Ultra-thin inertial measurement combination

The MEMS inertial device is fixed to the housing by cable-free rigid-flexible bonding plate, which solves the problem of large volume of inertial measurement combined, realizes ultra-thin design, has the advantages of high precision and low cost, and is suitable for miniaturized products.

CN222144165UActive Publication Date: 2024-12-10贵州航天控制技术有限公司
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Patent Information

Application Number
CN202323624410.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-29
Publication Date
2024-12-10
Estimated Expiration
2033-12-29

AI Technical Summary

Technical Problem

The existing inertial measurement combinations meet the range and accuracy requirements of missile weapon systems, while it is difficult to achieve ultra-thin design, resulting in excessive volume.

Method used

Using the cable-free rigid-flexible bonding plate form, the rigid circuit board where the MEMS inertial device is fixed to the shell through silicone rubber bonding, realizing the miniaturization design of the system structure, and the information processing circuit board is processed through flexible cables and MEMS inertial device plates form a compact ultra-thin inertial measurement combination.

Benefits of technology

It realizes the miniaturization design of the system structure in a limited space, solves the low stress orthogonal installation problem of inertial sensor chips, and has the advantages of low cost, large range, high accuracy, small size and ultra-thinness, and is suitable for the development of miniaturized products. .

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Abstract

The utility model provides an ultra-thin inertial measurement combination, which relates to the technical field of inertial measurement and comprises a shell and an electronic component, the shell comprises a base and an upper cover which are detachably connected, and a containing cavity is formed in the base; the electronic component comprises an information processing circuit board and a plurality of MEMS inertial device boards which are connected with each other through a flexible cable. According to the utility model, an internal circuit adopts a cableless rigid-flexible combined board form, and a rigid circuit board where an MEMS inertial device is located is directly bonded and fixed on the shell through silicone rubber, so that the problems of miniaturization design of a system structure, low-stress orthogonal installation of an inertial sensor chip and the like in a limited space are solved. The ultra-thin electronic scale has the advantages of being low in cost, large in measuring range, high in precision, small in size, ultra-thin and the like, can be widely applied to development of small-sized products, has wide application prospects, and can generate long-term economic benefits.
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Description

Technical Field

[0001] The utility model relates to the technical field of inertial measurement, in particular to an ultra-thin inertial measurement combination. Background Art

[0002] As an important component of missile weapon systems, the inertial measurement unit mainly realizes the inertial measurement function when working on the missile, and outputs information such as angular velocity, apparent acceleration, and temperature. In recent years, micro-missile weapon systems have developed rapidly. How to build a miniaturized inertial measurement system that meets the use requirements of micro-missile weapon systems in a small space has become one of the key technologies. There are many current design schemes, but none of them can achieve ultra-thin design while meeting the range and accuracy requirements of the weapon system. Utility Model Content

[0003] The utility model aims to provide an ultra-thin inertial measurement unit to solve the problem that the existing inertial measurement unit has a large overall volume in order to meet the requirements of range and accuracy.

[0004] The utility model is implemented as follows: an ultra-thin inertial measurement unit, which includes a housing and electronic components;

[0005] The housing comprises a detachably connected base and an upper cover, and a receiving cavity is arranged in the base;

[0006] The electronic components include an information processing circuit board and a plurality of MEMS inertial device boards interconnected by flexible cables. The information processing circuit board and the plurality of MEMS inertial device boards are both fixed in the accommodating cavity by bonding with silicone rubber.

[0007] Preferably, the number of the information processing circuit board is one, which is fixed in the accommodating cavity by bonding with silicone rubber; the number of the MEMS inertial device boards is six, which are fixed in the accommodating cavity by bonding with silicone rubber.

[0008] Preferably, the accommodating cavity includes a cavity bottom surface and cavity side surfaces, and the cavity side surfaces further include a front side surface and left and right side surfaces; wherein the plane where the cavity side surfaces are located is perpendicular to the plane where the cavity bottom surface is located.

[0009] Preferably, the upper cover is connected to the base via bolts.

[0010] Preferably, the MEMS inertial device board is a circuit board on which a MEMS inertial device is installed, including an X-axis uniaxial accelerometer board, a Y-axis uniaxial accelerometer board, a Z-axis uniaxial accelerometer board, an X-axis uniaxial gyroscope board, a Y-axis uniaxial gyroscope board and a Z-axis uniaxial gyroscope board.

[0011] Preferably, the X-axis uniaxial accelerometer board, the Y-axis uniaxial accelerometer board, and the Z-axis uniaxial accelerometer board are perpendicular to each other in the X, Y, and Z directions of the three-dimensional space.

[0012] Preferably, the X-axis uniaxial gyroscope board, the Y-axis uniaxial gyroscope board and the Z-axis uniaxial gyroscope board are perpendicular to each other in the X, Y and Z directions of the three-dimensional space.

[0013] Preferably, the interface module of the information processing circuit board includes a power supply interface, RS422, UART, and PS external interfaces.

[0014] By adopting the above technical solution, the internal circuit of the utility model adopts a cable-free rigid-flexible board form, and the rigid circuit board where the MEMS inertial device is located is directly fixed to the shell by bonding with silicone rubber, which solves the problems of realizing the miniaturization design of the system structure in a limited space and the low-stress orthogonal installation of the inertial sensor chip. It has the advantages of low cost, large range, high precision, small size, ultra-thinness, etc., and can be widely used in the development of miniaturized products, has broad application prospects, and can generate long-term economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a structural schematic diagram of the utility model;

[0017] Figure 2 It is a principle block diagram of the utility model.

[0018] In the figure: 1—upper cover, 2—accommodating cavity, 3—base, 5—cavity bottom surface, 6—cavity side surface, 7—information processing circuit board, 8—single-axis accelerometer, 9—single-axis gyroscope. DETAILED DESCRIPTION

[0019] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0020] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0021] like Figure 1 , Figure 2 As shown, the utility model provides an ultra-thin inertial measurement unit, including a shell and electronic components.

[0022] The housing of the utility model comprises a detachably connected base 3 and an upper cover 1, and a receiving cavity 2 is arranged in the base. The receiving cavity 2 comprises a cavity bottom surface 5 and a cavity side surface 6. The plane where the cavity side surface 6 is located is perpendicular to the plane where the cavity bottom surface 5 is located, and the cavity side surface 6 comprises a front side surface and left and right side surfaces, and the front side surface and the left and right side surfaces are also perpendicular to each other. The upper cover 1 is connected to the base 3 by bolts, and after the upper cover 1 is installed, a closed space is formed in the receiving cavity 2.

[0023] The electronic components of the present invention include an information processing circuit board 7 and a plurality of MEMS inertial device boards interconnected by flexible cables.

[0024] The number of information processing circuit board 7 is one, which is fixed in the accommodating cavity 2 by silicone rubber bonding. As shown in the embodiment in the figure, the information processing circuit board 7 is pasted on the top of the base 3. The information processing circuit board 7 is provided with components such as information processing circuit, DSP processor, SPI bus controller, etc. The SPI bus controller is connected to the SPI bus, and the SPI interface of the SPI bus is connected to the external N MEMS inertial devices. The DSP processor on the information processing circuit exchanges information with the 6 MEMS inertial devices through SPI signals. The block diagram of the composition principle of the inertial measurement combination system is shown in the attached figure. Furthermore, the interface module of the information processing circuit board includes a power interface, RS422, UART, and PS external interfaces.

[0025] There are six MEMS inertial device boards, which are fixed in the accommodating cavity 2 by silicone rubber bonding. The MEMS inertial device board is a circuit board with MEMS inertial devices installed. The MEMS inertial devices include three uniaxial accelerometers 8 and three uniaxial gyroscopes 9. The three uniaxial accelerometers are respectively installed on three rigid boards in the X, Y, and Z directions to form an X-axis uniaxial accelerometer board, a Y-axis uniaxial accelerometer board, and a Z-axis uniaxial accelerometer board. The three uniaxial gyroscopes are respectively installed on three rigid boards in the X, Y, and Z directions to form an X-axis uniaxial gyroscope board, a Y-axis uniaxial gyroscope board, and a Z-axis uniaxial gyroscope board. Among them, in the accommodating cavity 2 An X-axis uniaxial accelerometer board and a Y-axis uniaxial accelerometer board are arranged horizontally and perpendicularly on the front side and the left or right side of the cavity, and a Z-axis uniaxial accelerometer board is arranged on the cavity bottom surface 5. An X-axis uniaxial gyroscope board and a Y-axis uniaxial gyroscope board are arranged horizontally and perpendicularly on the front side and the right or left side of the accommodating cavity, and a Z-axis uniaxial gyroscope board is arranged on the cavity bottom surface 5. The X-axis uniaxial accelerometer board, the Y-axis uniaxial accelerometer board, and the Z-axis uniaxial accelerometer board are perpendicular to each other in the X, Y, and Z directions of the three-dimensional space. The X-axis uniaxial gyroscope board, the Y-axis uniaxial gyroscope board, and the Z-axis uniaxial gyroscope board are perpendicular to each other in the X, Y, and Z directions of the three-dimensional space.

[0026] During measurement, the X-axis acceleration channel uses a single-axis accelerometer with a range of 100g to measure acceleration information, and the Y-axis and Z-axis acceleration channels use two single-axis accelerometers with a range of 50g to measure acceleration information; the X-axis angular velocity channel uses a single-axis gyroscope with a range of 1000° / s to measure angular velocity information, and the Y-axis and Z-axis angular velocity channels use two single-axis gyroscopes with a range of 500° / s to measure angular velocity information. The information processing circuit completes the reading of three-way angular velocity information, three-way acceleration information and temperature information through the SPI interface of the DSP, and performs system error compensation and temperature compensation calculation on the acceleration channel and angular velocity channel according to the inertial system error compensation model based on the temperature information. Finally, under the action of the 4ms trigger pulse signal of the external computer, the relevant information is output through the asynchronous serial communication interface. In addition, in order to improve the use and maintenance performance of the inertial measurement combination, the inertial measurement combination can establish communication with the host computer through the RS422 interface to realize the calibration error coefficient and upload and update the working software to the internal FLASH storage space of the inertial measurement combination.

[0027] The internal circuit of the utility model adopts a cable-free rigid-flexible board form, and the rigid circuit board where the MEMS inertial device is located is directly fixed to the shell through silicone rubber bonding, which solves the problems of realizing the miniaturization design of the system structure in a limited space and the low-stress orthogonal installation of the inertial sensor chip. It has the advantages of low cost, large range, high accuracy, small size, ultra-thinness, etc., and can be widely used in the development of miniaturized products, has broad application prospects, and can generate long-term economic benefits.

[0028] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An ultra-thin inertial measurement unit, characterized in that: Including housing and electronic components; The housing comprises a detachably connected base and an upper cover, and a receiving cavity is arranged in the base; The electronic components include an information processing circuit board and a plurality of MEMS inertial device boards interconnected by flexible cables. The information processing circuit board and the plurality of MEMS inertial device boards are both fixed in the accommodating cavity by bonding with silicone rubber.

2. The ultra-thin inertial measurement unit according to claim 1, characterized in that: The number of the information processing circuit board is one, which is fixed in the accommodating cavity by bonding with silicone rubber; the number of the MEMS inertial device boards is six, which are fixed in the accommodating cavity by bonding with silicone rubber.

3. The ultra-thin inertial measurement unit according to claim 2, characterized in that: The accommodating cavity includes a cavity bottom surface and cavity side surfaces, and the cavity side surfaces further include a front side surface and left and right side surfaces; wherein the plane where the cavity side surfaces are located is perpendicular to the plane where the cavity bottom surface is located.

4. The ultra-thin inertial measurement unit according to claim 1, characterized in that: The upper cover is connected to the base via bolts.

5. The ultra-thin inertial measurement unit according to claim 1, characterized in that: The MEMS inertial device board is a circuit board with MEMS inertial devices installed, including an X-axis uniaxial accelerometer board, a Y-axis uniaxial accelerometer board, a Z-axis uniaxial accelerometer board, an X-axis uniaxial gyroscope board, a Y-axis uniaxial gyroscope board and a Z-axis uniaxial gyroscope board.

6. The ultra-thin inertial measurement unit according to claim 5, characterized in that: The X-axis uniaxial accelerometer board, the Y-axis uniaxial accelerometer board, and the Z-axis uniaxial accelerometer board are perpendicular to each other in the X, Y, and Z directions of the three-dimensional space.

7. The ultra-thin inertial measurement unit according to claim 5, characterized in that: The X-axis uniaxial gyroscope board, the Y-axis uniaxial gyroscope board and the Z-axis uniaxial gyroscope board are perpendicular to each other in the X, Y and Z directions of the three-dimensional space.

8. The ultra-thin inertial measurement unit according to claim 1, characterized in that: The interface module of the information processing circuit board includes a power supply interface, RS422, UART, and PS external interfaces.

Citation Information

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