Display screen capable of rapidly dissipating heat

Abstract

The utility model discloses a display screen capable of dissipating heat rapidly. The display screen comprises a heat conduction film layer, a circuit board and a liquid crystal screen body. The liquid crystal screen body comprises a visible area and a non-visible area, the circuit board is connected to the non-visible area of the liquid crystal screen body, at least one power amplifier IC is arranged in the non-visible area of the liquid crystal screen body, the power amplifier ICs are all electrically connected with the circuit board, and the heat conduction film layer is bonded to the power amplifier ICs. The heat dissipation area of the heat conduction film layer is larger than the surface area of the power amplifier IC, so that the heat dissipation performance of the heat conduction film layer is better, the heat conduction film layer can quickly conduct heat generated by the power amplifier IC, the heat generated by the power amplifier IC is prevented from being concentrated at the same position, the heat generated by the power amplifier IC is further led out, devices in the liquid crystal screen body are prevented from being burnt out, and the service life of the liquid crystal screen is prolonged. Therefore, the user experience is improved.

Description

Technical Field

[0001] The utility model relates to the field of liquid crystal screens, in particular to a display screen capable of rapidly dissipating heat. Background Art

[0002] The screen display requires integrated circuit chips to drive the display. There are usually multiple power amplifier ICs on one side of the screen. When the power amplifier IC is working, it will generate a lot of heat, which will be transferred to the surface of the cover through heat transfer. When the user operates, it will affect the user experience. In addition, if the heat accumulates in the display, the temperature of the display will exceed the normal operating temperature, causing the display to burn out. Utility Model Content

[0003] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a display screen capable of quickly dissipating heat.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A display screen capable of rapidly dissipating heat comprises: a heat-conducting film layer, a circuit board and a liquid crystal screen body; the liquid crystal screen body comprises a visible area and a non-visible area, the circuit board is connected to the non-visible area of ​​the liquid crystal screen body, at least one power amplifier IC is arranged in the non-visible area of ​​the liquid crystal screen body, the power amplifier ICs are all electrically connected to the circuit board, and the heat-conducting film layer is bonded to the power amplifier IC.

[0006] In one embodiment, the thermally conductive film layer includes a PET film layer, a heat-leveling layer and a thermally conductive adhesive layer;

[0007] The PET film layer and the thermally conductive adhesive layer are respectively bonded to two sides of the heat-leveling layer, and a side of the thermally conductive film layer away from the heat-leveling layer is bonded to the power amplifier IC.

[0008] In one embodiment, the thickness of the thermal conductive film layer is 0.07 mm to 0.5 mm.

[0009] In one embodiment, the thickness of the thermal conductive film layer is 0.2 mm.

[0010] In one of the embodiments, a clearance opening is provided on the circuit board.

[0011] In one embodiment, the power amplifier IC is soldered on the circuit board.

[0012] In one embodiment, the liquid crystal screen body is an LCD display screen.

[0013] In one embodiment, the circuit board is an FPC.

[0014] In one embodiment, a component area is provided on the FPC, and a steel sheet is provided on the back side of the component area.

[0015] In one of the embodiments, a plug-in portion is provided on the FPC.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] The display screen capable of rapid heat dissipation of the utility model is provided with a heat-conducting film layer, a circuit board and a liquid crystal screen body. The liquid crystal screen body includes a visible area and a non-visible area. The circuit board is connected to the non-visible area of ​​the liquid crystal screen body. At least one power amplifier IC is provided in the non-visible area of ​​the liquid crystal screen body, and the heat-conducting film layer is bonded to the power amplifier IC. Since the heat dissipation area of ​​the heat-conducting film layer is larger than the surface area of ​​the power amplifier IC, the heat dissipation performance of the heat-conducting film layer is better, and the heat-conducting film layer can quickly conduct the heat generated by the power amplifier IC, avoiding the heat generated by the power amplifier IC from being concentrated in the same position, and then conducting the heat generated by the power amplifier IC to prevent the components in the liquid crystal screen body from burning out, thereby improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 It is a partial side structural schematic diagram of a display screen capable of rapid heat dissipation in one embodiment of the utility model;

[0020] Figure 2 This is a schematic diagram of the front structure of a display screen capable of rapid heat dissipation in one embodiment of the utility model;

[0021] Figure 3 Schematic diagram of the structure of the thermal conductive film layer in one embodiment of the utility model.

[0022] Reference numerals:

[0023] Thermally conductive film layer 10 , PET film layer 11 , heat-uniform layer 12 , thermally conductive adhesive layer 13 , circuit board 20 , avoidance opening 21 , plug-in portion 22 , LCD body 30 , visible area 31 , non-visible area 32 , power amplifier IC 40 . DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0025] This application proposes a display screen that can quickly dissipate heat, please refer to Figure 1 , Figure 2 and Figure 3, including a thermally conductive film layer 10, a circuit board 20 and a liquid crystal screen body 30. The liquid crystal screen body 30 includes a visible area 31 and a non-visible area 32, the visible area 31 is used to display the picture, and the non-visible area 32 is used to shield the components in the display screen. The circuit board 20 is connected to the non-visible area 32 of the liquid crystal screen body 30, and at least one power amplifier IC40 is arranged in the non-visible area 32 of the liquid crystal screen body 30. The thermally conductive film layer 10 is bonded to the power amplifier IC40, and the power amplifier IC40 is welded on the circuit board 20. The heat dissipation area of ​​the thermally conductive film layer 10 is larger than the surface area of ​​the power amplifier IC40, so the heat dissipation performance of the thermally conductive film layer 10 is better, and the thermally conductive film layer 10 can quickly conduct the heat generated by the power amplifier IC40, avoid the heat generated by the power amplifier IC40 from being concentrated in the same position, and then conduct the heat generated by the power amplifier IC40, prevent the components in the liquid crystal screen body 30 from burning out, thereby improving the user experience. Preferably, the liquid crystal screen body 30 is an LCD display screen.

[0026] In one embodiment, see Figure 3 , the thermally conductive film layer 10 includes a PET film layer 11, a heat-uniform layer 12 and a thermally conductive adhesive layer 13. Among them, the color of the PET film layer 11 is black. Since black substances can collect heat, the heat in the thermally conductive film layer 10 is transferred toward the black PET film layer 11 through heat transfer, and the heat in the PET film layer 11 is dissipated to the outside, thereby achieving heat dissipation. One side of the PET film layer 11 is sticky, and both sides of the thermally conductive adhesive layer 13 are sticky. The PET film layer 11 and the thermally conductive adhesive layer 13 are respectively bonded to the two sides of the heat-uniform layer 12, and the side of the thermally conductive film layer 10 away from the heat-uniform layer 12 is bonded to the power amplifier IC40. The thermally conductive film layer 10 dissipates the heat generated by the power amplifier IC40 through the thermally conductive adhesive layer 13 and the heat-uniform layer 12, and finally dissipates it from the PET film layer 11. The heat-uniform layer 12 is made of a multilayer composite material, mainly made of materials with good thermal conductivity and heat transfer such as copper.

[0027] Furthermore, the thickness of the thermal conductive film layer 10 is 0.07 mm to 0.5 mm, and the thickness range is large, so as to be attached to different numbers of power amplifier ICs 40, thereby improving the versatility of the thermal conductive film layer 10. In addition, the size of the thermal conductive film layer 10 is set according to the number of power amplifier ICs 40 and the distance between them. If there is only one power amplifier IC 40, a layer of thermal conductive film layer 10 is attached to the power amplifier IC 40 for heat dissipation.

[0028] Furthermore, the thickness of the thermal conductive film layer 10 is 0.2 mm.

[0029] In another embodiment, the circuit board 20 is an FPC. The FPC is provided with a component area, which is used to weld components so that the FPC can achieve specific functions. A steel sheet is provided on the back of the component area to strongly support the FPC with components welded thereon to prevent the FPC from bending and causing product defects. For further information, please refer to Figure 2 The circuit board 20 is provided with an escape opening 21, which is used to avoid the arrangement of other components to prevent other components from holding the FPC and causing damage to the FPC. In addition, please refer to Figure 2 The FPC is provided with a plug-in portion 22, and two protruding blocks extend from the plug-in portion 22, so that the FPC can be quickly electrically connected to other components, thereby improving the assembly work efficiency.

[0030] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A display screen capable of rapid heat dissipation, characterized in that: include: Thermal conductive film layer, circuit board and LCD screen body; The LCD screen body includes a visible area and a non-visible area, the circuit board is connected to the non-visible area of ​​the LCD screen body, at least one power amplifier IC is arranged in the non-visible area of ​​the LCD screen body, the power amplifier ICs are electrically connected to the circuit board, and the thermal conductive film layer is bonded to the power amplifier ICs.

2. The display screen capable of rapid heat dissipation according to claim 1, characterized in that: The thermally conductive film layer comprises a PET film layer, a heat-uniform layer and a thermally conductive adhesive layer; The PET film layer and the thermally conductive adhesive layer are respectively bonded to two sides of the heat-leveling layer, and a side of the thermally conductive film layer away from the heat-leveling layer is bonded to the power amplifier IC.

3. The display screen capable of rapid heat dissipation according to claim 1, characterized in that: The thickness of the thermal conductive film layer is 0.07 mm to 0.5 mm.

4. The display screen capable of rapid heat dissipation according to claim 3, characterized in that: The thickness of the thermal conductive film layer is 0.2 mm.

5. The display screen capable of rapid heat dissipation according to claim 1, characterized in that: The circuit board is provided with an escape opening.

6. The display screen capable of rapid heat dissipation according to claim 1, characterized in that: The power amplifier IC is soldered on the circuit board.

7. The display screen capable of rapid heat dissipation according to claim 1, characterized in that: The liquid crystal screen body is an LCD display screen.

8. The display screen capable of rapid heat dissipation according to claim 1, characterized in that: The circuit board is an FPC.

9. The display screen capable of rapid heat dissipation according to claim 8, characterized in that: A component area is arranged on the FPC, and a steel sheet is arranged on the back of the component area.

10. The display screen capable of rapid heat dissipation according to claim 9, characterized in that: The FPC is provided with a plug-in portion.

Images