Vibration sensor and electronic device

Abstract

The utility model discloses a vibration sensor and electronic equipment. The vibration sensor comprises a substrate, a packaging shell, a vibration assembly, a connecting piece and a chip, the packaging shell comprises an outer shell and an inner shell, the inner shell covers the substrate, a packaging cavity is defined by the inner shell and the substrate, the outer shell covers the substrate or a mainboard of the electronic equipment and is located on the outer side of the inner shell, and a gap exists between the outer shell and the inner shell; the vibration assembly is located in the packaging cavity and arranged on the substrate, and the vibration assembly and the substrate define a first cavity; the connecting piece is located in the packaging cavity and arranged on the side, away from the substrate, of the vibration assembly, and the connecting piece is provided with a through hole. The chip is located in the packaging cavity and arranged on the side, away from the substrate, of the connecting piece, the chip is electrically connected with the substrate, the chip and the vibration assembly are communicated through the through hole, and the chip, the connecting piece and the vibration assembly define a second cavity. The vibration sensor can effectively reduce the influence of a sound signal on a device in the packaging cavity, and improves the performance and reliability of a product.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, in particular to a vibration sensor and electronic equipment. Background Art

[0002] The vibration sensor includes but is not limited to structures such as a shell, a PCB substrate, a vibration component, a MEMS chip, an ASIC chip, and a metal wire. The vibration component uses the inertial characteristics of the mass unit to generate a displacement △d, compresses the air △V, and forms an air pressure difference signal △P; there is an air pressure difference sensing area on the MEMS (such as capacitance / piezoresistance / piezoelectricity, etc., similar to a MIC sensing structure), which can sense the air pressure difference signal and convert the displacement into an electrical signal through an ASIC signal processing unit to detect a vibration signal.

[0003] In the existing technology, when external sound signals come into contact with the product shell, the shell will cause slight deformation and compress the internal gas, causing the product sound sensitivity to increase and affecting the product vibration signal pickup. Therefore, it is necessary to optimize the product structure design to reduce the impact of external sound signals. Utility Model Content

[0004] The main purpose of the utility model is to provide a vibration sensor and an electronic device, aiming to reduce the impact of external sound signals and improve product performance and product reliability.

[0005] To achieve the above-mentioned purpose, the vibration sensor proposed by the utility model is applied to electronic equipment, and the vibration sensor comprises:

[0006] substrate;

[0007] A packaging shell, the packaging shell comprising an outer shell and an inner shell, the inner shell is covered on the substrate and enclosed with the substrate to form a packaging cavity, the outer shell is covered on the substrate or the mainboard of the electronic device and is located on the outside of the inner shell, and there is a gap between the outer shell and the inner shell;

[0008] A vibration component, the vibration component is located in the packaging cavity and is arranged on the substrate, and the vibration component and the substrate are enclosed to form a first chamber;

[0009] A connecting member, the connecting member is located in the packaging cavity and is arranged on a side of the vibration component away from the substrate, and the connecting member is provided with a through hole; and

[0010] The chip is located in the packaging cavity and is arranged on a side of the connector away from the substrate. The chip is electrically connected to the substrate. The through hole connects the chip and the vibration component. The chip, the connector and the vibration component enclose a second chamber.

[0011] In some embodiments, the outer shell and the inner shell have the same shape, and a gap between the outer shell and the inner shell is an equal gap.

[0012] In some embodiments, a gap between the outer shell and the inner shell is not less than 0.03 mm.

[0013] In some embodiments, the thickness of the outer shell is in the range of 0.05-0.5 mm; and / or the thickness of the inner shell is in the range of 0.05-0.5 mm.

[0014] In some embodiments, at least one of the outer shell and the inner shell is a metal shell or a metal-plated shell.

[0015] In some embodiments, the inner shell is provided with a first pressure relief hole connecting the packaging cavity with the outside, and the outer shell is provided with a second pressure relief hole connecting the gap with the outside.

[0016] In some embodiments, the first pressure relief hole and the second pressure relief hole are arranged opposite to each other, and a size of the second pressure relief hole is larger than a size of the first pressure relief hole.

[0017] In some embodiments, the chip includes a MEMS chip and an ASIC chip, the MEMS chip and the ASIC chip are both arranged on a side of the connecting member away from the substrate, and the MEMS chip is opposite to the through hole, and the MEMS chip, the connecting member and the vibration component enclose a second chamber; the MEMS chip and the ASIC chip are electrically connected through wires, and the ASIC chip and the substrate are electrically connected through wires.

[0018] In some embodiments, the vibration assembly includes:

[0019] A vibration ring, wherein the vibration ring is arranged on the substrate;

[0020] a diaphragm, the diaphragm being arranged on a side of the diaphragm away from the substrate; and

[0021] A mass block, wherein the mass block is attached to a surface of the diaphragm close to the substrate;

[0022] The vibration ring, the vibration membrane, the mass block and the substrate together form the first chamber, and the chip, the connecting member and the vibration membrane together form the second chamber.

[0023] The utility model also provides an electronic device, which comprises the vibration sensor as mentioned above.

[0024] The technical solution of the utility model sets a double shell structure for the packaging shell in the vibration sensor, that is, it includes an inner shell and an outer shell, and there is a gap between the inner shell and the outer shell. With such a setting, the external sound signal first contacts the outer shell, and the outer shell is slightly deformed, so that the air in the gap is compressed to squeeze the inner shell. Since the outer shell and the inner shell have a certain hardness and are buffered by the air in the middle gap, the influence of external sound can be effectively reduced, so that the deformation of the inner shell is smaller than the deformation of the outer shell, and finally the influence of the sound signal on the device in the packaging cavity can be effectively reduced, thereby improving the performance and reliability of the vibration sensor product. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0026] Figure 1 It is a cross-sectional structural diagram of an embodiment of a vibration sensor of the utility model;

[0027] Figure 2 It is a cross-sectional structural schematic diagram of another embodiment of the vibration sensor of the utility model;

[0028] Figure 3 This is a schematic cross-sectional structure diagram of another embodiment of the vibration sensor of the utility model.

[0029] Description of Figure Numbers:

[0030] name Label name Label Vibration Sensor 100 Through Hole 31 substrate 10 MEMS Chips 40 Avoidance slot 11 ASIC Chip 50 Vibration components 20 Inner shell 60 Vibration Ring 21 The first pressure relief hole 61 Diaphragm 22 Outer shell 70 Mass 23 Second pressure relief hole 71 Ventilation holes 24 Sealant 80 Connectors 30 Motherboard 90

[0031] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In addition, in the present utility model, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0036] In order to reduce the impact of external sound signals and improve product performance and reliability, the utility model provides a vibration sensor 100.

[0037] Please refer to Figures 1 to 3 In an embodiment of the present utility model, the vibration sensor 100 comprises:

[0038] substrate 10;

[0039] The packaging shell includes an outer shell 70 and an inner shell 60. The inner shell 60 is covered on the substrate 10 and enclosed with the substrate 10 to form a packaging cavity. The outer shell 70 is covered on the substrate 10 or the mainboard 90 of the electronic device and is located on the outside of the inner shell 60. There is a gap between the outer shell 70 and the inner shell 60.

[0040] A vibration component 20, the vibration component 20 is located in the packaging cavity and is disposed on the substrate 10, and the vibration component 20 and the substrate 10 enclose a first chamber;

[0041] A connecting member 30 , which is located in the packaging cavity and disposed on a side of the vibration assembly 20 away from the substrate 10 , and is provided with a through hole 31 ; and

[0042] The chip is located in the packaging cavity and is arranged on a side of the connector 30 away from the substrate 10. The chip is electrically connected to the substrate 10. The through hole 31 connects the chip and the vibration component 20. The chip, the connector 30 and the vibration component 20 enclose a second chamber.

[0043] In the vibration sensor 100 provided by the utility model, the substrate 10 can use a PCB (Printed Circuit Board) as a support for electronic components, which is convenient for arranging other electronic components on the substrate 10. The shapes of the outer shell 70 and the inner shell 60 are not limited, and the shapes of the two can be the same or different, and there is a gap between the outer shell 70 and the inner shell 60 after they are assembled; Figure 1 As shown, in some embodiments, the outer shell 70 and the inner shell 60 are both mounted on the substrate 10, and the inner shell 60 and the substrate 10 are enclosed to form a packaging cavity for assembling electronic components. Figure 2 As shown, in some other embodiments, the outer shell 70 is mounted on the mainboard 90 of the electronic device, which can bring greater design flexibility. It should be noted that the mounting method of the outer shell 70 and the inner shell 60 can be selected by welding or bonding, which is simple to operate and relatively firm to mount.

[0044] Since the packaging shell of the utility model is configured as a double shell structure, namely, it includes an inner shell 60 and an outer shell 70, and there is a gap between the inner shell 60 and the outer shell 70, with such a configuration, the external sound signal first contacts the outer shell 70, and the outer shell 70 is slightly deformed, so that the air in the gap is compressed to squeeze the inner shell 60. Since the outer shell 70 and the inner shell 60 both have a certain hardness and are buffered by the air in the middle gap, the influence of external sound can be effectively reduced, so that the deformation of the inner shell 60 is smaller than the deformation of the outer shell 70, and finally the influence of the sound signal on the device in the packaging cavity can be effectively reduced, thereby improving the performance and reliability of the vibration sensor 100 product.

[0045] In the specific embodiment of the present invention, the outer shell 70 and the inner shell 60 have the same shape, and the gap between the outer shell 70 and the inner shell 60 is equal, so this design is convenient for manufacturing.

[0046] Optionally, the gap between the outer shell 70 and the inner shell 60 is not less than 0.03 mm. Such a design can ensure that the gap serves as an effective buffer for the air, thereby effectively reducing the impact of external sound on the inner shell 60, so that the deformation of the inner shell 60 is smaller than the deformation of the outer shell 70, and ultimately can effectively reduce the impact of sound signals on the components in the packaging cavity, thereby improving the performance and product reliability of the vibration sensor 100 product.

[0047] In an optional embodiment of the utility model, the thickness range of the outer shell 70 is 0.05-0.5mm (for example, 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm and an interval value between any two end points); the thickness range of the inner shell 60 is 0.05-0.5mm (for example, 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm and an interval value between any two end points).

[0048] In a specific embodiment of the utility model, at least one of the outer shell 70 and the inner shell 60 is a metal shell or a metal-plated shell. The metal shell or the metal-plated shell is mounted on a PCB board or a mainboard 90 of an electronic device, and can be connected to the PCB board or the mainboard 90 of the electronic device to form an electromagnetic shielding cover, thereby improving the electromagnetic stability of the product. Preferably, the material of the metal shell is brass, which has a high hardness.

[0049] It should be noted that, in some embodiments, the outer shell 70 and the inner shell 60 are both made of metal or metal-plated material; of course, in some other embodiments, one of the outer shell 70 and the inner shell 60 is made of metal or metal-plated material, and the other shell is made of plastic. This can not only form an electromagnetic shielding cover, but also reduce the product weight to a certain extent and reduce the product manufacturing cost.

[0050] like Figures 1 to 3 As shown, in an embodiment of the utility model, the vibration component 20 is arranged on the substrate 10, and a first chamber is formed between the vibration component 20 and the substrate 10. The first chamber is the vibration space of the vibration component 20, which is convenient for the vibration component 20 to pick up external vibration signals and vibrate accordingly.

[0051] Furthermore, an avoidance groove 11 is provided on the surface of the substrate 10 corresponding to the vibration component 20. The setting of the avoidance groove 11 can expand the volume of the first chamber, ensuring that the vibration component 20 has sufficient vibration space, and facilitating the vibration component 20 to accurately pick up external vibration signals, thereby improving the recognition accuracy and recognition ability of the vibration sensor 100.

[0052] like Figures 1 to 3 As shown, in an embodiment of the utility model, a connector 30 is provided on a side of the vibration assembly 20 away from the substrate 10, that is, the connector 30 is located on the vibration assembly 20, so that the chip can be easily arranged on the connector 30, and the arrangement of the connector 30 serves to provide reliable support for the chip. The connector 30 includes a connecting portion and a supporting portion that are connected to each other, and the connecting portion is an annular structure, and the side away from the supporting portion is connected to the vibration assembly 20, and the chip is arranged on the supporting portion. Furthermore, a through hole 31 is provided on the connector 30, and the through hole 31 is provided in the supporting portion and passes through the supporting portion, and is used to connect the chip and the vibration assembly 20, wherein the chip generally includes a MEMS (Micro Electro Mechanical System) chip, so that the vibration cavity of the MEMS chip 40 and the vibration assembly 20 can be connected by using the through hole 31. A second chamber is formed between the chip, the connector 30 and the vibration component 20. When the vibration component 20 vibrates, the vibration component 20 can move away from or close to the connector 30 to compress or stretch the air in the second chamber accordingly, that is, it can cause the air in the second chamber to fluctuate. The MEMS chip 40 of the chip can sense the fluctuation of the air through the through hole 31 on the connector 30 and output an electrical signal, thereby realizing the recognition function of the vibration sensor 100.

[0053] like Figures 1 to 3 As shown, in a specific embodiment of the utility model, the inner shell 60 is provided with a first pressure relief hole 61 connecting the packaging cavity and the outside, and the outer shell 70 is provided with a second pressure relief hole 71 connecting the gap and the outside. The first pressure relief hole 61 and the second pressure relief hole 71 are both micron-level holes processed by laser, which play a role in pressure relief during packaging, and can be blocked after the packaging is completed to isolate the outside air.

[0054] Optionally, the first pressure relief hole 61 and the second pressure relief hole 71 are arranged opposite to each other, and the size of the second pressure relief hole 71 is larger than that of the first pressure relief hole 61. Such an arrangement is convenient for glue sealing after the packaging is completed. For details, refer to Figure 3 After the packaging is completed, the first pressure relief hole 61 and the second pressure relief hole 71 are sealed with a sealant 80 to isolate the external air.

[0055] like Figures 1 to 3 As shown, in a specific embodiment of the utility model, the chip includes a MEMS chip 40 and an ASIC chip 50, and the MEMS chip 40 and the ASIC chip 50 are both arranged on a side of the connecting member 30 away from the substrate 10, and the MEMS chip 40 is opposite to the through hole 31, and the MEMS chip 40, the connecting member 30 and the vibration component 20 enclose a second chamber; the MEMS chip 40 and the ASIC chip 50 are electrically connected through wires, and the ASIC chip 50 and the substrate 10 are electrically connected through wires.

[0056] In this embodiment, the chip includes a MEMS (Micro Electro Mechanical System) chip and an ASIC (Application Specific Integrated Circuit) chip. The MEMS chip 40 can sense the fluctuation of the air in the second chamber through the through hole 31 on the connector 30 and output an electrical signal accordingly, and transmit the electrical signal to the ASIC chip 50, so that the ASIC chip 50 can process and output the electrical signal. The MEMS chip 40 and the ASIC chip 50 are both arranged on the connector 30, which can make full use of the reliable supporting ability of the connector 30. In addition, the MEMS chip 40 is arranged opposite to the through hole 31, and the vibration cavity of the MEMS chip 40 and the vibration component 20 can be directly connected by the through hole 31. In this way, the second chamber is enclosed between the MEMS chip 40, the connector 30 and the vibration component 20.

[0057] like Figures 1 to 3 As shown, in a specific embodiment of the present utility model, the vibration assembly 20 includes:

[0058] A vibration ring 21, wherein the vibration ring 21 is disposed on the substrate 10;

[0059] A diaphragm 22 , which is disposed on a side of the diaphragm 21 away from the substrate 10 ; and

[0060] The mass block 23 is attached to the surface of the diaphragm 22 close to the substrate 10;

[0061] The vibration ring 21 , the vibration membrane 22 , the mass block 23 and the substrate 10 together form a first chamber, and the chip, the connecting member 30 and the vibration membrane 22 together form a second chamber.

[0062] Specifically, the vibration ring 21 is arranged on the substrate 10, and is used to connect and support the diaphragm 22. The diaphragm 22 is arranged on the side of the vibration ring 21 away from the substrate 10, that is, the diaphragm 22 is arranged on the vibration ring 21, and the mass block 23 is arranged on the surface of the diaphragm 22 close to the substrate 10. The above-mentioned setting methods can all be selected to be glued, which is simple to operate and relatively firm. When the vibration sensor 100 vibrates, it can drive the internal mass block 23 and the diaphragm 22 to vibrate together, so that the mass block 23 and the diaphragm 22 can be away from or close to the connector 30 to compress or stretch the air in the second chamber accordingly, that is, it can drive the air in the second chamber to fluctuate, and the MEMS chip 40 can sense the air fluctuation in the second chamber through the through hole 31 on the connector 30 and output an electrical signal accordingly, thereby realizing the recognition function of the vibration sensor 100. When the mass block 23 vibrates, the air in the first chamber and the second chamber on both sides of the mass block 23 and the diaphragm 22 change in opposite directions. For example, when the mass block 23 vibrates toward the substrate 10, the air in the first chamber is compressed, while the air in the second chamber is stretched; when the mass block 23 vibrates away from the substrate 10, the air in the first chamber is stretched, while the air in the second chamber is compressed.

[0063] Furthermore, in an embodiment of the utility model, the vibration assembly 20 is also provided with an air hole 24 connecting the vibration cavity and the packaging cavity. Specifically, the air hole 24 is arranged on the mass block 23 and the diaphragm 22, and passes through the mass block 23 and the diaphragm 22. The setting of the air hole 24 plays a role in balancing the air pressure.

[0064] The utility model also proposes an electronic device, including the vibration sensor 100 as described above, and the electronic device includes but is not limited to an electric toothbrush, a mobile phone, a laptop computer, a tablet computer, a wearable device, a navigator, a handheld game console, etc.

[0065] The specific structure of the vibration sensor 100 refers to the above embodiments. Since the electronic device proposed by the present invention adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by all the above technical solutions, which will not be described one by one here.

[0066] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A vibration sensor, applied to electronic equipment, characterized in that: The vibration sensor comprises: substrate; A packaging shell, the packaging shell comprising an outer shell and an inner shell, the inner shell is covered on the substrate and enclosed with the substrate to form a packaging cavity, the outer shell is covered on the substrate or the mainboard of the electronic device and is located on the outside of the inner shell, and there is a gap between the outer shell and the inner shell; A vibration component, the vibration component is located in the packaging cavity and is arranged on the substrate, and the vibration component and the substrate are enclosed to form a first cavity; A connecting member, the connecting member is located in the packaging cavity and is arranged on a side of the vibration component away from the substrate, and the connecting member is provided with a through hole; and The chip is located in the packaging cavity and is arranged on a side of the connector away from the substrate. The chip is electrically connected to the substrate. The through hole connects the chip and the vibration component. The chip, the connector and the vibration component enclose a second chamber.

2. The vibration sensor according to claim 1, characterized in that The outer shell and the inner shell have the same shape, and a gap between the outer shell and the inner shell is equal.

3. The vibration sensor according to claim 2, characterized in that The gap between the outer shell and the inner shell is not less than 0.03 mm.

4. The vibration sensor according to claim 1, characterized in that The thickness of the outer shell is in the range of 0.05-0.5 mm; and / or, The thickness of the inner shell is in the range of 0.05-0.5 mm.

5. The vibration sensor according to claim 1, characterized in that At least one of the outer shell and the inner shell is a metal shell or a metal-plated shell.

6. The vibration sensor according to claim 1, characterized in that The inner shell is provided with a first pressure relief hole communicating with the packaging cavity and the outside, and the outer shell is provided with a second pressure relief hole communicating with the gap and the outside.

7. The vibration sensor according to claim 6, characterized in that The first pressure relief hole and the second pressure relief hole are arranged opposite to each other, and a size of the second pressure relief hole is larger than a size of the first pressure relief hole.

8. The vibration sensor according to any one of claims 1 to 7, characterized in that: The chip includes a MEMS chip and an ASIC chip, the MEMS chip and the ASIC chip are both arranged on a side of the connecting member away from the substrate, and the MEMS chip is opposite to the through hole, and the MEMS chip, the connecting member and the vibration component enclose and form the second chamber; The MEMS chip is electrically connected to the ASIC chip via a wire, and the ASIC chip is electrically connected to the substrate via a wire.

9. The vibration sensor according to any one of claims 1 to 7, characterized in that: The vibration assembly comprises: A vibration ring, wherein the vibration ring is arranged on the substrate; a diaphragm, the diaphragm being arranged on a side of the diaphragm away from the substrate; and A mass block, wherein the mass block is attached to a surface of the diaphragm close to the substrate; The vibration ring, the vibration membrane, the mass block and the substrate together form the first chamber, and the chip, the connecting member and the vibration membrane together form the second chamber.

10. An electronic device, characterized in that: The electronic device comprises the vibration sensor according to any one of claims 1-9.

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