Embedded combined ceramic filter

Abstract

The utility model is suitable for the technical field of filters, and provides an embedded combined type ceramic filter, which comprises a circuit board, an upper shell and a lower shell, the upper shell and the lower shell are respectively arranged at the top and the bottom of the circuit board, the circuit board is provided with a preformed hole, and a body arranged between the upper shell and the lower shell is arranged in the preformed hole; the upper shell and the lower shell respectively comprise an upper heat-conducting plate and a lower heat-conducting plate which are abutted against the body, and upper connecting plates and lower connecting plates are respectively mounted on two sides of the upper heat-conducting plate and two sides of the lower heat-conducting plate; a connecting column is installed at the bottom of the body, a contact hole connected with the connecting column in a sleeved mode is formed in the top of the lower shell, a wire connected with the contact hole is installed at the top of the lower shell, and the wire is provided with a pin fixedly connected with the lower connecting plate. Therefore, the device can simultaneously achieve the heat dissipation performance and ensure that the thickness of the integrated circuit board is reduced.

Description

Technical Field

[0001] The utility model is applicable to the field of filters and provides an embedded combined ceramic filter. Background Art

[0002] Ceramic filters are made of lead zirconate titanate ceramic material. This ceramic material is made into sheets and coated with silver on both sides as electrodes. After DC high-voltage polarization, it has piezoelectric effect and plays a filtering role. It has the characteristics of stability and good anti-interference performance. It is widely used in various electronic equipment such as televisions, video recorders, radios, mobile signal base stations, etc. as frequency selection and filtering components.

[0003] Considering the cost, for electronic products such as video recorders, radios, and small mobile base stations, ceramic filters of the Ma-Ca-Ti system are often used for embedded applications. However, due to the poor high and low temperature performance of ceramic filters of the Mg-Ca-Ti system, ceramic filter devices work in high and low temperature environments, and the center frequency point shifts greatly, and good heat dissipation needs to be achieved through dielectrics or auxiliary heat dissipation devices. However, in embedded integrated circuits, to ensure the heat dissipation effect, the components themselves and the auxiliary heat dissipation devices will affect the thickness of the entire product, occupying a large height space, which is not only unsightly but also affects the user experience.

[0004] It can be seen that the existing ceramic filter cannot simultaneously achieve heat dissipation and reduce the thickness of the integrated circuit board. Utility Model Content

[0005] In view of the above-mentioned defects, the purpose of the utility model is to provide an embedded combined ceramic filter, the purpose is to solve the problems raised in the background technology, including a circuit board, characterized in that it also includes an upper shell and a lower shell respectively installed on the top and bottom of the circuit board, the circuit board is provided with a reserved hole, and a body arranged between the upper shell and the lower shell is installed in the reserved hole; the upper shell and the lower shell respectively include an upper heat conducting plate and a lower heat conducting plate abutting the body, and upper connecting plates and lower connecting plates are respectively installed on both sides of the upper heat conducting plate and both sides of the lower heat conducting plate; a connecting column is installed at the bottom of the body, a contact hole is provided at the top of the lower shell for sleeve connection with the connecting column, a wire connected to the contact hole is installed at the top of the lower shell, and the wire is installed with a pin fixedly connected to the lower connecting plate.

[0006] Furthermore, the circuit board, the upper connecting plate and the lower connecting plate are respectively provided with through holes, bolt holes and nut holes; the circuit board, the upper shell and the lower shell are bolted together through the through holes, bolt holes and nut holes.

[0007] Furthermore, a contact layer is fixedly connected inside the contact hole, and the contact layer is fixedly connected to the conductive wire.

[0008] Furthermore, an insulating layer is installed between the contact layer and the lower heat conducting plate.

[0009] Furthermore, the insulating layer is made of soft material.

[0010] Furthermore, an upper heat dissipation grille is fixedly connected to the top of the upper connecting plate.

[0011] Furthermore, a lower heat dissipation grille is fixedly connected to the bottom of the lower connecting plate.

[0012] Furthermore, the bottom of the upper connecting plate is fixedly connected to the limiting frame.

[0013] The utility model is installed by adopting the upper and lower combination mode. The body of the ceramic filter is embedded in the limit frame of the upper shell, and a heat-conducting medium is coated between the body and the upper heat-conducting plate to increase the thermal conductivity. The body is installed between the upper shell and the lower shell, and is in close contact with the upper heat-conducting plate and the lower heat-conducting plate, transferring heat to the upper heat-dissipating grille and the lower heat-dissipating grille, increasing the heat dissipation, and reducing the center frequency offset of the ceramic filter. At the same time, the reserved hole provided on the circuit board can be embedded in the body, thereby reducing the influence of the ceramic filter and the heat dissipation device installed thereon on the overall thickness of the integrated circuit board, that is, the heat dissipation of the ceramic filter is enhanced, and the overall thickness of the integrated circuit board is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is an exploded diagram of the device structure;

[0015] Figure 2 is a cross-sectional view of the upper shell;

[0016] Figure 3 is a cross-sectional view of the lower shell;

[0017] Figure 4 for Figure 3 A magnified view of the structure of part A;

[0018] Figure 5 It is a cross-sectional view of the body;

[0019] In the figure: 1-body; 11-connecting column;

[0020] 2-upper shell; 21-upper heat conducting plate; 22-upper connecting plate; 221-bolt hole; 23-upper heat dissipation grille; 24-limiting frame;

[0021] 3-lower housing; 301-wire; 31-lower heat conducting plate; 32-lower connecting plate; 321-nut hole; 322-pin; 33-lower heat dissipation grille; 34-contact hole; 341-contact layer; 342-insulating layer;

[0022] 4-circuit board; 401-reserved hole; 41-through hole. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0024] See also Figure 1-5 The purpose of the utility model is to provide an embedded combined ceramic filter, including a body 1, an upper shell 2 and a lower shell 3, the upper shell 2 and the lower shell 3 are respectively installed on the top and the bottom of the circuit board 4, the body 1 is installed between the upper shell 2 and the lower shell 3, and the circuit board 4 is provided with a reserved hole 401 for the body 1 to pass through. The body 1 is a ceramic filter with three pins commonly used on the market, and the circuit board 4 is a PCB integrated circuit board. The size of the reserved hole 401 on the circuit board 4 is consistent with the size of the ceramic filter. The body 1 can be installed in the reserved hole 401, and the upper shell 2 and the lower shell 3 are respectively installed on the upper surface and the lower surface of the body 1, and are tightly fitted on the upper surface and the lower surface of the body 1 respectively. During installation, a medium with good thermal conductivity can be used for auxiliary fitting.

[0025] The upper shell 2 includes an upper heat conducting plate 21 abutting against the body 1, and upper connecting plates 22 are fixedly connected to both sides of the upper heat conducting plate 21, and bolt holes 221 are provided on the upper connecting plates 22. The lower shell 3 includes a lower heat conducting plate 31 abutting against the body 1, and lower connecting plates 32 are fixedly connected to both sides of the lower heat conducting plate 31, and two nut holes 321 are provided on the lower connecting plate 32. The specific bolt holes 221 are respectively arranged corresponding to the two nut holes 321. The circuit board 4 is provided with two through holes 41, and the two through holes 41 are respectively arranged corresponding to the two nut holes 321. Thus, the upper shell 2, the lower shell 3 and the circuit board 4 can be installed as a whole by nuts and bolts.

[0026] A contact hole 34 is provided at the top of the lower shell 3, and three connecting posts 11 are fixedly connected to the bottom of the body 1. The contact holes 34 are arranged corresponding to the connecting posts 11, and the connecting posts 11 are sleeved inside the contact holes 34. The connecting posts 11 are three pins of a ceramic filter, and the connecting posts 11 can be inserted into the contact holes 34. A wire 301 is fixedly connected to the top of the lower shell 3. Specifically, a plurality of wires 301 are installed on the top of the lower shell 3, and each wire 301 is fixedly connected to a pin 322, and the pin 322 is fixedly connected to the lower connecting plate 32. The pin 322 can be welded and connected to the pad of the electronic component on the circuit board 4. The device can be electrically connected to the integrated circuit as a whole through the pin 322.

[0027] Preferably, a contact layer 341 is fixedly connected inside the contact hole 34, and the contact layer 341 is fixedly connected to the wire 301; the contact layer 341 is a conductive metal layer, and the contact layer 341 is in direct contact with the connecting column 11. Specifically, the contact layer 341 is conductively connected to the wire 301 to transmit the electrical signal to the pin 322, thereby playing a conductive role.

[0028] Preferably, an insulating layer 342 is fixedly connected between the contact layer 341 and the lower heat conducting plate 31. The insulating layer 342 uses an insulating medium and can isolate the contact layer 341 from the lower heat conducting plate 31. At the same time, the insulating layer 342 uses a material with a certain softness. When the connecting column 11 is inserted into the contact layer 341 and contacts its bottom, it presses the contact layer 341 downward. The insulating layer 342 has a certain rebound margin, which can ensure that the connecting column 11 is always in contact with the contact layer 341.

[0029] Preferably, an upper heat dissipation grille 23 is fixedly connected to the top of the upper connecting plate 22. Specifically, the upper connecting plate 22 is integrally connected to the upper heat dissipation grille 23. The upper heat dissipation grille 23 has the function of increasing heat dissipation, which can ensure that the temperature of the ceramic filter is reduced and prevent the center frequency of the ceramic filter from shifting.

[0030] Preferably, a lower heat dissipation grille 33 is fixedly connected to the bottom of the lower connecting plate 32. Specifically, the lower connecting plate 32 is integrally connected to the lower heat dissipation grille 33. The lower heat dissipation grille 33 has the function of increasing heat dissipation, which is the same as the upper heat dissipation grille 23, and can further ensure the working temperature of the main body 1.

[0031] Preferably, the bottom of the upper connecting plate 22 is fixedly connected to a limiting frame 24. Specifically, the size of the limiting frame 24 is consistent with the main body 1. The main body 1 can be installed in the limiting frame 24. The limiting frame 24 limits and fixes the main body 1, and can also increase the contact area between the main body 1 and the upper connecting plate 22, thereby improving the heat dissipation effect.

[0032] In summary, the ceramic filter is installed in an upper and lower combination, the body 1 of the ceramic filter is embedded in the limit frame 24 of the upper shell 2, and a heat-conducting medium is coated between the body 1 and the upper heat-conducting plate 21 to increase thermal conductivity. The body 1 is installed between the upper shell 2 and the lower shell 3, and is in close contact with the upper heat-conducting plate 21 and the lower heat-conducting plate 31, transferring heat to the upper heat-dissipating grille 23 and the lower heat-dissipating grille 33, increasing heat dissipation, and reducing the center frequency offset of the ceramic filter. At the same time, the reserved hole 401 provided on the circuit board 4 can be embedded in the body 1, thereby reducing the influence of the ceramic filter and the heat dissipation device installed thereon on the overall thickness of the integrated circuit board, that is, the heat dissipation of the ceramic filter is enhanced, while the overall thickness of the integrated circuit board is reduced.

[0033] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, technicians familiar with the field may make various corresponding changes and deformations based on the present invention, but these corresponding changes and deformations should all fall within the scope of protection of the claims attached to the present invention.

Claims

1. An embedded combined ceramic filter, comprising a circuit board (4), characterized in that: It also comprises an upper shell (2) and a lower shell (3) respectively mounted on the top and bottom of the circuit board (4); a reserved hole (401) is provided on the circuit board (4); a body (1) arranged between the upper shell (2) and the lower shell (3) is installed in the reserved hole (401); The upper shell (2) and the lower shell (3) respectively comprise an upper heat conducting plate (21) and a lower heat conducting plate (31) abutting against the body (1); an upper connecting plate (22) and a lower connecting plate (32) are respectively installed on both sides of the upper heat conducting plate (21) and both sides of the lower heat conducting plate (31); A connecting column (11) is installed at the bottom of the body (1), a contact hole (34) sleeved with the connecting column (11) is provided at the top of the lower shell (3), a wire (301) connected to the contact hole (34) is installed at the top of the lower shell (3), and a pin (322) fixedly connected to the lower connecting plate (32) is installed on the wire (301).

2. The embedded combined ceramic filter according to claim 1, characterized in that: The circuit board (4), the upper connecting plate (22) and the lower connecting plate (32) are respectively provided with a through hole (41), a bolt hole (221) and a nut hole (321); the circuit board (4), the upper shell (2) and the lower shell (3) are bolted together via the through hole (41), the bolt hole (221) and the nut hole (321).

3. The embedded combined ceramic filter according to claim 1, characterized in that: A contact layer (341) is fixedly connected inside the contact hole (34), and the contact layer (341) is fixedly connected to the conductive wire (301).

4. The embedded combined ceramic filter according to claim 3, characterized in that: An insulating layer (342) is installed between the contact layer (341) and the lower heat conducting plate (31).

5. The embedded combined ceramic filter according to claim 4, characterized in that: The insulating layer (342) is made of soft material.

6. The embedded combined ceramic filter according to claim 1, characterized in that: An upper heat dissipation grille (23) is fixedly connected to the top of the upper connecting plate (22).

7. The embedded combined ceramic filter according to claim 1, characterized in that: The bottom of the lower connecting plate (32) is fixedly connected to a lower heat dissipation grille (33).

8. The embedded combined ceramic filter according to claim 1, characterized in that: The bottom of the upper connecting plate (22) is fixedly connected to a limiting frame (24).

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