Integrated circuit package having pre-wetted contact side wall surfaces
By pre-plating the contact sidewalls of the QFN package with tin, the problem of unstable solder coverage was solved, the reliability of soldering and inspection was improved, and the cost was reduced.
CN123035989APending Publication Date: 2026-11-03TEXAS INSTRUMENTS INC
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Patent Information
- Application Number
- CN202611320836.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2017-06-19
- Filing Date
- 2018-06-19
- Publication Date
- 2026-11-03
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Figure CN123035989A_ABST
Abstract
This application relates to integrated circuit packages having pre-wetted contact sidewall surfaces. An integrated circuit (IC) package (100) includes an encapsulation package (106) containing an integrated circuit die (341) attached to a leadframe (104). A set of contacts (102, 103) are formed on the package (100), each contact having an exposed contact sidewall surface and an exposed contact lower surface (813, 823). A protective layer (814, 824) of solder wettable material covers each contact sidewall surface.
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