Freely-combined distributed I / O

Abstract

The utility model discloses a freely combined distributed I / O (Input / Output), which comprises a fixed plate and an expansion module, an expansion module is installed at the top end of the fixing plate, a coupler is installed on one side of the top end of the fixing plate, installation plates are arranged on the two sides of the coupler, and a heat dissipation opening is formed in the front end of the expansion module. A connecting port is formed in one side of the top end of the extension module, a dustproof structure is arranged at the top end of the connecting port, dismounting structures are arranged on the two sides of the extension module, and a heat dissipation structure is arranged at the rear end of the extension module; the dismounting and mounting structure comprises a dismounting and mounting groove, a connecting plate, a dismounting and mounting elastic piece, a clamping block, a telescopic spring and a clamping groove. According to the utility model, through the cooperative use of the dismounting elastic sheet and the telescopic spring, the clamping block can be quickly inserted into the clamping groove during installation, so that the installation is more convenient, and when the dismounting elastic sheet is pulled backwards during dismounting, the dismounting elastic sheet can stretch and retract towards the middle position due to the elasticity, so that the clamping block falls off from the interior of the clamping groove, and the clamping block is prevented from falling off from the interior of the clamping groove. And therefore, the disassembly is more convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of distributed I / O, in particular to a freely combined distributed I / O. Background Art

[0002] Freely combined distributed I / O can be divided into plug-in distributed I / O and integrated distributed I / O. The plug-in distributed I / O module is a special distributed I / O product, and its design features are its compact plug-in structure and modular side splicing method. This design makes it very suitable for medium and large distributed control systems, and is easy to install in the cabinet. And because it is plug-in, it can be freely combined when connected. The plug-in distributed I / O is a combination of a coupler and an expansion module. However, there are still some problems in the use of traditional plug-in distributed I / O.

[0003] When using traditional plug-in distributed I / O, the expansion module needs to be installed on a fixed plate. The traditional installation method is generally to install it by screws. This means that it cannot be disassembled without dedicated tools, making it more troublesome to disassemble. Therefore, a freely combined distributed I / O is needed to solve the above problems. Utility Model Content

[0004] The utility model aims to provide a freely combined distributed I / O, so as to solve the defect that the existing distributed I / O cannot be disassembled without a dedicated tool when disassembling the expansion module.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a freely combined distributed I / O, comprising a fixed plate and an expansion module; the expansion module is installed at the top of the fixed plate, a coupler is installed on one side of the top of the fixed plate, mounting plates are arranged on both sides of the coupler, and a heat dissipation port is arranged at the front end of the expansion module; a connection port is arranged on one side of the top of the expansion module, a dustproof structure is arranged at the top of the connection port, disassembly structures are arranged on both sides of the expansion module, and a heat dissipation structure is arranged at the rear end of the expansion module; the disassembly structure comprises a disassembly slot, a connecting plate, a disassembly spring, a clamping block, a telescopic spring and a clamping slot, and the disassembly slot is opened inside both sides of the expansion module at the top of the fixed plate.

[0006] Preferably, the connecting plate is arranged on both sides of the expansion module, a disassembly spring is arranged at the bottom end of the connecting plate, a telescopic spring is arranged at the middle position of the disassembly spring, clamping blocks are arranged on both sides of the disassembly spring, and the clamping slots are opened at both ends inside one side of the disassembly slot.

[0007] Preferably, the inner diameter of the card slot is larger than the inner diameter of the card block, and an insertion structure is formed between the card slot and the card block.

[0008] Preferably, two groups of the disassembly and assembly springs are provided, and the two groups of the disassembly and assembly springs are symmetrically distributed on both sides of the expansion module.

[0009] Preferably, the dustproof structure includes a dustproof plate, a fixing plate, a torsion spring and a fixing column, the fixing plate is arranged on both sides of the top of the connecting port, a fixing column is installed at the middle position of the fixing plate, a dustproof plate is arranged on the outer side of the fixing column, and torsion springs are sleeved on both sides of the fixing column, one end of the torsion spring is fixed to one side of the fixing plate, and the other end of the torsion spring is fixed to one side of the dustproof plate.

[0010] Preferably, the heat dissipation structure includes an air inlet, a fan, a radiator and an air outlet, the radiator is arranged at the rear end of the expansion module, an air inlet is opened on one side of the radiator, a fan is installed on one side inside the air inlet, and the air outlet is opened at the front end of the radiator.

[0011] Preferably, a plurality of air outlets are provided, and the plurality of air outlets are arranged at equal intervals at the front end of the radiator.

[0012] The utility model provides a freely combined distributed I / O, which has the advantages of:

[0013] By using the disassembly and assembly shrapnel and the telescopic spring in coordination, the card block can be quickly inserted into the interior of the card slot during installation, making the installation more convenient; and during disassembly, when the disassembly and assembly shrapnel is pulled backward, the disassembly and assembly shrapnel will be elastic and will be telescoped to the middle position, causing the card block to fall off from the interior of the card slot, making the disassembly more convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a front view structural schematic diagram of the utility model;

[0015] Figure 2 It is a rear view structural schematic diagram of the utility model;

[0016] Figure 3 This is a schematic diagram of the rear view structure of the disassembly and assembly structure of the utility model;

[0017] Figure 4 It is a schematic diagram of a partial structure of the utility model in a front view;

[0018] Figure 5 It is a partial structural schematic diagram of the disassembly and assembly structure of the utility model.

[0019] In the figure: 1. fixing plate; 2. disassembly and assembly structure; 201. disassembly and assembly slot; 202. connecting plate; 203. disassembly and assembly spring; 204. clamping block; 205. telescopic spring; 206. clamping slot; 3. expansion module; 4. heat dissipation port; 5. dustproof structure; 501. dustproof plate; 502. fixing plate; 503. torsion spring; 504. fixing column; 6. coupler; 7. mounting plate; 8. heat dissipation structure; 801. air inlet; 802. fan; 803. radiator; 804. air outlet; 9. connecting port. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] The present utility model embodiment provides a freely combined distributed I / O, such as Figure 1-Figure 5 As shown, a freely combined distributed I / O includes a fixed plate 1 and an expansion module 3; the expansion module 3 is installed on the top of the fixed plate 1, a coupler 6 is installed on one side of the top of the fixed plate 1, mounting plates 7 are arranged on both sides of the coupler 6, and a heat dissipation port 4 is arranged at the front end of the expansion module 3; a connection port 9 is arranged on one side of the top of the expansion module 3, a dustproof structure 5 is arranged at the top of the connection port 9, a disassembly structure 2 is arranged on both sides of the expansion module 3, and a heat dissipation structure 8 is arranged at the rear end of the expansion module 3. In a further preferred embodiment of the utility model, as Figure 1-Figure 5 As shown: the disassembly and assembly structure 2 includes a disassembly and assembly slot 201, a connecting plate 202, a disassembly and assembly spring 203, a block 204, a telescopic spring 205 and a slot 206. The disassembly and assembly slot 201 is arranged inside the two sides of the expansion module 3 at the top of the fixed plate 1, the connecting plate 202 is arranged on both sides of the expansion module 3, the bottom end of the connecting plate 202 is provided with a disassembly and assembly spring 203, the middle position of the disassembly and assembly spring 203 is provided with a telescopic spring 205, both sides of the disassembly and assembly spring 203 are provided with a block 204, the slot 206 is arranged at both ends of the inside of one side of the disassembly and assembly slot 201, the inner diameter of the slot 206 is larger than the inner diameter of the block 204, and an insertion structure is formed between the slot 206 and the block 204, and two groups of disassembly and assembly springs 203 are provided, and the two groups of disassembly and assembly springs 203 are symmetrically distributed on both sides of the expansion module 3.

[0022] Specifically, in the present embodiment, when installing the expansion module 3, the disassembly and assembly spring 203 is aligned with one side of the disassembly and assembly slot 201, and then the expansion module 3 is pushed to make the disassembly and assembly spring 203 move inside the disassembly and assembly slot 201. As the disassembly and assembly spring 203 moves to the position of the card slot 206, the card block 204 is inserted into the card slot 206 under the action of the telescopic spring 205, and the installation work is completed. When it is necessary to disassemble the expansion module 3, the expansion module 3 is pulled downward with force. At this time, under the action of external force, the disassembly and assembly spring 203 is retracted to the middle position, so that the card block 204 on one side of the disassembly and assembly spring 203 falls off from the inside of the card slot 206, thereby completing the disassembly of the expansion module 3 and making it more convenient to disassemble.

[0023] In a further preferred embodiment of the present invention, Figure 1-Figure 5 As shown: the dustproof structure 5 includes a dustproof plate 501, a fixing plate 502, a torsion spring 503 and a fixing column 504, the fixing plate 502 is arranged on both sides of the top of the connecting port 9, the fixing column 504 is installed at the middle position of the fixing plate 502, the dustproof plate 501 is arranged on the outer side of the fixing column 504, and the torsion springs 503 are sleeved on both sides of the fixing column 504, one end of the torsion spring 503 is fixed to one side of the fixing plate 502, and the other end of the torsion spring 503 is fixed to one side of the dustproof plate 501.

[0024] Specifically, in this embodiment; when the fixing plate 1 is not in use, the dustproof plate 501 will cover the top of the connecting port 9 under the action of the torsion spring 503, thereby shielding the connecting port 9, so that dust will not enter the interior of the connecting port 9 when the connecting port 9 is not in use, thereby affecting the connection effect, thereby completing the dustproof work.

[0025] In a further preferred embodiment of the present invention, Figure 1-Figure 5 As shown: the heat dissipation structure 8 includes an air inlet 801, a fan 802, a radiator 803 and an air outlet 804. The radiator 803 is arranged at the rear end of the expansion module 3. The air inlet 801 is opened on one side of the radiator 803. The fan 802 is installed on one side inside the air inlet 801. The air outlet 804 is opened at the front end of the radiator 803. There are several air outlets 804, and the several air outlets 804 are arranged at equal intervals at the front end of the radiator 803.

[0026] Specifically, in this embodiment, when the expansion module 3 is working, the fan 802 is started. After starting, the fan 802 will rotate to generate wind force. The generated wind force will blow into the interior of the radiator 803, and then blow out through the air outlet 804. The blown wind will blow into the interior of the expansion module 3 through the rear end of the expansion module 3, and then be discharged through the heat dissipation port 4, taking away the heat inside the expansion module 3, making it faster when dissipating heat, thereby completing the heat dissipation work.

[0027] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A freely combinable distributed I / O, comprising a fixed board (1) and an expansion module (3); Features: An expansion module (3) is installed at the top of the fixing plate (1), a coupler (6) is installed on one side of the top of the fixing plate (1), mounting plates (7) are arranged on both sides of the coupler (6), and a heat dissipation port (4) is arranged at the front end of the expansion module (3); A connection port (9) is provided on one side of the top of the expansion module (3), a dustproof structure (5) is provided on the top of the connection port (9), disassembly structures (2) are provided on both sides of the expansion module (3), and a heat dissipation structure (8) is provided at the rear end of the expansion module (3); The disassembly and assembly structure (2) comprises a disassembly and assembly slot (201), a connecting plate (202), a disassembly and assembly spring (203), a clamping block (204), a telescopic spring (205) and a clamping slot (206); the disassembly and assembly slot (201) is arranged inside the two sides of the expansion module (3) at the top end of the fixing plate (1).

2. A freely combinable distributed I / O according to claim 1, Features: The connecting plate (202) is arranged on both sides of the expansion module (3); a disassembly spring (203) is arranged at the bottom end of the connecting plate (202); a telescopic spring (205) is arranged at the middle position of the disassembly spring (203); clamping blocks (204) are arranged on both sides of the disassembly spring (203); and the clamping slots (206) are arranged at both ends inside one side of the disassembly slot (201).

3. A freely combinable distributed I / O according to claim 2, Features: The inner diameter of the card slot (206) is greater than the inner diameter of the card block (204), and an insertion structure is formed between the card slot (206) and the card block (204).

4. A freely combinable distributed I / O according to claim 1, Features: Two groups of the disassembly and assembly springs (203) are provided, and the two groups of the disassembly and assembly springs (203) are symmetrically distributed on both sides of the expansion module (3).

5. A freely combinable distributed I / O according to claim 4, Features: The dustproof structure (5) comprises a dustproof plate (501), a fixing plate (502), a torsion spring (503) and a fixing column (504); the fixing plate (502) is arranged on both sides of the top of the connecting port (9); a fixing column (504) is installed at the middle position of the fixing plate (502); a dustproof plate (501) is arranged on the outer side of the fixing column (504); torsion springs (503) are sleeved on both sides of the fixing column (504); one end of the torsion spring (503) is fixed to one side of the fixing plate (502); and the other end of the torsion spring (503) is fixed to one side of the dustproof plate (501).

6. A freely combinable distributed I / O according to claim 1, Features: The heat dissipation structure (8) comprises an air inlet (801), a fan (802), a radiator (803) and an air outlet (804); the radiator (803) is arranged at the rear end of the expansion module (3); an air inlet (801) is provided on one side of the radiator (803); a fan (802) is installed on one side inside the air inlet (801); and the air outlet (804) is provided at the front end of the radiator (803).

7. A freely combinable distributed I / O according to claim 6, Features: A plurality of air outlets (804) are provided, and the plurality of air outlets (804) are arranged at equal intervals at the front end of the radiator (803).

Images