Multi-channel local oscillator source assembly, quantum calculation measurement and control system and quantum computer
By designing multi-channel local oscillator source components in quantum computers, integrating the vibration modules and using temperature monitoring and adjustment modules, the problem of insufficient stability of the local oscillator signal is solved, and a higher stability of the control signal is achieved. Improves the accuracy of the calculation results.
Patent Information
- Application Number
- CN202420818470.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-18
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-04-18
AI Technical Summary
The phase difference stability of the local oscillator signal in quantum computers is insufficient, which affects the accuracy of the control signal.
Design a multi-channel local oscillator source component, which ensures the temperature constant of the local oscillator module by integrating multiple local oscillator modules in the chassis and equipped with temperature monitoring and regulation modules, combining thermal conductivity and heat dissipation components, thereby improving the local oscillator signal. phase difference stability.
It effectively improves the phase difference stability of the local oscillator signal and control signal, and enhances the accuracy of the calculation results of quantum computers.
Smart Images
Figure CN222167540U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of quantum computer technology, and in particular to a multi-channel local oscillator source component, a quantum computing measurement and control system, and a quantum computer. Background Art
[0002] A quantum computer is a physical device that follows the laws of quantum mechanics to perform high-speed mathematical and logical calculations, store and process quantum information; it is mainly composed of a quantum computing measurement and control system, a quantum chip system, a quantum computing environment support system and a quantum computer operating system.
[0003] As the core component of a quantum computer, a quantum chip integrates many qubits. Each qubit performs a variety of quantum computing tasks. Control signals are needed to control and measure qubits. In order to ensure the accuracy of the calculation results, it is necessary to ensure the stability of the phase difference between the control signals used to control and measure different qubits.
[0004] Usually, the control signal is obtained by mixing the local oscillator signal and the intermediate frequency signal. Therefore, the phase difference stability index of the local oscillator signal directly determines the stability of the phase difference of the control signal.
[0005] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Utility Model Content
[0006] The purpose of the present application is to provide a multi-channel local oscillator source component, a quantum computing measurement and control system and a quantum computer, which are used to improve the phase difference stability of the local oscillator signal, thereby improving the stability of the phase difference of the control signal.
[0007] In order to achieve the above objectives, this application provides the following technical solutions:
[0008] The first aspect of the present application provides a multi-channel local oscillator source component, comprising:
[0009] Chassis;
[0010] A plurality of local oscillator modules are arranged in the chassis, each local oscillator module is used to provide at least one local oscillator signal;
[0011] A temperature monitoring module provided on the local oscillator module, for monitoring the temperature of each local oscillator module in real time;
[0012] The temperature regulating module disposed on the local oscillator module is used to regulate the temperature of each local oscillator module to a target temperature according to the monitored temperature.
[0013] The multi-channel local oscillator source assembly as described above further includes a heat-conducting assembly wrapped around the outer walls of the plurality of local oscillator modules, and the temperature monitoring module and the temperature regulating module are arranged in contact with the heat-conducting assembly.
[0014] The multi-channel local oscillator source assembly as described above, further, the heat conduction assembly comprises a first heat conduction plate, a second heat conduction plate and a heat conduction connecting column;
[0015] Wherein, the first heat conducting plate cover is arranged on the upper end surface of multiple local oscillator modules; the second heat conducting plate cover is arranged on the lower end surface of multiple local oscillator modules; a heat conducting connecting column is arranged between the first extension surface of the first heat conducting plate and the second extension surface of the second heat conducting plate; wherein, the first extension surface is the portion of the first heat conducting plate extending beyond the upper end surface; the second extension surface is the portion of the second heat conducting plate extending beyond the lower end surface.
[0016] The multi-channel local oscillator source assembly as described above, further, a heat-insulating shell is provided outside the heat-conducting assembly, and the temperature monitoring module and the temperature regulating module pass through the heat-insulating shell to be attached to the heat-conducting assembly.
[0017] The multi-channel local oscillator source assembly as described above further includes a heat dissipation assembly, and the heat dissipation assembly is used to discharge the heat dissipated by the local oscillator module to the outside of the chassis.
[0018] The multi-channel local oscillator source assembly as described above, further, the heat dissipation assembly comprises a heat sink, a first fan and a second fan;
[0019] The heat sink is arranged on the surface of the local oscillator module, the first fan is arranged on a side of the heat sink away from the local oscillator module, and the second fan is arranged on the chassis and facing the air outlet of the first fan.
[0020] The multi-channel local oscillator source assembly as described above, further, the heat dissipation assembly also includes a guide cover, the guide cover is arranged between the first fan and the second fan, and is used to guide the heat sucked by the first fan to the second fan.
[0021] The multi-channel local oscillator source assembly as described above further includes a power divider arranged outside the chassis, and the power divider is used to divide the power of the received reference clock signal and output it to each of the local oscillator modules.
[0022] A second aspect of the present application provides a quantum computing measurement and control system, comprising the above-mentioned multi-channel local oscillator source component and a signal generation module, wherein the signal generation module outputs a measurement and control signal based on a local oscillator signal provided by the local oscillator source component.
[0023] The third aspect of the present application provides a quantum computer, including the above-mentioned quantum computing measurement and control system and a quantum chip, wherein the quantum chip performs quantum computing tasks according to the measurement and control signals provided by the quantum computing measurement and control system.
[0024] The beneficial effects of this application are:
[0025] The present application integrates multiple local oscillator modules in the chassis by setting up a chassis to protect them from interference from the external environment, thereby improving the phase difference stability of the local oscillator signal; by setting up a temperature monitoring module to monitor the temperature of each of the local oscillator modules in real time, and by setting up a temperature adjustment module to adjust the temperature of each of the local oscillator modules to the target temperature based on the monitored temperature, thereby ensuring the constancy of the temperatures of the multiple local oscillator modules, further improving the phase difference stability of the local oscillator signals output by the multiple local oscillator modules, and thereby improving the stability of the phase difference of the control signal.
[0026] The quantum computing measurement and control system and quantum computer provided in this application both include the above-mentioned multi-channel local oscillator source component, and therefore have the same beneficial effects, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 A schematic diagram of the first structure of a multi-channel local oscillator source component provided in an embodiment of the present application;
[0028] Figure 2 A second structural schematic diagram of a multi-channel local oscillator source component provided in an embodiment of the present application;
[0029] Figure 3 A third structural schematic diagram of a multi-channel local oscillator source assembly provided in an embodiment of the present application, wherein the cover of the chassis is not drawn in the figure;
[0030] Figure 4 It is a structural schematic diagram of the arrangement of the temperature adjustment module in the third structural schematic diagram;
[0031] Figure 5 It is a schematic diagram of the structure of a heat-conducting connecting column when it is in use;
[0032] In the accompanying drawings: 10, local oscillator module; 20, chassis; 30, temperature monitoring module; 40, temperature adjustment module; 50, heat conduction component; 51, first heat conduction plate; 52, second heat conduction plate; 53, heat conduction connecting column; 60, thermal insulation shell; 70, heat sink; 80, first fan; 90, second fan; 100, air guide cover; 120, control module; 130, PCB voltage stabilizing circuit board; 140, power adapter. DETAILED DESCRIPTION
[0033] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and cannot be interpreted as limitations on the present application.
[0034] In the description of the present application, it should be understood that the terms "center", "up", "down", "left", "right", etc., indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present application.
[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0036] Figure 1 A first structural diagram of a multi-channel local oscillator source assembly provided in an embodiment of the present application; Figure 1 As shown, the present application provides a multi-channel local oscillator source component, including: a chassis 20; a plurality of local oscillator modules 10 arranged in the chassis 20, each local oscillator module 10 is used to provide at least one local oscillator signal; a temperature monitoring module 30 arranged on the local oscillator module 10, for real-time monitoring of the temperature of each of the local oscillator modules 10; a temperature adjustment module 40 arranged on the local oscillator module 10, for adjusting the temperature of each of the local oscillator modules 10 to a target temperature based on the monitored temperature.
[0037] In this embodiment, by providing a chassis 20, multiple local oscillator modules 10 are integrated in the chassis 20 to avoid interference from the external environment, thereby improving the phase difference stability of the local oscillator signal; by providing a temperature monitoring module 30 for real-time monitoring of the temperature of each local oscillator module 10, by providing a temperature adjustment module 40 for adjusting the temperature of each local oscillator module 10 to a target temperature based on the monitored temperature, thereby ensuring the constancy of the temperatures of the multiple local oscillator modules 10, further improving the phase difference stability of the local oscillator signals output by the multiple local oscillator modules 10, thereby improving the stability of the phase difference of the control signal.
[0038] In this embodiment, the number of the multiple local oscillator modules 10 is not specifically limited, and may be 2, 3, 4, etc.
[0039] In the present embodiment, the arrangement of the multiple local oscillator modules 10 is not specifically limited. By way of example, the multiple local oscillator modules 10 are arranged in an array along the length direction and / or width direction of the chassis 20, and any two adjacent local oscillator modules 10 are arranged in close contact. This ensures heat conduction between the local oscillator modules 10, makes it easier to achieve the same temperature for the multiple local oscillator modules 10, and improves the phase difference stability of the local oscillator signals output by the multiple local oscillator modules 10. In order to further improve heat conduction between the local oscillator modules 10, a thermally conductive silicone pad is provided at the place where any two adjacent local oscillator modules 10 are in close contact.
[0040] In this embodiment, the number of temperature monitoring modules 30 is not specifically limited, and one local oscillator module 10 can be provided with 1, 2 or 3 temperature monitoring modules 30. The type of temperature monitoring module 30 is also not specifically limited, and illustratively, the temperature monitoring module 30 is a temperature sensor.
[0041] In this embodiment, the number of the temperature regulating modules 40 is not specifically limited, and one local oscillator module 10 can be provided with 1, 2, or 3 temperature regulating modules 40. The type of the temperature regulating module 40 is also not specifically limited, and the temperature regulating module 40 includes a heating unit and / or a cooling unit. Exemplarily, the temperature regulating module 40 is a TEC cooling patch.
[0042] In this embodiment, the shape of the chassis 20 is not specifically limited. Exemplarily, the chassis 20 includes a square box body with an open side and a cover plate disposed on top of the square box body.
[0043] Figure 2 A second structural schematic diagram of a multi-channel local oscillator source assembly provided in an embodiment of the present application; Figure 2 As shown, in some implementations of this embodiment, the multi-channel local oscillator source component further includes a heat-conducting component 50 wrapped around the outer walls of the plurality of local oscillator modules 10, and the temperature monitoring module 30 and the temperature adjustment module 40 are arranged in contact with the heat-conducting component 50. By providing the heat-conducting component 50, heat conduction between the local oscillator module 10 and the temperature monitoring module 30 and the temperature adjustment module 40 is achieved, so as to facilitate measurement and adjustment of the temperature of the local oscillator module 10. Furthermore, in order to improve the thermal conduction performance, a heat-conducting silicone pad is provided at the contact point between the temperature adjustment module 40 and the heat-conducting component 50; and a heat-conducting silicone pad is provided at the contact point between the temperature monitoring module 30 and the heat-conducting component 50.
[0044] In this embodiment, the material of the heat conducting component 50 is not specifically limited. Exemplarily, the material of the heat conducting component 50 is oxygen-free copper.
[0045] In this embodiment, the structure of the heat conducting component 50 is not specifically limited, and two specific examples are given as follows:
[0046] Example 1, the heat conducting assembly 50 includes a first heat conducting plate 51 and a second heat conducting plate 52, wherein the first heat conducting plate 51 is covered on the upper end surfaces of the plurality of local oscillator modules 10; and the second heat conducting plate 52 is covered on the lower end surfaces of the plurality of local oscillator modules 10. In order to further improve the heat conduction between the local oscillator modules 10, a heat conducting silicone pad is provided on the bonding surface between the first heat conducting plate 51 and the local oscillator module 10, and a heat conducting silicone pad is provided on the bonding surface between the second heat conducting plate 52 and the local oscillator module 10.
[0047] Example 2, continue as Figure 2 As shown: the heat-conducting assembly 50 includes a first heat-conducting plate 51, a second heat-conducting plate 52 and a heat-conducting connecting column 53; wherein the first heat-conducting plate 51 is covered on the upper end surfaces of multiple local oscillator modules 10; the second heat-conducting plate 52 is covered on the lower end surfaces of multiple local oscillator modules 10; a heat-conducting connecting column 53 is arranged between the first extension surface of the first heat-conducting plate 51 and the second extension surface of the second heat-conducting plate 52; wherein the first extension surface is the portion of the first heat-conducting plate 51 that exceeds the upper end surface; the second extension surface is the portion of the second heat-conducting plate 52 that exceeds the lower end surface. In this example, the heat-conducting connecting column 53 is arranged between the first extension surface and the second extension surface, which plays a role in further strengthening the uniform heat conduction of the local oscillator module 10, and the arrangement of the heat-conducting connecting column 53 does not affect the connection of the circuits between the local oscillator module 10 and other components.
[0048] In this example, the structure of the heat-conducting connecting column 53 in the heat-conducting component 50 is not specifically limited, and it only needs to play the role of heat conduction and connection between the first extension surface and the second extension surface. In one example, Figure 5 FIG. 5 is a schematic diagram of the structure of a heat-conducting connecting column 53 when it is in use; Figure 5 As shown, the thermally conductive connecting column 53 includes a columnar body and a screw located above it, the upper end surface of the columnar body is downwardly extended with a first threaded hole, the lower section of the columnar body is a threaded section, the first extension surface of the first heat conducting plate 51 is provided with a first mounting hole, the second extension surface of the second heat conducting plate 52 is provided with a second mounting hole, the screw passes through the first mounting hole and is threadedly matched with the first threaded hole to achieve fixation of the thermally conductive connecting column 53 to the first extension surface, the threaded section is threadedly matched with the second mounting hole to achieve fixation of the thermally conductive connecting column 53 to the second extension surface.
[0049] Continue as Figure 2As shown, in some implementations of this embodiment, a heat-insulating shell 60 is provided outside the heat-conducting component 50, and the temperature monitoring module 30 and the temperature regulating module 40 penetrate the heat-insulating shell 60 to be attached to the heat-conducting component 50. By providing the heat-insulating shell 60, it is more conducive to ensuring that the temperatures of multiple local oscillator modules 10 are the same, thereby improving the phase stability of the local oscillator signal.
[0050] In this embodiment, the material of the heat-insulating shell 60 is not specifically limited. Exemplarily, the material of the heat-insulating shell 60 is polytetrafluoroethylene.
[0051] In this embodiment, a through hole is opened on the heat-insulating shell 60 so that the temperature monitoring module 30 and the temperature regulating module 40 pass through the heat-insulating shell 60 to be attached to the heat-conducting component 50 .
[0052] In some implementations of this embodiment, the multi-channel local oscillator source component further includes a heat dissipation component, and the heat dissipation component is used to discharge the heat of the local oscillator module 10 to the outside of the chassis 20.
[0053] In this embodiment, the structure of the heat dissipation assembly is not specifically limited, and three specific examples are given as follows:
[0054] Example 1: Figure 2 As shown: the heat dissipation component includes a first fan 80 and a heat sink 70, wherein the heat sink 70 is directly or indirectly arranged on the surface of the local oscillator module 10, and the first fan 80 is arranged on a side of the heat sink 70 away from the local oscillator module 10. Specifically, the heat sink 70 can be arranged on the temperature adjustment module 40 to achieve an indirect connection with the local oscillator module 10; the first fan 80 is a centrifugal fan, which extracts the heat generated by the local oscillator module 10 and discharges it through the heat dissipation holes arranged on the chassis 20; of course, the heat dissipation component in Example 1 may also only include the first fan 80, and the first fan 80 is directly or indirectly arranged on the surface of the local oscillator module 10.
[0055] Example 2: The heat dissipation assembly includes a second fan 90, and the second fan 90 is disposed in the chassis 20. Specifically, the second fan 90 is a heat dissipation fan.
[0056] Example 3: Figure 3 A third structural schematic diagram of a multi-channel local oscillator source assembly provided in an embodiment of the present application; Figure 4 FIG. 4 is a schematic diagram showing the arrangement of the temperature adjustment module 40 in the third schematic diagram; Figure 3 and Figure 4As shown: the heat dissipation component includes a heat sink 70, a first fan 80 and a second fan 90; wherein the heat sink 70 is directly or indirectly arranged on the surface of the local oscillator module 10, the first fan 80 is arranged on the side of the heat sink 70 away from the local oscillator module 10, and the second fan 90 is arranged on the chassis 20 and is arranged opposite to the air outlet of the first fan 80. Specifically, in this example, eight temperature adjustment modules 40 are arranged on the heat conduction component 50, and the heat sink 70 is arranged on the eight temperature adjustment modules 40 to achieve indirect connection with the local oscillator module 10; the first fan 80 is a centrifugal fan, and the second fan 90 is a heat dissipation fan. In order to further improve the heat dissipation effect, the heat dissipation component also includes a guide cover 100, which is arranged between the first fan 80 and the second fan 90, and is used to guide the heat sucked by the first fan 80 to the second fan 90. In this example, the structure of the air deflector 100 is not specifically limited. In a specific example, the air deflector 100 is a rectangular parallelepiped with openings at both ends, one of the opening ends faces the air outlet of the first fan 80, and the other opening end faces the second fan 90, thereby achieving an air deflection effect.
[0057] Continue as Figure 3 As shown, in some implementations of this embodiment, the multi-channel local oscillator source component further includes a power divider disposed outside the chassis 20, and the power divider is used to divide the received reference clock signal and output it to the multiple local oscillator modules 10. By providing a power divider, a reference clock signal is divided and output to the multiple local oscillator modules 10, so that the reference clock signals received by the multiple local oscillator modules 10 are kept consistent, and the phase difference stability of the local oscillator signals generated by the multiple local oscillator modules 10 is improved.
[0058] Continue as Figure 3 As shown, in some implementations of this embodiment, the control module 120: also includes a control module 120 arranged in the chassis 20, which is used to control the working state of the temperature adjustment module 40 so that the temperature adjustment module 40 adjusts the temperature of the local oscillator module 10 to the target temperature; three examples are given below for detailed explanation.
[0059] Example 1: When the target temperature is 30°C, when the temperature monitored by the temperature monitoring module 30 is 35°C, at this time, the monitored temperature is higher than the target temperature, and the control module 120 controls the working mode of the temperature adjustment module 40 to be adjusted to the cooling mode, and the temperature adjustment module 40 cools down the local oscillator module 10 until the temperature reaches 35°C.
[0060] Example 2: When the target temperature is 30°C, when the temperature monitored by the temperature monitoring module 30 is 25°C, the monitored temperature is lower than the target temperature. The control module 120 controls the working mode of the temperature adjustment module 40 to be adjusted to the heating mode. The temperature adjustment module 40 heats the local oscillator module 10 until the temperature reaches 30°C.
[0061] Example three, when the target temperature is 30°C, when the temperature monitored by the temperature monitoring module 30 is 30°C, at this time, the monitored temperature is equal to the target temperature, and the control module 120 controls the working mode of the temperature adjustment module 40 to be adjusted to a non-working state.
[0062] Continue as Figure 3 As shown, in some implementations of this embodiment, the multi-channel local oscillator source component also includes a PCB voltage stabilizing circuit board 130 disposed in the chassis 20; the PCB voltage stabilizing circuit board 130 is used to stabilize the received external voltage and output it to the multiple local oscillator modules 10. By setting the PCB voltage stabilizing circuit board 130, it can be ensured that the local oscillator module 10 can operate under a stable voltage, thereby providing a high-precision, stable local oscillator signal, and further ensuring the stability of the phase difference. Furthermore, the external voltage is provided by an external power supply, and a power adapter 140 is also electrically connected between the PCB voltage stabilizing circuit board 130 and the external power supply; the power adapter 140 is used to process the external power supply to further ensure the reliability of the voltage.
[0063] In some implementations of the present embodiment, a plurality of signal connectors are arranged in an array on the chassis 20, and any signal connector is connected to any output end of any local oscillator module 10 through a stable phase line. The plurality of stable phase lines are arranged with equal length, which further improves the stability of the phase difference. Furthermore, the outer surface of the first stable phase line is wrapped with an insulation layer.
[0064] Based on the same application concept, the embodiment of the present application also proposes a quantum computing measurement and control system, including any of the multi-channel local oscillator source components described above, and a signal generation module, wherein the signal generation module outputs a measurement and control signal based on the local oscillator signal provided by the local oscillator source component. The quantum measurement and control system of the present application includes the multi-channel local oscillator source component described above, and therefore has the same beneficial effects as the multi-channel local oscillator source component described above, which will not be repeated here.
[0065] Based on the same application concept, an embodiment of the present application also proposes a quantum computer, including the above-mentioned quantum computing measurement and control system and a quantum chip, wherein the quantum chip performs quantum computing tasks according to the measurement and control signals provided by the quantum computing measurement and control system.
[0066] In the description of this specification, the description with reference to the terms "some embodiments" or "examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.
[0067] The above are only preferred embodiments of the present application and do not have any limiting effect on the present application. Any technical personnel in the relevant technical field, without departing from the scope of the technical solution of the present application, may make any form of equivalent replacement or modification to the technical solution and technical content disclosed in the present application, which shall be deemed as the content of the technical solution of the present application and still fall within the protection scope of the present application.
Claims
1. A multi-channel local oscillator source component, It is characterized in that include: Chassis; A plurality of local oscillator modules are arranged in the chassis, each local oscillator module is used to provide at least one local oscillator signal; A temperature monitoring module provided on the local oscillator module, for monitoring the temperature of each local oscillator module in real time; The temperature regulating module disposed on the local oscillator module is used to regulate the temperature of each local oscillator module to a target temperature according to the monitored temperature.
2. The multi-channel local oscillator source assembly according to claim 1, It is characterized in that It also includes a heat-conducting component wrapped around the outer walls of the plurality of local oscillator modules, and the temperature monitoring module and the temperature regulating module are arranged in close contact with the heat-conducting component.
3. The multi-channel local oscillator source assembly according to claim 2, It is characterized in that The heat-conducting assembly includes a first heat-conducting plate, a second heat-conducting plate and a heat-conducting connecting column; Wherein, the first heat conducting plate cover is arranged on the upper end surface of the plurality of local oscillator modules; the second heat conducting plate cover is arranged on the lower end surface of the plurality of local oscillator modules; a heat conducting connecting column is arranged between the first extension surface of the first heat conducting plate and the second extension surface of the second heat conducting plate; wherein, the first extension surface is the portion of the first heat conducting plate extending beyond the upper end surface; the second extension surface is the portion of the second heat conducting plate extending beyond the lower end surface.
4. The multi-channel local oscillator source assembly according to claim 2, It is characterized in that A heat-insulating shell is disposed outside the heat-conducting component, and the temperature monitoring module and the temperature regulating module penetrate through the heat-insulating shell to be attached to the heat-conducting component.
5. The multi-channel local oscillator source assembly according to claim 1, It is characterized in that It also includes a heat dissipation component, which is used to discharge the heat dissipated by the local oscillator module to the outside of the chassis.
6. The multi-channel local oscillator source assembly according to claim 5, It is characterized in that The heat dissipation assembly includes a heat sink, a first fan and a second fan; The heat sink is arranged on the surface of the local oscillator module, the first fan is arranged on a side of the heat sink away from the local oscillator module, and the second fan is arranged on the chassis and facing the air outlet of the first fan.
7. The multi-channel local oscillator source assembly according to claim 6, It is characterized in that The heat dissipation assembly further includes a guide cover, which is disposed between the first fan and the second fan and is used for guiding heat sucked by the first fan to the second fan.
8. The multi-channel local oscillator source assembly according to claim 1, It is characterized in that It also includes a power divider arranged outside the chassis, and the power divider is used to divide the power of the received reference clock signal and output it to each of the local oscillator modules.
9. A quantum computing measurement and control system, It is characterized in that It comprises a multi-channel local oscillator source component as described in any one of claims 1 to 8, and a signal generating module, wherein the signal generating module outputs a measurement and control signal based on a local oscillator signal provided by the local oscillator source component.
10. A quantum computer, It is characterized in that It includes the quantum computing measurement and control system and quantum chip as described in claim 9, and the quantum chip performs quantum computing tasks according to the measurement and control signals provided by the quantum computing measurement and control system.