Kitchen heat exchanger
By designing a kitchen heat exchanger using semiconductor refrigeration sheets, using the cooling end to cool down and heating end to heat, the problems of energy waste and drying in the prior art are solved, and efficient refrigeration and drying of kitchen supplies are achieved. .
Patent Information
- Application Number
- CN202421014956.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-10
- Publication Date
- 2024-12-20
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing semiconductor refrigeration refrigeration boxes cannot effectively utilize the heat generated by the refrigeration sheet, resulting in waste of energy and cannot be used to dry kitchen supplies such as chopstick cages and chopping boards.
A kitchen heat exchanger is designed, which uses the refrigeration end of the semiconductor refrigeration sheet to cool the box for refrigeration or frozen food. At the same time, it uses its heating end to heat water, and dry items through the heat sink plate through the heat sink to achieve effective energy. use.
Effectively utilizes the cooling capacity and heat produced by semiconductor refrigeration sheets, which can be used to refrigerate or freeze food, and dry items, reducing energy waste, and strengthening convection through fans, improving drying effect and cooling guidance. Effect.
Smart Images

Figure CN222210900U_ABST
Abstract
Description
Technical field:
[0001] The utility model belongs to the technical field of kitchen appliances, in particular to a kitchen heat exchanger. Background technology:
[0002] There is usually water in the chopstick cage and at the bottom of the chopping board in the kitchen, and the rag is also wet, which makes it easy for mold and bacteria to grow. At the same time, food is easy to spoil when the weather is hot.
[0003] In order to slow down food spoilage, a Chinese utility model patent (publication number CN201508091U, application date 2009.08.21, publication date 2010.06.16) discloses a semiconductor refrigeration refrigerator, including a refrigerator, a semiconductor refrigeration sheet, a cold-end heat exchanger, a hot-end heat exchanger, a heat dissipation space, a heat-resistant cover and a heat-resistant cover controller. The refrigerator includes an outer shell of the refrigerator, an insulation layer of the refrigerator and an inner shell of the refrigerator; the semiconductor refrigeration sheet is arranged in the insulation layer of the refrigerator, and the cold-end heat exchanger is arranged in the refrigerator, close to one end of the semiconductor refrigeration sheet; the hot-end heat exchanger is close to the other end of the semiconductor refrigeration sheet and is in the heat dissipation space; the heat-resistant cover is arranged in the refrigerator, and a heat-resistant cover controller is installed on the heat-resistant cover, and the heat-resistant cover is controlled by the heat-resistant cover controller so that the heat-resistant cover covers the cold-end heat exchanger or leaves the cold-end heat exchanger.
[0004] The disadvantages of the above semiconductor refrigeration refrigerator are that the heat generated by the semiconductor refrigeration sheet is not utilized, resulting in energy waste, and the items that need to be dried, such as chopstick cages, cutting boards, and rags, cannot be dried. Summary of the invention:
[0005] The utility model aims to provide a kitchen heat exchanger which can utilize the coldness and heat produced by semiconductor refrigeration sheets to reduce energy waste and can be used for refrigerating or freezing food as well as drying articles.
[0006] The utility model is achieved in this way:
[0007] A kitchen heat exchanger comprises a box body and a heat sink with a water flow path inside, a cooler is arranged inside the box body, a water tank is arranged outside the box body, a semiconductor refrigeration sheet is arranged between the cooler and the water tank, the cooler is close to the cooling end of the semiconductor refrigeration sheet, the water tank is close to the heating end of the semiconductor refrigeration sheet, the water inlet of the water tank is connected to the water outlet of the heat sink through a first pipe, the water outlet of the water tank is connected to the water inlet of the heat sink through a second pipe, and a water pump is arranged on the first pipe or the second pipe.
[0008] In the above-mentioned kitchen heat exchanger, the heat dissipation plate includes a plurality of heat dissipation tubes arranged at intervals and a heat dissipation belt arranged between two adjacent heat dissipation tubes, and a water flow path is arranged in the heat dissipation tube.
[0009] In the above-mentioned kitchen heat exchanger, a first fan is provided below the heat dissipation plate, and a second fan is provided on the side of the cooler.
[0010] In the above-mentioned kitchen heat exchanger, a padding block is provided below the fan.
[0011] In the above-mentioned kitchen heat exchanger, it also includes a controller electrically connected to the power supply and a temperature sensor for detecting the temperature inside the box. The semiconductor refrigeration plate, water pump, fan one, fan two, and temperature sensor are electrically connected to the controller respectively.
[0012] In the above-mentioned kitchen heat exchanger, the cooling device is block-shaped, and a plurality of ventilation slots are arranged inside the cooling device, and the second fan is arranged on a side of the cooling device having the ventilation slots.
[0013] In the above-mentioned kitchen heat exchanger, the box body includes a main body with an open upper end and a cover body covered on the main body, and the cover body includes a fixed cover fixedly connected to the main body and a rotating cover hinged on the fixed cover.
[0014] In the above-mentioned kitchen heat exchanger, the lower edge of the fixed cover that is not connected to the rotating cover is sealed to the box body by adhesive tape 1, and the fixed cover is connected to the rotating cover by adhesive tape 2.
[0015] In the above-mentioned kitchen heat exchanger, the water tank is arranged above the cooling device and is fixedly connected to the cooling device by nylon screws.
[0016] In the above-mentioned kitchen heat exchanger, the fixed cover is provided with a mounting groove for the water tank to extend into, and a mounting plate is provided on the side of the bottom of the water tank. Nylon screws pass through the mounting plate and are screwed to the cooler.
[0017] In the above-mentioned kitchen heat exchanger, the lower surface of the water tank is flush with the lower surface of the fixed cover, and the water tank and the fixed cover are fixedly connected by tape three, and the tape three is adhered to the side of the water tank and the upper surface of the fixed cover.
[0018] In the above-mentioned kitchen heat exchanger, a lifting block is provided below the cooler, and a mounting plate is provided below the lifting block.
[0019] In the above-mentioned kitchen heat exchanger, it also includes a liquid level column for displaying the liquid level in the water tank.
[0020] In the above-mentioned kitchen heat exchanger, a water inlet hole, a liquid level hole and a water outlet hole are provided at the bottom of the water tank, the water inlet hole is connected to the first pipe, the liquid level hole is connected to the liquid level column, and the water outlet hole is connected to the second pipe.
[0021] In the above-mentioned kitchen heat exchanger, a heat insulation cotton is provided between the cooling device and the water tank and is arranged around the outer periphery of the semiconductor refrigeration plate.
[0022] In the above-mentioned kitchen heat exchanger, the box body is a foam box, and the heat sink and the cooler are made of aluminum or copper.
[0023] In the above-mentioned kitchen heat exchanger, the tape one, tape two and tape three are aluminum foil tapes or Teflon tapes.
[0024] The outstanding advantages of the utility model compared with the prior art are:
[0025] 1. The utility model cools down the box through the cooling end of the semiconductor refrigeration sheet, which is used for refrigerating or freezing food. At the same time, the heating end of the semiconductor refrigeration sheet heats water, and then the hot water flows through the heat sink to dry the items placed on the heat sink, effectively utilizing the coldness and heat generated by the semiconductor refrigeration sheet to reduce energy waste;
[0026] 2. A fan 1 is provided below the heat sink of the utility model, and a fan 2 is provided on the side of the cooler, which effectively enhances convection, improves the drying effect of the heat sink and the cooling effect of the cooler;
[0027] 3. The water tank of the utility model is arranged above the cooler and is fixedly connected to the cooler by nylon screws, which can reduce heat conduction. At the same time, the installation structure is simple and easy to install. Description of the drawings:
[0028] Figure 1 It is a three-dimensional diagram of the utility model;
[0029] Figure 2 It is a three-dimensional diagram of the main body, the cooler, the semiconductor cooling sheet, the second fan, the lifting block and the mounting plate of the utility model;
[0030] Figure 3 It is a three-dimensional diagram of the cover body and the water tank of the utility model;
[0031] Figure 4 It is a three-dimensional diagram of the cooling device of the utility model;
[0032] Figure 5 It is a three-dimensional diagram of the utility model without a heat sink and a water pump and with the rotating cover in an open state;
[0033] Figure 6 It is a three-dimensional diagram of the heat dissipation plate and the fan of the utility model;
[0034] Figure 7 It is a partial stereogram of the utility model.
[0035] Figure numerals: 1, box body; 1a, main body; 1b, cover body; 1b1, fixed cover; 1b2, rotating cover; 2, heat sink; 3, cooler; 4, water tank; 5, semiconductor refrigeration plate; 6, pipe one; 7, pipe two; 8, water pump; 9, fan one; 10, fan two; 11, controller; 12, ventilation slot; 13, tape one; 14, tape two; 15, nylon screw; 16, lifting block; 17, mounting plate; 18, liquid level column; 19, tape three; 20, water inlet hole; 21, liquid level hole; 22, water outlet hole. Specific implementation method:
[0036] The present invention is further described below with reference to specific embodiments. Figure 1 —7:
[0037] A kitchen heat exchanger includes a box body 1 and a heat sink 2 with a water flow path inside, a cooler 3 is provided inside the box body 1, a water tank 4 is provided outside the box body 1, a semiconductor cooling sheet 5 is provided between the cooler 3 and the water tank 4, the cooler 3 is close to the cooling end of the semiconductor cooling sheet 5, the water tank 4 is close to the heating end of the semiconductor cooling sheet 5, the water inlet of the water tank 4 is connected to the water outlet of the heat sink 2 through a pipe 1 6, the water outlet of the water tank 4 is connected to the water inlet of the heat sink 2 through a pipe 2 7, and a water pump 8 is provided on the pipe 1 6 or the pipe 2 7. In this embodiment, the water pump 8 is provided on the pipe 1 6, and two semiconductor cooling sheets 5 are provided.
[0038] The working principle of the utility model is as follows: Figure 1-7 As shown, the semiconductor refrigeration sheet 5 is energized, the cooling end of the semiconductor refrigeration sheet 5 cools and transfers the cold energy to the cooling device 3 arranged in the box body 1, and the cooling device 3 transfers the cold energy to the box body 1 to cool the box body 1, which can be used for refrigerating or freezing food; the heating end of the semiconductor refrigeration sheet 5 generates heat and transfers the heat to the water in the water tank 4, and the water in the water tank 4 flows to the heat sink 2 through the water outlet of the water tank 4, the pipe 2 7, and the water inlet of the heat sink 2 under the pressure provided by the water pump 8, and flows into the water tank 4 through the water outlet of the heat sink 2, the pipe 1 6, and the water inlet of the water tank 4, forming a water circulation, and the items that need to be dried, such as chopstick cages, cutting boards, rags, etc., can be placed on the heat sink 2, and the heat sink 2 dries the items while dissipating heat.
[0039] The utility model cools down the box 1 through the cooling end of the semiconductor refrigeration sheet 5 for refrigerating or freezing food, and heats water through the heating end of the semiconductor refrigeration sheet 5, and then dries the objects placed on the heat sink 2 by flowing the hot water, effectively utilizing the coldness and heat generated by the semiconductor refrigeration sheet 5 to reduce energy waste.
[0040] The structure of the heat sink 2 is as follows: Figure 1As shown, the heat sink 2 includes a plurality of heat sinks arranged at intervals and a heat sink belt arranged between two adjacent heat sinks, and a water flow path is arranged in the heat sink.
[0041] In order to strengthen convection, improve the drying effect of the heat sink 2 and the cooling effect of the cooler 3, as shown in FIG. Figure 2 , 6 As shown, a fan 1 9 is provided below the heat sink 2 , and a fan 2 10 is provided on the side of the cooler 3 .
[0042] In order to enhance convection and achieve a better drying effect of the heat sink 2, a pad is provided under the fan 9.
[0043] In order to facilitate the control of the temperature of each electrical component and the box 1, a controller 11 electrically connected to the power supply and a temperature sensor for detecting the temperature in the box 1 are also included. The semiconductor cooling sheet 5, the water pump 8, the fan 1 9, the fan 2 10, and the temperature sensor are electrically connected to the controller 11. When the temperature in the box 1 is low, the controller 11 controls the power-off of the semiconductor cooling sheet 5 to be turned off; when the temperature in the box 1 is high, the controller 11 controls the power-on of the semiconductor cooling sheet 5 to be turned on.
[0044] The structure of the cooler 3: Figure 2 , 4 As shown, the cooler 3 is block-shaped, and a plurality of ventilation slots 12 are provided inside. The fan 2 10 is arranged on a side of the cooler 3 having the ventilation slots 12, which has a good cooling effect and can better cool the box 1.
[0045] The structure of box 1: Figure 1-5 As shown, the box body 1 includes a main body 1a with an opening at the upper end and a cover body 1b covered on the main body 1a, and the cover body 1b includes a fixed cover 1b1 fixedly connected to the main body 1a and a rotating cover 1b2 hinged on the fixed cover 1b1. When the box body 1 needs to be opened, the rotating cover 1b2 is rotated upward; when the box body 1 needs to be closed, the rotating cover 1b2 is rotated downward, and the operation is simple and convenient.
[0046] The connection structure between the fixed cover 1b1 and the box body 1 is as follows: Figure 1 , 5 As shown, the lower edge of the fixed cover 1b1 that is not connected to the rotating cover 1b2 is sealed to the box body 1 by means of a tape 13, and the connection is firm and reliable, and the sealing effect is good.
[0047] The hinge structure of the fixed cover 1b1 and the rotating cover 1b2: Figure 1 , 3 As shown in FIGS. 5 and 7 , the fixed cover 1b1 and the rotating cover 1b2 are connected by a tape 14 , and the rotating cover 1b2 can rotate along the fold of the tape 14 , so the installation is simple and convenient, and the sealing effect is good.
[0048] The installation structure of the water tank 4 and the cooler 3 is as follows: Figure 1-5 As shown, the water tank 4 is arranged above the cooler 3 and is fixedly connected to the cooler 3 by means of nylon screws 15. The connection by means of nylon screws 15 can reduce heat conduction. The installation structure is simple and easy to install.
[0049] The installation structure of the fixed cover 1b1 is as follows: Figure 1 , 3 As shown in FIG. 5 , the fixing cover 1b1 is provided with a mounting groove for the water tank 4 to extend into, and a mounting plate is provided on the bottom side of the water tank 4 , and a nylon screw 15 passes through the mounting plate and is screwed to the cooler 3 .
[0050] Furthermore, the lower surface of the water tank 4 is flush with the lower surface of the fixed cover 1b1, and the water tank 4 and the fixed cover 1b1 are fixedly connected by a tape 3 19, and the tape 3 19 is adhered to the side of the water tank 4 and the upper surface of the fixed cover 1b1.
[0051] In order to achieve better convection in the box 1, that is, better cooling, a lifting block 16 is provided under the cooler 3, and a mounting plate 17 is provided under the lifting block 16 to prevent the lifting block 16 with a small area from being placed directly on the foam box and being unstable.
[0052] In order to intuitively know the water level in the water tank 4, a liquid level column 18 is also included to display the liquid level in the water tank 4.
[0053] Furthermore, a water inlet hole 20, a liquid level hole 21 and a water outlet hole 22 are provided at the bottom of the water tank 4, the water inlet hole 20 is connected to the pipeline 1 6, the liquid level hole 21 is connected to the liquid level column 18, and the water outlet hole 22 is connected to the pipeline 2 7.
[0054] In order to reduce the heat exchange between the cooling device 3 and the water tank 4 , a heat insulation cotton is arranged between the cooling device 3 and the water tank 4 and is arranged around the outer periphery of the semiconductor cooling plate 5 .
[0055] Preferably, the box body 1 is a foam box, and the heat sink 2 and the cooler 3 are made of aluminum or copper. In this embodiment, the heat sink 2 and the cooler 3 are made of aluminum.
[0056] Preferably, the adhesive tape 1 13, the adhesive tape 2 14 and the adhesive tape 3 19 are aluminum foil tapes or Teflon tapes. In this embodiment, the adhesive tape 1 13, the adhesive tape 2 14 and the adhesive tape 3 19 are aluminum foil tapes.
[0057] The above embodiment is only one of the preferred embodiments of the present utility model, and is not intended to limit the scope of implementation of the present utility model. Therefore, any equivalent changes made based on the shape, structure, and principle of the present utility model should be included in the protection scope of the present utility model.
Claims
1. A kitchen heat exchanger, characterized in that: The invention comprises a box body (1) and a heat sink (2) having a water flow path therein, wherein a cooler (3) is arranged inside the box body (1), a water tank (4) is arranged outside the box body (1), a semiconductor cooling plate (5) is arranged between the cooler (3) and the water tank (4), the cooler (3) is closely attached to the cooling end of the semiconductor cooling plate (5), the water tank (4) is closely attached to the heating end of the semiconductor cooling plate (5), the water inlet of the water tank (4) is connected to the water outlet of the heat sink (2) through a pipe 1 (6), the water outlet of the water tank (4) is connected to the water inlet of the heat sink (2) through a pipe 2 (7), and a water pump (8) is arranged on the pipe 1 (6) or the pipe 2 (7).
2. A kitchen heat exchanger according to claim 1, characterized in that: A fan 1 (9) is provided below the heat dissipation plate (2), and a fan 2 (10) is provided on the side of the cooler (3).
3. A kitchen heat exchanger according to claim 2, characterized in that: It also includes a controller (11) electrically connected to a power source and a temperature sensor for detecting the temperature inside the box (1); the semiconductor cooling plate (5), water pump (8), fan one (9), fan two (10), and temperature sensor are electrically connected to the controller (11) respectively.
4. A kitchen heat exchanger according to claim 2, characterized in that: The cooler (3) is block-shaped and has a plurality of ventilation slots (12) arranged at intervals inside. The second fan (10) is arranged on a side of the cooler (3) having the ventilation slots (12).
5. A kitchen heat exchanger according to claim 1, characterized in that: The box body (1) comprises a main body (1a) with an opening at the upper end and a cover body (1b) arranged on the main body (1a); the cover body (1b) comprises a fixed cover (1b1) fixedly connected to the main body (1a) and a rotating cover (1b2) hinged on the fixed cover (1b1).
6. A kitchen heat exchanger according to claim 5, characterized in that: The lower edge of the fixed cover (1b1) not connected to the rotating cover (1b2) is sealed to the box body (1) via adhesive tape 1 (13), and the fixed cover (1b1) and the rotating cover (1b2) are connected via adhesive tape 2 (14).
7. A kitchen heat exchanger according to claim 1, characterized in that: The water tank (4) is arranged above the cooler (3) and is fixedly connected to the cooler (3) via nylon screws (15).
8. A kitchen heat exchanger according to claim 7, characterized in that: A lifting block (16) is provided below the cooler (3), and a mounting plate (17) is provided below the lifting block (16).
9. A kitchen heat exchanger according to claim 1, characterized in that: It also includes a liquid level column (18) for displaying the liquid level in the water tank (4).
10. A kitchen heat exchanger according to claim 1, characterized in that: A heat insulation cotton is provided between the cooling device (3) and the water tank (4) and is arranged around the outer periphery of the semiconductor cooling plate (5).
