Semiconductor test structure

Abstract

The utility model relates to the technical field of semiconductor testing, and provides a semiconductor testing structure. The semiconductor test structure comprises a crimping soft copper bar, a crimping hard copper bar and a switching copper bar. The crimping hard copper bar is connected between the crimping soft copper bar and the switching copper bar, one end, deviating from the crimping hard copper bar, of the crimping soft copper bar is used for connecting a power semiconductor, and one end, deviating from the crimping hard copper bar, of the switching copper bar is used for connecting a cable. The semiconductor test structure further comprises a supporting seat and a cooling plate, the supporting seat is supported on the crimping hard copper bar, the cooling plate is installed on the supporting seat and located above the crimping hard copper bar, and the cooling plate is used for cooling the crimping hard copper bar. According to the semiconductor test structure provided by the invention, sufficient space can be provided for stable placement of the test circuit board, normal detection of the power semiconductor is ensured, and heat dissipation and cooling requirements can be met.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a semiconductor testing structure. Background Art

[0002] During semiconductor reactive power testing, a cooling structure is usually required to meet the temperature reduction requirements. Currently, two commonly used methods are single-sided water cooling and double-sided water cooling.

[0003] Among them, as far as double-sided water cooling is concerned, since water channel plates need to be set up both above and below the power semiconductor, the space above the power semiconductor for placing the test circuit board will be reduced, or even there will be no space for placing the test circuit board, making the power semiconductor detection more difficult. Utility Model Content

[0004] Based on this, it is necessary to provide a semiconductor test structure to provide sufficient space for the stable placement of the test circuit board, ensure the normal detection of the power semiconductor, and meet the heat dissipation and cooling requirements.

[0005] A semiconductor test structure includes a crimped soft copper bus, a crimped hard copper bus and a transfer copper bus.

[0006] The crimped hard copper bar is connected between the crimped soft copper bar and the transfer copper bar, and the end of the crimped soft copper bar away from the crimped hard copper bar is used to connect the power semiconductor, and the end of the transfer copper bar away from the crimped hard copper bar is used to connect the cable;

[0007] The semiconductor test structure also includes a support seat and a cooling plate, wherein the support seat is supported by the crimped hard copper busbar, the cooling plate is installed on the support seat and located above the crimped hard copper busbar, and the cooling plate is used to dissipate heat for the crimped hard copper busbar.

[0008] It is understandable that the setting of the crimped hard copper busbar is used to connect between the crimped soft copper busbar and the transfer copper busbar, which extends the installation length between the crimped soft copper busbar and the transfer copper busbar so that the transfer copper busbar can be arranged in other positions. Therefore, when the crimped hard copper busbar is stably assembled, it is equivalent to reserving more assembly space for placing the test circuit board. In this process, the setting of the support seat is used to ensure that the crimped hard copper busbar is stably assembled, and it will not easily deviate or fluctuate to affect the test effect or increase the noise, and the test circuit board can be stably placed; and the assembly of the cooling plate can timely and effectively dissipate heat and cool the crimped hard copper busbar to avoid overheating and affect the test results.

[0009] In some embodiments, along the vertical direction, the transfer copper bus is located above the crimped soft copper bus, and the crimped hard copper bus has a first bending section at one end facing the transfer copper bus, the first bending section extends upward along the vertical direction, and the extended end of the first bending section is connected to the transfer copper bus.

[0010] In some embodiments, the crimped hard copper busbar further comprises a second bending section and a connecting section, wherein the connecting section is connected between the second bending section and the first bending section;

[0011] The connecting section, the first bending section and the second bending section are arranged at angles in pairs, and the second bending section extends along the length direction of the crimped soft copper busbar, and the extended end of the second bending section is connected to the corresponding crimped soft copper busbar.

[0012] In some embodiments, the connecting segment and the second bending segment are located in a first plane.

[0013] In some embodiments, the support base includes a support base plate and a support vertical plate connected to the support base plate, the support vertical plate is arranged at an angle to the support base plate, the support base plate is supported by the connecting section and the second bending section, and the support vertical plate is supported by the first bending section; wherein at least the support base plate is connected to the cooling plate.

[0014] In some embodiments, the supporting bottom plate and / or the supporting vertical plate are both provided with an assembly groove, the crimped hard copper busbar is installed in the assembly groove, and the shape of the assembly groove is adapted to the shape of the crimped hard copper busbar; wherein the thickness of the crimped hard copper busbar is less than the recessed depth of the assembly groove.

[0015] In some embodiments, there are multiple crimped soft copper bars, and the multiple crimped soft copper bars are arranged at intervals along a first direction, which is the width direction of the crimped soft copper bars; each of the crimped soft copper bars is connected to a crimped hard copper bar and a transfer copper bar, and each of the crimped hard copper bars and each of the transfer copper bars are arranged at intervals; wherein all of the crimped soft copper bars are a crimping group, and all of the transfer copper bars are a transfer group, and the transfer group is arranged on one side of the crimping group along the first direction; among the multiple crimped soft copper bars, the length of the crimped hard copper bar corresponding to the crimped soft copper bar close to the transfer group is smaller than the length of the crimped hard copper bar corresponding to the crimped soft copper bar far away from the transfer group.

[0016] In some of the embodiments, among the plurality of crimped hard copper bars, the crimped hard copper bars with a longer length are located outside the crimped hard copper bars with a shorter length.

[0017] In some of the embodiments, the cooling plate is constructed with an air supply duct and an air inlet and a plurality of blowing holes connected to the air supply duct, the plurality of blowing holes are located on the side of the cooling plate facing the crimped hard copper busbar, the extension shape of the air supply duct is adapted to the extension shape of the crimped hard copper busbar, and the plurality of blowing holes are arranged at intervals along the extension direction of the air supply duct; and / or, the supporting base plate is constructed with a plurality of heat dissipation holes penetrating along its own thickness direction, and the plurality of heat dissipation holes are arranged at intervals along the extension direction of the crimped hard copper busbar.

[0018] In some embodiments, the semiconductor test structure further comprises:

[0019] A probe fixing plate, covering a side of a portion of the crimped hard copper busbar away from the support seat, the probe fixing plate is connected to the support seat, the probe fixing plate is configured with a through hole, and the probe fixing plate is configured with an avoidance hole for avoiding the crimped soft copper busbar;

[0020] A test circuit board is installed on a side of the probe fixing plate away from the crimped hard copper bar, and the circuit board pins of the test circuit board pass through the penetration holes and extend to the bottom of the probe fixing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 A first partial schematic diagram of a semiconductor test structure provided by the present application;

[0023] Figure 2 for Figure 1 A partial exploded view of a semiconductor test structure is provided;

[0024] Figure 3 for Figure 1 A partial cross-sectional view of a semiconductor test structure is provided;

[0025] Figure 4 for Figure 1 An exploded view of a support base plate and a cooling plate in a semiconductor test structure is provided;

[0026] Figure 5 A second partial schematic diagram of a semiconductor test structure provided by the present application;

[0027] Figure 6A third partial schematic diagram of a semiconductor test structure provided by the present application;

[0028] Figure 7 This is a fourth partial schematic diagram of the semiconductor test structure provided by the present application.

[0029] Figure numerals: 10, crimping soft copper bar; 20, crimping hard copper bar; 21, first bending section; 22, second bending section; 23, connecting section; 30, transfer copper bar; 31, assembly seat; 40, support seat; 41, support bottom plate; 4101, heat dissipation hole; 42, support vertical plate; 50, cooling plate; 501, air inlet; 502, blowing hole; 503, air delivery airway; 5031, horizontal airway; 5032, longitudinal Airway; 401, assembly groove; 4011, first assembly groove; 4012, second assembly groove; 61, probe fixing plate; 6101, avoidance hole; 62, test circuit board; 63, circuit board pin; 70, water cooling component; 71, upper water channel plate; 72, lower water channel plate; 80, carrier; 90, cable; 91, terminal block; 100, semiconductor test structure; 200, power semiconductor; 210, power pin. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0031] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0033] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0034] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0035] like Figure 1 , Figure 2 and Figure 5 As shown, an embodiment of the present application provides a semiconductor test structure 100, which can provide sufficient space for the stable placement of the test circuit board 62, ensure the normal detection of the power semiconductor 200, and meet the heat dissipation and cooling requirements. Specifically, the semiconductor test structure 100 includes a crimped soft copper bar 10, a crimped hard copper bar 20 and a transfer copper bar 30. The crimped hard copper bar 20 is connected between the crimped soft copper bar 10 and the transfer copper bar 30, and the end of the crimped soft copper bar 10 away from the crimped hard copper bar 20 is used to connect the power semiconductor 200, and the end of the transfer copper bar 30 away from the crimped hard copper bar 20 is used to connect the cable 90. The semiconductor test structure 100 also includes a support seat 40 and a cooling plate 50, the support seat 40 is supported on the crimped hard copper bar 20, the cooling plate 50 is installed on the support seat 40, and is located above the crimped hard copper bar 20, and the cooling plate 50 is used to dissipate heat for the crimped hard copper bar 20.

[0036] It can be understood that, since the crimped soft copper busbar 10 is used to connect the power semiconductor 200, and the test circuit board 62 is also connected to the power semiconductor 200 during the test, the crimped soft copper busbar 10 and the test circuit board 62 are both arranged close to the power semiconductor 200, and the connection lengths relative to the power semiconductor 200 can also be shortened to reduce the noise. Therefore, in this embodiment, the crimped hard copper busbar 20 is arranged to connect between the crimped soft copper busbar 10 and the transfer copper busbar 30, which is equivalent to extending the installation length between the crimped soft copper busbar 10 and the transfer copper busbar 30, and then the transfer copper busbar 30 can be arranged at a position far away from the crimped soft copper busbar 10, so that the position close to the crimped soft copper busbar 10 can be fully reserved for placing the test circuit board 62; and, it is precisely because the transfer copper busbar 30 is transferred to other positions that the installation interference between the transfer copper busbar 30 and the test circuit board 62 is reduced. In this process, the support base 40 is used to support the crimped hard copper busbar 20 to ensure assembly stability, so that it will not easily deviate or fluctuate to affect the test results; and the support base 40 can also support the test circuit board 62 to ensure that the test circuit board 62 is stably placed. In addition, the assembly of the cooling plate 50 can timely and effectively dissipate heat and cool the crimped hard copper busbar 20 to avoid overheating and affecting the test results.

[0037] Please continue reading Figure 1 , Figure 2 and Figure 5 , exemplarily, along the vertical direction, the transfer copper bar 30 is located above the crimped soft copper bar 10, and the crimped hard copper bar 20 has a first bending section 21 at one end facing the transfer copper bar 30, and the first bending section 21 extends upward along the vertical direction, and the extended end of the first bending section 21 is connected to the transfer copper bar 30. In other words, by raising the transfer copper bar 30 relative to the crimped soft copper bar 10, part of the space of the crimped soft copper bar 10 upward in the vertical direction can also be reserved to meet the height requirement when the test circuit board 62 is placed. Moreover, it is precisely because the crimped hard copper bar 20 is used to transfer between the crimped soft copper bar 10 and the transfer copper bar 30, the crimped hard copper bar 20 can be bent to form the first bending section 21, which meets the position arrangement of the transfer copper bar 30 relative to the crimped soft copper bar 10.

[0038] Furthermore, the crimped hard copper busbar 20 also has a second bending section 22 and a connecting section 23, wherein the connecting section 23 is connected between the second bending section 22 and the first bending section 21; the connecting section 23, the first bending section 21, and the second bending section 22 are arranged at an angle in pairs, and the second bending section 22 extends along the length direction of the crimped soft copper busbar 10, and the extended end of the second bending section 22 is connected to the corresponding crimped soft copper busbar 10. The connecting section 23 and the second bending section 22 are located in the first plane.

[0039] That is to say, the crimped hard copper busbar 20 can be composed of a first bending section 21, a connecting section 23 and a second bending section 22 connected in sequence. The first bending section 21 is arranged in the vertical direction, and the end away from the connecting section 23 is connected to the transfer copper busbar 30; the connecting section 23 and the second bending section 22 are both arranged in the horizontal direction and are located in the same horizontal plane (i.e., the first plane), and the end of the second bending section 22 away from the connecting section 23 is connected to the crimped soft copper busbar 10. Such an arrangement satisfies the space reservation in the horizontal direction through the cooperation of the second bending section 22 and the connecting section 23, and satisfies the space reservation in the vertical direction through the arrangement of the first bending section 21, thereby leaving a three-dimensional space for stably placing the test circuit board 62.

[0040] The length of the connecting section 23 may be along the X-axis direction, the length of the second bending section 22 may be along the Y-axis direction, and the length of the first bending section 21 may be along the Z-axis direction.

[0041] In an alternative embodiment, a third bending section may be provided between the connecting section 23 and the second bending section 22. Specifically, the third bending section is provided along the vertical direction, so that the connecting section 23 and the second bending section 22 are provided in two parallel planes.

[0042] Furthermore, the semiconductor test structure 100 also includes an assembly seat 31 for supporting the transfer copper bus 30. The assembly seat 31 is constructed with an assembly hole that penetrates in the vertical direction. The transfer copper bus 30 is inserted into the corresponding assembly hole. The end located below the assembly hole is connected to the crimped hard copper bus 20, and the end located above the assembly hole is connected to the cable 90 through the wiring terminal 91.

[0043] In some specific embodiments, the crimped soft copper busbar 10 is threadedly connected to the crimped hard copper busbar 20 , the crimped hard copper busbar 20 is threadedly connected to the transition copper busbar 30 , and the transition copper busbar 30 is threadedly connected to the terminal 91 .

[0044] like Figure 1 and Figure 2 As shown, in an optional embodiment, the support seat 40 includes a support base plate 41 and a support vertical plate 42 connected to the support base plate 41, the support vertical plate 42 is set at an angle with the support base plate 41, the support base plate 41 is supported on the connecting section 23 and the second bending section 22, and the support vertical plate 42 is supported on the first bending section 21; as mentioned above, the crimped hard copper bus 20 is bent along the Z-axis direction, the Y-axis direction and the X-axis direction to meet the reservation of the three-dimensional space. Therefore, for the support seat 40 used to support the crimped hard copper bus 20, it is necessary to meet the simultaneous support in the horizontal direction and the vertical direction to ensure the installation stability of the crimped hard copper bus 20. Therefore, the setting of the support base plate 41 is used to meet the support in the horizontal direction (including the X-axis direction and the Y-axis direction), and the setting of the support vertical plate 42 is used to meet the support in the vertical direction (i.e., the Z-axis direction).

[0045] Furthermore, at least the support base plate 41 is connected with a cooling plate 50. It is precisely because the second bending section 22 and the connecting section 23 are used to ensure the space of the three-dimensional space on the horizontal plane, that is, the length of the second bending section 22 determines the size of the three-dimensional space along the Y-axis direction, and the length of the connecting section 23 determines the size of the three-dimensional space along the X-axis direction. Therefore, in order to ensure that there is sufficient space, the length of the second bending section 22 and the connecting section 23 needs to be larger to facilitate the placement of multiple test circuit boards 62. However, for the crimped hard copper busbar 20, the greater the length, the more heat is generated, so it is necessary to connect the cooling plate 50 to the support base plate 41 to ensure the heat dissipation of the connecting section 23 and the second bending section 22.

[0046] Of course, considering that the length of the first bending section 21 determines the size of the three-dimensional space along the Z-axis direction, a cooling plate 50 may also be installed on the supporting vertical plate 42 to meet the heat dissipation of the first bending section 21 .

[0047] Please combine Figure 2 and Figure 3 Furthermore, the support seat 40 is constructed with an assembly groove 401 for accommodating the crimped hard copper busbar 20 for assembly positioning to avoid the crimped hard copper busbar 20 from shifting and shaking as much as possible. Among them, the support base plate 41 is correspondingly provided with a first assembly groove 4011, and the support vertical plate 42 is correspondingly provided with a second assembly groove 4012 as an example. As for the support base plate 41, the support base plate 41 is supported on the bottom of the crimped hard copper busbar 20, so the support base plate 41 is recessed downward from the upper surface with a first assembly groove 4011, and the first assembly groove 4011 is L-shaped, the long side of the L-shape is used for the assembly of the connecting section 23, and the short side of the L-shape is used for the assembly of the second bending section 22.

[0048] The thickness of the crimped hard copper bar 20 is less than the recessed depth of the first assembly groove 4011. Therefore, after the second bending section 22 and the connecting section 23 are inserted into the corresponding first assembly groove 4011, some space is left thereon for blowing air from the cooling plate 50 and for gas flow to achieve cooling.

[0049] In an alternative embodiment, a groove may be provided on the side of the cooling plate 50 facing the crimped hard copper busbar 20 so as to be buckled above the crimped hard copper busbar 20 to ensure space for gas flow.

[0050] It should be added that the matching mode of the support vertical plate 42 and the first bending section 21 is basically similar to the above, the shape of the second assembly groove 4012 is adapted to the first bending section 21, and the groove depth is greater than the thickness of the first bending section 21. When the support vertical plate 42 is connected to the cooling plate 50, there can be space for gas circulation.

[0051] Please combine Figure 1 , Figure 2 , Figure 5 and Figure 6 In some embodiments, there are multiple crimped soft copper bars 10, and the multiple crimped soft copper bars 10 are arranged at intervals along the first direction. Each crimped soft copper bar 10 is connected to a crimped hard copper bar 20 and a transfer copper bar 30, and each crimped hard copper bar 20 and each transfer copper bar 30 are arranged at intervals. The first direction is the width direction of the crimped soft copper bar 10, such as Figure 2 As shown, the width direction of the crimped soft copper busbar 10 is the X-axis direction, and the length direction is the Y-axis direction.

[0052] That is to say, by setting up multiple crimped soft copper bars 10, the connection of multiple power semiconductors 200 can be satisfied, and the simultaneous testing of multiple power semiconductors 200 can be achieved, thereby improving the testing efficiency. Among them, all the transfer copper bars 30 are used as a transfer group, and all the crimped soft copper bars 10 are used as a crimping group, and the transfer group is set on one side of the crimping group along the X-axis direction. Such a setting can ensure that the connection direction of each transfer copper bar 30 is consistent with the corresponding crimped soft copper bar 10, which is convenient for the installation of the crimped hard copper bar 20.

[0053] Further, take the example that the adapter group is set on the right side of the crimping group along the X-axis direction. Since multiple crimped soft copper bars 10 are arranged at intervals along the X-axis direction, among the multiple crimped soft copper bars 10, the ones located on the right side are closer to the adapter group, and the ones located on the left side are farther away from the adapter group. Therefore, the length of the crimped hard copper bar 20 corresponding to the crimped soft copper bar 10 closer to the adapter group is greater than the length of the crimped hard copper bar 20 corresponding to the crimped soft copper bar 10 farther away from the adapter group. In other words, according to the position of each crimped soft copper bar 10 relative to the adapter copper bar 30 along the X-axis direction, the length of the corresponding crimped hard copper bar 20 is matched to meet the connection requirements.

[0054] Furthermore, a plurality of transfer copper bars 30 are arranged at intervals along the length direction (i.e., the Y-axis direction) of the crimped soft copper bar 10. When the water-cooling assembly 70 is arranged close to the power semiconductor 200, the transfer group can be arranged on the side of the crimping group away from the power semiconductor 200 along the Y-axis direction, and the plurality of transfer copper bars 30 are arranged at intervals toward the side away from the power semiconductor 200. In this way, it can be ensured that the reserved three-dimensional space is relatively avoided by the water-cooling assembly 70, thereby reducing the assembly interference between the test circuit board 62 and the water-cooling assembly 70. Moreover, a plurality of crimped soft copper bars 10 are arranged at intervals along the X-axis direction, and a plurality of transfer copper bars 30 are arranged at intervals along the Y-axis direction to ensure the size of the three-dimensional space along the X-axis direction and the Y-axis direction.

[0055] Among them, the crimping group and the transition group are arranged at a right angle. Among the multiple crimping soft copper bars 10, the one closest to the transition group along the X-axis direction is the head soft copper bar, and the one farthest from the transition group is the end soft copper bar; among the multiple transition copper bars 30, the one closest to the crimping group along the Y-axis direction is the head transition copper bar, and the one farthest from the crimping group is the end transition copper bar. The length of the crimping hard copper bar 20 corresponding to the head soft copper bar and the head transition copper bar is smaller than the length of the crimping hard copper bar 20 corresponding to the end soft copper bar and the end transition copper bar; and, from the head end to the end, the length of the corresponding crimping hard copper bar 20 gradually increases. In this way, the crimping hard copper bar 20 with a larger length is located on the outside of the crimping hard copper bar 20 with a smaller length, so as to meet the connection between each crimping soft copper bar 10 and the corresponding transition copper bar 30.

[0056] Please combine Figure 3 and Figure 4 Exemplarily, the cooling plate 50 is constructed with an air supply passage 503, an air inlet 501 connected to the air supply passage 503, and a plurality of air blowing holes 502, the plurality of air blowing holes 502 are located on the side of the cooling plate 50 facing the crimped hard copper bar 20, the extension shape of the air supply passage 503 is adapted to the extension shape of the crimped hard copper bar 20, and the plurality of air blowing holes 502 are arranged at intervals along the extension direction of the air supply passage 503. Among them, the air inlet 501 can be connected to the air supply pipe to connect the cooling plate 50 with the air supply structure. The gas flows to the air supply passage 503 through the air inlet 501, and in the process of flowing along the air supply passage 503, it can be blown from the air blowing holes 502 at the bottom to the crimped hard copper bar 20 at the bottom to achieve heat dissipation. Moreover, it is precisely because the extension shape of the air supply passage 503 is adapted to the extension shape of the crimped hard copper bar 20 that it is ensured that there are corresponding crimped hard copper bars 20 along the gas delivery path, thereby improving the heat dissipation efficiency.

[0057] Further, taking the cooling plate 50 installed on the supporting base plate 41 as an example, the air supply duct 503 thereon includes a transverse air duct 5031 and a longitudinal air duct 5032. One crimped hard copper busbar 20 corresponds to a group of transverse air ducts 5031 and longitudinal air ducts 5032. The transverse air duct 5031 is arranged corresponding to the connecting section 23, and the longitudinal air duct 5032 is arranged corresponding to the second bending section 22 to ensure sufficient heat dissipation. When there are multiple crimped soft copper busbars 10, there are also multiple corresponding air supply ducts 503 on the cooling plate 50, and they are adapted to the arrangement position of the crimped hard copper busbars 20. Among them, multiple air supply ducts 503 can share one air inlet 501, or each air supply duct 503 can correspond to one air inlet 501; and each air supply duct 503 corresponds to multiple blowing holes 502 to facilitate gas diversion and ensure the heat dissipation range.

[0058] The diameter of the blowing hole 502 is smaller than the diameter of the air supply passage 503. Such a setting can change the flow cross section of the gas flow, thereby increasing the flow rate and pressure of the gas flowing from the air supply passage 503 to the blowing hole 502, so as to improve the heat dissipation effect.

[0059] Please continue to combine Figure 3 and Figure 4 In an optional embodiment, the support base plate 41 is constructed with a plurality of heat dissipation holes 4101 penetrating along the thickness direction thereof, and the plurality of heat dissipation holes 4101 are arranged at intervals along the extension direction of the crimped hard copper busbar 20. When the gas is blown toward the crimped hard copper busbar 20, it can flow out through the heat dissipation holes 4101 at the bottom of the support base plate 41, thereby achieving gas circulation, thereby avoiding the problem of excessive pressure affecting the stability of the crimped hard copper busbar due to the inability of the gas to enter or exit. In addition, the heat dissipation holes 4101 on the support base plate 41 can cause the bottom of the crimped hard copper busbar 20 to be exposed, which also has the effect of heat dissipation; at this time, the heat dissipation holes 4101 cooperate with the cooling plate 50 to improve the heat dissipation rate to ensure sufficient and timely heat dissipation.

[0060] In actual use, it can be selected whether to set the corresponding air supply duct 503 according to the length of the crimped hard copper bar 20. For example, in some embodiments, the corresponding crimped hard copper bar 20 between the first end soft copper bar and the first end transfer copper bar does not need to be provided with an air supply duct 503, because its length is relatively small, and the heat dissipation requirements can be met through the multiple heat dissipation holes 4101 at the bottom. In addition, considering the heat dissipation requirements of the first bending section 21, the air supply duct 503 of the corresponding cooling plate 50 is set in the vertical direction to adapt to the first bending section 21.

[0061] Please combine Figures 5 to 7 Optionally, the semiconductor test structure 100 further includes a probe fixing plate 61 and a test circuit board 62. The probe fixing plate 61 covers a side of the partially crimped hard copper busbar 20 away from the support seat 40, the probe fixing plate 61 is connected to the support seat 40, the probe fixing plate 61 is configured with a through hole, and the probe fixing plate 61 is configured with an avoidance hole 6101 for avoiding the crimped soft copper busbar 10; the test circuit board 62 is installed on the side of the probe fixing plate 61 away from the crimped hard copper busbar 20, and the circuit board pins 63 of the test circuit board 62 extend to the bottom of the probe fixing plate 61 through the through hole.

[0062] It is understandable that the probe fixing plate 61 is used to support the test circuit board 62 and isolate the test circuit board 62 from the crimped hard copper bus 20 to avoid direct contact between the two and adverse effects such as short circuit. At the same time, the avoidance hole 6101 is used to avoid direct contact between the crimped soft copper bus 10 and the test circuit board 62, further ensuring assembly safety. The test circuit board 62 can be installed on the probe fixing plate 61, and its circuit board pins 63 pass through the penetration holes to contact the power pins 210 of the power semiconductor 200 to achieve circuit conduction for testing.

[0063] Furthermore, the water cooling assembly 70 includes an upper waterway plate 71 and a lower waterway plate 72, which are arranged opposite to each other and spaced apart in the vertical direction. The power semiconductor 200 can be placed on the lower waterway plate 72, and the upper waterway plate 71 can move relative to the lower waterway plate 72 in the vertical direction, so as to facilitate the placement and removal of the power semiconductor 200. At the same time, the semiconductor test structure 100 also includes a carrier 80, and the upper waterway plate 71, the support seat 40 and the probe fixing plate 61 are all connected to the carrier 80 to form an integral structure, and the integral structure is surrounded by a cavity for accommodating the test circuit board 62. Since the semiconductor test structure 100 utilizes the setting that can press-fit the hard copper bus 20 to transfer the setting position of the transfer copper bus 30, sufficient three-dimensional space is reserved on the side of the press-fit soft copper bus 10 away from the water cooling assembly 70 along the Y-axis direction, so as to facilitate the installation of the test circuit board 62.

[0064] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A semiconductor test structure, characterized in that: The semiconductor test structure (100) comprises a crimped soft copper busbar (10), a crimped hard copper busbar (20) and a transfer copper busbar (30); The crimped hard copper bar (20) is connected between the crimped soft copper bar (10) and the transfer copper bar (30), and one end of the crimped soft copper bar (10) facing away from the crimped hard copper bar (20) is used to connect a power semiconductor (200), and one end of the transfer copper bar (30) facing away from the crimped hard copper bar (20) is used to connect a cable (90); The semiconductor test structure (100) further comprises a support seat (40) and a cooling plate (50), wherein the support seat (40) is supported on the crimped hard copper busbar (20), and the cooling plate (50) is mounted on the support seat (40) and is located above the crimped hard copper busbar (20), and the cooling plate (50) is used to dissipate heat from the crimped hard copper busbar (20).

2. The semiconductor test structure according to claim 1, characterized in that: In the vertical direction, the transfer copper bus (30) is located above the crimped soft copper bus (10), and the crimped hard copper bus (20) has a first bending section (21) at one end facing the transfer copper bus (30), and the first bending section (21) extends upward in the vertical direction, and the extended end of the first bending section (21) is connected to the transfer copper bus (30).

3. The semiconductor test structure according to claim 2, characterized in that: The crimped hard copper busbar (20) further comprises a second bending section (22) and a connecting section (23), wherein the connecting section (23) is connected between the second bending section (22) and the first bending section (21); The connecting section (23), the first bending section (21) and the second bending section (22) are arranged at an angle in pairs, and the second bending section (22) extends along the length direction of the crimped soft copper busbar (10), and the extended end of the second bending section (22) is connected to the corresponding crimped soft copper busbar (10).

4. The semiconductor test structure according to claim 3, characterized in that: The connecting section (23) and the second bending section (22) are located in a first plane.

5. The semiconductor test structure according to claim 3, characterized in that: The support seat (40) comprises a support base plate (41) and a support vertical plate (42) connected to the support base plate (41), wherein the support vertical plate (42) is arranged at an angle with the support base plate (41), the support base plate (41) is supported by the connecting section (23) and the second bending section (22), and the support vertical plate (42) is supported by the first bending section (21); Wherein, at least the supporting base plate (41) is connected to the cooling plate (50).

6. The semiconductor test structure according to claim 5, characterized in that: The supporting bottom plate (41) and / or the supporting vertical plate (42) are both provided with a mounting groove (401), the crimped hard copper busbar (20) is installed in the mounting groove (401), and the shape of the mounting groove (401) is adapted to the shape of the crimped hard copper busbar (20); Wherein, the thickness of the crimped hard copper busbar (20) is smaller than the recessed depth of the assembly groove (401).

7. The semiconductor test structure according to claim 1, characterized in that: The number of the crimped soft copper bars (10) is plural, and the plural crimped soft copper bars (10) are arranged at intervals along a first direction, and the first direction is the width direction of the crimped soft copper bars (10); Each of the crimped soft copper bars (10) is correspondingly connected to a crimped hard copper bar (20) and a transfer copper bar (30), and each of the crimped hard copper bars (20) and each of the transfer copper bars (30) are arranged at intervals; Among them, all the crimped soft copper bars (10) form a crimping group, and all the transition copper bars (30) form a transition group, and the transition group is arranged on one side of the crimping group along the first direction; among the plurality of crimped soft copper bars (10), the length of the crimped hard copper bar (20) corresponding to the crimped soft copper bar (10) close to the transition group is shorter than the length of the crimped hard copper bar (20) corresponding to the crimped soft copper bar (10) far from the transition group.

8. The semiconductor test structure according to claim 7, characterized in that: Among the plurality of crimped hard copper bars (20), the crimped hard copper bars (20) with a larger length are located outside the crimped hard copper bars (20) with a smaller length.

9. The semiconductor test structure according to claim 1, characterized in that: The cooling plate (50) is constructed with an air supply duct (503), an air inlet (501) and a plurality of air blowing holes (502) connected to the air supply duct (503), the plurality of air blowing holes (502) are located on a side of the cooling plate (50) facing the crimped hard copper busbar (20), the extension shape of the air supply duct (503) is adapted to the extension shape of the crimped hard copper busbar (20), and the plurality of air blowing holes (502) are arranged at intervals along the extension direction of the air supply duct (503); and / or, The support seat (40) is constructed with a plurality of heat dissipation holes (4101) penetrating along the thickness direction of the support seat, and the plurality of heat dissipation holes (4101) are arranged at intervals along the extension direction of the crimped hard copper busbar (20).

10. The semiconductor test structure according to any one of claims 1 to 9, characterized in that: The semiconductor test structure (100) further comprises: A probe fixing plate (61) covers a side of a portion of the crimped hard copper busbar (20) facing away from the support seat (40), the probe fixing plate (61) is connected to the support seat (40), the probe fixing plate (61) is configured with a through hole, and the probe fixing plate (61) is configured with an avoidance hole (6101) for avoiding the crimped soft copper busbar (10); A test circuit board (62) is mounted on a side of the probe fixing plate (61) away from the crimped hard copper busbar (20), and circuit board pins (63) of the test circuit board (62) extend through the through holes to below the probe fixing plate (61).

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