Resin sheet press-fit packaging support

Abstract

The utility model discloses a resin sheet press-fit packaging support, which belongs to the technical field of packaging supports and comprises a bottom plate and a cover plate arranged on the bottom plate, the bottom plate and the cover plate are pressed into a whole through a bonding layer, a metal circuit conductive area is etched on the surface of the bottom plate, metal PINs are etched on the back surface of the bottom plate, and the metal circuit conductive area is in conductive intercommunication with the metal PINs. The cover plate is of a frame structure, grid supports are arranged in the cover plate in a crossed mode, and the interior of the cover plate is divided into a plurality of block-shaped packaging supports through the grid supports. According to the packaging support, the metal circuit conductive area is etched on the surface of the bottom plate, the metal PINs are etched on the back surface of the bottom plate, and the metal circuit conductive area and the metal PINs are in conductive intercommunication, so that the packaging support can be suitable for electronic components with multiple PINs, the PINs can be arranged at will, and the size of the electronic components is large; the cover plate is arranged to be a frame, the grid support is arranged in the cover plate, the interior of the cover plate is divided into a plurality of block-shaped packaging supports, it is guaranteed that the packaging supports can be cut in any size, and the packaging support is suitable for small-interval electronic components.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging brackets, in particular to a resin sheet pressed packaging bracket. Background Art

[0002] The electronic component packaging bracket is currently assembled with C2046 and C194 copper plates and PPA plastic materials. The processing steps are: copper electroplating, stamping, injection molding, bending, cutting, and cleaning. Not only is the production mold cost high, but also special funds are used for special purposes. Some designs with a large number of PIN pins have a large finished size of the bracket, which is not convenient for the use of small-pitch products; especially the application of small-pitch displays. In addition, conventional CHIP products have problems of light leakage around and poor waterproof and airtightness. Therefore, a new type of resin sheet pressed packaging bracket is urgently needed to solve the above problems. Utility Model Content

[0003] The main purpose of the utility model is to provide a resin sheet pressed packaging bracket and its processing technology, aiming to solve the technical problems of high processing cost of existing packaging brackets, unsuitability for brackets with a large number of PIN pins and small pitch products.

[0004] To achieve the above-mentioned purpose, the utility model proposes a resin sheet pressed packaging bracket, comprising a base plate and a cover plate arranged on the base plate, the base plate and the cover plate are pressed together through an adhesive layer, a metal circuit conductive area is etched on the surface of the base plate, and a metal PIN foot is etched on the back side, the metal circuit conductive area and the metal PIN foot are conductively connected, the cover plate is a frame structure, and a grid bracket is cross-arranged inside, and the grid bracket divides the inside of the cover plate into a number of block-shaped packaging brackets.

[0005] Preferably, the bottom plate and the cover plate are made of plastic material or BT material, the bottom plate has a thickness of 0.1-2 mm, and the cover plate has a thickness of ≥0.18 mm-20 mm.

[0006] Preferably, the cover plate is in the shape of an irregular ring, a quadrilateral, an ellipse or a polygon, and its inner diameter or length and width is ≥ 1 mm.

[0007] Preferably, the adhesive layer is a resin adhesive.

[0008] Preferably, the substrate of the metal circuit conductive area is a metal conductive material, which is arranged on the surface or bottom surface of the base plate and has a thickness of 0.02-2 mm. The metal conductive material is pressed onto the base plate by a resin adhesive.

[0009] Preferably, the surface of the metal conductive material needs to be electroplated to form an electroplated layer, and the electroplated metal of the electroplated layer is copper, nickel, silver, and gold, wherein the thickness of the nickel, silver, and gold electroplated layer is 1u"-500u".

[0010] Preferably, the bottom plate and the cover plate are pressed together into one by a high-pressure pressing machine, and the TG point thereof is 300°C.

[0011] The utility model also provides a processing technology for pressing and packaging a resin sheet bracket, comprising the following steps:

[0012] S1: cutting the bottom plate and drilling holes in the bottom plate;

[0013] S2: Bond the copper sheet to the surface and bottom of the base plate;

[0014] S3: Make metal circuit conductive areas or metal PIN feet through laser and exposure etching process;

[0015] S4: Electroplating the metal circuit conductive area and the metal PIN pin;

[0016] S5: Electroplating or resin plugging is performed on the conductive area of ​​the metal circuit to make the conductive area of ​​the metal circuit and the metal PIN foot conductively connected;

[0017] S6: Processing the cover plate by laser forming or CNC forming to make the inside of the cover plate grid-shaped;

[0018] S7: Apply glue on the bottom surface of the cover plate, and press the cover plate onto the bottom plate by a press machine;

[0019] S8: Finally, the electronic components are packaged and then cut into shapes according to size.

[0020] Preferably, the electroplating process sequence in step S4 is copper plating, nickel plating, silver plating and gold plating, or gold plating is not required.

[0021] Preferably, in step S7, for small-sized products, packaging can be performed first and then pressing, the pressing temperature is 100-160°, and the pressing time is 1-5 minutes.

[0022] The beneficial effects of the technical solution of the utility model are:

[0023] The utility model provides a resin sheet pressed packaging bracket, which mainly includes a base plate and a cover plate. By etching a metal circuit conductive area on the surface of the base plate and etching a metal PIN foot on the back, and the metal circuit conductive area and the metal PIN foot are conductively connected, it is ensured that it can be used for electronic components with multiple PIN feet, and the PIN feet can be arranged arbitrarily and large in size; by setting the cover plate as a frame structure and setting a grid bracket inside it, the inside of the cover plate is divided into a number of block-shaped packaging brackets, ensuring that the packaging bracket can be cut to any size, which is suitable for electronic components with small pitches. The utility model provides a processing technology for a resin sheet pressed packaging bracket, which saves the processing steps and costs of the packaging bracket; and ensures that the size of the packaging bracket can be cut arbitrarily, which is suitable for the packaging of electronic components with small pitches. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of an embodiment of a resin sheet press-fit packaging bracket of the utility model;

[0025] Figure 2 It is a schematic diagram of the split structure of an embodiment of a resin sheet press-fit packaging bracket of the utility model;

[0026] Figure 3 It is a schematic cross-sectional structure diagram of a resin sheet press-fit packaging bracket of the utility model;

[0027] Figure 4 It is a schematic structural diagram of a resin sheet press-fit packaging bracket after cutting according to an embodiment of the utility model;

[0028] Figure 5 It is a schematic diagram of the bottom structure after cutting of an embodiment of a resin sheet pressed packaging bracket of the utility model.

[0029] In the figure: 1-base plate, 2-cover plate, 3-adhesive layer, 4-metal line conductive area, 5-metal PIN foot, 6-grid bracket. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the scheme in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] The utility model provides a resin sheet pressed packaging bracket, referring to Figure 1-5, including a base plate 1 and a cover plate 2 arranged on the base plate, the base plate 1 and the cover plate 2 are pressed together through an adhesive layer 3, a metal circuit conductive area 4 is etched on the surface of the base plate 1, and a metal PIN foot 5 is etched on the back side, the metal circuit conductive area 4 and the metal PIN foot 5 are conductively connected, the cover plate 2 is a frame structure, and a grid bracket 6 is cross-arranged inside it, and the grid bracket 6 divides the inside of the cover plate 2 into a plurality of block-shaped packaging brackets.

[0032] The utility model discloses a resin sheet pressed packaging bracket, which comprises a base plate 1 and a cover plate 2. The cover plate 2 and the base plate 1 are pressed together into an integrated structure through an adhesive layer. A metal circuit conductive area 4 is etched on the surface of the base plate 1, a metal PIN foot 5 is etched on the back, and the metal circuit conductive area 4 and the metal PIN foot 5 are electrically connected to each other, so as to ensure that the electronic components with multiple PIN feet, arbitrarily arranged PIN feet and large size can be applied. The cover plate 2 is set as a frame structure, and a grid bracket 6 is arranged inside the cover plate 2, so that the inside of the cover plate 2 is divided into a plurality of block-shaped packaging brackets, so as to ensure that the packaging bracket can be cut into any size, and is suitable for electronic components with small spacing.

[0033] In a preferred embodiment, referring to Figure 1-5 The bottom plate 1 and cover plate 2 of the resin sheet pressed packaging bracket are made of plastic material or BT material, the thickness of the bottom plate 1 is 0.1-2mm, and the thickness of the cover plate 2 is ≥0.18mm-20mm. The bottom plate 1 and the cover plate 2 are made of plastic material or BT material, including but not limited to any resin material, wherein the bottom plate 1 is a substrate, and its thickness ranges from 0.1-2mm, and its length is designed according to the stroke of the actual cutting equipment, not limited to the specific size, and the minimum is the size of a single component; the cover plate 2 is a protective shell of the grid bracket 6, which plays the role of wrapping and packaging glue molding during packaging, and its raw material is a flat resin sheet, but not limited to silicone resin or epoxy resin.

[0034] In a preferred embodiment, referring to Figure 1-5 The shape of the cover plate 2 of the resin sheet pressed and packaged bracket is irregular ring, quadrilateral, ellipse or polygon, and its inner diameter or length and width is ≥1mm. The adhesive layer 3 is a resin adhesive. The shape of the cover plate can be ring, quadrilateral, ellipse, polygon, and its molding method is laser or CNC numerical control molding. When installed, it is pressed on the top of the metal circuit conductive area 4 through the resin adhesive.

[0035] In a preferred embodiment, referring to Figure 1-5The base material of the metal circuit conductive area 4 of the resin sheet pressed package bracket is a metal conductive material, which is arranged on the surface or bottom of the base plate 1 and has a thickness of 0.02-2mm. The metal conductive material is pressed on the base plate through a resin adhesive. The surface of the metal conductive material needs to be electroplated to form an electroplated layer. The electroplated metal of the electroplated layer is copper, nickel, silver, and gold. Among them, the thickness of the nickel, silver, and gold electroplated layer is 1u"-500u".

[0036] The substrate of the metal circuit conductive area 4 is a metal conductive material, specifically a copper sheet, which can be arranged on the surface and / or bottom of the base plate 1, and is specifically set according to actual circuit requirements. The metal circuit conductive area 4 is mainly used for conductive welding of components. After etching the metal circuit, it is necessary to electroplate metal on its surface to make it conductive. The electroplating process is to first plate copper, then nickel, then silver, and finally gold. Gold plating is also optional. The thickness of the nickel, silver, and gold electroplating layers is 1u"-500u".

[0037] In a preferred embodiment, referring to Figure 1-5 The bottom plate 1 and the cover plate 2 of the resin sheet packaging bracket are pressed together by a high-pressure press, and the TG point is 300°C. The bottom plate 1 and the cover plate 2 are pressed together as a whole by a press, and both the bottom plate 1 and the cover plate 2 are resin substrate sheets, which are resistant to high temperature and humidity. The TG point is 300°C, which is particularly suitable for the packaging of electronic components, especially for the packaging of LED and IC integrated circuit brackets. After the sealed package, it can reach IP68 or above standards.

[0038] As a preferred solution, the substrate of the metal circuit conductive area of ​​the utility model is a copper sheet. During installation, a resin adhesive and a high-temperature and high-pressure pressing machine are used to make it evenly laid and bonded to the base plate. The thickness of the copper sheet is generally 0.02-2mm. Through the integrated circuit manufacturing process, exposure etching or laser engraving, the circuit can be designed arbitrarily without being restricted by the mold. The minimum wire diameter is 0.08mm, the minimum bottom PIN foot is 0.08mm, and the orientation can be arranged arbitrarily, which is suitable for bottom selection testing. The front and back of the pressed base plate are CNC drilled, and the circuits on the front and back of the base plate are connected through the electroplating hole filling process.

[0039] In addition, the cover plate of the utility model is formed by laser forming and CNC forming, and is not limited by the traditional bracket stamping injection mold. The size of the formed cover plate can be designed as needed. The minimum inner diameter can be 1mm, and the minimum thickness can be 0.18. It can be used in the field of small-pitch electronic components, especially mini LED display screens and backlight industries. The production method is to first form the resin sheet substrate, that is, the cover plate, according to the designed size by laser and CNC forming technology to produce the required inner frame shape, and then press it with a resin adhesive just above the conductive area of ​​the metal circuit to form an enclosure for electronic component packaging.

[0040] The resin sheet pressing package bracket of the utility model also has the following characteristics:

[0041] 1. Compared with the traditional packaging bracket, the packaging bracket of the utility model saves the processes of stamping, injection molding and bending, thus saving the production cost;

[0042] 2. The package cover of the utility model is made by laser and CNC technology, and the size can be designed at will, which solves the problem of using special molds;

[0043] 3. The packaging bracket of the utility model is different from the copper stamping process, which requires the minimum size of the PIN foot to be greater than 0.5mm. The utility model can achieve a minimum PIN foot of 0.08mm, which is suitable for the packaging of small-pitch electronic components, solves the packaging problem of miniLED and IC, and can realize the design of ultra-small P1.0 display screens, such as the fantasy color display series;

[0044] 4. The utility model adopts the resin sheet molding cover plate process, and the total thickness of the bracket can be as small as 0.36mm and as large as 20mm. It can be well applied in the small-pitch display industry, and is particularly suitable for brackets with package sizes within 2.0mm*2.0mm, especially 1.5mm*1.5mm and 1.0mm*1.0mm colorful LED brackets with frames.

[0045] The utility model also provides a processing technology for pressing and packaging a resin sheet bracket, comprising the following steps:

[0046] S1: cutting the bottom plate and drilling holes in the bottom plate;

[0047] S2: Bond the copper sheet to the surface and bottom of the base plate;

[0048] S3: Make metal circuit conductive areas or metal PIN feet through laser and exposure etching process;

[0049] S4: Electroplating the metal circuit conductive area and the metal PIN pin;

[0050] S5: Electroplating or resin plugging is performed on the conductive area of ​​the metal circuit to make the conductive area of ​​the metal circuit and the metal PIN foot conductively connected; the hole diameter is 0.02-0.8mm.

[0051] S6: Processing the cover plate by laser forming or CNC forming to make the inside of the cover plate grid-shaped;

[0052] S7: Apply glue on the bottom surface of the cover plate, and press the cover plate onto the bottom plate by a press machine; two processes are used for glue coating, the first is screen printing adhesive, and the second is double-sided quick-drying adhesive film;

[0053] S8: Finally, the electronic components are packaged and then cut into shapes according to size.

[0054] The electroplating process sequence in step S4 is copper plating, nickel plating, silver plating and gold plating, or gold plating is not required.

[0055] In step S7, for small-sized products, packaging can be performed first and then pressing, the pressing temperature is 100-160°, the pressing time is 1-5 minutes, and the pressing force is set to increase linearly from 4 to 50 kg.

[0056] The processing technology of the resin sheet pressed packaging bracket of the utility model can realize a packaging bracket with a small pitch and a frame, reduce the manufacturing cost of the bracket mold, and improve the reliability of the CHIP product. At the same time, it can be applied to the LED industry to realize a small pitch P1.0 display application design, and the four sides are different from conventional CHIP products and can be completely opaque on all sides.

[0057] The above description is only a partial or preferred embodiment of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect application in other related technical fields are included in the scope of protection of the present invention.

Claims

1. A resin sheet pressed packaging bracket, characterized in that: It includes a base plate and a cover plate arranged on the base plate, the base plate and the cover plate are pressed together by an adhesive layer, a metal circuit conductive area is etched on the surface of the base plate, and a metal PIN foot is etched on the back side, the metal circuit conductive area and the metal PIN foot are conductively connected, the cover plate is a frame structure, and grid brackets are cross-arranged inside, and the grid brackets divide the inside of the cover plate into a number of block-shaped packaging brackets.

2. The resin sheet press-fit packaging bracket according to claim 1, characterized in that: The bottom plate and the cover plate are made of plastic material or BT material, the bottom plate has a thickness of 0.1-2 mm, and the cover plate has a thickness of ≥0.18 mm-20 mm.

3. The resin sheet press-fit packaging bracket according to claim 1, characterized in that: The shape of the cover plate is a quadrilateral or an ellipse, and its inner diameter or length and width is ≥ 1 mm.

4. The resin sheet pressing package bracket according to claim 1, characterized in that: The adhesive layer is a resin adhesive.

5. The resin sheet press-fit packaging bracket according to claim 1, characterized in that: The base material of the metal line conductive area is a metal conductive material, which is arranged on the surface or bottom of the base plate and has a thickness of 0.02-2 mm. The metal conductive material is pressed onto the base plate by a resin adhesive.

6. The resin sheet press-fit packaging bracket according to claim 1, characterized in that: The bottom plate and the cover plate are pressed together by a high-pressure pressing machine, and the TG point is 300°C.

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