Semiconductor packaging epoxy resin weighing mechanism

Abstract

The utility model provides a semiconductor packaging epoxy resin weighing mechanism, and belongs to the technical field of weighing equipment. Comprising a base; the rotary table is rotationally mounted on the base table, and a driving mechanism for driving the rotary table to rotate is arranged on the base table; the weighing platform is arranged on the rotating platform, and a weighing sensor is assembled between the weighing platform and the rotating platform and used for weighing epoxy resin; the conveying belt and the frame bodies are arranged on the base table, the conveying belt and the pair of frame bodies are distributed around the rotating table, and material returning mechanisms capable of pushing epoxy resin away from the weighing table are arranged on the pair of frame bodies. According to the epoxy resin weighing device, the epoxy resin can be continuously weighed and classified and collected under the conditions that the epoxy resin is continuously conveyed by the rotating table, the epoxy resin is rotationally and continuously weighed by the rotating table, and the first material receiving box and the second material receiving box are matched with the material returning mechanism for classified material returning, so that the epoxy resin weighing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of weighing equipment, in particular to a semiconductor packaging epoxy resin weighing mechanism. Background Art

[0002] In semiconductor packaging, black glue (epoxy resin) is usually required to protect semiconductor chips by plastic sealing. Before the semiconductor automatic plastic sealing equipment loads the black glue for use, the black glue needs to be weighed and the black glue with insufficient weight is screened out to avoid poor plastic sealing of semiconductor chips due to insufficient black glue, resulting in product scrapping and increased production costs.

[0003] In the prior art, the utility model with application number 202321922196.0 discloses a semiconductor packaging epoxy resin weighing mechanism, comprising: a stand; a conveying component, arranged on the stand along a first direction, for conveying products to be weighed; a weighing platform, arranged on the stand along a second direction and relatively located on the side of the conveying component, the weighing platform comprising a weighing sensor and a tray arranged on the upper part of the weighing sensor; a clamping component, arranged directly above the weighing platform along the second direction, for conveying the conveying component to a predetermined position and clamping and conveying the product to the tray; the utility model can solve the problem that the black glue weighing mechanism of traditional semiconductor automatic sealing equipment cannot realize the machine to push and shift the weighed black glue while transporting the black glue, which results in the need for manual cleaning of materials when the equipment is stopped, or the use of other components to push the weighed black glue, which is not conducive to reducing the use of equipment components. However, in the prior art, although the weighed black glue on the tray can be automatically pushed, the epoxy resin is still weighed one by one, and the weighing efficiency of the epoxy resin needs to be improved. For this reason, the present application provides a semiconductor packaging epoxy resin weighing mechanism to meet the demand. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a semiconductor packaging epoxy resin weighing mechanism to solve the problem that the efficiency of the current method of weighing epoxy resins one by one needs to be improved.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0006] A semiconductor packaging epoxy resin weighing mechanism comprises a base; a rotating table rotatably mounted on the base, the base being provided with a driving mechanism for driving the rotating table to rotate; a weighing platform arranged on the rotating table, a weighing sensor being installed between the weighing platform and the rotating table for weighing epoxy resin; a conveyor belt and a frame arranged on the base, the frame being provided with a pair, the conveyor belt and the pair of frames being distributed around the rotating table, and the pair of frames being provided with a material return mechanism capable of pushing the epoxy resin away from the weighing platform.

[0007] Optionally, a plurality of weighing platforms are provided, and the plurality of weighing platforms are distributed in a ring shape on the sides of the upper surface of the rotating platform.

[0008] Optionally, a pair of the frames are respectively provided with a first material receiving box and a second material receiving box, and the first material receiving box and the second material receiving box are pull-out-type matched with the frames.

[0009] Optionally, a first material guide plate inclined downward is fixed to one end of the conveyor belt facing the rotating table, and an end of the first material guide plate away from the conveyor belt is located above the weighing platform.

[0010] Optionally, a baffle is provided on one side of the upper surface of the weighing platform close to the middle of the rotating platform.

[0011] Optionally, the baffle is configured to be in an arc shape, and a raised portion of the arc-shaped baffle faces one side of the middle portion of the rotating platform.

[0012] Optionally, the driving mechanism comprises a driving motor installed at the bottom of the base, a driving shaft of the driving motor is coaxially connected to the rotating table, and a conductive slip ring is sleeved on the driving shaft of the driving motor.

[0013] Optionally, a mounting rod is fixed to one end of the frame top facing the rotating table, and an upwardly inclined second material guide plate is fixed to the mounting rod, and one end of the second material guide plate away from the mounting rod is located below the weighing platform.

[0014] Optionally, the material stripping mechanism includes a fixing frame fixed on the frame, a first electric push rod vertically fixed on the fixing frame, a second electric push rod horizontally installed on the telescopic end of the first electric push rod, and a material stripping plate vertically fixed on the telescopic end of the second electric push rod, and the material stripping plate is located above the weighing platform.

[0015] Optionally, a mounting block is fixed to the telescopic end of the first electric push rod, and the mounting block is fixedly sleeved at the middle position of the second electric push rod. A sleeve arm is horizontally fixed to the side of the mounting block facing the rotating table, and an auxiliary arm is horizontally movably provided at one end of the sleeve arm away from the mounting block, and one end of the auxiliary arm extending out of the sleeve arm is fixedly connected to the stripping plate.

[0016] Compared with the prior art, the utility model has at least the following beneficial effects:

[0017] In the above scheme, through the arrangement of the rotating table and the conveyor belt, the conveyor belt can continuously convey the epoxy resin for semiconductor packaging toward the rotating table. After the epoxy resin approaches the rotating table, it falls onto the weighing table under the guidance of the first material guide plate. The epoxy resin is weighed by the weighing sensor installed between the weighing table and the rotating table. The weighed epoxy resin rotates with the rotating table to align with the frame, and is driven by the material return mechanism to push the epoxy resin to the first material receiving box or the second material receiving box on the frame for collection. When the epoxy resin is qualified, the epoxy resin follows the rotating table to align with the frame. The table rotates to align with the first material receiving box, and the material stripping plate is controlled to push the epoxy resin into the first material receiving box for collection. When the epoxy resin is unqualified in weighing, the epoxy resin follows the rotating table to rotate to align with the second material receiving box, and the material stripping plate is controlled to push the epoxy resin into the second material receiving box for collection. In this way, with the continuous transportation of the epoxy resin by the rotating table, the continuous weighing of the epoxy resin by the rotating table, and the classified material return of the first and second material receiving boxes in cooperation with the material stripping mechanism, the epoxy resin can be continuously weighed and classified and collected, thereby improving the weighing efficiency of the epoxy resin. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments of the present invention and, together with the description, further serve to explain the principles of the present invention and enable those skilled in the relevant art to make and use the present invention.

[0019] Figure 1 It is a schematic diagram of the overall structure of the semiconductor packaging epoxy resin weighing mechanism;

[0020] Figure 2 It is a schematic diagram of the structure of the rotating table of the semiconductor packaging epoxy resin weighing mechanism;

[0021] Figure 3 It is a structural schematic diagram of the frame and the material return mechanism;

[0022] Figure 4 It is a structural schematic diagram of the material return mechanism;

[0023] Figure 5 A schematic diagram of the structure of the frame.

[0024] [Reference Signs]

[0025] 1. Base; 2. Rotating table; 3. Conveyor belt; 4. Frame; 5. First material receiving box; 6. Second material receiving box; 7. Material return mechanism; 8. First material guide plate; 9. Weighing table; 10. Weighing sensor; 11. Driving motor; 12. Conductive slip ring; 13. Baffle bar; 14. Second material guide plate; 15. Fixed frame; 16. First electric push rod; 17. Second electric push rod; 18. Material return plate; 19. Mounting block; 20. Sleeve arm; 21. Auxiliary arm; 22. Mounting rod.

[0026] As shown in the figure, in order to clearly implement the structure of the embodiment of the utility model, specific structures and devices are marked in the figure, but this is only for illustrative purposes and is not intended to limit the utility model to the specific structure, device and environment. According to specific needs, ordinary technicians in this field can adjust or modify these devices and environments. DETAILED DESCRIPTION

[0027] The following is a detailed description of a semiconductor packaging epoxy resin weighing mechanism provided by the utility model in combination with the accompanying drawings and specific embodiments. At the same time, it is explained here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art may also adopt other alternative methods to implement some known technologies; and the accompanying drawings are only for a more specific description of the embodiments, and are not intended to specifically limit the utility model.

[0028] It should be noted that the references to "one embodiment", "embodiment", "exemplary embodiments", "some embodiments" and the like in the specification indicate that the embodiments described may include specific features, structures or characteristics, but not every embodiment may include the specific features, structures or characteristics. In addition, when a specific feature, structure or characteristic is described in conjunction with an embodiment, it should be within the knowledge of a person skilled in the art to implement such feature, structure or characteristic in conjunction with other embodiments (whether or not explicitly described).

[0029] In general, a term can be understood, at least in part, from its use in context. For example, depending, at least in part, on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense. Additionally, the term "based on" can be understood as not necessarily intended to convey an exclusive set of factors, but can instead, depending, at least in part, on the context, allow for the presence of other factors that are not necessarily explicitly described.

[0030] It is to be understood that the meanings of “on,” “over,” and “above” in the present invention should be interpreted in the broadest manner, so that “on” not only means “directly on” something, but also includes the meaning of being “on” something with intervening features or layers, and “on” or “above” not only means “on” or “above” something, but also includes the meaning of being “on” or “above” something with no intervening features or layers.

[0031] Additionally, spatially relative terms such as "under," "beneath," "lower," "above," "upper," and the like may be used herein for descriptive convenience to describe the relationship of one element or feature to another element or features, as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially relative descriptors used herein may be similarly interpreted accordingly.

[0032] like Figure 1 and Figure 2 As shown, an embodiment of the utility model provides a semiconductor packaging epoxy resin weighing mechanism, comprising a base 1; a rotating table 2 rotatably mounted on the base 1, the base 1 being provided with a driving mechanism for driving the rotating table 2 to rotate; a weighing table 9 arranged on the rotating table 2, a weighing sensor 10 being installed between the weighing table 9 and the rotating table 2 for weighing epoxy resin; a conveyor belt 3 and a frame 4 arranged on the base 1, the frame 4 being provided with a pair, the conveyor belt 3 and a pair of frames 4 being distributed around the rotating table 2, the pair of frames 4 being provided with a material return mechanism 7 capable of pushing the epoxy resin away from the weighing table 9, through the arrangement of the rotating table 2 and the conveyor belt 3, the conveyor belt 3 can be moved toward Epoxy resin for semiconductor packaging is continuously conveyed to the rotating table 2. After the epoxy resin approaches the rotating table 2, it falls onto the weighing table 9 under the guidance of the first guide plate 8. The epoxy resin is weighed by using the weighing sensor 10 installed between the weighing table 9 and the rotating table 2. The weighed epoxy resin rotates with the rotating table 2 to be aligned with the frame 4, and is pushed to the frame 4 for collection under the drive of the material return mechanism 7. Therefore, with the continuous conveying of the epoxy resin by the rotating table 2, the continuous weighing of the epoxy resin by the rotating table 2, and the returning of the epoxy resin by the frame 4 in cooperation with the material return mechanism 7, the continuous weighing and classified collection of the epoxy resin can be realized, thereby improving the weighing efficiency of the epoxy resin.

[0033] like Figure 1 and Figure 2As shown, the weighing platform 9 is provided with multiple weighing platforms 9, which are distributed in a ring shape on the side of the upper surface of the rotating platform 2, which is conducive to the simultaneous rotation and weighing of multiple epoxy resins, and improves the weighing efficiency. A pair of frames 4 are respectively provided with a first material receiving box 5 and a second material receiving box 6, which are pulled together with the frame 4 to collect qualified epoxy resins and unqualified epoxy resins. A first material guide plate 8 tilted downward is fixed to the end of the conveyor belt 3 facing the rotating platform 2, and the end of the first material guide plate 8 away from the conveyor belt 3 is located above the weighing platform 9, which is used to guide the epoxy resin on the rotating platform 2 to the weighing platform 9. A baffle 13 is provided on the side of the upper surface of the weighing platform 9 close to the middle of the rotating platform 2. The baffle 13 is arranged in an arc shape, and the arched part of the arc-shaped baffle 13 faces the middle side of the rotating platform 2, which is used to limit the epoxy resin falling on the weighing platform 9.

[0034] like Figure 1 and Figure 2 As shown, the driving mechanism includes a driving motor 11 installed at the bottom of the base 1. The driving shaft of the driving motor 11 is coaxially connected to the rotating table 2. The rotating table 2 can be driven to rotate by starting the driving motor 11. A conductive slip ring 12 is mounted on the driving shaft of the driving motor 11. The conductive slip ring 12 can ensure that the weighing sensor 10 can be connected to the circuit during the rotation of the rotating table 2.

[0035] like Figures 1 to 3 As shown, a mounting rod 22 is fixed to one end of the top of the frame 4 facing the rotating table 2, and an upwardly inclined second material guide plate 14 is fixed to the mounting rod 22. The end of the second material guide plate 14 away from the mounting rod 22 is located below the weighing platform 9, and is used to cooperate with the material return mechanism 7 to push the epoxy resin after weighing on the weighing platform 9 to the first material receiving box 5 or the second material receiving box 6.

[0036] like Figure 1 and Figures 3 to 5As shown, the material stripping mechanism 7 includes a fixing frame 15 fixed on the frame 4, a first electric push rod 16 vertically fixed on the fixing frame 15, a second electric push rod 17 horizontally installed at the telescopic end of the first electric push rod 16, and a material stripping plate 18 vertically fixed at the telescopic end of the second electric push rod 17. The material stripping plate 18 is located above the weighing platform 9. By starting the first electric push rod 16 to retract, the second electric push rod 17 and the material stripping plate 18 are driven to move downward as a whole. The material stripping plate 18 is between the epoxy resin and the baffle 13, and then the second electric push rod 17 is started. When the second electric push rod 17 contracts, the stripping plate 18 can push the epoxy resin to the first material receiving box 5 or the second material receiving box 6 on the frame 4 for collection. Specifically, when the epoxy resin is qualified in weighing, the epoxy resin follows the rotating table 2 to rotate to align with the first material receiving box 5, and the stripping plate 18 is controlled to push the epoxy resin into the first material receiving box 5 for collection. When the epoxy resin is unqualified in weighing, the epoxy resin follows the rotating table 2 to rotate to align with the second material receiving box 6, and the stripping plate 18 is controlled to push the epoxy resin into the second material receiving box 6 for collection.

[0037] like Figure 1 and Figures 3 to 5 As shown, a mounting block 19 is fixed to the telescopic end of the first electric push rod 16, and the mounting block 19 is fixedly sleeved at the middle position of the second electric push rod 17, which is conducive to keeping the second electric push rod 17 horizontal. A sleeve arm 20 is horizontally fixed to the side of the mounting block 19 facing the rotating table 2, and an auxiliary arm 21 is horizontally movably penetrated at one end of the sleeve arm 20 away from the mounting block 19. The end of the auxiliary arm 21 extending out of the sleeve arm 20 is fixedly connected to the stripping plate 18. The stripping plate 18 can be guided by the sleeve cooperation between the auxiliary arm 21 and the sleeve arm 20.

[0038] The working principle provided by the utility model is that when in use, the conveyor belt 3 conveys the epoxy resin for semiconductor packaging toward the rotating table 2. After the epoxy resin approaches the rotating table 2, it falls onto the weighing table 9 under the guidance of the first material guide plate 8. The epoxy resin is weighed by the weighing sensor 10 installed between the weighing table 9 and the rotating table 2. The weighed epoxy resin rotates with the rotating table 2 to align with the frame 4. By starting the first electric push rod 16 to retract, the second electric push rod 17 and the stripping plate 18 are driven to move downward as a whole. The stripping plate 18 is between the epoxy resin and the baffle 13. Then, the second electric push rod 17 is started to retract, and the stripping plate 18 can push the epoxy resin to the first receiving box 5 or the second receiving box 5 on the frame 4. The epoxy resin is collected in the second material receiving box 6. Specifically, when the epoxy resin is qualified in weighing, the epoxy resin follows the rotating table 2 to rotate to align with the first material receiving box 5, and the material return plate 18 is controlled to push the epoxy resin into the first material receiving box 5 for collection. When the epoxy resin is unqualified in weighing, the epoxy resin follows the rotating table 2 to rotate to align with the second material receiving box 6, and the material return plate 18 is controlled to push the epoxy resin into the second material receiving box 6 for collection. Therefore, with the continuous transportation of the epoxy resin by the rotating table 2, the continuous weighing of the epoxy resin by the rotating table 2, and the classified return of the first material receiving box 5 and the second material receiving box 6 in cooperation with the return mechanism 7, the epoxy resin can be continuously weighed and classified collected, thereby improving the weighing efficiency of the epoxy resin.

[0039] The present invention covers any substitution, modification, equivalent method and scheme made on the essence and scope of the present invention. In order to make the public have a thorough understanding of the present invention, specific details are described in detail in the following preferred embodiments of the present invention, and those skilled in the art can fully understand the present invention without the description of these details. In addition, in order to avoid unnecessary confusion about the essence of the present invention, well-known methods, processes, procedures, components and circuits are not described in detail.

[0040] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A semiconductor packaging epoxy resin weighing mechanism, It is characterized in that include: abutment; A rotating table rotatably mounted on a base, wherein a driving mechanism for driving the rotating table to rotate is disposed on the base; A weighing platform is arranged on the rotating platform, and a weighing sensor is installed between the weighing platform and the rotating platform for weighing epoxy resin; A conveyor belt and a frame are arranged on the base, wherein a pair of frames are arranged, the conveyor belt and the pair of frames are distributed around the rotating table, and a material return mechanism capable of pushing the epoxy resin away from the weighing table is arranged on the pair of frames.

2. The semiconductor packaging epoxy resin weighing mechanism according to claim 1, It is characterized in that There are multiple weighing platforms, which are distributed in a ring shape on the sides of the upper surface of the rotating platform.

3. The semiconductor packaging epoxy resin weighing mechanism according to claim 1, It is characterized in that A first material receiving box and a second material receiving box are respectively arranged on a pair of the frames, and the first material receiving box and the second material receiving box are pulled out and matched with the frames.

4. The semiconductor packaging epoxy resin weighing mechanism according to claim 1, It is characterized in that A first material guide plate that is tilted downward is fixed to one end of the conveyor belt facing the rotating table, and one end of the first material guide plate that is away from the conveyor belt is located above the weighing platform.

5. The semiconductor packaging epoxy resin weighing mechanism according to claim 1, It is characterized in that A blocking bar is arranged on one side of the upper surface of the weighing platform close to the middle of the rotating platform.

6. The semiconductor packaging epoxy resin weighing mechanism according to claim 5, It is characterized in that The baffle is configured to be in an arc shape, and the arched portion of the arc-shaped baffle faces one side of the middle portion of the rotating platform.

7. The semiconductor packaging epoxy resin weighing mechanism according to claim 1, It is characterized in that The driving mechanism comprises a driving motor installed at the bottom of the base, a driving shaft of the driving motor is coaxially connected with the rotating table, and a conductive slip ring is sleeved on the driving shaft of the driving motor.

8. The semiconductor packaging epoxy resin weighing mechanism according to claim 1, It is characterized in that A mounting rod is fixed to one end of the frame top facing the rotating platform, and a second material guide plate inclined upward is fixed to the mounting rod. An end of the second material guide plate away from the mounting rod is located below the weighing platform.

9. The semiconductor packaging epoxy resin weighing mechanism according to claim 1, It is characterized in that The material stripping mechanism includes a fixing frame fixed on the frame, a first electric push rod vertically fixed on the fixing frame, a second electric push rod horizontally installed on the telescopic end of the first electric push rod, and a material stripping plate vertically fixed on the telescopic end of the second electric push rod, wherein the material stripping plate is located above the weighing platform.

10. The semiconductor packaging epoxy resin weighing mechanism according to claim 9, It is characterized in that A mounting block is fixed to the telescopic end of the first electric push rod, and the mounting block is fixedly sleeved at the middle position of the second electric push rod. A sleeve arm is horizontally fixed to the side of the mounting block facing the rotating table, and an auxiliary arm is horizontally movably provided at one end of the sleeve arm away from the mounting block, and one end of the auxiliary arm extending out of the sleeve arm is fixedly connected to the stripping plate.

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