Anti-coating-winding substrate positioning device for magnetron sputtering coating

Abstract

The utility model discloses an anti-winding plating substrate positioning device for magnetron sputtering coating, which comprises a substrate positioning frame, a plurality of positioning areas are arranged on the substrate positioning frame, each positioning area is used for positioning a substrate, the positioning areas are distributed in an array, a barrier strip is arranged between every two adjacent positioning areas, and the barrier strips are arranged on the substrate positioning frame. The barrier strip is used for covering a gap formed by two adjacent substrates. According to the anti-winding-plating substrate positioning device for magnetron sputtering coating, the substrate positioning frame is arranged, the substrates are limited and fixed through the positioning areas on the substrate positioning frame, and meanwhile, a gap formed by every two adjacent substrates is covered with the barrier strip, so that target molecules are prevented from winding around the front surfaces of the substrates through the gaps, and the target molecules are prevented from winding around the front surfaces of the substrates. And plating on the back surface of the substrate to form a winding plating problem.

Description

Technical Field

[0001] The utility model relates to the technical field of production and manufacturing of touch display screens, in particular to an anti-wrap-around-plating substrate positioning device for magnetron sputtering coating. Background Art

[0002] The magnetron sputtering coating process is a common process in the production of touch screens. Magnetron sputtering coating refers to coating a layer of the required material on the surface of the substrate. Under the action of the magnetic field, the target material molecules are sputtered onto the substrate along the direction of the Lorentz force to complete the coating. However, the existing substrate positioning method for magnetron sputtering coating is usually simple in structure. Usually, the substrate is directly placed on the substrate rack for coating. When the substrate rack is a multi-channel substrate rack, that is, when multiple substrates are placed on the substrate rack, a certain gap will be formed between two adjacent substrates. And because there is a certain curvature between the Lorentz magnetic force and the glass substrate, the target material molecules will bypass the front surface of the substrate through the gap and be plated on the back of the substrate, forming a bypass plating problem. Utility Model Content

[0003] The utility model aims to overcome the shortcomings of the prior art and provide a substrate positioning device for magnetron sputtering coating to prevent winding.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A substrate positioning device for magnetron sputtering coating to prevent winding, comprising: a substrate positioning frame, on which a plurality of positioning areas are arranged, each of which is used to perform a positioning operation on a substrate, each of which is distributed in an array, and a barrier strip is arranged between two adjacent positioning areas, and the barrier strip is used to cover a gap formed by two adjacent substrates.

[0006] In one embodiment, the barrier strip is detachably disposed on the substrate positioning frame.

[0007] In one embodiment, the central area of ​​each positioning zone is a clearance hole, and positioning bosses are arranged around the clearance hole, and the positioning bosses are used to support and limit the substrate.

[0008] In one embodiment, the substrate positioning frame is a titanium alloy substrate positioning frame.

[0009] In one embodiment, six positioning areas are provided, and each of the positioning areas is distributed in a rectangular array.

[0010] In one of the embodiments, a fixing component is further included, one end of the fixing component is disposed on the substrate positioning frame, and the other end of the fixing component faces the substrate, and the fixing component is used to limit the substrate.

[0011] In one embodiment, the fixing assembly includes a fixing column and a rotating abutment block, the fixing column is mounted on the substrate positioning frame, the rotating abutment block can be rotatably mounted on the fixing column, and when the substrate is located on the positioning area, the rotating abutment block is used to limit the substrate.

[0012] In one embodiment, the rotating abutting block includes a rotating portion and a abutting portion, the rotating portion is sleeved on the fixing column, and the abutting portion is disposed on the rotating portion.

[0013] In one embodiment, a plurality of fixing components are provided, and each of the fixing components is disposed on the substrate positioning frame at intervals.

[0014] In one of the embodiments, the substrate positioning frame is further provided with an avoidance groove, the avoidance groove is located on one side of the positioning area, and the fixing assembly is located in the avoidance groove.

[0015] Compared with the prior art, the utility model has at least the following advantages:

[0016] The utility model discloses a substrate positioning device for magnetron sputtering coating to prevent winding plating, by setting a substrate positioning frame, and fixing the substrate by a positioning area on the substrate positioning frame, and at the same time covering a gap formed by two adjacent substrates by a barrier strip, so as to prevent target material molecules from bypassing the front surface of the substrate through the gap and being plated on the back side of the substrate, thus causing winding plating problem. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0018] Figure 1 It is a schematic structural diagram of a substrate positioning device for magnetron sputtering coating in one embodiment of the utility model;

[0019] Figure 2 It is a structural schematic diagram of a substrate removed from an anti-wrap-around substrate positioning device for magnetron sputtering coating in one embodiment of the utility model;

[0020] Figure 3 for Figure 2 A schematic diagram of the partially enlarged structure of the A tool of the anti-winding plating substrate positioning device for magnetron sputtering coating. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0022] See also Figure 1 , Figure 2 and Figure 3 As shown, a substrate positioning device 10 for magnetron sputtering coating to prevent winding coating comprises: a substrate positioning frame 100, on which a plurality of positioning areas are arranged, each positioning area is used to perform positioning operation on a substrate 20, each positioning area is distributed in an array, and a barrier strip 110 is arranged between two adjacent positioning areas, and the barrier strip 110 is used to cover the gap formed by two adjacent substrates 20.

[0023] It should be noted that the substrate 20 is limited and fixed by the positioning area on the substrate positioning frame 100, and the gap formed by two adjacent substrates 20 is covered by the barrier strip 110 to prevent the target material molecules from bypassing the front surface of the substrate 20 through the gap and being plated on the back side of the substrate 20 to cause the bypass plating problem, thereby improving the coating quality of the product.

[0024] In one embodiment, the barrier strip 110 is detachably mounted on the substrate positioning frame 100. In this way, the width of the barrier strip 110 can be changed to match the gap formed by substrates 20 of different sizes. For example, the barrier strip 110 is mounted on the substrate positioning frame 100 using bolts or screws, so that the barrier strip 110 can be easily removed and installed.

[0025] In one embodiment, the central area of ​​each positioning area is an avoidance hole 120, and a positioning boss 130 is arranged around the avoidance hole 120. The positioning boss 130 is used to hold and limit the substrate 20. The avoidance hole 120 can reduce the contact area between the substrate 20 and the substrate positioning frame 100, thereby preventing foreign matter from being on the substrate positioning frame 100 and damaging the substrate.

[0026] In one embodiment, the substrate positioning frame 100 is a titanium alloy substrate positioning frame. Since the titanium alloy material has good rigidity and strength, the stability of the overall structure of the substrate positioning frame 100 can be ensured. At the same time, the hardness of the titanium alloy material is lower than that of other metal materials, so the substrate positioning frame material can be prevented from being too hard and scratching the substrate.

[0027] Preferably, six positioning areas are provided, each of which is in a rectangular array. A barrier strip 110 is provided between each two adjacent positioning areas, and a plurality of positioning areas are provided, so that a plurality of substrates 20 can be coated at one time.

[0028] In one embodiment, the anti-winding substrate positioning device 10 for magnetron sputtering coating further includes a fixing assembly 200, one end of which is disposed on the substrate positioning frame 100, and the other end of the fixing assembly 200 faces the substrate 20, and the fixing assembly 200 is used to limit the substrate 100. The substrate on the positioning area is fixed by the fixing assembly 200, so that the substrate is located between the positioning boss 130 and the fixing assembly 200, thereby ensuring the stability of the substrate. In another embodiment, a positioning slot is disposed on the substrate positioning frame 100 on the opposite side of the fixing assembly 200, and one side of the substrate is clamped by the positioning slot, while the fixing assembly fixes the other side of the substrate, thereby ensuring the stability of the substrate and preventing the substrate from flipping and collapsing.

[0029] In one embodiment, the fixing assembly 200 includes a fixing column 210 and a rotating abutment block 220. The fixing column 210 is mounted on the substrate positioning frame 130. The rotating abutment block 220 can be rotatably sleeved on the fixing column 210. When the substrate is located on the positioning area, the rotating abutment block 220 is used to limit the position of the substrate 20. When the substrate 20 needs to be placed on the positioning area, it is only necessary to rotate the rotating abutment block 220 away from the positioning area. In this way, the substrate 20 can be placed on the positioning area. Then, the rotating abutment block 220 is rotated back to the initial position, and the substrate 20 is limited by the rotating abutment block 220; for example, the fixing column 210 has a threaded threaded column, and the fixing column is threadedly connected to the substrate positioning frame 100. Specifically, the rotating supporting block 220 includes a rotating portion and a supporting portion 221. The rotating portion is sleeved on the fixed column 210, and the supporting portion 221 is arranged on the rotating portion. The supporting portion 221 is a strip structure. While ensuring the stable positioning of the substrate, the area of ​​the supporting portion 221 should be as small as possible to avoid the supporting portion 221 blocking most of the area and affecting the coating effect.

[0030] In one embodiment, a plurality of fixing assemblies 200 are provided, and each fixing assemblies 200 is disposed at intervals on the substrate positioning frame 100. For example, two fixing assemblies 200 are provided, and the two fixing assemblies 200 are disposed at intervals, and the substrate 20 is fixed at different positions by the fixing assemblies 200, thereby ensuring the stability of the substrate 20.

[0031] Furthermore, the substrate positioning frame 100 is also provided with an avoidance groove 140, which is located on one side of the positioning area, and the fixing assembly 200 is located in the avoidance groove 140. One side of the avoidance groove 140 extends toward the direction close to the positioning area and forms an opening. The avoidance groove 140 is provided to ensure that the substrate positioning frame 100 has sufficient thickness to ensure the strength of the substrate positioning frame 100, and at the same time, the fixing assembly can be arranged in an area closer to the positioning boss 130, so the avoidance groove 140 is provided so that the fixing assembly 200 can limit the substrate 20.

[0032] Furthermore, a void groove 150 is also provided on the substrate positioning frame 100, one side of the void groove 150 extends toward the positioning area and forms an opening. Through the void groove 150, the operator can place the substrate 20 in the positioning area or remove the substrate from the positioning area.

[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A substrate positioning device for magnetron sputtering coating to prevent winding, It is characterized in that include: A substrate positioning frame is provided with a plurality of positioning areas, each of which is used to position a substrate, each of which is distributed in an array, and a barrier strip is provided between two adjacent positioning areas, and the barrier strip is used to cover a gap formed by two adjacent substrates.

2. The anti-winding substrate positioning device for magnetron sputtering coating according to claim 1, It is characterized in that The baffle strip is detachably arranged on the substrate positioning frame.

3. The anti-winding substrate positioning device for magnetron sputtering coating according to claim 2, It is characterized in that The central area of ​​each positioning zone is a clearance hole, and positioning bosses are arranged around the clearance hole. The positioning bosses are used to hold and limit the substrate.

4. The anti-winding substrate positioning device for magnetron sputtering coating according to claim 1, It is characterized in that The substrate positioning frame is a titanium alloy substrate positioning frame.

5. The anti-winding substrate positioning device for magnetron sputtering coating according to claim 1, It is characterized in that There are six positioning areas, and each of the positioning areas is distributed in a rectangular array.

6. The anti-winding substrate positioning device for magnetron sputtering coating according to claim 1, It is characterized in that It also includes a fixing component, one end of which is arranged on the substrate positioning frame, and the other end of which faces the substrate, and the fixing component is used to limit the substrate.

7. The anti-winding substrate positioning device for magnetron sputtering coating according to claim 6, It is characterized in that The fixing assembly includes a fixing column and a rotating abutment block, wherein the fixing column is mounted on the substrate positioning frame, and the rotating abutment block can be rotatably sleeved on the fixing column. When the substrate is located on the positioning area, the rotating abutment block is used to limit the substrate.

8. The anti-winding substrate positioning device for magnetron sputtering coating according to claim 7, It is characterized in that The rotating abutting block comprises a rotating portion and an abutting portion, wherein the rotating portion is sleeved on the fixing column, and the abutting portion is arranged on the rotating portion.

9. The anti-winding substrate positioning device for magnetron sputtering coating according to claim 7, It is characterized in that A plurality of fixing components are provided, and each of the fixing components is arranged on the substrate positioning frame at intervals.

10. The anti-winding substrate positioning device for magnetron sputtering coating according to claim 9, It is characterized in that The substrate positioning frame is further provided with an avoidance groove, the avoidance groove is located on one side of the positioning area, and the fixing component is located in the avoidance groove.

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