Testing device

Abstract

The utility model provides a testing device. The testing device comprises an evaluation board, a circuit board, an optical chip, a socket and a power supply, the evaluation board comprises a plurality of first bonding pads, the circuit board comprises a plurality of second bonding pads and indicating lamps corresponding to at least one second bonding pad, and the socket comprises a plurality of first pins and a plurality of second pins; the optical chip is mounted on the circuit board; the evaluation board is connected with a power supply and used for receiving electric energy provided by the power supply, and a first bonding pad of the evaluation board is correspondingly connected with a first pin of the socket and used for providing the electric energy to the socket; a second pin of the socket is correspondingly connected with a second bonding pad of the circuit board and is used for providing electric energy to the circuit board; and for any indicating lamp, the indicating lamp emits light under the condition that the second bonding pad corresponding to the indicating lamp receives the electric energy transmitted by the connected second pin, and the indicating lamp does not emit light under the condition that the second bonding pad corresponding to the indicating lamp does not receive the electric energy transmitted by the connected second pin. According to the scheme, invalid testing can be avoided, and the testing efficiency is improved.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of integrated optical testing, and in particular, to a testing device. Background Art

[0002] Optical chips use light waves (electromagnetic waves) as a carrier for information transmission or data calculation. They generally rely on dielectric optical waveguides in integrated optics or silicon-based optoelectronics to transmit guided-mode optical signals, integrating the modulation, transmission, and demodulation of optical and electrical signals on the same chip. They have many advantages such as low transmission loss, wide transmission bandwidth, and strong anti-electromagnetic interference ability, and are widely used in the field of integrated optics.

[0003] After the optical chip is packaged, its performance usually needs to be tested, such as calibration test, matrix operation test, etc. Specifically, the optical chip is mounted on a circuit board, the circuit board is connected to a socket so as to be mounted on an evaluation board, the evaluation board is powered by a power supply, the power is transmitted to the optical chip through the socket and the circuit board, and then the optical chip is tested using an optical signal sent by an optical transmitter.

[0004] During the above test process, there may be abnormal connection between the circuit board and the socket, such as poor contact between the circuit board's pad and the socket's pin, which makes it impossible to smoothly transmit power to the circuit board and the optical chip, that is, it is impossible to supply power to the optical chip. However, in traditional solutions, it is usually after the optical chip test is completed that the above connection and power supply abnormalities are known based on the test results, resulting in invalid testing, affecting test efficiency and test accuracy. Utility Model Content

[0005] The embodiment of the present application provides a testing device to avoid invalid testing and improve testing efficiency and testing accuracy.

[0006] In a first aspect, an embodiment of the present application provides a test device, including an evaluation board, a circuit board, an optical chip, a socket, and a power supply; the evaluation board includes a plurality of first solder pads, the circuit board includes a plurality of second solder pads and an indicator light corresponding to at least one second solder pad, the socket includes a plurality of first pins corresponding to the plurality of first solder pads and a plurality of second pins corresponding to the plurality of second solder pads; the optical chip is mounted on the circuit board;

[0007] The evaluation board is connected to the power supply to receive the electric energy provided by the power supply, and the first pad of the evaluation board is correspondingly connected to the first pin of the socket to provide the electric energy to the socket;

[0008] The second pin of the socket is correspondingly connected to the second pad of the circuit board, and is used to provide the electrical energy to the circuit board;

[0009] For any indicator light, when the second solder pad corresponding to the indicator light receives power transmitted by the connected second pin, the indicator light will illuminate; and when the second solder pad corresponding to the indicator light does not receive power transmitted by the connected second pin, the indicator light will not illuminate.

[0010] Optionally, the circuit board and the socket are both rectangular in shape, second pads are provided within a first preset range at four vertices of the circuit board, and second pins are provided at positions in the socket corresponding to the second pads within the first preset range;

[0011] The circuit board includes four indicator lights, and the four indicator lights are connected one by one to four second solder pads arranged within a first preset range where the four vertices are located.

[0012] Optionally, the circuit board and the socket are both rectangular in shape, three rows of second solder pads are arranged within a second preset range on four sides of the circuit board, the second solder pads are arranged at preset distances, and second pins are arranged at positions in the socket corresponding to the second solder pads within the second preset range.

[0013] Optionally, the indicator light includes a light emitting diode.

[0014] Optionally, the optical chip is mounted on the circuit board via a wire bonding patch;

[0015] When the circuit board receives the electric energy, the electric energy is provided to the optical chip by using a metal wire.

[0016] Optionally, the device further comprises an optical transmitter and a transmission optical fiber;

[0017] The optical transmitter is connected to one end of the transmission optical fiber, and the other end of the transmission optical fiber is coupled to the optical chip;

[0018] The optical signal emitted by the optical transmitter is transmitted to the optical chip via the transmission optical fiber. When the optical chip receives the electrical energy, the optical signal is used to test the optical chip.

[0019] Optionally, the optical chip includes a grating coupler, and the other end of the transmission optical fiber is coupled to the grating coupler;

[0020] The optical signal is transmitted to the optical chip via the transmission optical fiber and the grating coupler.

[0021] Optionally, the light transmitter includes a laser.

[0022] Optionally, the transmission optical fiber includes a polarization-maintaining single-mode optical fiber array.

[0023] The test device provided in the embodiment of the present application includes an evaluation board, a circuit board, an optical chip, a socket and a power supply, wherein the evaluation board includes a plurality of first solder pads, the circuit board includes a plurality of second solder pads and an indicator light corresponding to at least one second solder pad, the socket includes a plurality of first pins corresponding to the plurality of first solder pads and a plurality of second pins corresponding to the plurality of second solder pads, and the optical chip is mounted on the circuit board; wherein the evaluation board is connected to the power supply for receiving electric energy provided by the power supply, and the first solder pad of the evaluation board is connected to the first pin of the socket for providing electric energy to the socket; the second pin of the socket is connected to the second solder pad of the circuit board for providing electric energy to the circuit board; for any indicator light, when the second solder pad corresponding to the indicator light receives the electric energy transmitted by the connected second pin, the indicator light is illuminated, and when the second solder pad corresponding to the indicator light does not receive the electric energy transmitted by the connected second pin, the indicator light is not illuminated. By setting an indicator light corresponding to at least one second soldering pad on the circuit board, when the second soldering pad receives the electric energy transmitted by the connected second pin, that is, when the second soldering pad is normally connected to the corresponding second pin, the indicator light will illuminate, and when the second soldering pad does not receive the electric energy transmitted by the connected second pin, that is, when the connection between the second soldering pad and the corresponding second pin is abnormal, the indicator light will not illuminate. Before testing the optical chip, it is possible to detect whether the connection between the second soldering pad in the circuit board and the second pin in the socket is abnormal, and then reconnect the two when the connection is abnormal, and test the optical chip again when the connection is normal, and other subsequent operations, thereby avoiding invalid testing and improving test efficiency and test accuracy.

[0024] These and other aspects of the present application will become more clearly understood in the description of the following embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 A top view of an embodiment of a testing device provided by the present application is shown;

[0027] Figure 2 A side view of an embodiment of a testing device provided by the present application is shown. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0029] In some structures described in the specification and claims of this application and the above drawings, multiple structural parts appearing in a specific order are included, and the serial numbers of these structural parts, such as 101, 102, etc., are only used to distinguish different structural parts. It should be noted that the descriptions of "first", "second", etc. in this article are used to distinguish different structural parts, etc., and do not represent the order of precedence, nor do they limit the "first" and "second" to be different types.

[0030] The embodiments of the present application can be applied to the field of integrated optical testing, especially the field of optical chip testing. Optical chips use light waves (electromagnetic waves) as carriers for information transmission or data calculation, and generally rely on dielectric optical waveguides in integrated optics or silicon-based optoelectronics to transmit guided-mode optical signals, integrating the modulation, transmission, and detection of optical and electrical signals on the same chip. They have many advantages such as low transmission loss, wide transmission bandwidth, and strong anti-electromagnetic interference ability, and are widely used in the field of integrated optics.

[0031] After the optical chip is packaged, its performance usually needs to be tested, such as calibration test, matrix operation test, etc. Specifically, the optical chip is mounted on a circuit board, the circuit board is connected to a socket so as to be mounted on an evaluation board, the evaluation board is powered by a power supply, the power is transmitted to the optical chip through the socket and the circuit board, and then the optical chip is tested using an optical signal sent by an optical transmitter.

[0032] During the above test process, there may be abnormal connection between the circuit board and the socket, such as poor contact between the circuit board's pad and the socket's pin, which makes it impossible to smoothly transmit power to the circuit board and the optical chip, that is, it is impossible to supply power to the optical chip. However, in traditional solutions, it is usually after the optical chip test is completed that the above connection and power supply abnormalities are known based on the test results, resulting in invalid testing, affecting test efficiency and test accuracy.

[0033] In order to solve the above technical problems, the inventors thought whether it is possible to timely perceive the abnormal connection before using optical signals to test the optical chip, so as to avoid invalid testing. Based on this, the inventors proposed the technical solution of the present application, and proposed a test device, including an evaluation board, a circuit board, an optical chip, a socket and a power supply; the evaluation board includes a plurality of first pads, the circuit board includes a plurality of second pads and an indicator light corresponding to at least one second pad, the socket includes a plurality of first pins corresponding to the plurality of first pads and a plurality of second pins corresponding to the plurality of second pads; the optical chip is mounted on the circuit board; wherein the evaluation board is connected to the power supply for receiving the electric energy provided by the power supply, and the first pad of the evaluation board is connected to the first pin of the socket for providing the electric energy to the socket; the second pin of the socket is connected to the second pad of the circuit board for providing the electric energy to the circuit board; for any indicator light, when the second pad corresponding to the indicator light receives the electric energy transmitted by the connected second pin, the indicator light is illuminated, and when the second pad corresponding to the indicator light does not receive the electric energy transmitted by the connected second pin, the indicator light is not illuminated.

[0034] The test device provided by the present application sets an indicator light corresponding to at least one second soldering pad on the circuit board. When the second soldering pad receives the electric energy transmitted by the connected second pin, that is, the connection between the second soldering pad and the corresponding second pin is normal, the indicator light illuminates, and when the second soldering pad does not receive the electric energy transmitted by the connected second pin, that is, the connection between the second soldering pad and the corresponding second pin is abnormal, the indicator light does not illuminate. Before testing the optical chip, it is possible to detect whether the connection between the second soldering pad in the circuit board and the second pin in the socket is abnormal, and then reconnect the two when the connection is abnormal, and test the optical chip again when the connection is normal, and other subsequent operations, thereby avoiding invalid testing and improving test efficiency and test accuracy.

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0036] like Figure 1 , which is a top view of an embodiment of a testing device provided by the present application, includes an evaluation board 101, a circuit board 102, an optical chip 103, a socket 104 and a power supply (not shown in the figure).

[0037] The evaluation board 101 includes a plurality of first solder pads (not shown in the figure), the circuit board 102 includes a plurality of second solder pads (not shown in the figure) and an indicator light 1021 corresponding to at least one second solder pad, and the socket 104 includes a plurality of first pins (not shown in the figure) corresponding to the plurality of first solder pads and a plurality of second pins (not shown in the figure) corresponding to the plurality of second solder pads.

[0038] An evaluation board (EVB) is an electronic hardware platform used for prototype development and product evaluation. It integrates a microcontroller or processor minimum system and a variety of peripheral interfaces, such as analog-to-digital converters, displays, etc. It can provide a complete system so that developers can build and test circuits without having to design and make components themselves.

[0039] Printed Circuit Board (PCB) is the support for electronic components and the provider of circuit connections for electronic components. Optical chips can be mounted on the circuit board. Pads are the basic building blocks of surface mount assembly. They are small metallized areas on the board surface and serve as contact points with component pins or other interconnect elements. They can provide stable and reliable connections between evaluation boards, circuit boards, sockets and other components, allowing electronic signals and power to be transmitted and ensuring normal functions.

[0040] A socket is a slot used to mount a circuit board on an evaluation board. A pin is a circuit connection that can be soldered to a pad on the board to form a solder joint, providing a stable and reliable connection between evaluation boards, circuit boards, sockets and other components, allowing electronic signals and power to be transmitted to ensure normal function.

[0041] An indicator light is a device that uses light to monitor the working or position status of circuits and electrical equipment. It can reflect the working status of the circuit (powered or not), the working status of the electrical equipment (running, shut down or testing) and the position status (closed or open), etc.

[0042] Specifically, the evaluation board 101 is connected to a power source to receive power provided by the power source, and the first pad of the evaluation board 101 is correspondingly connected to the first pin of the socket 104 to provide power to the socket 104. For ease of understanding, Figure 2 A side view of one embodiment of a testing device is shown.

[0043] The evaluation board may be provided with a power interface, which may be connected to a power source to receive electrical energy provided by the power source.

[0044] Furthermore, the evaluation board may be provided with a plurality of first pads, and the number and position of the first pads may be set according to the actual application scenario. For example, when the evaluation board is rectangular, first pads may be provided at the upper left corner, the upper right corner, the lower left corner, and the lower right corner, or may be provided at each side. The present application does not limit this. Correspondingly, the socket may be provided with a plurality of first pins, the number of the first pins may be consistent with the first pads, and the position of the first pins may correspond to the first pads, so that the plurality of first pads on the evaluation board may be connected one by one with the plurality of first pins on the socket to provide electrical energy to the socket.

[0045] The second pin of the socket 104 is connected to the second pad of the circuit board 102 to provide electrical energy to the circuit board.

[0046] Among them, a plurality of second pads may be provided on the circuit board, and the number and position of the second pads may also be set according to the actual application scenario. For example, when the circuit board is rectangular, the first pads may be provided at the upper left corner, the upper right corner, the lower left corner and the lower right corner, or the first pads may be provided on each side without limitation. Correspondingly, a plurality of second pins may be provided on the socket, the number of the second pins may be consistent with the second pads, and the positions of the second pins may correspond to the second pads, so that the plurality of second pins on the socket may be connected one by one with the plurality of second pins on the circuit board to provide electrical energy to the circuit board.

[0047] Furthermore, an indicator light corresponding to at least one second pad may be provided on the circuit board, and the number of the indicator lights may be less than or equal to the number of the second pads, and the specific values ​​and positions may be set according to the actual application scenario, for example, the second pads at the upper left corner, upper right corner, lower left corner, and lower right corner of the circuit board may be provided with corresponding indicator lights, respectively, or the second pads at each side position of the circuit board may be provided with corresponding indicator lights, without limitation. The indicator light may be connected to the corresponding second pad to monitor the connection between the second pad and the connected second pin.

[0048] For any indicator light, when the second solder pad corresponding to the indicator light receives power transmitted by the connected second pin, the indicator light illuminates, and when the second solder pad corresponding to the indicator light does not receive power transmitted by the connected second pin, the indicator light does not illuminate.

[0049] Therefore, when the indicator light is on, it may indicate that the corresponding second solder pad has received the electric energy transmitted by the connected second pin, thereby indicating that the connection between the corresponding second solder pad and the second pin is normal. When the indicator light is not on, it may indicate that the corresponding second solder pad has not received the electric energy transmitted by the connected second pin, thereby indicating that the connection between the corresponding second solder pad and the second pin is abnormal.

[0050] Optionally, the indicator light may be a light-emitting diode (LED for short).

[0051] In this embodiment, the test device includes an evaluation board, a circuit board, an optical chip, a socket and a power supply, the evaluation board includes a plurality of first solder pads, the circuit board includes a plurality of second solder pads and an indicator light corresponding to at least one second solder pad, the socket includes a plurality of first pins corresponding to the plurality of first solder pads and a plurality of second pins corresponding to the plurality of second solder pads, and the optical chip is mounted on the circuit board; wherein the evaluation board is connected to the power supply for receiving electric energy provided by the power supply, and the first solder pad of the evaluation board is connected to the first pin of the socket for providing electric energy to the socket; the second pin of the socket is connected to the second solder pad of the circuit board for providing electric energy to the circuit board; for any indicator light, when the second solder pad corresponding to the indicator light receives the electric energy transmitted by the connected second pin, the indicator light is on, and when the second solder pad corresponding to the indicator light does not receive the electric energy transmitted by the connected second pin, the indicator light is off. By setting an indicator light corresponding to at least one second soldering pad on the circuit board, when the second soldering pad receives the electric energy transmitted by the connected second pin, that is, when the second soldering pad is normally connected to the corresponding second pin, the indicator light will illuminate, and when the second soldering pad does not receive the electric energy transmitted by the connected second pin, that is, when the connection between the second soldering pad and the corresponding second pin is abnormal, the indicator light will not illuminate. Before testing the optical chip, it is possible to detect whether the connection between the second soldering pad in the circuit board and the second pin in the socket is abnormal, and then reconnect the two when the connection is abnormal, and test the optical chip again when the connection is normal, and other subsequent operations, thereby avoiding invalid testing and improving test efficiency and test accuracy.

[0052] In actual applications, when it is detected that the indicator light does not light up, that is, the connection between the second solder pad corresponding to the indicator light and the second pin is abnormal, the position of the circuit board can be readjusted. For example, the circuit board can be moved toward the position of the second pin corresponding to the indicator light, and power can be supplied to the evaluation board again to detect the lighting of the indicator light until the indicator lights are all lit, indicating that the connection between the second solder pad and the second pin is normal, that is, the circuit board is connected to the socket normally, and the power transmitted through the socket can be received, the optical chip can be powered, and subsequent operations such as optical chip testing can be performed.

[0053] In some embodiments, the circuit board and the socket are both rectangular in shape, second pads may be provided at the four vertices of the circuit board within the first preset range, and second pins may be provided at positions in the socket corresponding to the second pads within the first preset range.

[0054] Furthermore, the circuit board may include four indicator lights, and the four indicator lights may be connected one by one to four second pads disposed within the first preset range where the four vertices are located.

[0055] Among them, the first preset range where the four vertices in the circuit board are located can refer to the preset range at the upper left corner, upper right corner, lower left corner and lower right corner of the circuit board. The preset range can be set according to actual needs such as the circuit board size, socket size, second pad size, etc., without restriction. Normally, the four second pads within the first preset range where the four vertices are located are powered normally, indicating that the four second pads are in good contact. Since the overall appearance of the pads of the circuit board, the pins of the socket, and the pads of the evaluation board are consistent, when the second pads within the first preset range where the four vertices are located are in good contact, it basically means that the other second pads are also in good contact, and the electrical connection of the test device is good.

[0056] Furthermore, when it is detected that the indicator light does not light up, such as the indicator light corresponding to the second solder pad set at the upper left corner does not light up, the circuit board can be moved to the upper left corner to reconnect the second solder pad set at the upper left corner with the corresponding second pin.

[0057] By setting corresponding indicator lights for the second pads at the upper left corner, upper right corner, lower left corner and lower right corner of the circuit board, when a certain indicator light does not light up, the circuit board can be moved to the position of the indicator light, thereby indicating the direction for the installation of the circuit board.

[0058] In some embodiments, the circuit board and the socket are both rectangular in shape, three rows of second solder pads can be set within the second preset range of the four sides of the circuit board, the second solder pads can be set at preset distances, and second pins can be set at positions in the socket corresponding to the second solder pads within the second preset range.

[0059] Among them, the second preset range and preset distance can be set according to actual needs such as circuit board size, socket size, second pad size, etc., without restriction.

[0060] By arranging three rows of second solder pads within the second preset range on the four sides of the circuit board and arranging corresponding second pins at corresponding positions in the socket, the stability of circuit board installation is improved, thereby improving the stability of power transmission and the accuracy of optical chip testing.

[0061] In practical applications, when all indicator lights on the detection circuit board are lit, the optical chip test can be performed. In some embodiments, the optical chip 103 can be mounted on the circuit board 102 by wire bonding.

[0062] Among them, wire bonding (also known as pressure welding, binding, bonding, wire bonding) refers to the use of metal wires (gold wire, aluminum wire, etc.) using heat pressure or ultrasonic energy to complete the connection of internal interconnections of solid-state circuits in microelectronic devices, that is, the connection between chips and circuits or lead frames.

[0063] At this time, when the circuit board receives electric energy, the metal wire can be used to provide electric energy to the optical chip.

[0064] In some embodiments, the testing device may further include an optical transmitter and a transmission optical fiber.

[0065] The optical transmitter is connected to one end of the transmission optical fiber, and the other end of the transmission optical fiber can be coupled and connected to the optical chip.

[0066] Optionally, the optical transmitter may include a laser, wherein the specific laser wavelength band may be set according to the actual application scenario without limitation.

[0067] Optionally, the transmission optical fiber may include a polarization-maintaining single-mode optical fiber array. A polarization-maintaining single-mode optical fiber array is an optical fiber array (FA) that can maintain a polarization state unchanged. It is an array formed by mounting a bundle of optical fibers or an optical fiber ribbon on a substrate at preset intervals using a V-groove substrate. The array formed by polarization-maintaining optical fibers is called a polarization-maintaining optical fiber array.

[0068] Optionally, the optical chip may include a grating coupler, and the other end of the transmission optical fiber may be coupled to the grating coupler.

[0069] Specifically, the optical signal emitted by the optical transmitter can be transmitted to the optical chip via the transmission optical fiber and the grating coupler. When the optical chip receives electrical energy, the optical chip can be tested using the optical signal, such as calibration test, matrix operation test, etc. The specific optical chip testing process can refer to the testing process in the traditional solution, and this application will not elaborate on this.

[0070] It is clear to those skilled in the art that the device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Those of ordinary skill in the art may understand and implement it without creative labor.

[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A testing device, characterized in that: The device comprises an evaluation board, a circuit board, an optical chip, a socket and a power supply; the evaluation board comprises a plurality of first solder pads, the circuit board comprises a plurality of second solder pads and an indicator light corresponding to at least one second solder pad, the socket comprises a plurality of first pins corresponding to the plurality of first solder pads and a plurality of second pins corresponding to the plurality of second solder pads; the optical chip is mounted on the circuit board; The evaluation board is connected to the power supply to receive the electric energy provided by the power supply, and the first pad of the evaluation board is correspondingly connected to the first pin of the socket to provide the electric energy to the socket; The second pin of the socket is correspondingly connected to the second pad of the circuit board, and is used to provide the electrical energy to the circuit board; For any indicator light, when the second solder pad corresponding to the indicator light receives power transmitted by the connected second pin, the indicator light will illuminate; and when the second solder pad corresponding to the indicator light does not receive power transmitted by the connected second pin, the indicator light will not illuminate.

2. The device according to claim 1, characterized in that The circuit board and the socket are both rectangular in shape, second pads are arranged within a first preset range of the four vertices of the circuit board, and second pins are arranged at positions of the socket corresponding to the second pads within the first preset range; The circuit board includes four indicator lights, and the four indicator lights are connected one by one to four second solder pads arranged within a first preset range where the four vertices are located.

3. The device according to claim 1, characterized in that The circuit board and the socket are both rectangular in shape, three rows of second solder pads are arranged within the second preset range on the four sides of the circuit board, the second solder pads are arranged at preset distances, and second pins are arranged at positions in the socket corresponding to the second solder pads within the second preset range.

4. The device according to claim 1, characterized in that The indicator light comprises a light emitting diode.

5. The device according to claim 1, characterized in that The optical chip is mounted on the circuit board via a wire bonding patch; When the circuit board receives the electric energy, the electric energy is provided to the optical chip by using a metal wire.

6. The device according to claim 5, characterized in that The device also includes an optical transmitter and a transmission optical fiber; The optical transmitter is connected to one end of the transmission optical fiber, and the other end of the transmission optical fiber is coupled to the optical chip; The optical signal emitted by the optical transmitter is transmitted to the optical chip via the transmission optical fiber. When the optical chip receives the electrical energy, the optical signal is used to test the optical chip.

7. The device according to claim 6, characterized in that The optical chip includes a grating coupler, and the other end of the transmission optical fiber is coupled to the grating coupler; The optical signal is transmitted to the optical chip via the transmission optical fiber and the grating coupler.

8. The device according to claim 6, characterized in that The light transmitter includes a laser.

9. The device according to claim 6, characterized in that The transmission optical fiber includes a polarization-maintaining single-mode optical fiber array.

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