Semiconductor laser light beam collimation device

Abstract

The utility model discloses a light beam collimating device of a semiconductor laser. The light beam collimating device comprises a fast axis collimating lens, a slow axis collimating lens, a focusing lens, an industrial camera and a fast axis collimating lens clamping mouth which are arranged in sequence. Wherein the fast-axis collimating lens, the slow-axis collimating lens and the laser chip are on the same straight line, and the slow-axis collimating lens and the fast-axis collimating lens are integrated. The size of the focusing lens is not smaller than 50 mm so that light beam spots of laser chips with different step heights can be focused to one position, and collimation of chip light beams with all step heights can be achieved only by moving the fast axis collimating lens clamping mouth. The light beam collimating device of the semiconductor laser can perform omnibearing compression and collimation on light spots, and can cause obvious change of the light spot form by adjusting a small change of the shaft in the collimation process, thereby facilitating fast axis collimating lens operation, and requiring no extremely sensitive instrument for identification.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor lasers, in particular to a semiconductor laser light beam collimation device. Background Art

[0002] Semiconductor lasers have the advantages of high efficiency, small size, long life, low cost, etc., and their output wavelength range is wide, so they are widely used in production, life, national defense, etc. With the advancement of growth technology, the improvement of packaging capabilities and the reduction of costs, the application fields of semiconductor lasers are constantly expanding, such as medical beauty, industrial welding, cutting, communications, military industry and display fields. However, there is an obvious problem with semiconductor laser chips. The light beams in the fast axis direction and the slow axis direction are asymmetric. There is a 30°~40° divergence angle in the fast axis direction and a 5°~10° divergence angle in the slow axis direction. Under this divergence angle, the semiconductor laser chip cannot be used without being compressed by an optical lens.

[0003] At present, the more commonly used technology is to use a fast-axis collimating lens and a slow-axis collimating lens to compress the fast-axis and slow-axis light spots respectively, so that the light spots reach the minimum state. Among them, during the fast-axis collimation process, since the slow-axis collimation is not performed, the light spot is longer after only the fast-axis collimation. During the collection and adjustment of the light spot information, most instruments cannot recognize all the light spot information, and the light spot change amplitude is small after each axis adjustment. Extremely sensitive instruments are required to effectively identify the light spot change parameters. In addition, when aligning chips with different step heights, it is necessary to locate the position of the collimated light spots of different step heights one by one according to the step difference. Utility Model Content

[0004] The utility model proposes a semiconductor laser beam collimation device, which can compress and collimate the light spot in all directions, and a slight change in the adjustment axis during the collimation process can cause a significant change in the shape of the light spot, which is convenient for fast axis collimation lens operation and does not require extremely sensitive instruments for identification. To achieve the above purpose, the technical solution of the utility model is as follows.

[0005] A semiconductor laser beam collimation device comprises: a fast axis collimation lens, a slow axis collimation lens, a focusing lens, an industrial camera and a fast axis collimation lens nozzle which are arranged in sequence. The fast axis collimation lens, the slow axis collimation lens and the laser chip are in the same straight line, and the slow axis collimation lens and the fast axis collimation lens nozzle are integrated. The size of the focusing lens is not less than 50 mm, so that the beam spots of laser chips with different step heights can be focused to one place, and the collimation of the chip beams of all step heights can be achieved by only moving the fast axis collimation lens nozzle.

[0006] Furthermore, the fast axis collimating lens nozzle is a clip-type structure, and the light spot can pass through the middle position of the clip.

[0007] Furthermore, it also includes a periscope, which is arranged between the slow axis collimating lens and the focusing lens. The periscope is used to adjust the upper and lower positions of the light spot, so as to facilitate matching with laser housings of different heights.

[0008] Compared with the prior art, the utility model has the following beneficial effects:

[0009] (1) The slow axis collimating lens and the fast axis collimating lens of the utility model are integrated into one, so that the degree of compression of the light spot in the slow axis direction can be adjusted by adjusting the distance between the slow axis collimating lens and the fast axis collimating lens or replacing the slow axis collimating lens with different focal lengths, and the actual compression effect of chips with different strip widths can be adjusted. After the light spot is compressed in the slow axis direction, the defective light spot phenomenon can be magnified, and even if a small current is used, a clearer light spot shape can be obtained, which is convenient for adjusting the light spot without the need for extremely sensitive instruments to identify it.

[0010] (2) The utility model adopts a large-volume focusing lens, so that the light spots generated by laser chips with different step heights can be focused to the industrial camera by simply moving the fast-axis collimating lens clamp. In addition, the focusing lens can focus parallel light to the same position. All light spots can be collimated into parallel beams by simply calibrating the camera parameters with a gold sample, greatly improving the directivity of the light spots. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.

[0012] Figure 1 Schematic diagram of the structure of the semiconductor laser beam collimation device in the embodiment.

[0013] Figure 2 1 is a front view of the fast axis collimating lens nozzle in the embodiment.

[0014] Figure 3 A top view of the fast axis collimating lens holder in the embodiment

[0015] Figure 4 FIG. 4 is a schematic structural diagram of another semiconductor laser beam collimation device in an embodiment.

[0016] The marks in the figure represent: 1-fast axis collimating lens, 2-slow axis collimating lens, 3-focusing lens, 4-industrial camera, 5-fast axis collimating lens nozzle, 6-chip, 7-periscope. DETAILED DESCRIPTION

[0017] It should be noted that the following detailed descriptions are all illustrative and are intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used in the present invention have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs.

[0018] For the convenience of description, if the words "up", "down", "left" and "right" appear in the present invention, they only indicate that they are consistent with the up, down, left and right directions of the drawings themselves, and do not limit the structure. They are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or component needs to have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0019] Terminology explanation: The terms "install", "connect", "connect", "fix" and the like in the present invention should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. The semiconductor laser beam collimation device of the present invention is further described in conjunction with the drawings and specific embodiments of the specification.

[0020] refer to Figure 1 , an example of a semiconductor laser beam collimation device is provided, which includes: a fast axis collimating lens (FAC) 1, a slow axis collimating lens 2, a focusing lens 3, an industrial camera 4 (such as the MV-GEF890GM-T-CL camera of Medvision) and a fast axis collimating lens nozzle 5. Among them: the fast axis collimating lens 1, the slow axis collimating lens 2 and the laser chip 6 are in the same straight line, ensuring that the light beam emitted by the chip 6 is compressed by the fast axis collimating lens 1 and the slow axis collimating lens 2, so that the fast axis direction and the slow axis direction of the light spot are compressed, so that the industrial camera 4 can capture a clear light spot.

[0021] The slow axis collimating lens 2 is connected to the fast axis collimating lens nozzle 5. The fast axis collimating lens nozzle 5 is a clip-type structure (such as Figure 2 , Figure 3 As shown in the figure, the laser spot emitted by the laser chip can pass through the middle of the clip after being collimated by FAC, and then pass through the slow axis collimating lens 2; thus, the degree of compression of the spot in the slow axis direction can be adjusted by adjusting the distance between the slow axis collimating lens 2 and the fast axis collimating lens 1 or replacing the slow axis collimating lens 2 with different focal lengths, and the actual compression effect of chips with different strip widths can be adjusted. After the spot is compressed in the slow axis direction, the bad spot phenomenon can be magnified, and even with a small current, a clearer spot shape can be obtained, which is convenient for adjusting the spot without the need for extremely sensitive instruments to identify it.

[0022] The size of the focusing lens 3 is not less than 50 mm. This embodiment uses a large-volume focusing lens 3, so that the light spots generated by laser chips with different step heights (the chip module in the laser is generally composed of several chips arranged in a step shape) can be focused to the industrial camera 4 by simply moving the fast-axis collimating lens clamp 5. In addition, the focusing lens 4 can focus parallel light to the same position. All light spots can be collimated into parallel light beams by simply calibrating the camera parameters through a gold sample, which greatly improves the directivity of the light spot.

[0023] refer to Figure 4 , another semiconductor laser beam collimation device is exemplified, which, compared with the above embodiment, further includes a periscope 7 arranged between the slow axis collimating lens 2 and the focusing lens 3. The periscope 7 can move the light spot compressed by the slow axis collimating lens 2 up to the upper side of the laser housing wall, so as to facilitate the collimation of the beams of lasers with housings of different specifications.

[0024] Finally, it should be noted that any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model should be included in the protection scope of the utility model. Although the above describes the specific implementation of the utility model in conjunction with the drawings, it is not a limitation on the protection scope of the utility model. Those skilled in the art should understand that on the basis of the technical solution of the utility model, various modifications or deformations that can be made by those skilled in the art without creative labor are still within the protection scope of the utility model.

Claims

1. A semiconductor laser beam collimation device, characterized in that: The invention comprises: a fast-axis collimating lens, a slow-axis collimating lens, a focusing lens, an industrial camera and a fast-axis collimating lens nozzle which are arranged in sequence; wherein: the fast-axis collimating lens, the slow-axis collimating lens and the laser chip are in the same straight line, and the slow-axis collimating lens and the fast-axis collimating lens nozzle are integrated; the size of the focusing lens is not less than 50 mm; the fast-axis collimating lens nozzle is a clip-type structure; the slow-axis collimating lens is connected to the fast-axis collimating lens nozzle, and the laser spot emitted by the laser chip is collimated by the fast-axis collimating lens, and then passes through the middle position of the clip of the fast-axis collimating lens nozzle and enters the slow-axis collimating lens; the invention also comprises a periscope which is arranged between the slow-axis collimating lens and the focusing lens.

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