Large die bonding platform for micro-led panels

Abstract

Embodiments of the present disclosure generally relate to die bonding and methods of die bonding LEDs. The methods include positioning a bond head carrier over a first array of dies. The bond head carrier includes an array of bond head modules corresponding to respective dies of the array of dies. The methods also include securing the first array of dies with the array of bond head modules, transferring the first array of dies onto an array of elements of a backplane, aligning an array of thermal head modules over the array of bond head modules, the first array of dies, and the array of elements, and applying thermal energy with the array of thermal head modules through the array of bond head modules to the first array of dies to bond the first array of dies with the array of elements to form a bonded first array.

Description

Technical Field

[0001] Embodiments of this disclosure generally relate to an LED bonding system and panel, as well as a method of manufacturing an LED panel. Background Technology

[0002] Light-emitting diode (LED) panels use LED arrays, with individual LEDs providing independently controllable output. LED panels using micrometer-scale LEDs based on III-V semiconductor technology (also known as microLEDs) have a variety of applications. LED panels for interconnect devices, such as photonic interconnects, contain LEDs bonded to a backplane to integrate the LEDs with other components connected to the backplane. Problems can arise during the bonding process. The process of transferring LEDs to the backplane has traditionally had low throughput. Conventional bonding processes can lead to poor illumination yields, thermal instability, non-uniformity, long operating times, and high costs. However, manufacturing microLED panels presents challenges. Therefore, LED bonding systems and panels, as well as methods for manufacturing LED panels, are needed. Summary of the Invention

[0003] In one embodiment, a method is provided. The method includes placing a connector holder over a first die array. The connector holder includes an array of connector modules corresponding to respective dies in the die array. The method further includes securing the first die array with the connector module array, transferring the first die array onto a component array on a backplane, aligning a hot-head module array above the connector module array, the first die array, and the component array, and applying heat through the connector module array to the first die array to bond the first die array to the component array to form a bonded first array.

[0004] In another embodiment, a method is provided. This die bonding method includes placing a bonding head support over a first die array. The bonding head support includes an array of bonding head modules, wherein each bonding head module in the array corresponds to a corresponding die in the die array. The method further includes fixing the first die array by applying a vacuum using the bonding head module array, transferring the first die array onto a first element array patterned on a backplane using the bonding head support, aligning a hothead module array over the corresponding bonding head modules and the corresponding die of the first die array, applying thermal energy, and bonding to the first element array on the backplane to form a bonded first array. The thermal energy is applied to each die by corresponding hotheads in the hothead module array, the corresponding hotheads being aligned to guide thermal energy through the corresponding bonding head. The method further includes placing a second die array on a second element array on a backplane adjacent to the bonded first array using the bonding head support.

[0005] In another embodiment, a system is provided. The bonding system includes a backplate support, a first bracket positioned above the backplate support, and a bonding head bracket positioned above the first bracket and coupled to a vacuum source. The bonding head bracket includes an array of bonding head modules having one or more bonding heads. Each bonding head includes an alignment mechanism and an alignment sensor. The system further includes a thermal bracket positioned above the first bracket, the thermal bracket having an array of thermal head modules having one or more thermal heads. Each thermal head includes a photonic heating element. Attached Figure Description

[0006] To gain a more detailed understanding of the features described above, reference can be made to some embodiments of the disclosure, some of which are illustrated in the accompanying drawings. However, it is important to note that the drawings are merely illustrative and should not be considered as limiting of their scope, and may allow for other equally effective embodiments.

[0007] However, it is worth noting that these figures only illustrate exemplary embodiments of this disclosure and should therefore not be considered as limiting its scope, and may allow for other equally effective embodiments.

[0008] Figure 1A It is a cross-sectional view of a panel portion according to one or more embodiments.

[0009] Figure 1B It is a top view of the grains of a panel according to one or more embodiments.

[0010] Figure 3 This is a flowchart of a method for bonding a die to a backplane according to one or more embodiments.

[0011] Figures 4 to 9 It is a schematic top view of the engagement system during the method according to one or more embodiments.

[0012] Figure 10 It is a schematic top view of a joint according to one or more embodiments.

[0013] For ease of understanding, the same reference numerals have been used where possible to indicate the same elements common in the figures. Elements and features of one embodiment may be advantageously incorporated into other embodiments without further description.

[0014] For ease of understanding, the same reference numerals have been used where possible to indicate the same elements common in the figures. Elements and features of one embodiment may be advantageously incorporated into other embodiments without further description. Detailed Implementation

[0015] Embodiments of this disclosure generally relate to LED bonding systems and panels, as well as methods of manufacturing LED panels. The bonding system and method of manufacturing LED panels described herein can be a mass transfer system and method for transferring LED mass onto a backplane. The method includes using a large die bonding system with multiple supports, which applies heat with enhanced precision through an optical window within the bonding head module. The LED panel can be used in display panel devices, interconnect devices (e.g., photonic interconnect devices), or similar devices for bonding LEDs to a backplane. The LED can be a microLED (hereinafter “microLED”). The LED panel described herein can be a microLED. In some embodiments, multiple LEDs are arranged in an array on a backplane. MicroLEDs are self-emissive LEDs with a critical dimension of less than 100 micrometers (μm).

[0016] Figure 1A This is a cross-sectional view of a portion of panel 105. Figure 1B This is a top view of the chips 100 of panel 105. Each chip 100 contains multiple LEDs 104. LEDs 104 are microLEDs. MicroLEDs are self-emissive LEDs with a critical dimension less than 100 μm. Each LED 104 contains an LED electrode 107. Each chip 100 further includes one or more reference marks 109. Backplane 102 contains multiple elements 101. Elements 101 are thin-film transistors (TFTs). Elements 101 are arranged in a pattern 213. Pattern 213 is the arrangement of elements 101. Figure 1A As shown, although each LED 104 of die 100 is coupled to a corresponding element 101, each LED 104 of die 100 may also be coupled to a single element 101, i.e., a single TFT. Each element 101 includes a backplane electrode 103. The backplane electrode 103 contains a metallic material.

[0017] Pattern 213 may also include reference marks such that, during the method described herein, reference marks 109 of die 100 are aligned with reference marks of pattern 213. Reference marks 109 provided for each die 100 are used for connection with each joint 255 ( Figure 2 Alignment is performed. When the coupling head 255 ( Figure 2 When the alignment mechanism 256a and the alignment sensor 256b are located above the corresponding die 100, Figure 2 The alignment mechanism 256a and alignment sensor 256b detect the alignment of the connector 255 with respect to the corresponding die 100. The alignment mechanism 256a and alignment sensor 256b allow the connector 255 to change its orientation so that the reference mark 1005 of the connector 255 aligns with the reference mark 109 of the die 100. Figure 1B ) and the corresponding mark of pattern 213 ( Figure 2Alignment. The alignment mechanism 256a of each joint 255 allows for precise real-time adjustments in alignment in the X, Y and Z directions, θ rotation, coplanarity, pitch and yaw.

[0018] LED electrode 107 comprises a metallic material. Backplate electrode 103 comprises a metallic material. The method 300 using bonding system 200 ( Figure 3 The alloy of the metallic materials of each backplate electrode 103 and LED electrode 107 is formed by the thermal bonding process described herein.

[0019] Figure 2 This is a top view of a bonding system 200 according to some embodiments. The bonding system 200 can be used to bond LED 104 to a backplate 102. Figure 1A and Figure 1B ).

[0020] The bonding system 200 includes a bonding device 201 and a backplate loader 203 coupled to the bonding device 201. The backplate loader 203 includes a platform 204 configured to mount the backplate 102 from the backplate loader 203 onto a backplate support 205 of the bonding device 201.

[0021] The bonding device 201 also includes one or more dies 100, housed in one or more cassettes 211. The die 100 may be an optical device component, a microLED, a microLED chip, or an LED chip, but other optical device components are also contemplated. The one or more dies 100 are ultimately disposed in a pattern 213 on the backplane 102. In some embodiments, the pattern 213 includes individual thin-film transistors (TFTs), i.e., elements 101, arranged to receive microLEDs from the dies 100. For example, the pattern 213 includes elements 101, backplane electrodes 103, and reference marks 109 (…). Figure 1A and Figure 1B ).

[0022] The bonding apparatus 201 also includes a robot 215 that transfers one or more dies 100 from one or more cassettes 211 to a first support 230 coupled to a guide rail system 220. In some embodiments, the robot 215 is one or more robotic loading arms of die holders 235 configured to transfer dies 100 from cassettes 211 to the first support 230. The bonding apparatus 201 may have one or more robots 215, allowing the robots 215 to transfer multiple dies 100 from cassettes 211 to the first support 230 simultaneously.

[0023] The guide rail system includes an inner guide rail assembly 221 and an outer guide rail assembly 223. The guide rail system 220 is also coupled to a joint bracket 250 and a thermal bracket 270. In some embodiments, the guide rail system 220 is also coupled to a metering bracket 290. For example, the metering bracket 290 is coupled to the inner guide rail assembly 221.

[0024] The internal guide rail assembly 221 includes guide rails disposed on opposite sides of the backplate support 205. For example, the internal guide rail assembly 221 includes two parallel guide rails on opposite sides of the backplate support 205. The first bracket 230 can be moved on the internal guide rail assembly 221. For example, the first bracket 230 can be moved from above the backplate support 205 to a position beyond the backplate support 205. When positioned beyond the backplate support 205, the first bracket 230 is not directly above the backplate support 205. Figure 2 As shown, robot 215 places one or more dies 100 onto an array of die holders 233. The array of die holders 233 consists of individual die holders 235. Each die holder 235 is positioned on the top surface 237 of crossbar 231. Dies 100 are placed in the array of die holders 233 to form a die array 217. The die array 217 may be a first die array 217, such as a linear die array 217.

[0025] like Figure 2 As shown, a first support 230 is positioned in a receiving position, close to one or more boxes 211, such that one or more robots 215 can place one or more dies 100 onto the crossbar 231 of the first support 230. The crossbar 231 includes a die holder 233 coupled to the crossbar 231.

[0026] In some embodiments, the first bracket 230 is coupled to the inner guide rail assembly 221, and the coupling head bracket 250 and the thermal bracket 270 are coupled to the outer guide rail assembly 223, respectively. The outer guide rail assembly 223 includes guide rails disposed on opposite sides of the backplate support 205. For example, the outer guide rail assembly 223 includes two parallel guide rails on opposite sides of the backplate support 205. In some embodiments, the outer guide rail assembly 223 is disposed parallel to the inner guide rail assembly 221. In some embodiments, the inner guide rail assembly 221 is disposed between the backplate support 205 and the outer guide rail assembly 223.

[0027] The connector holder 250 includes a crossbar 251, wherein a connector module array 253 is formed from individual connector modules 255. The connector module array 253 is mounted on a side surface 257 of the crossbar 251. Each connector module array 253 is coupled to a vacuum source 252. Each individual connector module 255 in the connector module array 253 corresponds to a corresponding die 100 in the die array 217. Each individual connector module 255 includes an alignment mechanism 256a and an alignment sensor 256b. The alignment mechanism 256a and alignment sensor 256b enable each individual connector module 255 to be aligned with the corresponding die 100 while held and mounted on the backplate 102. Each alignment sensor 256b of the corresponding connector module 255 includes alignment optics integrated with a transparent optical window compatible with various infrared (IR) light sources, such as an IR laser or IR flash source of the thermal holder 270. Alignment is performed in... Figure 10 This is described in more detail in the discussion of Figure 11.

[0028] The coupling bracket 250 is coupled to the outer guide rail assembly 223, while the first bracket 230 is coupled to the inner guide rail assembly 221, allowing the two brackets to pass over each other without collision. This enables the simultaneous operation of different brackets, increasing throughput compared to a single guide rail assembly configuration.

[0029] The thermal support 270 includes a crossbar 271, wherein the thermal head module array 273 is formed by individual thermal heads 275. Each thermal head 275 has a corresponding photonic heater 276 capable of directing heat energy toward the backplate 102. The thermal head module array 273 is positioned on the side surface 277 of the crossbar 271. The side surface 257 of the connector bracket 250 faces the side surface 277 of the thermal support 270, such that when the connector bracket 250 approaches the thermal support 270, the thermal head module array 273 can be positioned above the connector module array 253 without collision.

[0030] The metering support 290 includes a crossbar 291, wherein the metering array 293 is formed by independent metering modules 295. The metering array 293 enables metering operations to be performed after the die 100 has been bonded to the backplane 102.

[0031] System 200 also includes a controller 190. In some embodiments, the operation of system 200 is directed by controller 190. Controller 190 includes a programmable central processing unit (CPU) 191, which can operate in conjunction with memory 192 (e.g., non-volatile memory) and support circuitry 193. Support circuitry 193 is conventionally coupled to CPU 191 and includes cache, clock circuitry, input / output subsystems, power supplies, and combinations thereof coupled to various components of system 200 to facilitate its control. CPU 191 is one of any form of general-purpose computer processor used in industrial environments, such as a programmable logic controller (PLC) for controlling various components and subprocessors of a processing system. Memory 192 coupled to CPU 191 is non-transient and typically consists of one or more readily available memories, such as random access memory (RAM), read-only memory (ROM), disk drives, hard disks, or any other form of local or remote digital storage.

[0032] Typically, memory 192 exists in the form of a non-transitory computer-readable storage medium (e.g., non-volatile memory) containing instructions that, when executed by CPU 191, facilitate the operation of system 200. The instructions in memory 192 are in the form of a program product, such as a program implementing the methods of this disclosure. The program code may conform to any of a large number of different programming languages. In one embodiment, this disclosure may be implemented as a program product stored on a computer-readable storage medium for use by a computer system. The program product defines the functionality of the implementation (including the methods described herein). For example, CPU 191 causes the execution of multiple operations.

[0033] Illustrative non-transitory computer-readable storage media include, but are not limited to: (i) non-writable storage media (e.g., read-only memory devices within a computer, such as CD-ROM discs readable by a CD-ROM drive, flash memory, ROM chips, or any type of solid-state non-volatile semiconductor memory device, such as a solid-state hard disk (SSD)) on which information can be permanently stored; and (ii) writable storage media (e.g., disks in a disk drive or hard disk drive, or any type of solid-state random access semiconductor memory) on which changeable information is stored. Such computer-readable storage media are embodiments of this disclosure when carrying computer-readable instructions instructing the functions of the methods described herein. In some embodiments, the methods or portions thereof described herein are performed by one or more application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other types of hardware implementations. In some other embodiments, the substrate processing and / or disposal methods described herein are performed by a combination of software routines, ASICs, FPGAs, and other types of hardware implementations.

[0034] The controller 190 is configured to perform operations of the system 200. In some embodiments that may be combined with other embodiments, the controller 190 is configured to guide one or more of the robot 215, the first support 230, the joint support 250, the thermal support 270, and the metering support 290.

[0035] For example, system 200 includes an array of connectors attached to connector holder 250, which are arranged to traverse along an axis to facilitate precise engagement across the entire backplate 102.

[0036] In some embodiments, the outer guide rail assembly 223 is a first X-axis linear stage, and the inner guide rail assembly 221 is a second X-axis linear stage. The first X-axis linear stage is disposed outside the second X-axis linear stage. The first and second X-axis linear stages are disposed outside the backplate stage. The backplate stage may include a heating zone.

[0037] In some embodiments, the coupling bracket 250 and the heating bracket 270 are a first Y-axis linear stage and a second Y-axis linear stage. The first and second Y-axis linear stages are positioned on the first X-axis linear stage. The second X-axis linear stage includes a first bracket 230 and a metering bracket 290.

[0038] In some embodiments, one or more robots 215 move the microLEDs from the chip cassette to a first support 230. In some embodiments, the first support 230 is a microLED support that includes a slot tray located on a separate linear stage of the bonding head support 250. The microLED support houses the microLEDs in a tray slot on the lift, allowing for a continuous supply of microLEDs during bonding operations. The microLED support follows the bonding head module during operation.

[0039] In some embodiments, the bonding system 200 is configured to have corresponding and corresponding parts. For example, a corresponding cassette 211e supplies a corresponding die 100e. A robot 215 transfers the corresponding die 100e and places it on a corresponding die holder 235e. During operation, a corresponding bonding head 255e extends toward, holds, and transfers the corresponding die 100e from the corresponding die holder 235e to a corresponding element 101e of a corresponding pattern 213e on the backplate 102. During operation, a corresponding hot head 275e aligns with the corresponding element 101e of the backplate 102, the corresponding die 100e, and the corresponding bonding head 255e to bond the corresponding die 100e to the backplate 102. After the corresponding die 100e has been bonded to the backplane 102, the metering bracket 290 places the corresponding metering module 295e on the corresponding die 100e and performs metering operations on the bonded die 100e. These operations will be described in more detail below.

[0040] In some embodiments, the bonding system 200 includes additional bonding head supports and thermal supports. In this embodiment, the system includes a microLED support, an embedded metering support, first and second bonding head supports, and first and second heat source supports. The additional supports can enhance throughput. The system 200 is customizable to accommodate different numbers of modules, supports, backplane sizes, and desired throughput. Furthermore, the bonding system 200 can be placed in a nitrogen atmosphere to improve the intermetallic bonding quality between the backplane 102 and the die 100.

[0041] Figure 3 This is a flowchart of a method 300 for bonding a die 100 to a backplane 102 according to some embodiments. Figures 4 to 9 This is a schematic cross-sectional view of the joining system 200 during method 300.

[0042] In operation 301, such as Figure 4 As shown, the connector holder 250 is positioned above the die array 217. The backplane loader 203 has transferred the backplane 102 and placed it on the backplane support 205. The first holder 230 has been removed from... Figure 2 The receiving location shown has been transferred to Figure 4 The raised position is shown. When in the raised position, the first support 230 is positioned above the backplate 102 and below the connector module array 253. This allows the connector support 250 to pick up the die array 217 from the first support 230 using the connector module array 253.

[0043] In operation 303, such as Figure 4 As shown, the connector support 250 uses a connector module array to fix the first die array 217, with the connector module array positioned above the die array 217. The connector module array 253 extends downward toward the corresponding die 100 and applies a vacuum to the die array 217 to fix them. The vacuum is generated from a vacuum source 252 (…). Figure 2 The first support 230 is then placed in a ready position after the connector holder 250 picks up the die 100. Next, the connector holder 250 moves into position and performs an optical alignment process between the die 100 and the pattern 213 in multiple predefined areas.

[0044] In operation 305, such as Figure 5 As shown, the connector bracket 250 transfers the die array 217 and mounts the die array 217 onto the element 101 of the backplane 102. Figure 5As shown, after the connector holder 250 transfers the die array 217 from the first holder 230, the first holder 230 returns to the receiving position, allowing the connector module array 253 to transfer the die array 217 onto the backplane 102. The connector module array 253 places the die array 217 within a pattern 213 on the backplane 102. In some embodiments, the pattern 213 includes reference marks or index marks, which allows the connector module array 253 to place the die array 217 onto the backplane 102 with greater accuracy and repeatability by aligning the reference marks or index marks of the respective connectors 255 with the reference marks or index marks of each respective die 100, and then with the corresponding reference marks or index marks of the pattern 213 on the backplane 102.

[0045] In operation 307, such as Figure 6 As shown, the thermal head module array 273 of the thermal support 270 is aligned above the connector module array 253. The thermal support 270 moves toward the connector support 250, positioning the thermal head module array 273 above the connector module array 253 and above the element 101 on which the die array 217 is disposed. The thermal support 270 moves toward the connector support 250, positioning the thermal head module array 273 above both the connector module array 253 and the die array 217. After the optical alignment process, the thermal support 270 moves to the appropriate position, while the metering support 290 follows the thermal support 270. The thermal support 270 performs simultaneous local intermetallic bonding between the die 100 and the backplane 102 within multiple predefined regions.

[0046] In operation 309, such as Figure 6 As shown, heat energy is applied to the first die array 217 via the junction module array 253 using the heat head module array 273. This heat energy bonds the first die array 217 to the element array 101 of the backplane. Each heat head 275 in the heat head module array 273 is aligned above a corresponding junction 255 of the junction module array 253 and a corresponding die 100 of the first die array 217. In some embodiments, heat energy is applied by transmitting infrared light to each die 100. For example, applying heat energy may include directing light from a corresponding laser disposed within a corresponding heat head 275 to the corresponding die 100 of the first die array 217. The metal alloy of each backplane electrode 103 and LED electrode 107 is formed by a thermal bonding process.

[0047] like Figure 6As shown, each die 100 in die array 217 is bonded to backplane 102. Each die 100 in die array 217 can be bonded to backplane 102 simultaneously. Heat energy is directed from the corresponding photonic heating element 276 to the corresponding die 100 of the first die array 217 through the corresponding bonding head module 255. In some embodiments, the effective bonding area of ​​each die 100 on backplane 102 is typically less than a 50 mm by 50 mm square, and therefore requires precise control of thermal expansion between interfaces. Bonding system 200 provides alignment of hothead module array 273 over bonding head module array 253, the first die array 217, and the element array 101 of backplane 102 to construct an effective bonding area, thereby improving yield, scalability, and efficiency in microLED panel manufacturing processes.

[0048] Thermal energy bonds the die array 217 to the backplane 102, forming a first bonded array 601. Thermal energy is also transmitted through the bonding of the corresponding LED electrodes 107 to the corresponding backplane electrodes 103. Figure 1A The die array 217 is bonded to the backplane 102 by fusion. Individual hotheads 275 of the hothead module array 273 apply heat to their respective dies 100, while the bonding head module array 253 holds the die array 217 in place. In some embodiments, the hothead module array 273 applies heat for less than 10 seconds. For example, the hothead module array 273 applies heat through a corresponding photonic heating element 276 of each hothead 275, which transfers the heat to the corresponding die 100 through the corresponding bonding head 255. In another example, heat is applied by a laser in the corresponding hothead 275 transmitting infrared light to each die 100. In some embodiments, operations 301, 303, and 305 can be performed iteratively so that a first die array can be bonded to the backplane 102 to form a first bonded array 601, and subsequently a second die array 701 (… Figure 7 To enhance accuracy and yield, it is joined to the backplate 102 adjacent to the first joined array 601.

[0049] By shortening the time period for applying heat and selectively applying heat through the corresponding joint 255, only localized areas of the corresponding grain 100 and backplane 102 receive heat, thereby reducing potential thermal mismatch. Reduced thermal mismatch allows for improved grain bonding accuracy without being limited by thermal expansion at the grain and backplane interface.

[0050] In some implementations, method 300 may include operation 311, as appropriate. In operation 311, such as Figure 7As shown, after bonding the first die array 217, the bonding head support 250 moves over the second die array 701, and the metering support 290 performs metering operations on the first bonded array 601 while the bonding head support 250 moves over the second die array 701. For example, after partial intermetallic bonding, the thermal support 270 and the bonding head support 250 are positioned in a standby position. In the standby position, the bonding head support 250 picks up the die 100 from the first support 230, while the metering support 290 is positioned to scan the bonding area where intermetallic bonding has just occurred. While the metering support 290 performs metering operations, the robot 215 can simultaneously load the second die array 701 onto the first support 230.

[0051] like Figure 8 As shown, the bonding head support 250 transfers the second die array 701 from the first support 230 over the backplane 102. The bonding head support 250 is capable of mounting the second die array 701 onto the backplane 102. The second die array 701 is positioned adjacent to the first bonded array 601. For example, the second die array 701 is positioned in adjacent columns and / or rows of pattern 213.

[0052] like Figure 9 As shown, the backplate 102 includes a plurality of grains 100, which are bonded to a pattern 213 of the backplate 102 to form a panel 105. Figure 1A The backplate loader 203 removes the backplate 102 from the backplate support 205 so that a subsequent backplate can be loaded into the device 201.

[0053] Once the embedded metering holder 290 has scanned the bonded die 100, the embedded metering holder is placed in a standby position, while the bonding head holder 250 is placed in a new position. The bonding head holder 250 in the new position, similar to that described above, performs optical alignment processes between the micro-LEDs and the TFT array in multiple predefined regions.

[0054] The above process can be repeated for multiple areas across the back panel 102 until the back panel 102 is processed and a bonded back panel 902 is formed, such as panel 105. Figure 1A Once the backplate 102 has been processed, all supports are placed in the ready position, while the backplate loader 203 removes the engaged backplate 902 from the backplate support 205.

[0055] Figure 10 This is a schematic top view of a connector 255 according to some embodiments. The connector 255 includes an optical window 1001 surrounded by a vacuum region 1003. The optical window 1001 includes one or more reference marks 1005. The reference marks 1005 may be used to align the connector 255 with the die 100 (…). Figure 2 The index point of ).

[0056] Vacuum region 1003 includes one or more vacuum ports 1007, which are connected to vacuum source 252. Figure 2 The individual connectors 255 are connected to the first support 230. One or more vacuum ports 1007 allow the individual connectors 255 to apply a vacuum and fix the corresponding die 100. The applied vacuum allows the die 100 to escape from the first support 230. Figure 2 It was picked up from ).

[0057] The optical window 1001 may be an optically transparent window or a chrome mask in each joint 255.

[0058] In some implementations, each heat head is 275 ( Figure 2 This may include high-frequency laser technology to achieve rapid localized thermal bonding by guiding thermal energy through a corresponding optical window 1001. Localized thermal bonding promotes efficient intermetallic diffusion during operation while reducing thermal expansion mismatch.

[0059] While the foregoing describes embodiments of this disclosure, other and further embodiments of this disclosure may be designed without departing from its basic scope, the scope of which is defined by the foregoing claims.

Claims

1. A grain bonding method, the method comprising: A bonding head support is placed above a first grain array, the bonding head support comprising a bonding head module array, wherein each bonding head module in the bonding head module array corresponds to a corresponding grain in the grain array; The first grain array is fixed using the junction module array; The first die array is transferred onto the element array on the backplane using the connector holder; The hothead module array is aligned above the connector module array, the first die array, and the element array of the backplate; as well as Through the bonding head module array, the hot head module array applies heat energy to the first die array to bond the first die array to the element array of the backplane to form a bonded first array.

2. The method of claim 1, wherein transferring the first die array onto the element array comprises placing the first die array on the backplane and aligning it with the pattern of the backplane.

3. The method of claim 1, wherein fixing the first die array comprises applying a vacuum to the die array with a corresponding bonding head, wherein each die in the die array is a microLED.

4. The method of claim 1, wherein the application of thermal energy comprises guiding thermal energy from a photonic heating element within each of the hotheads of the hothead module array, the thermal energy being guided from the respective photonic heating element through a respective junction module to a respective grain of the first grain array.

5. The method of claim 1, further comprising: After the first die array is transferred to the backplane, the second die array is loaded onto the first support.

6. The method of claim 1, further comprising: Align the first reference mark of each grain of the first grain array with the corresponding reference mark of the backplate.

7. The method of claim 1, wherein the thermal energy is applied through an optical window of each joint.

8. The method of claim 1, further comprising: When transferring the bonding head support toward the second grain array, a metering support is used to meter the already bonded first array; as well as The thermal support, including the array of thermal head modules, is transferred from the already joined first array.

9. The method of claim 1, wherein the thermal energy is applied by transmitting infrared light to each grain.

10. A grain bonding method, the method comprising: A bonding head support is placed above a first die array, the bonding head support comprising a bonding head module array, wherein each bonding head module of the bonding head module array corresponds to a corresponding die of the die array; The first grain array is fixed by applying a vacuum using the connector module array; The first die array is transferred onto the first element array patterned on the backplate using the connector holder; Align the hot head module array with the corresponding connector module and the corresponding die of the first die array; Thermal energy is applied to bond each die of the first die array to a first element array on the backplane to form a bonded first array. The thermal energy is applied to each die by corresponding hotheads of the hothead module array, the corresponding hotheads being aligned to guide the thermal energy through the corresponding bonding heads; and Using the bonding head support, the second grain array is placed on the second element array of the backplate adjacent to the already bonded first array.

11. The method of claim 10, wherein applying thermal energy further comprises: Light from a corresponding laser placed in the corresponding hot head is directed to the corresponding grain of the first grain array, the corresponding hot head being aligned above the corresponding joint and the corresponding grain, such that the corresponding laser guides the heat energy through the corresponding optical window of each joint module.

12. The method of claim 10, further comprising: A robot is used to transfer one or more dies from the cassette to a die holder coupled to a first support to form the first die array; as well as The robot is used to transfer one or more dies from the cassette to the die holder coupled to the first support to form the second die array.

13. The method of claim 10, further comprising: After the first grain array is bonded, the bonding head support is moved above the second grain array; as well as When the bonding head support is moved above the second grain array, the bonding first array is metered using a metering support.

14. A joining system, the joining system comprising: Backplate support components; A first bracket is positioned above the backplate support member; A connector holder, positioned above the first holder and coupled to a vacuum source, the connector holder comprising: A connector module array having one or more connectors, each connector comprising: Alignment mechanism; and Alignment sensor; and A heat-supporting bracket, positioned above the first bracket, comprises: A hothead module array having one or more hotheads, each hothead including a photonic heating element.

15. The joining system of claim 14, further comprising: A metering bracket is positioned above the backplate support.

16. The joining system of claim 14, further comprising: A guide rail system, which is coupled to the first bracket, the joint bracket and the thermal bracket.

17. The joining system of claim 16, wherein the guide rail system comprises: An external guide rail assembly, which is coupled to the joint head bracket and the thermal bracket; as well as An internal guide rail assembly is coupled to the first bracket and is positioned between the back plate support and the external guide rail assembly.

18. The bonding system of claim 14, wherein the photonic heating element is a laser.

19. The joining system of claim 14, further comprising: A robotic loading arm configured to transfer dies from a cassette to a die holder of the first support.

20. The joining system of claim 14, wherein each of the one or more joining heads is coupled to the vacuum source.

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