Display module and electronic equipment

Abstract

The utility model provides a display module and electronic equipment, the display module comprises a TFT substrate, a panel piece, a driving chip and a time sequence control panel, the TFT substrate comprises a second area and a first area, the first area is arranged around the peripheral side of the second area, the time sequence control panel, the driving chip and the panel piece are all located on the same side of the TFT substrate, the panel piece is arranged in the second area in an overlapped mode, and the time sequence control panel is arranged in the second area in an overlapped mode. The time sequence control board is installed in the first area and electrically connected with the TFT substrate, the driving chip is arranged in the first area, and the driving chip is embedded in the time sequence control board and electrically connected with the TFT substrate. The thickness of the display module can be reduced, and the widening of the first area of the display module can be avoided.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a display module and an electronic equipment. Background Art

[0002] In existing electronic devices, the driving module is located at the edge of the display module, which requires a certain amount of design space in both the thickness and width directions. When the thickness of the display module is reduced, the non-display area of ​​the display module is easily widened, which will reduce the screen-to-body ratio of the electronic device. Utility Model Content

[0003] The purpose of the present application is to provide a display module and an electronic device, which can reduce the thickness of the display module and avoid widening the non-display area of ​​the display module.

[0004] An embodiment of the present application provides a display module, including a TFT substrate, a panel component, a driving chip and a timing control board, the TFT substrate includes a second area and a first area, the first area is arranged around the circumference of the second area, the timing control board and the driving chip and the panel component are all located on the same side of the TFT substrate, wherein the panel component is stacked in the second area, the timing control board is installed in the first area and is electrically connected to the TFT substrate, the driving chip is arranged in the first area, the driving chip is embedded in the timing control board, and is electrically connected to the TFT substrate.

[0005] An embodiment of the present application provides a display module, which avoids the problem of widening the first area of ​​the display module due to the parallel arrangement of the timing control board and the TFT substrate, thereby increasing the proportion of the panel components in the display module, thereby facilitating improving the screen-to-body ratio of the electronic device.

[0006] In addition, by installing the timing control board on the first area of ​​the TFT substrate and embedding the driving chip in the timing control board, the space generated by the thickness difference between the first area and the second area of ​​the display module in the thickness direction of the display module is used to provide space for the thickness of the timing control board, so that the thickness of the timing control board and the thickness of the panel component will not overlap, and the thickness of the display module will not be increased, which is conducive to reducing the overall thickness of the display module and avoiding the problem of increased thickness of the display module caused by the timing control board being located on the side of the TFT substrate away from the panel component.

[0007] In addition, by arranging the driver chip to be embedded in the timing control board, while ensuring the normal operation of the driver chip, the timing control board and the driver chip can reuse the thickness of the display module, which is beneficial to reducing the thickness of the display module while avoiding increasing the width of the first area in the display module. In addition, the timing control board is arranged in the first area of ​​the TFT substrate, which can fill the space in the first area of ​​the TFT substrate, thereby enhancing the structural strength of the display module in the first area of ​​the TFT substrate, thereby facilitating the improvement of the reliability strength of the display module.

[0008] In a possible implementation manner, the thickness of the timing control board is less than or equal to the thickness of the panel member.

[0009] In a possible embodiment, the panel component includes a display layer and a packaging layer, the display layer is stacked in the second area, the packaging layer is arranged on the side of the display layer away from the TFT substrate, and the projection on the TFT substrate covers the first area, and the thickness of the timing control board is less than or equal to the thickness of the display layer.

[0010] In a possible embodiment, the display module includes a driving module, the driving module includes a driving chip, a timing control board and a reinforcement board, and the reinforcement board is installed between the timing control board and the TFT substrate. By providing the reinforcement board, the structural strength of the display module at the first area of ​​the TFT substrate can be further enhanced, thereby further improving the reliability strength of the display module. In addition, the flatter the timing control board is installed on the TFT substrate, the smaller the design space required when the display module is installed on the housing when assembling the electronic device. The present application can also improve the installation flatness of the timing control board on the TFT substrate by providing the reinforcement board between the timing control board and the TFT substrate, avoiding the problem of warping of the timing control board when the timing control board is directly installed on the first area of ​​the TFT substrate due to the uneven surface of the TFT substrate, and at the same time, it is beneficial to reduce the design space required for the display module when assembling the electronic device, thereby facilitating the miniaturization of the electronic device.

[0011] In a possible implementation, the driver chip passes through the reinforcement plate, or there are multiple reinforcement plates, the multiple reinforcement plates are arranged at intervals from each other, and the driver chip passes through the gap between two adjacent reinforcement plates.

[0012] In a possible implementation, the reinforcing plate is made of metal. On the one hand, the reinforcing plate can also play a role in heat distribution, so that the heat is more evenly distributed in the display module, avoiding heat accumulation in a local area, thereby avoiding the problem of local overheating of the display module. On the other hand, the reinforcing plate made of metal can also conduct heat. By setting up the reinforcing plate, the heat can be transferred to the air, thereby helping to improve the heat dissipation effect of the display module.

[0013] In a possible implementation manner, the thickness of the driving module is less than or equal to the thickness of the panel member.

[0014] In a possible implementation, the timing control board includes a circuit board and a functional device. The circuit board is installed in the first area, and the functional device is installed on a side of the circuit board away from the TFT substrate.

[0015] In a possible implementation, the circuit board is provided with an avoidance groove, the opening of the avoidance groove is provided on the surface of the circuit board facing the TFT substrate, and the driving chip is located in the avoidance groove.

[0016] In a possible implementation, there are a plurality of driving chips, which are spaced apart from each other; there are a plurality of avoidance grooves, which are spaced apart from each other; and each driving chip is located in one avoidance groove.

[0017] In a possible implementation, the display module further includes an electrical connector connected between a surface of the circuit board facing away from the TFT substrate and the TFT substrate, and the electrical connector is electrically connected to both the circuit board and the TFT substrate.

[0018] In a possible implementation, the functional device includes at least one of a timing control chip and a power management chip.

[0019] In a possible implementation, the display module includes a driving module, the driving module includes a driving chip and a timing control board, and the thickness of the driving module is greater than the thickness of the panel component.

[0020] An embodiment of the present application further provides an electronic device, which includes a housing and a display module as described above, wherein the display module is mounted on the housing.

[0021] An embodiment of the present application provides an electronic device. The electronic device assembled using the display module has a small thickness, a narrow non-display area, and a high screen-to-body ratio.

[0022] An embodiment of the present application also provides an electronic device, which includes a housing and a display module as described above, wherein the display module is installed in the housing, the housing covers the driving module, and protrudes relative to the panel component in a direction away from the TFT substrate along the thickness direction of the panel component. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0025] Figure 2 for Figure 1 The front view structural diagram of the display module in the electronic device shown in the first embodiment;

[0026] Figure 3 for Figure 2 The cross-sectional structure diagram of the display module is shown;

[0027] Figure 4 is a schematic diagram of a cross-sectional structure of an electronic device in another embodiment;

[0028] Figure 5 A schematic diagram of the assembly structure of the electrical connector and the timing circuit board in the driving module of the display module shown;

[0029] Figure 6 for Figure 1 A schematic side view of the structure of a display module in the electronic device in the second embodiment;

[0030] Figure 7 for Figure 6 The structure diagram of the reinforcement plate in the driving module of the display module is shown;

[0031] Figure 8 This is a schematic structural diagram of a display module according to an embodiment of the present application in a first example;

[0032] Fig. 9 A schematic diagram of the structure of the display module of the embodiment of the present application in a second example;

[0033] Fig.10 It is a schematic structural diagram of the display module of the embodiment of the present application in a third example;

[0034] Fig.11 is a schematic structural diagram of a display module according to an embodiment of the present application in a fourth example;

[0035] Fig.12 It is a schematic structural diagram of the display module of the embodiment of the present application in the fifth example. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] See also Figure 1 , Figure 1A schematic diagram of the structure of an electronic device 1000 provided in an embodiment of the present application.

[0038] The embodiment of the present application provides an electronic device 1000. For example, the electronic device 1000 may be a display, a television, a mobile phone, a tablet, a computer, a wearable device, etc., and the present application does not limit this. Among them, the wearable device includes a watch, a smart bracelet, etc.

[0039] Specifically, the electronic device 1000 includes a display module 1 and a housing 2. The display module 1 is mounted on the housing 2 and is used to display images. The display module 1 may be an OLED (Organic Light-Emitting Diode) module or an LCD (Liquid Crystal Display) module.

[0040] See also Figure 2 and Figure 3 , Figure 2 for Figure 1 The display module 1 in the electronic device 1000 is a front view structural diagram of the first embodiment. Figure 3 for Figure 2 The cross-sectional structure diagram of the display module 1 is shown. Figure 2 The middle dotted line represents the structure of the driving chip 300 in a perspective view.

[0041] For the convenience of description, we define Figure 2 The length direction of the display module 1 is the X-axis direction, the width direction is the Y-axis direction, and the thickness direction is the Z-axis direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. The words "upper" and "lower" mentioned in the embodiment of the present application when describing the display module 1 are based on the attached specification. Figure 2 The description of the directions shown uses the positive direction of the Y axis as “up” and the negative direction of the Y axis as “down”, which does not constitute a limitation on the display module 1 in actual application scenarios.

[0042] The display module 1 includes a TFT (Thin Film Transistor) substrate 100 , a driving module 200 and a panel component 700 . The driving module 200 and the panel component 700 are both mounted on the TFT substrate 100 .

[0043] Specifically, the TFT substrate 100 includes a first area 110 and a second area 130, and the first area 110 is arranged around the circumference of the second area 130. It can be understood that the TFT substrate 100 can adopt an existing TFT substrate. Exemplarily, the TFT substrate 100 includes a substrate and a thin film transistor. The thin film transistor is arranged on the substrate and arranged in an array. Among them, the thin film transistors arranged in the array and the substrate portion on which the thin film transistors are installed together constitute the second area 130, and the leads connected to the thin film transistors and the substrate portion on which the leads are installed together constitute the first area 110.

[0044] The driving module 200 is mounted on the first area 110 of the TFT substrate 100 and is used to drive the TFT substrate 100 to work. In this embodiment, the thickness of the driving module 200 is D1, that is, the maximum thickness of the driving module 200 along the Z-axis direction is D1. Specifically, the driving module 200 includes a timing control board 500, an electrical connector 600 and a driving chip 300. The timing control board 500 is mounted on the first area 110 of the TFT substrate 100. The electrical connector 600 is connected between the timing control board 500 and the TFT substrate 100, and is electrically connected to the timing control board 500 and the TFT substrate 100 to achieve electrical connection between the timing control board 500 and the TFT substrate 100. Exemplarily, the electrical connector 600 can be a flexible printed circuit (FPC), or the electrical connector 600 can also be a hard-soft board, and the bending portion of the electrical connector 600 is a flexible portion.

[0045] The driver chip (Driver IC) 300 is arranged in the first area 110 of the TFT substrate 100, and is embedded in the side of the timing control board 500 facing the TFT substrate 100, and is electrically connected to the TFT substrate 100. In this embodiment, the driver chip 300 is a source driver chip (Source Driver IC). There can be multiple driver chips 300, and the multiple driver chips 300 are arranged at intervals from each other. In this embodiment, the multiple driver chips 300 are all located in the area of ​​the first area 110 facing the negative direction of the Y axis, and are arranged at intervals along the X axis direction. In this embodiment, the driver chip 300 is completely embedded in the timing control board 500, and the thickness of the driver module 200 is equal to the thickness of the timing control board 500. It can be understood that in other embodiments, the driver chip 300 can also be partially embedded in the timing control board 500, and the thickness of the driver module 200 is equal to the sum of the thickness of the timing control board 500 and the thickness of the driver chip 300 protruding relative to the timing control board 500.

[0046] The panel component 700 is stacked on the second area 130 of the TFT substrate 100. In this embodiment, the thickness of the panel component 700 is D2. Among them, the "thickness of the panel component 700" refers to the maximum thickness of the panel component 700 along the Z-axis direction. In this embodiment, the thickness D1 of the driving module 200 is less than or equal to the thickness D2 of the panel component 700. Specifically, the panel component 700 and the second area 130 of the TFT substrate 100 together constitute the display area of ​​the display module 1 for displaying images. Among them, the area where the panel component 700 is located is the second area 130, which is used for users to watch the display content. The first area 110 on the TFT substrate 100 is covered by the driving chip 300 and the timing control board 500, which can be understood as the black edge area of ​​the display module 1. It can be understood that, refer to Figure 4 , Figure 4 FIG. 1 is a schematic diagram of a cross-sectional structure of an electronic device 1000 in another embodiment. In another embodiment, the thickness D1 of the driving module 200 may also be greater than the thickness D2 of the panel member 700. The housing 2 in the electronic device 1000 covers the driving module 200 to cover the driving module 200. At this time, the housing 2 protrudes relative to the panel member 700 in the thickness direction of the panel member 700 in the direction away from the TFT substrate 100, that is, Figure 3 The shell 2 shown is protruded toward the positive direction of the Z axis relative to the panel member 700.

[0047] When the display module 1 is working, the driving module 200 drives the TFT substrate 100 to work, and the panel component 700 cooperates with the TFT substrate 100 to realize the display of the picture. Specifically, the timing control board 500 located in the first area 110 outputs a control signal, and the control signal is transmitted to the driving chip 300 through the TFT substrate 100. The driving chip 300 receives the control signal and transmits a voltage signal to the second area 130 of the TFT substrate 100 to drive the display module 1 to display an image at the panel component 700, so that the user can watch the displayed content.

[0048] Combined with reference Figure 3 and Figure 5 , Figure 5 for Figure 3 The schematic diagram of the assembly structure of the electrical connector 600 and the timing control board 500 in the driving module 200 of the display module 1 is shown.

[0049] Specifically, the timing control board 500 in the driving module 200 includes a circuit board 510 and a functional device 530. The functional device 530 is mounted on the circuit board 510 and is electrically connected to the circuit board 510.

[0050] The circuit board 510 includes a first surface 511 and a second surface 513, and the first surface 511 and the second surface 513 are arranged opposite to each other along the thickness direction of the circuit board 510. In this embodiment, the thickness of the circuit board 510 is H1. The circuit board 510 is provided with an avoidance groove 515, the opening of the avoidance groove 515 is arranged on the second surface 513, and is recessed from the second surface 513 toward the first surface 511. Among them, there can be multiple avoidance grooves 515, and the multiple avoidance grooves 515 are arranged at intervals from each other. In this embodiment, the multiple avoidance grooves 515 are arranged at intervals along the X-axis direction. The multiple avoidance grooves 515 are respectively used to correspond to the multiple driving chips 300 one by one.

[0051] The functional device 530 is mounted on the first surface 511 of the circuit board 510 to realize the functional device 530 being mounted on the circuit board 510. There may be multiple functional devices 530, and the multiple functional devices 530 are arranged at intervals from each other. Exemplarily, the multiple functional devices 530 include but are not limited to timing control chips (Timming Controller, T-CON), power management chips (Power Management Unit, PMU) and other devices. In this embodiment, the maximum thickness H2 of the functional device 530 along the Z-axis direction. The sum of the maximum thickness H2 of the functional device 530 and the thickness H1 of the circuit board 510 is equal to the thickness of the timing control board 500, that is, equal to the thickness D1 of the driving module 200.

[0052] In the assembly structure of the electrical connector 600 and the timing control board 500, the electrical connector 600 is connected to the first surface 511 of the circuit board 510 to achieve electrical connection between the electrical connector 600 and the circuit board 510, thereby achieving electrical connection between the electrical connector 600 and the timing control board 500. The electrical connector 600 can be connected to the circuit board 510 by a binding process or by plugging.

[0053] Continue reading Figure 3In the assembled display module 1, the driving module 200 can be bonded to the TFT substrate 100 through the first adhesive layer. Specifically, a plurality of driving chips 300 are respectively installed in the first area 110 of the TFT substrate 100. The circuit board 510 is located in the first area 110 of the TFT substrate 100, and the second surface 513 of the circuit board 510 faces the TFT substrate 100. The first adhesive layer is bonded between the second surface 513 of the circuit board 510 and the TFT substrate 100, so that the circuit board 510 is bonded to the TFT substrate 100 through the first adhesive layer. At this time, the plurality of driving chips 300 are respectively located in the plurality of avoidance grooves 515 of the circuit board 510, so that the plurality of driving chips 300 are respectively embedded in the circuit board 510, thereby realizing that the plurality of driving chips 300 are embedded in the timing control board 500, and at the same time realizing that the circuit board 510 avoids the driving chip 300 to avoid damaging the driving chip 300. It is understandable that an avoidance space is provided in the area of ​​the first adhesive layer corresponding to the avoidance groove 515 , so that the driving chip 300 passes through the first adhesive layer and is located in the avoidance groove 515 .

[0054] One end of the electrical connector 600 is connected to the first surface 511 of the circuit board 510, and the other end is fixed to the first area 110 of the TFT substrate 100 and electrically connected to the TFT substrate 100, so that the electrical connector 600 electrically connects the circuit board 510 and the TFT substrate 100. The electrical connector 600 is bent so that the circuit board 510, the driving chip 300 and the panel member 700 are located on the same side of the TFT substrate 100. At this time, the functional device 530 installed on the first surface 511 is located on the side of the circuit board 510 away from the TFT substrate 100, which does not affect the normal operation of the functional device 530, thereby ensuring the normal use function of the timing control board 500.

[0055] In the display module 1 provided in the embodiment of the present application, the timing control board 500 is arranged in the first area 110 of the TFT substrate 100 to realize the installation of the timing control board 500 on the TFT substrate 100, and the misalignment space between the first area 110 of the TFT substrate 100 and the second area 130 of the display module 1 in the thickness direction of the display module 1 is utilized to avoid the timing control board 500 and the TFT substrate 100 being arranged in parallel (such as Figure 2 The timing control board 500 is located on one side of the TFT substrate 100 along the negative direction of the Y-axis in the viewing angle shown, which causes the first area 110 of the display module 1 to be widened, thereby causing the border area of ​​the electronic device 1000 to be widened, thereby increasing the proportion of the panel component 700 in the display module 1, thereby facilitating improving the screen-to-body ratio of the electronic device 1000.

[0056] In addition, the circuit board 510 in the timing control board 500 is stacked on the first area 110 of the TFT substrate 100 to achieve the installation of the timing control board 500 on the first area 110 of the TFT substrate 100. The driving chip 300 is embedded in the circuit board 510 to achieve the embedding of the driving chip 300 in the timing control board 500, and the space generated by the thickness difference between the first area 110 and the second area 130 of the display module 1 in the thickness direction of the display module 1 is used to provide space for the thickness of the timing control board 500, so that the thickness of the timing control board 500 and the thickness of the panel member 700 will not overlap, and the thickness of the display module 1 will not be increased, which is conducive to reducing the overall thickness of the display module 1, and avoiding the problem of increasing the thickness of the display module 1 caused by the timing control board 500 being located on the side of the TFT substrate 100 away from the panel member 700.

[0057] In addition, by arranging the driver chip 300 to be embedded in the timing control board 500, while ensuring the normal operation of the driver chip 300, the timing control board 500 and the driver chip 300 can reuse the thickness of the display module 1, which is beneficial to reducing the thickness of the display module 1 while avoiding increasing the width of the first area 110 in the display module 1. In addition, the timing control board 500 is arranged in the first area 110 of the TFT substrate 100, and can fill the space at the first area 110 of the TFT substrate 100, so as to enhance the structural strength of the display module 1 at the first area 110 of the TFT substrate 100, thereby facilitating the improvement of the reliability strength of the display module 1.

[0058] In this embodiment, the driver chip 300 is completely embedded in the circuit board 510, and the thickness of the driver module 200 is equal to the thickness of the timing control board 500, that is, equal to the sum of the thickness of the circuit board 510 and the functional device 530. In this embodiment, the thickness of the circuit board 510 and the functional device 530 is less than or equal to the thickness D2 of the panel member 700.

[0059] See also Figure 6 and Figure 7 , Figure 6 for Figure 1 The display module 1 in the electronic device 1000 is a side view structural diagram of the second embodiment. Figure 7 for Figure 6 The structure diagram of the reinforcing plate 570 in the driving module 200 of the display module 1 is shown.

[0060] The display module 1 of the second embodiment is different from the display module 1 of the first embodiment in that the driving module 200 of the display module 1 of the second embodiment further includes a reinforcing plate 570 , which is installed between the timing control board 500 and the TFT substrate 100 .

[0061] Specifically, the reinforcing plate 570 is mounted on the second surface 513 of the circuit board 510 to achieve a fixed connection between the reinforcing plate 570 and the timing control board 500. At this time, the reinforcing plate 570 is located on the side of the circuit board 510 away from the functional device 530. In this embodiment, the material of the reinforcing plate 570 can be metal. Exemplarily, the reinforcing plate 570 can be a copper sheet. In this embodiment, the reinforcing plate 570 is provided with an avoidance opening 571, and the avoidance opening 571 penetrates the reinforcing plate 570 along the thickness direction of the reinforcing plate 570. Among them, there can be multiple avoidance openings 571, and the multiple avoidance openings 571 are respectively used to communicate with multiple avoidance grooves 515 of the circuit board 510. Each avoidance opening 571 is used to provide an avoidance space for a driver chip 300.

[0062] In the assembled display module 1, the reinforcing plate 570 is installed in the first area 110 of the TFT substrate 100, so that the reinforcing plate 570 is installed between the timing control board 500 and the TFT substrate 100, thereby realizing that the driving module 200 is installed in the first area 110 of the TFT substrate 100. Exemplarily, in this embodiment, the driving module 200 also includes a second adhesive layer and a third adhesive layer. The second adhesive layer is bonded between the second surface 513 of the circuit board 510 and the reinforcing plate 570 to realize a fixed connection between the circuit board 510 and the reinforcing plate 570. The third adhesive layer is bonded between the surface of the reinforcing plate 570 away from the circuit board 510 and the first area 110 of the TFT substrate 100, so that the reinforcing plate 570 is installed between the timing control board 500 and the TFT substrate 100, thereby realizing that the driving module 200 is installed on the TFT substrate 100.

[0063] Each driver chip 300 is embedded in the inner side of the reinforcing plate 570 and the circuit board 510, so that the driver chip 300 is embedded in the inner side of the timing control board 500. Specifically, each driver chip 300 can pass through the avoidance opening 571 of the reinforcing plate 570 and the avoidance groove 515 of the circuit board 510, so that each driver chip 300 passes through the reinforcing plate 570 and is located in the avoidance opening 571 and the avoidance groove 515. At this time, the area of ​​the second adhesive layer corresponding to the avoidance groove 515 is provided with an avoidance space, and the area of ​​the third adhesive layer corresponding to the avoidance opening 571 is provided with an avoidance space, so that the driver chip 300 passes through the avoidance space of the third adhesive layer, the avoidance opening 571 of the reinforcing plate 570, the avoidance space of the second adhesive layer and the avoidance groove 515 of the circuit board 510 in sequence, and is located in the avoidance opening 571 and the avoidance groove 515.

[0064] It is understandable that in other embodiments, there may be multiple reinforcing plates 570, and the multiple reinforcing plates 570 are spaced apart from each other and are spaced apart from the driver chip 300. Each reinforcing plate 570 is installed between the second surface 513 of the circuit board 510 and the TFT substrate 100, and the driver chip 300 passes through the gap between two adjacent reinforcing plates 570 and is located in the avoidance groove 515.

[0065] In the display module 1 of the second embodiment, the driving module 200 includes a driving chip 300, a timing control board 500 and a reinforcing board 570. The driving chip 300 is completely embedded in the timing control board 500, and the sum of the thickness of the reinforcing board 570, the thickness of the circuit board 510 and the thickness of the functional device 530 is equal to the thickness D1 of the driving module 200. In this embodiment, the thickness D1 of the driving module 200 is less than or equal to the thickness D2 of the panel member 700.

[0066] In the display module 1 provided in this embodiment, by providing the reinforcing plate 570 , the structural strength of the display module 1 at the first area 110 of the TFT substrate 100 can be further enhanced, thereby further improving the reliability strength of the display module 1 . In addition, the flatter the timing control board 500 is installed on the TFT substrate 100, the smaller the design space required when the display module 1 is installed on the shell when assembling the electronic device. This embodiment sets a reinforcement plate 570 between the circuit board 510 and the TFT substrate 100 to achieve the setting of the reinforcement plate 570 between the timing control board 500 and the TFT substrate 100, and can also improve the installation flatness of the timing control board 500 on the TFT substrate 100, thereby avoiding the problem of warping of the timing control board 500 when it is directly installed on the first area 110 of the TFT substrate 100 due to the uneven surface of the TFT substrate 100, and at the same time, it is beneficial to reduce the design space required for the display module 1 when assembling the electronic device 1000, thereby facilitating the miniaturization of the electronic device 1000.

[0067] In addition, the functional components 530 of the timing control board 500 and the driver chip 300 will generate heat when working, which will cause the local temperature rise of the display module 1 to be very high, so that the display module 1 will have the risk of local overheating when in use. In this embodiment, by setting the material of the reinforcement plate 570 to be metal, on the one hand, the reinforcement plate 570 can also play a role in heat distribution, so that the heat is more evenly distributed in the display module 1, avoiding the accumulation of heat locally, thereby avoiding the problem of local overheating of the display module 1. On the other hand, the reinforcement plate 570 made of metal can also conduct heat. By setting the reinforcement plate 570, the heat can be transferred to the air, which is beneficial to improve the heat dissipation effect of the display module 1.

[0068] Different display modules may have panel members 700 with different structures. The display module will be described below in conjunction with a specific structure of the panel member 700 .

[0069] See also Figure 8 , Figure 8 Schematic diagram of the structure of the display module 1 in the first example according to an embodiment of the present application.

[0070] The first example provides an OLED display module 1, wherein the panel member 700 in the display module 1 includes an encapsulation layer (Encap) 710a, a polarizer (Polarizer, POL) 730a, an optically clear adhesive (OCA) 750a and a cover glass 770a stacked in sequence. The display module 1 also includes a buffer layer 800a. The cover glass 770a can provide an outer layer of protection for the display module 1 to prevent damage to the display module 1 by external forces or foreign objects, and on the other hand, is used to enhance the refinement of the appearance ID (Industrial Design) of the display module 1 in the electronic device 1000.

[0071] Specifically, the encapsulation layer 710a, the polarizer 730a, the optical adhesive layer 750a and the cover glass 770a are all stacked on the second area 130 of the TFT substrate 100. Among them, the encapsulation layer 710a is arranged in the second area 130 of the TFT substrate 100, and the polarizer 730a is stacked on the surface of the encapsulation layer 710a away from the TFT substrate 100. The optical adhesive layer 750a is stacked on the surface of the polarizer 730a away from the TFT substrate 100, and the cover glass 770a is stacked on the surface of the optical adhesive layer 750a away from the TFT substrate 100, so as to achieve the optical adhesive layer 750a being bonded between the polarizer 730a and the cover glass 770a. The buffer layer 800a is stacked on the side of the TFT substrate 100 away from the encapsulation layer 710b. Exemplarily, the buffer layer 800a can be a buffer foam (Cushion), which is used to provide buffer protection for the display module 1.

[0072] In this example, the sum of the thickness of the encapsulation layer 710a, the thickness of the polarizer 730a, the thickness of the optical adhesive layer 750a and the thickness of the cover glass 770a is equal to the thickness D2 of the panel member 700. Among them, the thickness D1 of the driving module 200 is less than or equal to the thickness D2 of the panel member 700. Since the encapsulation layer 710a, the polarizer 730a, the optical adhesive layer 750a and the cover glass 770a are all stacked in the second area 130, the top of the first area 110 is not covered, and the timing control board 500 is exposed in the display module 1. When assembling the electronic device 1000, the housing 2 can be used to cover the first area 110 of the TFT substrate 100 to cover the components such as the timing control board 500 arranged in the first area 110, so that the electronic device 1000 has a better appearance.

[0073] See also Fig. 9 , Fig. 9 Schematic diagram of the structure of the display module 1 in the second example according to an embodiment of the present application.

[0074] The display module 1 provided in the second example is different from the display module 1 provided in the first example in that the projection of the cover glass 770 a on the TFT substrate 100 in the display module 1 of the second example covers the first area 110 .

[0075] Specifically, the panel component 700 includes a display layer and an encapsulation layer, the display layer is stacked on the second area 130 of the TFT substrate 100, and the encapsulation layer is arranged on the side of the display layer away from the TFT substrate 100, and the projection on the TFT substrate 100 covers the first area 110. Wherein, "covering" includes partial coverage and full coverage. In this example, the display layer includes an encapsulation layer 710a, a polarizer 730a and an optical adhesive layer 750a, and the encapsulation layer 710a, the polarizer 730a and the optical adhesive layer 750a are all stacked on the first area 110. The encapsulation layer is a cover glass 770a, and the projection of the cover glass 770a on the TFT substrate 100 covers the first area 110 to block the first area 110 of the TFT substrate 100. At this time, a covering ink layer can be set on the surface of the cover glass 770a facing the first area 110 and in the area corresponding to the first area 110, so that the first area 110 of the TFT substrate 100 in the display module 1 can be covered by the cover glass 770a, so that components such as the timing control board 500 arranged in the first area 110 are covered, thereby making the electronic device 1000 have a better appearance effect.

[0076] In this example, the sum of the thickness of the encapsulation layer 710a, the thickness of the polarizer 730a and the thickness of the optical adhesive layer 750a is equal to the thickness of the display layer, and the thickness D1 of the driving module 200 in the display module 1 is less than or equal to the thickness of the display layer.

[0077] See also Fig.10 , Fig.10 It is a schematic structural diagram of the display module 1 in the third example according to an embodiment of the present application.

[0078] The third example provides a hard-screen OLED display module 1, in which the panel component 700 includes an encapsulation layer (Encap) 710b and a polarizer (Polarizer, POL) 730b stacked in sequence, and the display module 1 also includes a buffer layer 800b.

[0079] Specifically, the encapsulation layer 710b and the polarizer 730b are both stacked on the second area 130 of the TFT substrate 100. The encapsulation layer 710b is stacked on the second area 130 of the TFT substrate 100, and the polarizer 730b is stacked on the surface of the encapsulation layer 710b away from the TFT substrate 100. The buffer layer 800b is stacked on the side of the TFT substrate 100 away from the encapsulation layer 710b. Exemplarily, the buffer layer 800b can be a cushioning foam (Cushion), which is used to provide buffering protection for the display module 1.

[0080] In this example, the sum of the thickness of the encapsulation layer 710 b and the thickness of the polarizer 730 a is equal to the thickness D2 of the panel component 700 . The thickness D1 of the driving module 200 is less than or equal to the thickness D2 of the panel component 700 .

[0081] See also Fig.11 , Fig.11 It is a schematic structural diagram of the display module 1 in the fourth example according to an embodiment of the present application.

[0082] The fourth example provides an LCD display module 1, wherein the panel component 700 in the display module 1 includes a liquid crystal layer 740c, a color filter glass 720c and an upper polarizer (POL) 731c stacked in sequence. The display module 1 also includes a lower polarizer 732c and a backlight unit 900.

[0083] Specifically, the liquid crystal layer 740c, the color filter 720c and the upper polarizer 731c are all stacked on the second area 130 of the TFT substrate 100. The liquid crystal layer 740c is sandwiched between the color filter 720c and the TFT substrate 100, so that the color filter 720c and the TFT substrate 100 encapsulate the liquid crystal layer 740c to form a liquid crystal box. The upper polarizer 731c is stacked on the surface of the color filter 720c away from the TFT substrate 100.

[0084] The lower polarizer 732c is disposed on the side of the TFT substrate 100 away from the color filter 720c. The backlight unit 900 carries the TFT substrate 100 and provides a light source for the display module 1. Exemplarily, the backlight unit 900 includes an upper light-enhancing film 910, a lower light-enhancing film 920, a diffusion film 930, a light guide plate 940, a reflective film 950, a housing 960 and a light source 970. Specifically, the upper light-enhancing film 910 is stacked on the surface of the lower polarizer 732c away from the TFT substrate 100, the lower light-enhancing film 920 is stacked on the surface of the upper light-enhancing film 910 away from the TFT substrate 100, the diffusion film 930 is stacked on the surface of the lower light-enhancing film 920 away from the TFT substrate 100, the light guide plate 940 is stacked on the surface of the diffusion film 930 away from the TFT substrate 100, and the reflective film 950 is stacked on the surface of the light guide plate 940 away from the TFT substrate 100. The housing 960 includes a first portion 961 and a second portion 962. The first portion 961 is located on the side of the reflective sheet 950 away from the TFT substrate 100, and is arranged opposite to the reflective sheet 950, and carries the reflective sheet 950. The second portion 962 is fixedly connected to the first portion 961, and carries the TFT substrate 100. The light source 970 is installed on the second portion 962, and is located on the side of the TFT substrate 100 facing the first portion 961. In this embodiment, the backlight unit 900 is described by taking a side-type backlight structure as an example. It can be understood that the backlight unit 900 can also be a direct-type backlight structure. The embodiment of the present application does not limit the specific structure of the backlight unit 900.

[0085] In this example, when the backlight unit 900 of the display module 1 is working, the light source 970 emits light, which is incident on the reflective sheet 950 and forms reflected light. The reflected light passes through the light guide plate 940, the diffuser 930, the lower light enhancement sheet 920 and the upper light enhancement sheet 910 in sequence, then enters the lower polarizer 732c, and passes through the TFT substrate 100, the liquid crystal layer 740c, the color filter 720c and the upper polarizer 731c in sequence to be emitted. In this example, the sum of the thickness of the liquid crystal layer 740c, the thickness of the color filter 720c and the thickness of the upper polarizer 731c is equal to the thickness D2 of the panel component 700. The thickness D1 of the driving module 200 is less than or equal to the thickness D2 of the panel component 700.

[0086] See also Fig.12 , Fig.12 It is a schematic structural diagram of the display module 1 in the fifth example according to an embodiment of the present application.

[0087] The fifth example provides an LCD display module 1 , which is different from the display module 1 of the fourth embodiment in that the display module 1 of the fourth example is further provided with an optically clear adhesive (OCA) 750 d and a cover glass 770 d .

[0088] Specifically, the optical adhesive layer 750d and the cover glass 770d are both stacked on the second area 130 of the TFT substrate 100. The optical adhesive layer 750d is stacked on the surface of the upper polarizer 731c away from the TFT substrate 100, and the cover glass 770d is stacked on the surface of the optical adhesive layer 750d away from the TFT substrate 100, so that the optical adhesive layer 750d is bonded between the upper polarizer 731c and the cover glass 770d.

[0089] In this example, when the backlight unit 900 of the display module 1 is working, the light source 970 emits light, which is incident on the reflective sheet 950 and forms reflected light. The reflected light passes through the light guide plate 940, the diffuser 930, the lower light enhancement sheet 920 and the upper light enhancement sheet 910 in sequence, then enters the lower polarizer 732c, and passes through the TFT substrate 100, the liquid crystal layer 740c, the color filter 720c, the upper polarizer 731c, the upper polarizer 731c, the optical adhesive layer 750d and the cover glass 770d in sequence before being emitted. In this example, the sum of the thickness of the liquid crystal layer 740c, the thickness of the color filter 720c, the thickness of the upper polarizer 731c, the thickness of the optical adhesive layer 750d and the thickness of the cover glass 770d is equal to the thickness D2 of the panel component 700. The thickness D1 of the driving module 200 is less than or equal to the thickness D2 of the panel component 700.

[0090] It can be understood that in other examples, the cover glass 770d can also be used as an encapsulation layer, and the projection on the TFT substrate 100 covers the first area 110. In this case, the first area 110 of the TFT substrate 100 in the display module 1 can be covered by the cover glass 770a, so that the components such as the timing control board 500 provided in the first area 110 are covered, so that the electronic device 1000 has a better appearance effect. At this time, the liquid crystal layer 740c, the color filter 720c, the upper polarizer 731c, the upper polarizer 731c and the optical adhesive layer 750d serve as the display layer, and the sum of the thickness of the liquid crystal layer 740c, the color filter 720c, the upper polarizer 731c, the upper polarizer 731c and the optical adhesive layer 750d is equal to the thickness of the display layer, and the thickness of the driving module 200 is less than or equal to the thickness of the display layer.

[0091] It should be noted that the driving module 200 in the display module 1 of the first to fifth examples is illustrated by taking the driving module 200 of the first embodiment as an example. It is understandable that the driving module 200 in the display module 1 of the first to fourth examples may also be the driving module 200 in the second embodiment.

[0092] What is disclosed above is only a preferred embodiment of the present application, and it certainly cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A display module, characterized in that: It includes a TFT substrate, a panel component, a driving chip and a timing control board, the TFT substrate includes a second area and a first area, the first area is arranged around the circumference of the second area, the timing control board, the driving chip and the panel component are all located on the same side of the TFT substrate, wherein the panel component is stacked on the second area, the timing control board is installed in the first area and is electrically connected to the TFT substrate, the driving chip is arranged in the first area, the driving chip is embedded in the timing control board and is electrically connected to the TFT substrate.

2. The display module according to claim 1, characterized in that: The thickness of the timing control board is less than or equal to the thickness of the panel member.

3. The display module according to claim 2, characterized in that: The panel component includes a display layer and a packaging layer, the display layer is stacked on the second area, the packaging layer is arranged on the side of the display layer away from the TFT substrate, and the projection on the TFT substrate covers the first area, and the thickness of the timing control board is less than or equal to the thickness of the display layer.

4. The display module according to claim 1, characterized in that: The display module includes a driving module, and the driving module includes the driving chip, the timing control board and a reinforcement board, and the reinforcement board is installed between the timing control board and the TFT substrate.

5. The display module according to claim 4, characterized in that: The driving chip passes through the reinforcing plate, or there are multiple reinforcing plates, the multiple reinforcing plates are arranged at intervals from each other, and the driving chip passes through the gap between two adjacent reinforcing plates.

6. The display module according to claim 4, characterized in that: The reinforcing plate is made of metal.

7. The display module according to claim 4, characterized in that: The thickness of the driving module is less than or equal to the thickness of the panel member.

8. The display module according to any one of claims 1 to 7, characterized in that: The timing control board includes a circuit board and functional devices. The circuit board is installed in the first area, and the functional devices are installed on a side of the circuit board away from the TFT substrate.

9. The display module according to claim 8, characterized in that: The circuit board is provided with an avoidance groove, the opening of the avoidance groove is arranged on the surface of the circuit board facing the TFT substrate, and the driving chip is located in the avoidance groove.

10. The display module according to claim 9, characterized in that: There are a plurality of driving chips, which are spaced apart from each other; there are a plurality of avoidance grooves, which are spaced apart from each other; and each driving chip is located in one avoidance groove.

11. The display module according to claim 8, characterized in that: The display module further includes an electrical connector connected between a surface of the circuit board facing away from the TFT substrate and the TFT substrate, and the electrical connector is electrically connected to both the circuit board and the TFT substrate.

12. The display module according to claim 8, characterized in that: The functional device includes at least one of a timing control chip and a power management chip.

13. The display module according to claim 1, characterized in that: The display module includes a driving module, the driving module includes the driving chip and the timing control board, and the thickness of the driving module is greater than the thickness of the panel component.

14. An electronic device, characterized in that: The electronic device comprises a housing and a display module as claimed in any one of claims 1 to 12, wherein the display module is mounted on the housing.

15. An electronic device, characterized in that: The electronic device comprises a housing and a display module as claimed in claim 13, wherein the display module is mounted on the housing, the housing covers the driving module, and protrudes relative to the panel component in a direction away from the TFT substrate along the thickness direction of the panel component.

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