Heat dissipation assembly for high-voltage-resistant circuit board of high-voltage charging pile

Abstract

The heat dissipation assembly for the high-voltage-resistant circuit board of the high-voltage charging pile comprises a high-voltage charging pile body, a mounting plate is arranged at the position, close to the top, in the high-voltage charging pile body, and a first mounting notch and a second mounting notch are formed in the front side and the rear side of the mounting plate respectively. A heat dissipation shell is clamped to the front side of the mounting plate through a first mounting notch, heat dissipation nets are fixedly mounted on the left side and the right side of the heat dissipation shell, an aluminum oxide ceramic plate is clamped to the rear side of the mounting plate through a second mounting notch, and heat dissipation fins are fixedly mounted on the rear side of the aluminum oxide ceramic plate. According to the heat dissipation assembly for the high-voltage-resistant circuit board of the high-voltage charging pile, a plurality of heat dissipation structures are designed and comprise the heat dissipation shell, the heat dissipation net, the heat dissipation fan, the aluminum oxide ceramic plate, the heat dissipation fins and the heat conduction silica gel sheet, the structures work together, it is ensured that the circuit board can effectively dissipate heat in the high-voltage working state, the stable working temperature is maintained, and the service life is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of high-voltage resistant circuit boards, in particular to a heat dissipation component for a high-voltage resistant circuit board of a high-voltage charging pile. Background Art

[0002] High voltage resistant circuit board is an electronic circuit board specially designed to withstand high voltage and high current. With the rapid development of modern power electronics technology, especially in the fields of new energy vehicle charging, high voltage transmission, power conversion, etc., higher and higher requirements are put forward for the high voltage resistance performance of electronic equipment. Traditional circuit boards are often unable to cope with these high voltage environments, so high voltage resistant circuit boards came into being.

[0003] In actual use, some technical problems of high-voltage circuit boards used in high-voltage charging piles mainly include the following aspects:

[0004] Heat dissipation problem: Due to the high current and voltage of the charging pile, the circuit board may generate a lot of heat during operation. If the heat dissipation design is unreasonable, it is easy to cause the circuit board to rise too high, thus affecting its service life and stability. Therefore, how to effectively dissipate heat is a key issue that needs to be solved.

[0005] High voltage resistance: Circuit boards need to withstand higher voltages, which requires them to have good insulation and high voltage resistance. Once the insulation layer on the circuit board has problems or suffers voltage breakdown, it may cause charging failure or safety problems. Therefore, how to ensure the high voltage resistance of the circuit board is also an important technical issue. Utility Model Content

[0006] The purpose of the utility model is to provide a heat dissipation component for a high-voltage charging pile high-voltage circuit board to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heat dissipation component for a high-voltage charging pile resistant high-voltage circuit board, comprising a high-voltage charging pile body, a mounting plate is arranged near the top of the high-voltage charging pile body, a mounting slot one and a mounting slot two are respectively provided on the front and rear sides of the mounting plate, a heat dissipation shell is clamped on the front side of the mounting plate through the mounting slot one, a heat dissipation net is fixedly installed on the left and right sides of the heat dissipation shell, an alumina ceramic plate is clamped on the rear side of the mounting plate through the mounting slot two, a heat dissipation fin is fixedly installed on the rear side of the alumina ceramic plate, and an aluminum substrate is fixedly installed on the front side of the alumina ceramic plate, a circuit board body is fixedly installed on the top of the aluminum substrate, a V-shaped plate is fixedly installed at the four corners of the top of the circuit board body through a connecting rod, a thermal conductive silicone sheet is bonded between the V-shaped plate and the circuit board body, side grooves are provided at both ends of the top of the V-shaped plate, a moisture absorption plate is filled in the side grooves, and mounting rods are fixedly installed at the four corners of the top of the V-shaped plate.

[0008] Compared with the prior art, the beneficial effects of the utility model are:

[0009] 1. Efficient heat dissipation: The device is designed with multiple heat dissipation structures, including heat dissipation shell, heat dissipation net, heat dissipation fan, alumina ceramic plate, heat dissipation fins and thermal conductive silicone sheet. These structures work together to ensure that the circuit board can effectively dissipate heat under high-voltage working conditions, maintain a stable working temperature and extend its service life.

[0010] 2. High-voltage resistance: By using alumina ceramic plates and specially designed circuit boards, the device has good insulation performance and high-voltage resistance, and can work safely and reliably in high-voltage environments.

[0011] 3. Compact structure and modular design: The device adopts compact structure design and modular installation method, which is convenient for production, transportation, installation and maintenance.

[0012] 4. Protection and moisture-proof: By setting up V-shaped plates and moisture-absorbing plates, the device can prevent the influence of moisture and dust on the circuit board to a certain extent, and improve the reliability and stability of the equipment.

[0013] 5. Good ventilation design: There is an air inlet slot on the front side of the heat dissipation shell, which cooperates with the heat dissipation fan to form good air convection and further improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the interior of the high-voltage charging pile body of the utility model;

[0015] Figure 2 This is a schematic diagram of the structure of the heat dissipation housing of the utility model;

[0016] Figure 3 It is a bottom-view cross-sectional schematic diagram of the mounting plate and the heat dissipation housing of the utility model;

[0017] Figure 4 This is a three-dimensional structural diagram of the V-shaped plate of the utility model;

[0018] Figure 5 This is a three-dimensional structural diagram of the mounting plate of the utility model;

[0019] Figure 6 It is a rear view of the mounting plate structure of the utility model.

[0020] In the figure: 1. High-voltage charging pile body; 2. Mounting plate; 3. Heat dissipation shell; 4. Heat dissipation net; 5. Cooling fan; 6. Alumina ceramic plate; 7. Heat dissipation fins; 8. Aluminum base plate; 9. Circuit board body; 10. Thermal conductive silicone sheet; 11. V-shaped plate; 12. Side groove; 13. Moisture absorption plate; 14. Air inlet groove; 15. Mounting hole; 16. Mounting rod. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-6 The utility model provides a technical solution: a heat dissipation component for a high-voltage charging pile resistant high-voltage circuit board, comprising a high-voltage charging pile body 1, a mounting plate 2 is arranged at the top position of the high-voltage charging pile body 1, and a mounting slot 1 and a mounting slot 2 are respectively provided on the front and rear sides of the mounting plate 2, a heat dissipation shell 3 is clamped on the front side of the mounting plate 2 through the mounting slot 1, and a heat dissipation net 4 is fixedly installed on the left and right sides of the heat dissipation shell 3, an alumina ceramic plate 6 is clamped on the rear side of the mounting plate 2 through the mounting slot 2, and the alumina ceramic plate 6 A heat dissipation fin 7 is fixedly installed on the rear side, and an aluminum base plate 8 is fixedly installed on the front side of the alumina ceramic plate 6, a circuit board body 9 is fixedly installed on the top of the aluminum base plate 8, a V-shaped plate 11 is fixedly installed on the four corners of the top of the circuit board body 9 through connecting rods, a thermal conductive silicone sheet 10 is bonded between the V-shaped plate 11 and the circuit board body 9, side grooves 12 are opened at both ends of the top of the V-shaped plate 11, the side grooves 12 are filled with moisture absorbing plates 13, and mounting rods 16 are fixedly installed on the four corners of the top of the V-shaped plate 11.

[0023] Cooling fans 5 are arranged on both sides of the left and right sides of the heat dissipation shell 3. The front and rear sides of the heat dissipation fan 5 are respectively fixedly connected to two adjacent mounting rods 16. Threaded holes are provided at the top of the mounting rods 16 and the four corners of the top of the heat dissipation shell 3. The threaded holes are provided to facilitate the fixing of the heat dissipation shell 3 and the mounting rods 16.

[0024] The width of the V-shaped plate 11 is two-thirds of the width of the heat dissipation housing 3 . The heat generated by the circuit board body 9 can pass through the upper and lower sides of the V-shaped plate 11 with the air, and thus be sucked away by the heat dissipation fan 5 .

[0025] An exposed groove matching the heat sink fin 7 is provided on the rear side of the high-voltage charging pile body 1 , and the rear end of the heat sink fin 7 extends to the outside of the high-voltage charging pile body 1 . This arrangement can greatly accelerate the heat dissipation speed of the heat sink fin 7 .

[0026] An air inlet slot 14 is provided on the front side of the heat dissipation housing 3 , and mounting holes 15 are provided at the four corners of the front side of the mounting plate 2 .

[0027] When the high-voltage charging pile is working, the circuit board body 9 generates heat. The heat is first conducted to the alumina ceramic plate 6 through the aluminum substrate 8. The alumina ceramic plate 6 is an excellent insulator and thermal conductor, which can effectively conduct heat away from the circuit board body 9.

[0028] The rear side of the alumina ceramic plate 6 is fixedly mounted with heat dissipation fins 7, which greatly increase the heat dissipation area and improve the heat dissipation efficiency. At the same time, the rear end of the heat dissipation fins 7 extends to the outside of the high-voltage charging pile body 1, and is in direct contact with the outside air through the exposed groove, further accelerating the heat dissipation speed.

[0029] A V-shaped plate 11 is fixedly mounted above the circuit board body 9 through a connecting rod. A heat-conducting silicone sheet 10 is bonded between the V-shaped plate 11 and the circuit board body 9, so that the heat generated by the circuit board body 9 can be conducted to the V-shaped plate 11. Since the width of the V-shaped plate 11 is smaller than the width of the heat dissipation housing 3, air channels are formed on its upper and lower sides to facilitate convection dissipation of heat.

[0030] A cooling fan 5 is arranged in the heat dissipation shell 3. When the cooling fan 5 is working, it will inhale external cold air and take away the heat on the circuit board body 9 and the V-shaped plate 11 through the air channels on the upper and lower sides of the V-shaped plate 11, and then discharge it through the heat dissipation net 4 on both sides of the heat dissipation shell 3.

[0031] At the same time, an air inlet slot 14 is provided on the front side of the heat dissipation housing 3, which helps to increase the air intake of the heat dissipation fan 5 and improve the heat dissipation effect. The V-shaped plate 11 and the moisture absorption plate 13 work together to prevent moisture and dust from damaging the circuit board.

[0032] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation component for a high-voltage charging pile high-voltage circuit board, comprising a high-voltage charging pile body (1), Features: A mounting plate (2) is provided at a top position inside the pile body (1) of the high-voltage charging pile, and mounting slots 1 and 2 are respectively provided on the front and rear sides of the mounting plate (2), a heat dissipation shell (3) is clamped on the front side of the mounting plate (2) through the mounting slot 1, and heat dissipation nets (4) are fixedly installed on the left and right sides of the heat dissipation shell (3), an alumina ceramic plate (6) is clamped on the rear side of the mounting plate (2) through the mounting slot 2, and heat dissipation fins (7) are fixedly installed on the rear side of the alumina ceramic plate (6), and the front side of the alumina ceramic plate (6) is fixedly installed with a heat dissipation net (4). An aluminum substrate (8) is fixedly installed, a circuit board body (9) is fixedly installed on the top of the aluminum substrate (8), a V-shaped plate (11) is fixedly installed at the four corners of the top of the circuit board body (9) through connecting rods, a thermal conductive silicone sheet (10) is bonded between the V-shaped plate (11) and the circuit board body (9), side grooves (12) are opened at both ends of the top of the V-shaped plate (11), and moisture absorption plates (13) are filled in the side grooves (12), and mounting rods (16) are fixedly installed at the four corners of the top of the V-shaped plate (11).

2. A heat dissipation assembly for a high-voltage charging pile high-voltage circuit board according to claim 1, Features: The left and right sides of the heat dissipation shell (3) are both provided with heat dissipation fans (5), and the front and rear sides of the heat dissipation fan (5) are respectively fixedly connected to two adjacent mounting rods (16), and threaded holes are provided at the top of the mounting rods (16) and at the four corners of the top of the heat dissipation shell (3).

3. A heat dissipation assembly for a high-voltage charging pile high-voltage circuit board according to claim 1, Features: The width of the V-shaped plate (11) is two thirds of the width of the heat dissipation housing (3).

4. A heat dissipation assembly for a high-voltage charging pile high-voltage circuit board according to claim 1, Features: An exposure groove matching the heat dissipation fin (7) is provided on the rear side of the high-voltage charging pile body (1), and the rear end of the heat dissipation fin (7) extends to the outside of the high-voltage charging pile body (1).

5. A heat dissipation assembly for a high-voltage charging pile high-voltage circuit board according to claim 1, Features: An air inlet slot (14) is provided on the front side of the heat dissipation housing (3), and mounting holes (15) are provided on the four corners of the front side of the mounting plate (2).

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