection, both capillary network layers adopt a higher capillary density to further enhance the capillary driving force and liquid storage capacity in the high heat concentration area. This, combined with the high-density phase change support pillar 132, further strengthens the liquid working fluid supply capacity of the first region 1011, further suppresses the formation of localized dry areas on the evaporation side under high heat flux conditions, and increases the upper limit of the phase change vapor chamber 1's tolerance to high heat flux. The capillary density of the two capillary network layers in the second region 1012 is relatively lower, reducing capillary network material consumption and controlling processing costs. Through the zoned density design of the capillary network layers, the non-uniform heat source characteristics of the circuit board are adapted, further improving the supply and demand matching of the working fluid inside the phase change cavity 101, enhancing the temperature uniformity effect of the phase change vapor chamber 1, alleviating localized hot spots on the chip, and reducing the risk of chip frequency reduction.

[0059] The phase change support column 132 includes a first support column 1321, a second support column 1322, and a third support column 1323. Multiple first support columns 1321 are spaced apart within a first region 1011, and multiple second support columns 1322 are disposed within the first region 1011 and located between adjacent first support columns 1321. Multiple third support columns 1323 are spaced apart within a second region 1012. The cross-sectional area of ​​the second support column 1322 is smaller than the cross-sectional area of ​​the first support column 1321.

[0060] Inside the first region 1011, a second support column 1322 is added in the gap left by two adjacent first support columns 1321; relying on the first support columns 1321 and the second support columns 1322 added in the gap, the encrypted support array of the first region 1011 is formed together.

[0061] The cross-sectional area of ​​the third support column 1323 is smaller than that of the first support column 1321, but larger than that of the second support column 1322. The arrangement density of the first support column 1321 is greater than that of the third support column 1323.

[0062] This application also provides an electronic device, including a chassis, at least one circuit board, and any of the liquid cooling heat dissipation devices described above. The circuit board and the liquid cooling heat dissipation device are disposed inside the chassis, and the circuit board is connected to the other side of the liquid cooling heat dissipation device.

[0063] In some embodiments, the liquid cooling device includes two phase change heat exchange plates 1 disposed on both sides of the cold plate assembly 2. Two circuit boards are used, respectively disposed on the upper and lower phase change heat exchange plates 1 of the liquid cooling device, forming a stacked arrangement inside the chassis. The heat-conducting portions 14 on the opposite sides of the two phase change heat exchange plates 1 of the liquid cooling device form thermal contact with the heat-generating chips of the two circuit boards. Electronic devices include servers, switching equipment, storage devices, etc.

[0064] Preferably, the electronic device is a server. The chassis is a 1U rackmount chassis. The two circuit boards are circuit boards with integrated GPUs. The liquid cooling device's inlet connector 211 and outlet connector 212 are connected to the server's cooling distribution unit via inlet pipe 25 and outlet pipe 26, respectively.

[0065] The liquid cooling heat dissipation device and electronic device provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A liquid cooling heat dissipation device, characterized in that, include: At least one phase change heat spreader (1), wherein a phase change cavity (101) filled with a liquid absorbing core structure (13) is formed inside the phase change heat spreader (1). The cold plate assembly (2) is sealed to one side of the phase change heat exchange plate (1) and cooperates with the opposite side wall of the phase change heat exchange plate (1) to form a liquid cooling heat dissipation channel (2011). The cold plate assembly (2) is provided with an inlet and an outlet that communicate with the liquid cooling heat dissipation channel (2011). The other side of the phase change heat exchange plate (1) is provided with a heat-conducting part (14).

2. The liquid cooling heat dissipation device according to claim 1, characterized in that, The cold plate assembly (2) includes a cold plate frame (21) and a flow channel partition structure (22). The cold plate frame (21) is placed between the two phase change heat exchange plates (1) and is sealed to the opposite side walls of the two phase change heat exchange plates (1) to form a receiving cavity (201). The flow channel partition structure (22) is disposed in the receiving cavity (201). The flow channel partition structure (22) has multiple partition walls that are spaced apart. The multiple partition walls abut against the opposite side walls of the two phase change heat exchange plates (1), and multiple independent and parallel liquid cooling heat dissipation channels (2011) are separated between the two phase change heat exchange plates (1).

3. The liquid cooling heat dissipation device according to claim 2, characterized in that, The liquid inlet and the liquid outlet are located at opposite ends of the cold plate frame (21), and a plurality of liquid cooling heat dissipation channels (2011) extend from the liquid inlet to the liquid outlet.

4. The liquid cooling heat dissipation device according to claim 2, characterized in that, The cold plate frame (21) is respectively fixed with an inlet connector (211) and an outlet connector (212) that communicate with the receiving cavity (201); the inlet is formed on the inlet connector (211) and the outlet is formed on the outlet connector (212). The inlet connector (211) is connected to the inlet pipe (25) via the first quick connector (23), and the outlet connector (212) is connected to the outlet pipe (26) via the second quick connector (24).

5. The liquid cooling heat dissipation device according to claim 1, characterized in that, The phase change heat spreader (1) includes a phase change shell plate (11) and a phase change cover plate (12). A cavity is formed on one side of the phase change shell plate (11). The phase change cover plate (12) is connected to one side of the phase change shell plate (11) and closes the cavity to form the phase change cavity (101). The liquid absorption core structure (13) extends and connects between the phase change shell plate (11) and the phase change cover plate (12).

6. The liquid cooling heat dissipation device according to any one of claims 1-5, characterized in that, The liquid-absorbing core structure (13) extends and connects between two opposite sidewalls of the phase change cavity (101) along the height direction.

7. The liquid cooling heat dissipation device according to claim 6, characterized in that, The liquid absorption core structure (13) includes a first capillary network layer (131), a second capillary network layer (133), and a phase change support column (132). The first capillary network layer (131) and the second capillary network layer (133) are sequentially disposed on the two opposite sidewalls of the phase change cavity (101) along the height direction. The phase change support column (132) extends between the first capillary network layer (131) and the second capillary network layer (133) and is sintered and fixedly connected to the two opposite sidewalls of the phase change cavity (101) along the height direction.

8. The liquid cooling heat dissipation device according to claim 7, characterized in that, The phase change cavity (101) is divided into a first region (1011) and a second region (1012). The first capillary network layer (131) and the second capillary network layer (133) are both arranged in the first region (1011) and the second region (1012). The projection of the heat-conducting part (14) is located in the first region (1011), and the second region (1012) is located on the outer periphery of the first region (1011). The number of phase change support columns (132) is multiple, and the multiple phase change support columns (132) are arranged in the first region (1011) and the second region (1012); And / or, the density of phase change support columns (132) in the first region (1011) is greater than the density of phase change support columns (132) in the second region (1012).

9. The liquid cooling heat dissipation device according to claim 8, characterized in that, The phase change support column (132) includes a first support column (1321), a second support column (1322) and a third support column (1323). A plurality of first support columns (1321) are arranged at intervals in the first region (1011), and a plurality of second support columns (1322) are arranged in the first region (1011) and located between adjacent first support columns (1321); a plurality of third support columns (1323) are arranged at intervals in the second region (1012).

10. An electronic device, characterized in that, The device includes a chassis, at least one circuit board, and a liquid cooling device as described in any one of claims 1-9, wherein the circuit board and the liquid cooling device are disposed inside the chassis, and the circuit board is connected to the other side of the liquid cooling device.

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