Full-automatic silicon wafer tidying device with detection function
Patent Information
- Application Number
- CN202323362436.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-11
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2033-12-11
Smart Images
Figure CN222168330U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer detection, in particular to a full-automatic silicon wafer regularization device with a detection function. Background Art
[0002] Photovoltaic solar silicon wafers are the core part of the solar power generation system and the most valuable part of the solar power generation system. The function of photovoltaic solar silicon wafers is to convert solar energy into electrical energy, which is sent to batteries for storage or directly used to drive the load. The quality and cost of photovoltaic solar silicon wafers will directly determine the quality and cost of the entire solar power generation system. At present, before packaging photovoltaic solar silicon wafers, it is usually necessary to align the stacked silicon wafers. The silicon wafer aligning device in the prior art has the risk of falling off due to the large number of silicon wafers aligning at one time, and the friction between the silicon wafers during the flipping process of the silicon wafers will damage the silicon wafers. At the same time, the existing silicon wafer aligning device does not have the function of detecting silicon wafers, which increases the scrap rate in the subsequent packaging process and requires manual screening and inspection, thereby reducing the production efficiency of silicon wafers. In view of the above defects, it is necessary to design a fully automatic silicon wafer aligning device with detection function. Utility Model Content
[0003] The purpose of the utility model is to provide a fully automatic silicon wafer tidying device with a detection function to solve the problems raised in the above background technology.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a fully automatic silicon wafer tidying device with a detection function, comprising a frame, a workbench, a detection mechanism, a tidying mechanism, a conveyor line and a transplanting mechanism, wherein the frame is equipped with a workbench, the workbench is equipped with a detection mechanism, one side of the detection mechanism is provided with a tidying mechanism, the other side of the detection mechanism is provided with a conveyor line, and a transplanting mechanism is provided above the detection mechanism.
[0005] Preferably, the detection mechanism includes a first camera detection unit, a second camera detection unit, a driving assembly and an adjusting assembly, the first camera detection unit and the second camera detection unit both include a camera, the camera is installed at one end of a camera support plate, and a ring light source is installed at the other end of the camera support plate, four first camera detection units and four second camera detection units are provided, the camera support plates of the four first camera detection units are respectively installed on the four corners of the first base plate through the first supporting columns, the four second camera detection units are respectively arranged on the four sides of the first base plate and are connected to the driving assembly, a hollow groove is opened in the middle of the first base plate, a first bearing plate is movably arranged in the hollow groove, and the first bearing plate is installed on the adjusting assembly.
[0006] Preferably, the driving assembly includes a first motor, the output end of the first motor is connected to the driving pulley, the driving pulley is connected to the transmission pulley through a transmission belt, a clamp is installed on the transmission belt, the clamp is connected to the camera support plate of the second camera detection unit, a first slider is installed at the bottom of the camera support plate, the first slider is slidably set on the first slide rail, the adjustment assembly includes a first Z-axis linear module, the first Z-axis linear module is installed on the bottom of the first base plate through a module mounting plate, a support block is installed on the slide table of the first Z-axis linear module, and a second support column is installed on the support block.
[0007] Preferably, the tidying mechanism includes a flipping assembly and a first pushing assembly, the flipping assembly includes a second motor, the second motor is installed on one side of the first support frame, the output end of the second motor is connected to the rotating shaft, connecting seats are installed at both ends of the rotating shaft, a flip plate is installed on the connecting seat, a second bearing plate is installed on the flip plate, pads are installed on the four sides of the second bearing plate, first brackets are installed on both sides of the flip plate, the first bracket is installed on the first bracket, a second slide rail is installed at the bottom of the flip plate, a second slider is slidably arranged on the second slide rail, a T-shaped plate is installed on the second slider, rollers are movably installed at both ends of the T-shaped plate, and one side of the T-shaped plate is connected to the piston rod of the first cylinder.
[0008] Preferably, the first support frame is installed on the second base plate, the second base plate is installed with a second cylinder, a lifting plate is installed on the piston rod of the second cylinder, a limiting column is installed on the lifting plate, a third slide rail is installed at the bottom of the second base plate, a third slider is slidably arranged on the third slide rail, a first movable plate is installed on the third slider, a second bracket is installed at one end of the first movable plate, a second wind knife is installed on the second bracket, and the other end of the first movable plate is connected to the piston rod of the third cylinder.
[0009] Preferably, the first pushing assembly includes a first pushing plate, the first pushing plate is connected to the piston rod of the fourth cylinder, the fourth cylinder is installed at one end of the second movable plate, the second movable plate is installed on the fourth slider, the fourth slider is slidably set on the fourth slide rail, the fourth slide rail is installed on the second support frame, and a third motor is installed at the bottom of the second support frame, the output end of the third motor is connected to the screw rod, the screw rod is movably installed on the screw rod seat, a screw rod nut is sleeved on the screw rod, and the first connecting plate is connected to both sides of the screw rod nut.
[0010] Preferably, the transplanting mechanism includes an X-axis linear module, one end of the X-axis linear module is mounted on the slide of the Y-axis linear module, the other end of the X-axis linear module is mounted on the fifth slider, the fifth slider is slidably set on the fifth slide rail, the slide of the X-axis linear module is connected to the slide of the second Z-axis linear module, a mounting frame is installed at the bottom of the second Z-axis linear module, second pushing assemblies are installed at both ends of the mounting frame, and a clamping assembly is installed at the bottom of the mounting frame.
[0011] Preferably, the second pushing assembly includes a first slide cylinder, the first slide cylinder is installed on one end of the second connecting plate, the other end of the second connecting plate is installed on one end of the mounting frame, the second slide cylinder is installed on the slide seat of the first slide cylinder, and the second push plate is installed on the slide seat of the second slide cylinder.
[0012] Preferably, the clamping assembly includes a connecting frame, a fifth cylinder is installed at the bottom of the connecting frame, the piston rod of the fifth cylinder is connected to the middle part of the push plate, sliding sleeves are installed at both ends of the push plate, the sliding sleeves are arranged on the guide rod, the bottom of the guide rod is connected to a pressure plate, and a spring is connected between the pressure plate and the push plate.
[0013] Preferably, a sixth cylinder is installed on the top of the connecting frame, the piston rod of the sixth cylinder is connected to the third connecting plate, the third connecting plate is hinged with connecting rods on all four sides, one end of the connecting rod is hinged to the hinge seat, the hinge seat is installed on the connecting block, a clamping claw is installed at the bottom of the connecting block, a rubber pad is installed on the clamping claw, a sixth slider is installed at the bottom of the connecting block, and the sixth slider is slidably set on the sixth slide rail.
[0014] Compared with the prior art, the fully automatic silicon wafer tidying device with detection function of the utility model has the following beneficial effects:
[0015] 1. The utility model drives the active pulley to rotate through the operation of the first motor, and the active pulley drives the transmission belt to move, and the clamp block and the camera support plate also move, thereby driving the camera to move, so that the camera can move back and forth to detect cracks around the silicon wafer, thereby realizing all-round detection of the silicon wafer and improving the comprehensiveness and accuracy of the detection results.
[0016] 2. The utility model drives the rotating shaft to rotate through the operation of the second motor, and the connecting seat and the flip plate also rotate, thereby driving the second supporting plate to flip. When the second supporting plate flips, the first cylinder drives the T-shaped plate to move, and the T-shaped plate drives the roller to move. The roller pushes the multiple stacked silicon wafers on the second supporting plate to align the multiple stacked silicon wafers so that the edges of the silicon wafers are aligned, which is convenient for subsequent detection of the silicon wafers.
[0017] 3. The utility model uses the air flow generated by the air source to blow out from the first air knife and the second air knife to blow air to the silicon wafers stacked on the second supporting plate, so that an air layer is formed between the silicon wafers to reduce the friction between the multiple silicon wafers and reduce the waste rate of silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0019] Figure 1 It is a structural schematic diagram of the utility model;
[0020] Figure 2 It is a schematic diagram of the structure of the detection mechanism in the utility model;
[0021] Figure 3 This is a schematic diagram of the structure of the driving component in the utility model;
[0022] Figure 4 This is a schematic diagram of the structure of the flip assembly in the utility model;
[0023] Figure 5 It is a three-dimensional diagram of the regular mechanism in the utility model;
[0024] Figure 6 It is a side view of the regularization mechanism in the utility model;
[0025] Figure 7 It is a schematic diagram of the structure of the transplanting mechanism in the utility model;
[0026] Figure 8 It is a stereoscopic diagram of the second pusher assembly and the clamping assembly in the utility model;
[0027] Fig. 9 It is a schematic diagram of the structure of the clamping assembly in the utility model.
[0028] In the attached figure:
[0029] 1. Frame; 2. Workbench; 3. Detection mechanism; 4. Structuring mechanism; 5. Conveyor line; 6. Transplantation mechanism; 7. First camera detection unit; 8. Second camera detection unit; 9. Driving assembly; 10. Adjustment assembly; 11. First support column; 12. First bottom plate; 13. First bearing plate; 14. Camera; 15. Camera support plate; 16. Ring light source; 17. First motor; 18. Active pulley; 19. Transmission belt; 20. Transmission pulley; 21. Clamp; 22. First slider; 23. First slide rail; 24. First Z-axis linear module; 2 5. Module mounting plate; 26. Support block; 27. Second support column; 28. Turnover assembly; 29. First pusher assembly; 30. Second motor; 31. First support frame; 32. Rotating shaft; 33. Bearing seat; 34. Connecting seat; 35. Turnover plate; 36. Limiting plate; 37. Second bearing plate; 38. Pad; 39. First bracket; 40. First air knife; 41. Second slide rail; 42. Second slider; 43. T-shaped plate; 44. Roller; 45. First cylinder; 46. Limiting column; 47. Second bottom plate; 48. Second cylinder; 49. Lifting plate; 50. Limiting column; 51. Third slide rail; 52. Third slider; 53. First moving plate; 54. Second bracket; 55. Second air knife; 56. Third cylinder; 57. First push plate; 58. Fourth cylinder; 59. Second moving plate; 60. Fourth slider; 61. Fourth slide rail; 62. Second support frame; 63. Third motor; 64. Screw; 65. Screw seat; 66. Screw nut; 67. First connecting plate; 68. X-axis linear module; 69. Y-axis linear module; 70. Gantry; 71. Fifth slider; 72. Fifth slide rail; 73 , gantry; 74, Z-axis linear module; 75, mounting frame; 76, second pusher assembly; 77, clamping assembly; 78, first slide cylinder; 79, second connecting plate; 80, second slide cylinder; 81, second pusher plate; 82, connecting frame; 83, fifth cylinder; 84, pusher plate; 85, sleeve; 86, guide rod; 87, pressure plate; 88, spring; 89, sixth cylinder; 90, third connecting plate; 91, connecting rod; 92, hinged seat; 93, connecting block; 94, clamping claw; 95, rubber pad; 96, sixth slider; 97, sixth slide rail. DETAILED DESCRIPTION
[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0031] See also Figure 1-9As shown, the utility model provides a technical solution: a fully automatic silicon wafer tidying device with a detection function, comprising a frame 1, a workbench 2, a detection mechanism 3, a tidying mechanism 4, a conveyor line 5 and a transplanting mechanism 6, wherein the frame 1 is provided with a workbench 2, the workbench 2 is provided with a detection mechanism 3, the detection mechanism 3 is used to detect whether there are cracks around the silicon wafer, one side of the detection mechanism 3 is provided with a tidying mechanism 4, the tidying mechanism 4 is used to align the stacked silicon wafers, the other side of the detection mechanism 3 is provided with a conveyor line 5, the conveyor line 5 is used to unload and transport the silicon wafers with cracks, and the upper part of the detection mechanism 3 is provided with a transplanting mechanism 6, the transplanting mechanism 6 is used to transplant the silicon wafers to the detection mechanism 3, the tidying mechanism 4 and the conveyor line 5.
[0032] The detection mechanism 3 in this embodiment includes a first camera detection unit 7, a second camera detection unit 8, a driving component 9 and an adjusting component 10. The first camera detection unit 7 and the second camera detection unit 8 both include a camera 14. The camera 14 is installed at one end of a camera support plate 15. A ring light source 16 is installed at the other end of the camera support plate 15. There are four first camera detection units 7 and four second camera detection units 8. The camera support plates 15 of the four first camera detection units 7 are respectively installed on the four corners of the first base plate 12 through the first support columns 11. The four second camera detection units 8 are respectively arranged on the four sides of the first base plate 12 and are connected to the driving component 9. The driving component 9 is used to drive the second camera detection unit 8 to move back and forth. A hollow groove is opened in the middle of the first base plate 12. A first bearing plate 13 is movably arranged in the hollow groove. The first bearing plate 13 is installed on the adjusting component 10.
[0033] The driving assembly 9 in this embodiment includes a first motor 17, which is installed at the bottom of the first base plate 12. The output end of the first motor 17 is connected to the driving pulley 18, which is connected to the driving pulley 20 through the transmission belt 19. The transmission belt 19 is provided with a clamping block 21, which is connected to the camera support plate 15 of the second camera detection unit 8. The bottom of the camera support plate 15 is provided with a first slider 22, which is slidably arranged on a first slide rail 23, which is installed on the first base plate 12. The driving pulley 18 is driven to rotate by the operation of the first motor 17, and the driving pulley 18 drives the transmission belt 19 to move, and the clamping block 21 and the camera support plate 15 also move, thereby driving the camera 14 to move, so that the camera 14 can move back and forth to detect cracks around the silicon wafer, thereby achieving all-round detection around the silicon wafer and improving the comprehensiveness and accuracy of the detection results.
[0034] The adjustment assembly 10 in this embodiment includes a first Z-axis linear module 24, which is mounted on the bottom of the first base plate 12 through a module mounting plate 25, and a support block 26 is mounted on the slide of the first Z-axis linear module 24, on which a second support column 27 is mounted, and on which a first carrier plate 13 is mounted. The support block 26 is driven up and down by the first Z-axis linear module 24, and the second support column 27 and the first carrier plate 13 also move accordingly, so that the position of the silicon wafer on the first carrier plate 13 can be adjusted.
[0035] The tidying mechanism 4 in this embodiment includes a flip assembly 28 and a first pushing assembly 29, the first pushing assembly 29 is located on one side of the flip assembly 28, the flip assembly 28 includes a second motor 30, the second motor 30 is installed on one side of the first support frame 31, the output end of the second motor 30 is connected to the rotating shaft 32, the rotating shaft 32 is installed on the first support frame 31 through a bearing seat 33, connecting seats 34 are installed at both ends of the rotating shaft 32, a flip plate 35 is installed on the connecting seat 34, and limit plates 36 are installed on the four corners of the flip plate 35, and the limit plates 36 are L shaped structure, a second bearing plate 37 is installed on the flip plate 35, pads 38 are installed on the four sides of the second bearing plate 37, first brackets 39 are installed on both sides of the flip plate 35, a first wind knife 40 is installed on the first bracket 39, a second slide rail 41 is installed at the bottom of the flip plate 35, a second slider 42 is slidably arranged on the second slide rail 41, a T-shaped plate 43 is installed on the second slider 42, rollers 44 are movably installed at both ends of the T-shaped plate 43, one side of the T-shaped plate 43 is connected to the piston rod of the first cylinder 45, and the first cylinder 45 is installed at the bottom of the flip plate 35.
[0036] A limiting column 46 is installed on the first support frame 31 in this embodiment, the first support frame 31 is installed on the second base plate 47, a second cylinder 48 is installed on the second base plate 47, a lifting plate 49 is installed on the piston rod of the second cylinder 48, a limiting column 50 is installed on the lifting plate 49, a third slide rail 51 is installed at the bottom of the second base plate 47, a third slider 52 is slidably arranged on the third slide rail 51, a first movable plate 53 is installed on the third slider 52, a second bracket 54 is installed at one end of the first movable plate 53, a second wind knife 55 is installed on the second bracket 54, the other end of the first movable plate 53 is connected to the piston rod of the third cylinder 56, the third cylinder 56 is installed at the bottom of the second base plate 47, and the first wind knife 40 and the second wind knife 55 are connected to the air source through air pipes respectively.
[0037] The first pushing assembly 29 in this embodiment includes a first pushing plate 57, which is connected to the piston rod of the fourth cylinder 58, and the fourth cylinder 58 is installed at one end of the second movable plate 59. The second movable plate 59 is installed on the fourth slider 60, and the fourth slider 60 is slidably set on the fourth slide rail 61. The fourth slide rail 61 is installed on the second support frame 62, and a third motor 63 is installed at the bottom of the second support frame 62. The output end of the third motor 63 is connected to the screw rod 64, and the screw rod 64 is movably installed on the screw rod seat 65. A screw rod nut 66 is sleeved on the screw rod 64, and the first connecting plate 67 is connected to both sides of the screw rod nut 66. The first connecting plate 67 is connected to the second movable plate 59.
[0038] The transplanting mechanism 6 in this embodiment includes an X-axis linear module 68, one end of the X-axis linear module 68 is mounted on the slide of the Y-axis linear module 69, the Y-axis linear module 69 is mounted on the gantry 70, the other end of the X-axis linear module 68 is mounted on the fifth slider 71, the fifth slider 71 is slidably set on the fifth slide rail 72, the fifth slide rail 72 is mounted on the gantry 73, the slide of the X-axis linear module 68 is connected to the slide of the second Z-axis linear module 74, the bottom of the second Z-axis linear module 74 is installed with a mounting frame 75, both ends of the mounting frame 75 are installed with second pushing assemblies 76, and the bottom of the mounting frame 75 is installed with a clamping assembly 77.
[0039] The second pushing assembly 76 in this embodiment includes a first sliding cylinder 78, which is installed at one end of a second connecting plate 79, and the other end of the second connecting plate 79 is installed at one end of a mounting frame 75. A second sliding cylinder 80 is installed on the sliding seat of the first sliding cylinder 78, and a second pushing plate 81 is installed on the sliding seat of the second sliding cylinder 80. The second pushing plate 81 is an L-shaped structure.
[0040] The clamping assembly 77 in this embodiment includes a connecting frame 82, which is a cross-shaped structure. A fifth cylinder 83 is installed at the bottom of the connecting frame 82. The piston rod of the fifth cylinder 83 is connected to the middle of the push plate 84. Slide sleeves 85 are installed at both ends of the push plate 84. The slide sleeves 85 are sleeved on the guide rod 86. A pressure plate 87 is connected to the bottom of the guide rod 86. A spring 88 is connected between the pressure plate 87 and the push plate 84. The fifth cylinder 83 pushes the push plate 84 to move, and the push plate 84 drives the pressure plate 87 to move. The pressure plate 87 presses the silicon wafer to improve the stability of the silicon wafer clamping.
[0041] A sixth cylinder 89 is installed on the top of the connecting frame 82 in this embodiment, and the piston rod of the sixth cylinder 89 is connected to the third connecting plate 90. The third connecting plate 90 is a cross-shaped structure. Connecting rods 91 are hinged on all four sides of the third connecting plate 90. One end of the connecting rod 91 is hinged to a hinge seat 92. The hinge seat 92 is installed on a connecting block 93. A clamping jaw 94 is installed at the bottom of the connecting block 93. A rubber pad 95 is installed on the clamping jaw 94. A sixth slider 96 is installed at the bottom of the connecting block 93. The sixth slider 96 is slidably set on a sixth slide rail 97. The sixth slide rail 97 is installed on the connecting frame 82. The connecting frame 82 is installed at the bottom of the mounting frame 75.
[0042] The working principle of the utility model is as follows: the second pusher assembly 76 and the clamping assembly 77 are driven to move along the XY axis direction through the operation of the X-axis linear module 68 and the Y-axis linear module 69, thereby driving the second pusher assembly 76 and the clamping assembly 77 to move above a stack of silicon wafers, and the second Z-axis linear module 74 is driven to move the second pusher assembly 76 and the clamping assembly 77 onto the silicon wafers, the first slide cylinder 78 is actuated to push the second slide cylinder 80 to move downward, the second slide cylinder 80 is actuated to push the second pusher plate 81 to move, the pusher plate 81 pushes the stack of silicon wafers to move, so that the two edges of the stack of silicon wafers can be fully aligned, the sixth cylinder 89 is actuated to drive the connecting rod 91 to move, the connecting rod 91 pulls the connecting block 93 to move, so that The clamping claw 94 moves to clamp the silicon wafer. After the clamping is completed, the X-axis linear module 68, the Y-axis linear module 69 and the second Z-axis linear module 74 work to drive the clamping assembly 77 and the silicon wafer to move to the regularization mechanism 4. The sixth cylinder 89 drives the clamping claw 94 to loosen the silicon wafer, and the silicon wafer falls onto the second carrier plate 37. The second carrier plate 37 is initially in a horizontal state. The second motor 30 drives the rotating shaft 32 to rotate, and the connecting seat 34 and the flip plate 35 also rotate, thereby driving the second carrier plate 37 to flip. When the second carrier plate 37 flips, the first cylinder 45 drives the T-shaped plate 43 to move, and the T-shaped plate 43 drives the roller 44 to move. The roller 44 pushes the multiple stacked silicon wafers on the second carrier plate 37, and the multiple stacked The silicon wafers are aligned. When the second supporting plate 37 is flipped, the airflow generated by the air source is blown out from the first wind knife 40 and the second wind knife 55 to the silicon wafers stacked on the second supporting plate 37, so that an air layer is formed between the silicon wafers to reduce the friction between the multiple silicon wafers and reduce the waste rate of the silicon wafers. The third motor 63 drives the screw rod 64 to rotate, and the screw rod 64 drives the screw nut 66 to move. The second moving plate 59, the fourth cylinder 58 and the first pushing plate 57 also move. The fourth cylinder 58 drives the first pushing plate 57 to move to one side of the silicon wafer. The first pushing plate 57 pushes the silicon wafer and blocks the silicon wafer to prevent the silicon wafer from falling during the regular alignment process. After the alignment is completed, the second motor 30 drives the flip plate 35 and the second carrier plate 37 are flipped over to reset, and the silicon wafer on the second carrier plate 37 is clamped to the detection mechanism 3 through the cooperation of the X-axis linear module 68, the Y-axis linear module 69, the second Z-axis linear module 74 and the clamping assembly 77. Multiple cameras 14 work to take pictures and detect the silicon wafer. The first motor 17 drives the active pulley 18 to rotate, and the active pulley 18 drives the transmission belt 19 to move. The clamping block 21 and the camera support plate 15 also move, thereby driving the camera 14 to move, so that the camera 14 can move back and forth to detect cracks around the silicon wafer, realizing all-round detection of the silicon wafer around, improving the comprehensiveness and accuracy of the detection results, and after the detection is completed, the silicon wafer is clamped and unloaded through the transplanting mechanism 6. When the detection is qualified,The transfer mechanism 6 clamps the silicon wafer and transports it to the next process. If the test fails, the transfer mechanism 6 clamps the silicon wafer to the conveyor line 5, and the conveyor line 5 transports the silicon wafer for unloading and recycling.
[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A fully automatic silicon wafer aligning device with detection function, characterized in that: The invention comprises a frame (1), a workbench (2), a detection mechanism (3), a tidying mechanism (4), a conveying line (5) and a transplanting mechanism (6); the frame (1) is provided with a workbench (2); the workbench (2) is provided with a detection mechanism (3); one side of the detection mechanism (3) is provided with a tidying mechanism (4); the other side of the detection mechanism (3) is provided with a conveying line (5); and the transplanting mechanism (6) is provided above the detection mechanism (3).
2. The fully automatic silicon wafer aligning device with detection function according to claim 1, characterized in that: The detection mechanism (3) comprises a first camera detection unit (7), a second camera detection unit (8), a driving assembly (9) and an adjusting assembly (10); the first camera detection unit (7) and the second camera detection unit (8) both comprise a camera (14); the camera (14) is mounted on one end of a camera support plate (15); a ring light source (16) is mounted on the other end of the camera support plate (15); four first camera detection units (7) and four second camera detection units (8) are each provided; the camera support plates (15) of the four first camera detection units (7) are respectively mounted on the four corners of the first base plate (12) through first supporting columns (11); the four second camera detection units (8) are respectively arranged on the four sides of the first base plate (12) and are connected to the driving assembly (9); a hollow groove is provided in the middle of the first base plate (12); a first bearing plate (13) is movably arranged in the hollow groove; the first bearing plate (13) is mounted on the adjusting assembly (10).
3. The fully automatic silicon wafer aligning device with detection function according to claim 2, characterized in that: The driving assembly (9) comprises a first motor (17), the output end of the first motor (17) is connected to a driving pulley (18), the driving pulley (18) is connected to a driving pulley (20) through a transmission belt (19), a clamping block (21) is installed on the transmission belt (19), the clamping block (21) is connected to a camera support plate (15) of a second camera detection unit (8), a first slider (22) is installed at the bottom of the camera support plate (15), the first slider (22) is slidably arranged on a first slide rail (23), the adjusting assembly (10) comprises a first Z-axis linear module (24), the first Z-axis linear module (24) is installed at the bottom of the first base plate (12) through a module mounting plate (25), a support block (26) is installed on the slide table of the first Z-axis linear module (24), and a second support column (27) is installed on the support block (26).
4. The fully automatic silicon wafer tidying device with detection function according to claim 1, characterized in that: The tidying mechanism (4) comprises a flipping assembly (28) and a first pushing assembly (29), wherein the flipping assembly (28) comprises a second motor (30), wherein the second motor (30) is mounted on one side of the first support frame (31), wherein the output end of the second motor (30) is connected to a rotating shaft (32), wherein connecting seats (34) are mounted at both ends of the rotating shaft (32), wherein a flipping plate (35) is mounted on the connecting seat (34), wherein a second bearing plate (37) is mounted on the flipping plate (35), wherein the second bearing plate (37) has four A pad (38) is installed on the edge, first brackets (39) are installed on both sides of the flip plate (35), a first wind knife (40) is installed on the first bracket (39), a second slide rail (41) is installed at the bottom of the flip plate (35), a second slider (42) is slidably arranged on the second slide rail (41), a T-shaped plate (43) is installed on the second slider (42), rollers (44) are movably installed at both ends of the T-shaped plate (43), and one side of the T-shaped plate (43) is connected to the piston rod of the first cylinder (45).
5. The fully automatic silicon wafer tidying device with detection function according to claim 4, characterized in that: The first support frame (31) is mounted on a second base plate (47), a second cylinder (48) is mounted on the second base plate (47), a lifting plate (49) is mounted on the piston rod of the second cylinder (48), a limiting column (50) is mounted on the lifting plate (49), a third slide rail (51) is mounted at the bottom of the second base plate (47), a third slider (52) is slidably arranged on the third slide rail (51), a first movable plate (53) is mounted on the third slider (52), a second bracket (54) is mounted on one end of the first movable plate (53), a second wind knife (55) is mounted on the second bracket (54), and the other end of the first movable plate (53) is connected to the piston rod of the third cylinder (56).
6. The fully automatic silicon wafer aligning device with detection function according to claim 4, characterized in that: The first pusher assembly (29) comprises a first pusher plate (57), the first pusher plate (57) is connected to the piston rod of the fourth cylinder (58), the fourth cylinder (58) is mounted on one end of the second movable plate (59), the second movable plate (59) is mounted on the fourth slider (60), the fourth slider (60) is slidably arranged on the fourth slide rail (61), the fourth slide rail (61) is mounted on the second support frame (62), a third motor (63) is installed at the bottom of the second support frame (62), the output end of the third motor (63) is connected to the screw rod (64), the screw rod (64) is movably mounted on the screw rod seat (65), a screw rod nut (66) is sleeved on the screw rod (64), and the first connecting plate (67) is connected to both sides of the screw rod nut (66).
7. The fully automatic silicon wafer aligning device with detection function according to claim 1, characterized in that: The transplanting mechanism (6) comprises an X-axis linear module (68), one end of the X-axis linear module (68) is mounted on a slide of a Y-axis linear module (69), the other end of the X-axis linear module (68) is mounted on a fifth slider (71), the fifth slider (71) is slidably arranged on a fifth slide rail (72), the slide of the X-axis linear module (68) is connected to the slide of a second Z-axis linear module (74), a mounting frame (75) is mounted at the bottom of the second Z-axis linear module (74), second pusher assemblies (76) are mounted at both ends of the mounting frame (75), and a clamping assembly (77) is mounted at the bottom of the mounting frame (75).
8. The fully automatic silicon wafer aligning device with detection function according to claim 7, characterized in that: The second pusher assembly (76) includes a first slide cylinder (78), the first slide cylinder (78) is mounted on one end of a second connecting plate (79), the other end of the second connecting plate (79) is mounted on one end of a mounting frame (75), a second slide cylinder (80) is mounted on the slide seat of the first slide cylinder (78), and a second pusher plate (81) is mounted on the slide seat of the second slide cylinder (80).
9. The fully automatic silicon wafer aligning device with detection function according to claim 7, characterized in that: The clamping assembly (77) includes a connecting frame (82), a fifth cylinder (83) is installed at the bottom of the connecting frame (82), a piston rod of the fifth cylinder (83) is connected to the middle of a push plate (84), sliding sleeves (85) are installed at both ends of the push plate (84), the sliding sleeves (85) are sleeved on a guide rod (86), a pressure plate (87) is connected to the bottom of the guide rod (86), and a spring (88) is connected between the pressure plate (87) and the push plate (84).
10. The fully automatic silicon wafer aligning device with detection function according to claim 9, characterized in that: A sixth cylinder (89) is installed on the top of the connecting frame (82), and the piston rod of the sixth cylinder (89) is connected to the third connecting plate (90). The third connecting plate (90) is hinged with connecting rods (91) on all four sides, and one end of the connecting rod (91) is hinged to a hinge seat (92). The hinge seat (92) is installed on a connecting block (93). A clamping claw (94) is installed at the bottom of the connecting block (93), and a rubber pad (95) is installed on the clamping claw (94). A sixth sliding block (96) is installed at the bottom of the connecting block (93), and the sixth sliding block (96) is slidably set on a sixth sliding rail (97).