Heating device for oven and oven

Abstract

The utility model relates to the technical field of baking devices, and discloses a heating device for an oven, the oven comprises an inner container, and the heating device is arranged on the inner side wall of the inner container; the heating device comprises a transparent substrate and a conductive heating film. The transparent substrate is arranged on the inner side wall of the inner container; the conductive heating film is arranged on the transparent substrate and located between the transparent substrate and the inner side wall of the inner container, the conductive heating film is heated after being electrified, and heat is released to the inner container through the transparent substrate. Food materials can be quickly and evenly baked, loss of water in the food materials is reduced as much as possible, the taste of the food materials is good, and meanwhile a user can conveniently clean the inner container. The utility model further discloses the oven.

Description

Technical Field

[0001] The present application relates to the technical field of baking devices, for example, to a heating device for an oven and an oven. Background Art

[0002] At present, most existing ovens use radiant heat from electric heating elements to bake food. For example, a bent carbon steel heating tube is set at the top of the oven cavity to heat the food. Since the carbon steel heating tube is a linear heating tube, the food is heated unevenly; and the infrared radiation coefficient of the carbon steel heating tube is low, and its heating rate is slow.

[0003] In order to heat the food more evenly, the related technology provides an oven, including an inner pot, a heating tube is arranged on the top or bottom of the inner pot, and a fan is arranged on the side of the inner pot. The air is heated by the heating tube, and the hot air is blown toward the food by the fan to achieve the baking effect.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0005] The above baking method still has a slow heating rate and requires preheating, which takes a long time to bake. At the same time, more moisture in the food may be blown out of the surface of the food by the hot air, making the food taste worse. In addition, since the heating tube is set at the top of the inner pot, it is inconvenient for users to clean the inner pot.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] The disclosed embodiments provide a heating device for an oven and an oven, which can bake food quickly and evenly to minimize the loss of water in the food, thereby improving the taste of the food and making it easier for users to clean the inner pot.

[0009] In some embodiments, the heating device for an oven includes an inner pot, and the heating device is arranged on the inner side wall of the inner pot; the heating device includes a transparent substrate and a conductive heating film. The transparent substrate is arranged on the inner side wall of the inner pot; the conductive heating film is arranged on the transparent substrate and is located between the transparent substrate and the inner side wall of the inner pot. The conductive heating film generates heat after being energized, and releases heat to the inner pot through the transparent substrate.

[0010] In some embodiments, the conductive heating film includes an insulating layer, a heating layer, and a protective layer sequentially stacked on a transparent substrate.

[0011] In some embodiments, the material of the protection layer is an insulating material.

[0012] In some embodiments, the heating layer includes a conductor layer and a heating layer, the heating layer is a resistance layer, and the conductor layer has electrodes connected to a power supply.

[0013] In some embodiments, the heating device for an oven further includes: a heat insulation structure, which is arranged between the conductive heating film and the inner wall of the inner pot.

[0014] In some embodiments, the thermal insulation structure includes: a thermal insulation layer, which is arranged on the conductive heating film by means of a sealant, so that there is a gap between the thermal insulation layer and the conductive heating film to form an air layer.

[0015] In some embodiments, the thickness of the thermal insulation layer ranges from [2 mm, 5 mm], and the gap height of the air layer ranges from [5 mm, 10 mm].

[0016] In some embodiments, one or more fixing holes are disposed on the transparent substrate.

[0017] In some embodiments, the thickness of the transparent substrate is less than or equal to 5 mm.

[0018] In some embodiments, the oven comprises a heating device for an oven as described in the foregoing embodiments.

[0019] The heating device for an oven and the oven provided in the embodiments of the present disclosure can achieve the following technical effects:

[0020] A heating device is provided on the inner wall of the inner pot, wherein a conductive heating film is provided on a transparent substrate and is located between the transparent substrate and the inner wall of the inner pot. The conductive heating film generates heat after being energized, and releases heat to the inner pot through the transparent substrate. In this way, surface heating can be formed. Compared with ordinary heating tube heating, its heating area is larger, and rapid temperature rise can be achieved to achieve the effect of rapid baking of food. At the same time, it can also make the heating temperature of food more uniform and make the color of food more uniform. In addition, it can also reduce the loss of water in food, making the taste of food better. On this basis, the transparent substrate is a flat plate structure, so that there are fewer sanitary dead corners inside the inner pot, and it is also convenient for users to clean the inner pot.

[0021] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:

[0023] Figure 1 is a schematic structural diagram of a heating device for an oven provided in an embodiment of the present disclosure;

[0024] Figure 2 is a schematic structural diagram of another heating device for an oven provided by an embodiment of the present disclosure;

[0025] Figure 3 is a schematic structural diagram of another heating device for an oven provided by an embodiment of the present disclosure;

[0026] Figure 4 It is a schematic diagram of the structure of an oven provided in an embodiment of the present disclosure.

[0027] Reference numerals:

[0028] 10: transparent substrate; 11: fixing hole;

[0029] 20: conductive heating film; 21: insulating layer; 22: heating layer; 221: conductor layer; 222: heating layer; 223: electrode; 23: protective layer;

[0030] 30: thermal insulation structure; 31: thermal insulation layer; 32: sealant; 33: air layer;

[0031] 100: shell; 101: liner. DETAILED DESCRIPTION

[0032] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0033] The terms "first", "second", etc. in the specification and claims of the embodiments of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments of the embodiments of the present disclosure described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0034] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0035] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0036] Unless otherwise stated, the term "plurality" means two or more.

[0037] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B indicates: A or B.

[0038] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0039] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0040] At present, traditional ovens usually use resistance wire heating tubes at the top or bottom to heat the air, and then use fans to force convection to blow hot air to heat and bake the ingredients. However, this type of oven has many problems. For example, the oven heats up slowly (the infrared radiation coefficient of the resistance wire heating tube is small, generally around 0.3 to 0.4), and generally requires a preheating time of about 10 minutes, which means that users have to wait for a long time. At the same time, due to the preheating time of about 10 minutes, the moisture in the ingredients will be blown out of the surface of the ingredients with the hot air, and it is impossible to form a crispy outside and tender inside taste, resulting in a poor user experience. For example, the heat source is highly concentrated on the resistance wire heating tube set at the top, thus forming a large number of heating blind spots, resulting in different shades of color on the surface of the baked ingredients. For example, the resistance wire heating tube will also block the top area, making it inconvenient for users to clean the top area.

[0041] Combination Figure 1 As shown, the embodiment of the present disclosure provides a heating device for an oven, the oven includes an inner pot 101, and the heating device is arranged on the inner side wall of the inner pot 101; the heating device includes a transparent substrate 10 and a conductive heating film 20. The transparent substrate 10 is arranged on the inner side wall of the inner pot 101; the conductive heating film 20 is arranged on the transparent substrate 10 and is located between the transparent substrate 10 and the inner side wall of the inner pot 101. The conductive heating film 20 generates heat after being energized, and releases heat to the inner pot 101 through the transparent substrate 10.

[0042] The heating device for an oven provided by the embodiment of the present disclosure is used, and a heating device is arranged on the inner wall of the inner pot 101, wherein the conductive heating film 20 is arranged on the transparent substrate 10, and is located between the transparent substrate 10 and the inner wall of the inner pot 101. The conductive heating film 20 generates heat after being energized, and releases heat to the inner pot 101 through the transparent substrate 10. In this way, surface heating can be formed, and compared with ordinary heating tube heating, its heating area is larger, and rapid temperature rise can be achieved to achieve the effect of rapid baking of food; at the same time, the heating temperature of the food can be made more uniform, and the color of the food can be made more uniform; in addition, the loss of water in the food can be reduced, so that the taste of the food is better; on this basis, the transparent substrate 10 is a flat plate structure, so that there are fewer sanitary dead corners inside the inner pot 101, and it is also convenient for users to clean the inner pot 101.

[0043] In the embodiment of the present disclosure, the inner side wall of the inner container 101 includes a top wall, a bottom wall and a side wall between the top wall and the bottom wall, wherein the heating device (transparent substrate 10) can be arranged on the top wall, the bottom wall and / or the side wall, which is not limited here. Exemplarily, the heating device is arranged on the top wall of the inner container 101.

[0044] In the disclosed embodiment, the transparent substrate 10 is a high temperature resistant glass, such as graphene glass, which is a new type of functional glass formed by mixing graphene material with traditional glass. It has high strength, high toughness, high light transmittance, etc. In this way, the conductive heating film 20 can bake the food through the transparent substrate 10. In addition, the surface of the graphene glass is flat, and it also has the characteristics of easy cleaning and uniform temperature, so that it is convenient for users to clean the transparent substrate 10.

[0045] In the disclosed embodiment, the conductive heating film 20 is an electric heating element having a high infrared radiation coefficient and therefore has the characteristic of a fast temperature rise rate. This ensures that the surface of the food to be baked can be raised to a sufficiently high temperature at a faster rate to lock the moisture in the food and prevent it from evaporating, thereby making the food taste better.

[0046] In the disclosed embodiment, the conductive heating film 20 is formed by electronic slurry, which is in the form of a viscous paste or a thin viscous emulsion, and has nano-level, micron-level and mixed-level products. It has the advantages of simple structure, energy saving, fast heat transfer, and easy control of surface temperature. Among them, the heating principle of the conductive heating film 20 is based on the skin effect. Here, the electrons run fastest on the plane, and the current running on the plane will not generate thermal eddy currents, and its efficiency is the highest. Compared with traditional thermal inertia electric heating elements, energy saving is up to 36% or more, and the surface heat load is up to 200W / ㎝ 2 .

[0047] In the disclosed embodiment, the conductive heating film 20 can heat in the form of plane heat dissipation, with a wide heat radiation area and a fast diffusion speed. In this way, the heat source is more dispersed, and the heat can be efficiently transferred to the food, thereby eliminating the blind spot of heating and making the coloring effect on the surface of the food uniform and beautiful.

[0048] Combination Figure 2 As shown, in some embodiments, the conductive heating film 20 includes an insulating layer 21 , a heating layer 22 , and a protective layer 23 which are sequentially stacked on the transparent substrate 10 .

[0049] In the embodiment of the present disclosure, the conductive heating film 20 includes an insulating layer 21, a heating layer 22 and a protective layer 23. The insulating layer 21 is disposed on the transparent substrate 10, the heating layer 22 is stacked on the insulating layer 21, and the protective layer 23 is stacked on the heating layer 22. In this way, the insulating layer 21 can withstand the strong electric field of the heating layer 22 without being broken down. The insulating layer 21, the heating layer 22 and the protective layer 23 can be obtained by coating slurry.

[0050] In the embodiment of the present disclosure, the insulating medium slurry is coated on the transparent substrate 10 and then cured to form the insulating layer 21. Optionally, the insulating medium slurry is made of one or more of glass glaze, barium titanate, borosilicate and alumina ceramics.

[0051] In some embodiments, the insulating layer 21 can also be made of high-temperature resistant ceramic insulating material, which is not only resistant to high temperatures, but also has high volume resistivity, mechanical strength and good chemical stability. It is also resistant to aging, water and chemical corrosion, and has high thermal conductivity.

[0052] In some embodiments, the material of the protective layer 23 is an insulating material. In this way, the protective layer 23 can be used in conjunction with the insulating layer 21 to withstand the strong electric field of the heating layer 22 without being broken down.

[0053] In the embodiment of the present disclosure, the insulating medium slurry is coated on the heating layer 22 and then solidified to form the protective layer 23. Optionally, the insulating medium slurry is made of glass glaze.

[0054] Combination Figure 2 As shown, in some embodiments, the heating layer 22 includes a conductor layer 221 and a heating layer 222 , the heating layer 222 is a resistance layer, and the conductor layer 221 has an electrode 223 connected to a power supply.

[0055] In the embodiment of the present disclosure, the resistor paste is coated on the insulating layer 21 and cured to form the heating layer 222. Optionally, the material of the resistor paste includes one or a combination of silver palladium, silver platinum, nickel, tungsten, and graphene.

[0056] In the embodiment of the present disclosure, the conductor paste is coated on the heating layer 222 and then cured to form the conductor layer 221. Optionally, the material of the conductor paste includes one or a combination of gold, silver, platinum, copper, and nickel.

[0057] In the disclosed embodiment, the electrode 223 can be installed during or after the curing of the conductor layer 221. The electrode 223 led out of the silver paste is arranged on the side of the conductor layer 221, and the electrode 223 is connected to the electric control board of the oven to realize the electric heating. In this way, after the electrode 223 is energized, the infrared radiation coefficient of the heating device can reach 0.87, and the temperature can be increased at a rate of 80-150℃ / S to achieve the characteristics of rapid heating.

[0058] In the above embodiment, the insulating layer 21, the heating layer 222, the conductor layer 221 and the protective layer 23 are formed in sequence by screen printing process, and the insulating medium slurry, the resistance slurry, the conductor slurry and the insulating medium slurry are coated in sequence, and the high temperature sintering process is performed. The process is simple and easy to operate, and the insulating layer 21 and the protective layer 23 can be in full contact with the heating layer 22. Since the infrared transmittance of the transparent substrate 10 is strong, the conductive heating film 20 can emit infrared light waves of 2 microns to 16 microns.

[0059] In order to prevent the external temperature of the oven from being too high and reduce the heat loss of the inner pot 101, Figure 3 As shown, in some embodiments, the heating device for an oven further includes: a heat insulating structure 30 disposed between the conductive heating film 20 and the inner wall of the inner pot 101 .

[0060] In the disclosed embodiment, a heat insulation structure 30 is provided between the conductive heating film 20 and the inner wall of the inner pot 101. The heat insulation structure 30 plays a role of heat insulation. The heat insulation structure 30 can not only prevent the external temperature of the oven from being too high, thereby not affecting the ambient temperature of the oven, but also further reduce the heat loss of the inner pot 101, so as to further improve the baking effect.

[0061] Combination Figure 3 As shown, in some embodiments, the thermal insulation structure 30 includes: a thermal insulation layer 31, which is arranged on the conductive heating film 20 through a sealant 32, so that there is a gap between the thermal insulation layer 31 and the conductive heating film 20 to form an air layer 33.

[0062] In the embodiment of the present disclosure, the heat insulation structure 30 is composed of a heat insulation layer 31 and an air layer 33. The heat insulation layer 31 is provided with a metal layer on the side facing the air layer 33, and the metal layer is a metal sheet.

[0063] Here, the metal layer can effectively reflect the heat radiation of the conductive heating film 20, so that the conductive heating film 20 can enter the inner pot 101, thus further reducing the heat loss of the inner pot 101, so as to further improve the baking effect.

[0064] In the disclosed embodiment, the material of the heat insulation layer 31 may be aerogel or porous silicon.

[0065] Combination Figure 3 As shown, in some embodiments, the thickness of the heat insulation layer 31 is in the range of [2 mm, 5 mm], and the gap height of the air layer 32 is in the range of [5 mm, 10 mm].

[0066] In the disclosed embodiment, in order to ensure the volume of the liner, it is necessary to effectively control the thermal insulation structure 30. Here, the thickness of the thermal insulation layer 31 is in the range of [2mm, 5mm]. Optionally, the thickness of the thermal insulation layer 31 is in the range of [2.5mm, 4.5mm]. Optionally, the thickness of the thermal insulation layer 31 is in the range of [3mm, 4mm]. Optionally, the thickness of the thermal insulation layer 31 is 3mm.

[0067] In a specific application, the thickness of the heat insulation layer 31 is 3 mm. Of course, in other applications, the thickness of the heat insulation layer 31 can be selected from any value within [2 mm, 5 mm] and can be set according to actual needs.

[0068] In the disclosed embodiment, the gap height of the air layer 32 has a value range of [5 mm, 10 mm]. Optionally, the gap height of the air layer 32 has a value range of [6 mm, 9 mm]. Optionally, the gap height of the air layer 32 has a value range of [7 mm, 8 mm]. Optionally, the gap height of the air layer 32 is 7 mm.

[0069] In a specific application, the gap height of the air layer 32 is 7 mm. Of course, in other applications, the gap height of the air layer 32 can be selected from any value within [5 mm, 10 mm] and can be set according to actual needs.

[0070] Combination Figure 2 As shown, in some embodiments, one or more fixing holes 11 are provided on the transparent substrate 10. Thus, the transparent substrate 10 is fixed to the inner wall of the inner container 101 through the fixing holes 11.

[0071] In the disclosed embodiment, the transparent substrate 10 is rectangular in shape, and fixing holes 11 are provided at the four corners of the transparent substrate 10 , and bolts or screws are passed through the fixing holes 11 to connect and fix to the inner wall of the inner liner 101 .

[0072] In some embodiments, the thickness of the transparent substrate 10 is less than or equal to 5 mm. In this way, the space occupied by the transparent substrate 10 can be reduced, and the volume of the inner tank 101 can be increased while the power remains unchanged. Here, the thickness of the conductive heating film 20 is 0.4 mm.

[0073] Combination Figure 4 As shown, an embodiment of the present disclosure further provides an oven, comprising a heating device for an oven as described in the aforementioned embodiment.

[0074] In the disclosed embodiment, the oven further comprises a shell 100, a door body disposed on the shell 100, and an inner pot 101 disposed in the shell 100. The upper side wall of the inner pot 101 is provided with a heating device for the oven in the above embodiment, therefore, with reference to the above embodiment, at least the beneficial effects brought by the technical solution of the above embodiment are obtained, which will not be described one by one here.

[0075] In addition, a rack is provided on the inner wall of the inner pot, and a fan and an air induction structure are provided on the side of the rack, so that the heat conduction of the air can be accelerated to bake the food on the rack more quickly. At the same time, the oven is also provided with a temperature control system, which is connected to the heating device, the fan and the air induction structure to control the temperature of the inner pot.

[0076] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A heating device for an oven, characterized in that: The oven includes an inner container, and a heating device is arranged on the inner wall of the inner container; the heating device includes: A transparent substrate is arranged on the inner wall of the inner container; The conductive heating film is arranged on the transparent substrate and is located between the transparent substrate and the inner wall of the inner pot. The conductive heating film generates heat after being energized and releases heat to the inner pot through the transparent substrate.

2. The heating device according to claim 1, characterized in that The conductive heating film comprises an insulating layer, a heating layer and a protective layer which are sequentially stacked on a transparent substrate.

3. The heating device according to claim 2, characterized in that: The material of the protective layer is insulating material.

4. The heating device according to claim 2, characterized in that: The heating layer comprises a conductor layer and a heating layer, the heating layer is a resistance layer, and the conductor layer has electrodes connected to a power supply.

5. The heating device according to any one of claims 1 to 4, characterized in that: Also includes: The heat insulation structure is arranged between the conductive heating film and the inner wall of the inner tank.

6. The heating device according to claim 5, characterized in that: The insulation structure includes: The heat insulating layer is arranged on the conductive heating film by means of a sealant, so that there is a gap between the heat insulating layer and the conductive heating film to form an air layer.

7. The heating device according to claim 6, characterized in that The thickness of the thermal insulation layer ranges from [2mm, 5mm], and the gap height of the air layer ranges from [5mm, 10mm].

8. The heating device according to any one of claims 1 to 4, characterized in that: One or more fixing holes are arranged on the transparent substrate.

9. The heating device according to any one of claims 1 to 4, characterized in that: The thickness of the transparent substrate is less than or equal to 5 mm.

10. An oven, characterized in that: The invention comprises a heating device for an oven as claimed in any one of claims 1 to 9.

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