Secondary vaporization unit for semiconductor and secondary vaporization device for semiconductor

Abstract

The utility model provides a secondary vaporization unit for a semiconductor and a secondary vaporization device for the semiconductor. The secondary vaporization unit comprises a detachable semiconductor pipeline module and an auxiliary heating device wrapping the detachable semiconductor pipeline module. The detachable semiconductor pipeline module comprises a semiconductor pipeline for transmitting a reaction source and a heat conduction shell covering the semiconductor pipeline; the auxiliary heating device comprises a built-in thermocouple, a heat preservation layer laid in the auxiliary heating device and a plurality of heating wires embedded in the heat preservation layer.

Description

Technical Field

[0001] The utility model relates to semiconductor equipment, in particular to a secondary vaporization device for semiconductors. Background Art

[0002] In semiconductor processes, vaporized liquid sources are usually used as reaction sources, such as Teos, water, etc., which requires the use of vaporization devices. If the primary vaporization device in the prior art is not completely vaporized, the steam contains small droplets, which will cause a series of problems such as particle contamination and uneven deposition of thin films.

[0003] In addition, the steam delivery pipeline of the vaporizer in the prior art is too long, and it takes a long distance to be delivered to the cavity, which is prone to condensation. Due to the miniaturization requirements of the vaporizer and the extremely thin delivery pipeline, the internal fluid is often in a laminar state. It is difficult to heat the central area by heating the external pipeline. Therefore, there is a risk of liquefaction of steam.

[0004] Based on this, there is an urgent need for a secondary vaporization device that can avoid liquefaction risks and ensure vaporization efficiency. Utility Model Content

[0005] In order to overcome the risk of liquefaction of steam transported by traditional vaporizers, the utility model provides a novel secondary vaporization device for semiconductors, which can be disassembled and assembled, and can be combined in multiple sections to ensure vaporization efficiency.

[0006] The semiconductor secondary vaporization unit comprises a detachable semiconductor pipeline module and an auxiliary heating device wrapping the detachable semiconductor pipeline module.

[0007] The detachable semiconductor pipeline module comprises a semiconductor pipeline for transmitting a reaction source and a heat-conducting shell covering the semiconductor pipeline.

[0008] The auxiliary heating device comprises a built-in thermocouple, a heat-insulating layer laid inside the auxiliary heating device, and a plurality of heating wires embedded in the heat-insulating layer.

[0009] In one embodiment, the semiconductor secondary vaporization unit further includes: thermal insulation silica gel located at both ends of the semiconductor secondary vaporization unit.

[0010] In one embodiment, the axial direction of the heating wire is the same as the axial direction of the detachable semiconductor pipeline module.

[0011] In one embodiment, the semiconductor pipeline is a detachable semiconductor pipeline with a standard diameter.

[0012] In one embodiment, the semiconductor pipeline is a bent pipeline.

[0013] In one embodiment, the detachable semiconductor pipeline module accommodates semiconductor pipelines of different standard diameters.

[0014] In one embodiment, the heating wire is in contact with the heat conductive shell.

[0015] In one embodiment, the heating wire is a resistance wire.

[0016] In one embodiment, the semiconductor pipeline is a 1 / 4 inch standard semiconductor pipeline.

[0017] In one embodiment, the semiconductor pipeline is a 3 / 8 inch standard semiconductor pipeline.

[0018] In one embodiment, the heat conductive shell is an aluminum shell.

[0019] In one embodiment, the auxiliary heating device further includes a metal fixed shell.

[0020] In one embodiment, the built-in thermocouple monitors the temperature of the detachable semiconductor circuit, feeds back the temperature, and controls the temperature of the heating wire to ensure that the desired temperature is controlled.

[0021] In one embodiment, the semiconductor pipeline is connected to a reaction source transmission pipeline to pass the reaction source.

[0022] The utility model also provides a semiconductor secondary vaporization device, comprising a plurality of mutually connected semiconductor secondary vaporization units as described above.

[0023] The semiconductor secondary vaporization device of the utility model is composed of semiconductor standard diameter pipelines and auxiliary heating devices, and the parts are easy to obtain without additional complex design. Moreover, the secondary vaporization unit can be combined and disassembled according to actual needs.

[0024] In addition, the utility model can control the pressure of the inflowing liquid by adjusting the diameter of the standard pipeline to maintain a favorable gas pressure (lower than the saturated vapor pressure); and can control the secondary vaporization temperature by adjusting the temperature of the auxiliary heating device to cope with different reaction steam sources.

[0025] Thirdly, the present invention can also remove some impurities in the liquid source by heating the liquid to a desired temperature and cyclically heating the liquid to the flash point of the steam impurities. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above utility model content and the following specific embodiments of the utility model will be better understood when read in conjunction with the accompanying drawings. It should be noted that the accompanying drawings are only examples of the utility model claimed for protection. In the accompanying drawings, the same reference numerals represent the same or similar elements.

[0027] Figure 1A cross-sectional view of a secondary vaporization unit according to an embodiment of the present utility model is shown;

[0028] Figure 2 Show Figure 1 A cross-sectional view of the auxiliary heating device in FIG.

[0029] Figure 3 A schematic diagram showing the internal structure of a secondary vaporization unit according to an embodiment of the utility model is shown;

[0030] Figure 4 A secondary vaporization device according to an embodiment of the utility model is shown;

[0031] Figure 5 The figure shows an overall external schematic diagram of a secondary vaporization unit according to an embodiment of the utility model. DETAILED DESCRIPTION

[0032] The detailed features and advantages of the utility model are described in detail in the specific implementation mode below, and the content is sufficient for any technical personnel in the field to understand the technical content of the utility model and implement it accordingly, and according to the specification, claims and drawings disclosed in this specification, the technical personnel in the field can easily understand the relevant purposes and advantages of the utility model. Although the description of the utility model will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this utility model are limited to this implementation mode. On the contrary, the purpose of introducing the utility model in conjunction with the implementation mode is to cover other options or modifications that may be extended based on the claims of the utility model. In order to provide an in-depth understanding of the utility model, the following description will include many specific details. The utility model can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the utility model, some specific details will be omitted in the description.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0035] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, channels, components, regions, layers and / or parts, these components, channels, components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, channels, components, regions, layers and / or parts. In addition, the terms "first", "second", "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0036] As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not refer to the singular and may also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0037] In some embodiments, numbers describing the number of components and attributes are used. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise specified, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values ​​is as accurate as possible within the feasible range.

[0038] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0039] In semiconductor processes, vaporized liquid sources are usually used as reaction sources, such as Teos, water, etc., which requires the use of vaporization devices. If the primary vaporization device in the prior art is not completely vaporized, the steam contains small droplets, which will cause a series of problems such as particle contamination and uneven deposition of thin films.

[0040] In addition, the steam delivery pipeline of the vaporizer in the prior art is too long, and it takes a long distance to be delivered to the cavity, which is prone to condensation. Due to the miniaturization requirements of the vaporizer and the extremely thin delivery pipeline, the internal fluid is often in a laminar state. It is difficult to heat the central area by heating the external pipeline. Therefore, there is a risk of liquefaction of steam.

[0041] In order to solve the above problems, the utility model provides a secondary vaporization unit and a secondary vaporization device. The bent pipeline of the secondary vaporization unit is covered with an aluminum shell, and then wrapped with an auxiliary heating device to ensure the uniformity of the heating temperature; in addition, by heating to an extremely high temperature (the temperature at which the liquid itself does not denature), impurities inside the liquid are removed; furthermore, if the heating effect does not achieve a satisfactory effect (the properties of the medium in the pipeline such as the latent heat of vaporization are different), the length of the pipeline can be increased, and the number of sections of the outer wrapped heating device can be increased.

[0042] The semiconductor secondary vaporization unit of the utility model comprises: a detachable semiconductor pipeline module and an auxiliary heating device wrapping the detachable semiconductor pipeline module.

[0043] The detachable semiconductor pipeline module comprises a semiconductor pipeline for transmitting a reaction source and a heat-conducting shell covering the semiconductor pipeline.

[0044] The auxiliary heating device comprises a built-in thermocouple, a heat-insulating layer laid inside the auxiliary heating device, and a plurality of heating wires embedded in the heat-insulating layer.

[0045] In one embodiment, the semiconductor secondary vaporization unit further includes: thermal insulation silica gel located at both ends of the semiconductor secondary vaporization unit.

[0046] In one embodiment, the axial direction of the heating wire is the same as the axial direction of the detachable semiconductor pipeline module.

[0047] In one embodiment, the semiconductor pipeline is a detachable semiconductor pipeline with a standard diameter.

[0048] In one embodiment, the semiconductor pipeline is a bent pipeline.

[0049] In one embodiment, the detachable semiconductor pipeline module accommodates semiconductor pipelines of different standard diameters.

[0050] In one embodiment, the heating wire is in contact with the heat conductive shell.

[0051] In one embodiment, the heating wire is a resistance wire.

[0052] In one embodiment, the semiconductor pipeline is a 1 / 4 inch standard semiconductor pipeline.

[0053] In one embodiment, the semiconductor pipeline is a 3 / 8 inch standard semiconductor pipeline.

[0054] In one embodiment, the heat conductive shell is an aluminum shell.

[0055] In one embodiment, the auxiliary heating device further includes a metal fixed shell.

[0056] In one embodiment, the built-in thermocouple monitors the temperature of the detachable semiconductor circuit, feeds back the temperature, and controls the temperature of the heating wire to ensure that the desired temperature is controlled.

[0057] In one embodiment, the semiconductor pipeline is connected to a reaction source transmission pipeline to pass the reaction source.

[0058] Figure 1 FIG. 2 shows a cross-sectional view of a secondary vaporization unit according to an embodiment of the present invention. Figure 1 As shown, the secondary vaporization unit includes a detachable semiconductor pipeline module 101 and an auxiliary heating device 102 wrapping the detachable semiconductor pipeline module 101 .

[0059] The detachable semiconductor pipeline module 101 includes a semiconductor pipeline for transmitting a reaction source and a heat-conducting shell covering the semiconductor pipeline. The semiconductor pipeline is a detachable pipeline with a standard semiconductor pipe diameter.

[0060] It should be pointed out that Figure 1 The disassembled semiconductor pipeline module 101 in FIG. 1 is a disassembled semiconductor pipeline module 101 when a semiconductor pipeline has not been installed.

[0061] Figure 2 Show Figure 1 The auxiliary heating device 102 has a heat preservation layer 201 and a plurality of heating wires 202 embedded in the heat preservation layer. The heating wires 202 are used to heat the detachable semiconductor pipeline module 101.

[0062] In a preferred embodiment, the heating wire 202 fits the heat-conducting shell of the detachable semiconductor pipeline module 101 to better heat the detachable semiconductor pipeline module 101 .

[0063] In a preferred embodiment, the axial direction of the heating wire 202 is in the same direction as the length of the detachable semiconductor pipeline module 101 .

[0064] In one embodiment, the heating wire 202 is a resistance wire.

[0065] In one embodiment, the auxiliary heating device 102 further includes a metal fixed shell.

[0066] In one embodiment, the auxiliary heating device 102 further includes a built-in thermocouple (TC) (not shown).

[0067] Figure 3 FIG. 2 shows a schematic diagram of the internal structure of a secondary vaporization unit according to an embodiment of the present utility model. Figure 3 As shown, the detachable semiconductor pipeline module 101 includes a semiconductor pipeline 301 with a standard pipe diameter and a heat-conducting shell 306 covering the semiconductor pipeline 301 .

[0068] The semiconductor pipeline 301 is used to transmit the reaction source.

[0069] The heat-conducting shell 306 serves as the outer shell of the detachable semiconductor pipeline module 101 , and can make the surface of the detachable semiconductor pipeline 101 heated more evenly, thereby avoiding local underheating and causing local condensation.

[0070] In one embodiment, the heat-conducting shell 302 is an aluminum shell. Aluminum has high thermal conductivity, which can heat the surface of the pipeline evenly without causing local condensation.

[0071] The detachable semiconductor pipeline module 101 can be removed and loaded from the secondary vaporization unit for replacement. The detachable semiconductor pipeline module 101 can control the pressure of the inflowing liquid by replacing semiconductor pipelines of different standard diameters, thereby maintaining a favorable gas pressure (below the saturated vapor pressure).

[0072] In one embodiment, the semiconductor pipeline 301 is a bent pipeline.

[0073] In one embodiment, the diameter of the semiconductor pipeline 301 can be 1 / 4 inch or 3 / 8 inch. If a pipeline with a diameter of 1 / 4 inch is used, the pressure can reach about 500 Torr when the internal gas is 30 SLM. If it is adjusted to a pipeline with a diameter of 3 / 8 inch, the pressure can be reduced to about 450 Torr for the same volume flow rate of gas. According to the vaporization curve (such as water), the temperature of the vaporization phase transition point increases when the pressure increases; and the temperature of the vaporization phase transition point decreases when the pressure decreases.

[0074] The auxiliary heating device 102 includes a built-in thermocouple (TC) (not shown), a heat-insulating layer 201 , a heating wire 202 , a heat-insulating silica gel 305 , and a metal fixed shell 302 .

[0075] The metal fixed shell 302 is the outermost layer of the auxiliary heating device 102 and has a fixing function.

[0076] The heat-insulating layer 201 is laid inside the auxiliary heating device 102 to prevent heat from escaping.

[0077] The heat-insulating layer 201 is provided with a plurality of grooves for embedding the heating wire 202 .

[0078] In a preferred embodiment, the heating wire 202 fits the heat-conducting shell of the detachable semiconductor pipeline module 101 to better heat the detachable semiconductor pipeline module 101 (ie, the pipeline 301 ).

[0079] In a preferred embodiment, the axial direction of the heating wire 202 is the same as the axial direction of the detachable semiconductor pipeline module 101 .

[0080] In one embodiment, the heating wire 202 is a resistance wire.

[0081] The heat-insulating silica gel 305 is located at both ends of the secondary vaporization unit to play a heat-insulating role.

[0082] The built-in thermocouple (TC) is used to monitor the pipeline temperature, feedback temperature and control the temperature of the resistance wire to ensure the required temperature. For example, if the set temperature is 200 degrees Celsius, when the temperature is not reached, the output power of the resistance wire is increased to increase the pipeline temperature; when the temperature is low, the heating power is reduced (generally by adjusting the current) to reduce the heat source heat release and reduce the pipeline temperature.

[0083] The utility model uses semiconductor standard diameter pipelines and auxiliary heating devices to form a secondary vaporization unit. The parts are easy to obtain and do not require additional complex design. Moreover, the secondary vaporization unit can be combined and disassembled to increase the secondary vaporization unit according to the heating temperature requirements. If the heating effect does not achieve a satisfactory effect (the properties of the medium in the pipeline such as the latent heat of vaporization are different), the desired heating effect can be achieved by increasing the number of sections of the secondary vaporization unit, that is, increasing the length of the pipeline and increasing the number of sections of the outer wrapped heating device. For example, Figure 4 The secondary vaporization device according to the utility model is shown. The secondary vaporization device comprises a plurality of interconnected secondary vaporization units. The internal structure of each secondary vaporization unit is as follows: Figure 3 shown.

[0084] In addition, the utility model can control the pressure of the inflowing liquid by adjusting the diameter of the standard pipeline to maintain a favorable gas pressure (below the saturated vapor pressure); and use the built-in thermocouple of the auxiliary heating device to control the secondary vaporization temperature by adjusting the temperature of the auxiliary heating device to cope with different reaction steam sources.

[0085] Furthermore, the utility model can also be cyclically heated to a desired temperature (eg, 200 degrees Celsius) to remove the original impurities in the liquid source and the small droplets that may exist after vaporization.

[0086] Figure 5 FIG. 2 shows an overall external schematic diagram of a secondary vaporization unit according to an embodiment of the present utility model. Figure 2 The auxiliary heating device 102 is combined to wrap the detachable semiconductor pipeline module 101, so as to form the following Figure 5The external overall structure of the secondary vaporization unit is shown in FIG. The detachable semiconductor tube module 101 is connected to the reaction source transmission pipeline 501 to pass the reaction source.

[0087] The terms and expressions used above are for description only, and the present invention should not be limited to these terms and expressions. The use of these terms and expressions does not mean to exclude any equivalent features of the illustrations and descriptions (or parts thereof), and it should be recognized that various modifications that may exist should also be included in the scope of the claims. Other modifications, changes and substitutions may also exist. Accordingly, the claims should be deemed to cover all such equivalents.

[0088] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus facilitate the understanding of one or more utility model embodiments, in the above description of the embodiments of this application, multiple features are sometimes combined into one embodiment, drawing or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims.

[0089] Similarly, it should be pointed out that although the present invention has been described with reference to the current specific embodiments, ordinary technicians in this technical field should realize that the above embodiments are only used to illustrate the present invention, and various equivalent changes or substitutions can be made without departing from the spirit of the present invention. Therefore, as long as the changes and modifications to the above embodiments are within the scope of the essential spirit of the present invention, they will fall within the scope of the claims of this application.

Claims

1. A secondary vaporization unit for semiconductor, characterized in that: include: A detachable semiconductor pipeline module and an auxiliary heating device wrapping the detachable semiconductor pipeline module; The detachable semiconductor pipeline module comprises a semiconductor pipeline for transmitting a reaction source and a heat-conducting shell covering the semiconductor pipeline; The auxiliary heating device comprises a built-in thermocouple, a heat-insulating layer laid inside the auxiliary heating device, and a plurality of heating wires embedded in the heat-insulating layer.

2. The semiconductor secondary vaporization unit according to claim 1, characterized in that: Also includes: Thermal insulation silica gel is located at both ends of the secondary vaporization unit for the semiconductor.

3. The semiconductor secondary vaporization unit according to claim 1, characterized in that: The axial direction of the heating wire is the same as the axial direction of the detachable semiconductor pipeline module.

4. The semiconductor secondary vaporization unit according to claim 1, characterized in that: The semiconductor pipeline is a detachable semiconductor pipeline with a standard diameter of 1 / 4 inch or a semiconductor pipeline with a standard diameter of 3 / 8 inch.

5. The semiconductor secondary vaporization unit according to claim 1, characterized in that: The semiconductor pipeline is a bent pipeline.

6. The semiconductor secondary vaporization unit according to claim 1, characterized in that: The detachable semiconductor pipeline module accommodates the semiconductor pipeline having a 1 / 4 inch standard pipeline diameter or the semiconductor pipeline having a 3 / 8 inch standard pipeline diameter.

7. The semiconductor secondary vaporization unit according to claim 1, characterized in that: The auxiliary heating device also includes a metal fixed shell.

8. The semiconductor secondary vaporization unit according to claim 1, wherein: The heating wire is attached to the heat-conducting shell.

9. The semiconductor secondary vaporization unit according to claim 1, characterized in that: The heat-conducting shell is an aluminum shell.

10. The semiconductor secondary vaporization unit according to claim 1, characterized in that: The semiconductor pipeline is connected to the reaction source transmission pipeline.

11. A secondary vaporization device for semiconductor, characterized in that: A semiconductor secondary vaporization unit comprising a plurality of interconnected sections according to any one of claims 1 to 10.

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