Lead frame for packaging semiconductor chip

Abstract

The utility model relates to the technical field of lead frames, and discloses a lead frame for packaging a semiconductor chip, which comprises an outer frame and a plurality of lead frames, the plurality of lead frames are uniformly distributed in the outer frame in a rectangular array manner, each lead frame comprises a chip board and pins, the pins are arranged outside the chip board, and the chip board is arranged on the outer side of the lead frame. The pins are fixedly connected with the outer frame; the square grooves are formed in the left side and the right side of the interior of the outer frame, plastic strips are installed in the square grooves, silica gel gaskets are arranged at the positions, located at the rear end of the outer frame, of the exteriors of the plastic strips and fixedly connected with the plastic strips, grooves are formed in the rear ends of the plastic strips, and protruding strips are arranged at the front ends of the exteriors of the plastic strips and matched with the grooves. According to the utility model, the frame supporting structure is added, so that the whole plate of the pin frame is stacked more stably.

Description

Technical Field

[0001] The utility model relates to the technical field of lead frames, in particular to a lead frame for semiconductor chip packaging. Background Art

[0002] Semiconductor chips are semiconductor devices that can achieve certain functions after etching, wiring and other processes on semiconductor sheets. The lead frame for semiconductor chip packaging is the basic material for semiconductor packaging and is also the chip carrier of integrated circuits. It mainly consists of two parts: chip pads and pins. The chip pads provide mechanical support for the chip during the packaging process, while the pins serve as an electrical path connecting the chip to the outside of the package. Each end of the pin is connected to a pad on the chip through a lead wire, which is an inner pin, and the other end provides mechanical and electrical connection with the substrate or PC board, which is a pin.

[0003] The lead frame is a whole board structure after production. Multiple lead frames are connected to form a large whole board. During subsequent processing, they are automatically cut to the required size for use in semiconductor chip packaging. However, when multiple whole board lead frames are stored, due to their smooth surface and hollow structure, the friction between them is small when stacked, resulting in unstable stacking and easy collapse. Therefore, a lead frame for semiconductor chip packaging is proposed. Utility Model Content

[0004] 1. Technical issues to be solved

[0005] In view of the deficiencies of the prior art, the utility model provides a lead frame for semiconductor chip packaging to solve the problem of unstable stacking of the lead frame whole board proposed in the above background technology.

[0006] (II) Technical solution

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a lead frame for semiconductor chip packaging, comprising:

[0008] An outer frame and a plurality of lead frames, wherein the plurality of lead frames are evenly distributed inside the outer frame in a rectangular array, the lead frame comprises a chip board and pins, and the pins are arranged outside the chip board, and the pins are fixedly connected to the outer frame;

[0009] A square groove is arranged on the left and right sides of the outer frame, a plastic strip is installed inside the square groove, a silicone gasket is arranged outside the plastic strip at the rear end of the outer frame, and the silicone gasket is fixedly connected to the plastic strip, a groove is arranged at the rear end of the plastic strip, a convex strip is arranged at the front end of the outside of the plastic strip, and the convex strip is adapted to the groove.

[0010] Preferably, an inner frame is arranged inside the outer frame, and the inner frame is fixedly connected to the outer frame.

[0011] Preferably, an insertion rod is provided at the front end of the outer portion of the inner frame, and the insertion rod is fixedly connected to the inner frame, and the insertion rod is used to be combined with the insertion tube.

[0012] Preferably, a plug is provided at the rear end of the outer portion of the inner frame, and the plug is fixedly connected to the inner frame, the plug is matched with the plug rod, and the plug is combined with the plug rod for limiting.

[0013] Preferably, support columns are provided on both the front and rear sides of the outer corners of the outer frame, and the support columns are fixedly connected to the outer frame, and the support columns serve to support the edges of the outer frame.

[0014] Preferably, a triangular support plate is provided on one side of the upper end of the pin close to the chip board, and the triangular support plate is fixedly connected to the pin and the chip board, and the triangular support plate serves to improve the firmness of the pin.

[0015] (III) Beneficial effects

[0016] Compared with the prior art, the utility model provides a lead frame for semiconductor chip packaging, which has the following beneficial effects:

[0017] The utility model inserts a plastic strip into the square groove from bottom to top, supports the outside of the square groove, installs the plastic strip inside the square groove of each outer frame, and then stacks the outer frames, plugs the grooves of the plastic strips inside the upper and lower outer frames into the convex strips, thereby connecting the upper and lower plastic strips, making the stacking of the outer frames stable, and at the same time the silicone gasket plays a role in protecting the edges of the square grooves of the outer frames, thereby solving the problems raised in the background technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is the overall structural front view of the utility model;

[0019] Figure 2 This is a rear view of the overall structure of the utility model;

[0020] Figure 3 This is a front view of the overall structure of the outer frame of the utility model;

[0021] Figure 4 For the utility model Figure 3 A partial enlarged view of the middle A area;

[0022] Figure 5 It is a three-dimensional diagram of the plastic strip structure of the utility model.

[0023] In the figure: 1. outer frame; 2. square groove; 3. pin; 4. triangular support plate; 5. inner frame; 6. chip board; 7. support column; 8. insert tube; 9. insert rod; 10. plastic strip; 11. convex strip; 12. silicone gasket; 13. groove. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] The utility model provides a technical solution, a lead frame for semiconductor chip packaging, please refer to Figure 1 , Figure 2 and Figure 3 ,include:

[0026] An outer frame 1 and a plurality of lead frames, wherein the plurality of lead frames are uniformly distributed inside the outer frame 1 in a rectangular array, the lead frame comprises a chip board 6 and pins 3, and the pins 3 are arranged outside the chip board 6, and the pins 3 are fixedly connected to the outer frame 1;

[0027] The square groove 2 is arranged on the left and right sides of the outer frame 1. A plastic strip 10 is installed inside the square groove 2. A silicone gasket 12 is arranged outside the plastic strip 10 at the rear end of the outer frame 1, and the silicone gasket 12 is fixedly connected to the plastic strip 10. A groove 13 is arranged at the rear end of the plastic strip 10, and a convex strip 11 is arranged at the front end of the outside of the plastic strip 10, and the convex strip 11 is adapted to the groove 13.

[0028] When in use, insert the plastic strip 10 into the square groove 2 from bottom to top, support the silicone gasket 12 on the outside of the square groove 2, install the plastic strip 10 inside the square groove 2 of each outer frame 1, and then stack the outer frames 1. The grooves 13 of the plastic strips 10 inside the upper and lower outer frames 1 are plugged into the convex strips 11, so that the upper and lower plastic strips 10 are connected, making the stacking of the outer frames 1 stable, and the silicone gasket 12 plays a role in protecting the edge of the square groove 2 of the outer frame 1. It should be noted that in order to save space and highlight the innovative elements of this patent, some conventional equipment such as pins 3, chip board 6, silicone gasket 12, etc. will not be repeated in this patent.

[0029] See also Figure 1 , Figure 2 and Figure 3 An inner frame 5 is arranged inside the outer frame 1 , and the inner frame 5 is fixedly connected to the outer frame 1 .

[0030] See also Figure 1 , Figure 2 and Figure 3 A plug rod 9 is provided at the front end outside the inner frame 5 , and the plug rod 9 is fixedly connected to the inner frame 5 , and the plug rod 9 is used to be combined with the insertion tube 8 .

[0031] See also Figure 1 , Figure 2 and Figure 3 A cannula 8 is provided at the rear end outside the inner frame 5, and the cannula 8 is fixedly connected to the inner frame 5, the cannula 8 is adapted to the insertion rod 9, and the cannula 8 and the insertion rod 9 are combined to limit the position.

[0032] See also Figure 1 , Figure 2 and Figure 3 Support columns 7 are provided on both the front and rear sides of the outer corners of the outer frame 1, and the support columns 7 are fixedly connected to the outer frame 1, and the support columns 7 play a role in supporting the edges of the outer frame 1.

[0033] See also Figure 4 A triangular support plate 4 is provided on one side of the upper end of the pin 3 close to the chip board 6, and the triangular support plate 4 is fixedly connected to the pin 3 and the chip board 6, and the triangular support plate 4 serves to improve the firmness of the pin 3.

[0034] This solution: insert the plastic strip 10 into the square groove 2 from bottom to top, support the outside of the square groove 2 with the silicone gasket 12, install the plastic strip 10 inside the square groove 2 of each outer frame 1, and then stack the outer frames 1. The groove 13 of the plastic strip 10 inside the upper and lower outer frames 1 is plugged into the convex strip 11, so that the upper and lower plastic strips 10 are connected, making the stacking of the outer frames 1 stable. At the same time, the silicone gasket 12 plays a role in protecting the edge of the square groove 2 of the outer frame 1. The insertion rod 9 at the upper end of the inner frame 5 is combined with the insertion tube 8 at the lower end of the upper inner frame 5 to support the inner frame 5. The support column 7 at the corner of the outer frame 1 supports the stacking corners of the outer frame 1.

[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A lead frame for semiconductor chip packaging, characterized in that: include: An outer frame (1) and a plurality of lead frames, wherein the plurality of lead frames are evenly distributed inside the outer frame (1) in a rectangular array, the lead frame comprises a chip board (6) and pins (3), and the pins (3) are arranged outside the chip board (6), and the pins (3) are fixedly connected to the outer frame (1); A square groove (2) is arranged on the left and right sides of the outer frame (1); a plastic strip (10) is installed inside the square groove (2); a silicone gasket (12) is arranged outside the plastic strip (10) at the rear end of the outer frame (1), and the silicone gasket (12) is fixedly connected to the plastic strip (10); a groove (13) is arranged at the rear end of the plastic strip (10); a convex strip (11) is arranged at the front end of the outside of the plastic strip (10), and the convex strip (11) is matched with the groove (13).

2. A lead frame for semiconductor chip packaging according to claim 1, characterized in that: An inner frame (5) is arranged inside the outer frame (1), and the inner frame (5) is fixedly connected to the outer frame (1).

3. A lead frame for semiconductor chip packaging according to claim 2, characterized in that: An insertion rod (9) is provided at the front end of the outer portion of the inner frame (5), and the insertion rod (9) is fixedly connected to the inner frame (5).

4. A lead frame for semiconductor chip packaging according to claim 3, characterized in that: A plug tube (8) is provided at the rear end of the outer portion of the inner frame (5), and the plug tube (8) is fixedly connected to the inner frame (5), and the plug tube (8) is adapted to the plug rod (9).

5. The lead frame for semiconductor chip packaging according to claim 1, characterized in that: Support columns (7) are provided on both the front and rear sides of the outer corners of the outer frame (1), and the support columns (7) are fixedly connected to the outer frame (1).

6. A lead frame for semiconductor chip packaging according to claim 1, characterized in that: A triangular support plate (4) is provided on one side of the upper end of the pin (3) close to the chip plate (6), and the triangular support plate (4) is fixedly connected to the pin (3) and the chip plate (6).

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