Processing box

Abstract

The utility model provides a processing box which is detachably arranged in imaging equipment provided with a contact pin. The processing box comprises a shell, a plurality of contact pins and a plurality of processing pins, the developing part and the photosensitive part are rotatably arranged in the shell; the separating mechanism is used for receiving separating force for forcing the developing part and the photosensitive part to be separated from each other; the driving force receiving part is used for receiving the driving force; the chip assembly comprises a chip rack and a chip, and the chip is used for being in contact with the contact pin; the chip rack is detachably combined with the shell, the chip rack comprises a main body part and a supporting part connected with the main body part, and the supporting part is used for supporting the chip and limiting the chip from falling off in the-x direction; when the processing box is installed at the preset position of the imaging equipment, at least one part of the chip assembly is located above the separating mechanism, and the scheme enables a user to carry out chip upgrading operation more conveniently.

Description

[0001] This utility model is a divisional application submitted by the applicant to the China Patent Office on June 26, 2023, with the invention name being “Processing Box” and application number being 202321639087.8. Technical Field

[0002] The utility model relates to the field of electronic photographic imaging, in particular to a processing box which can be detachably installed in an electronic photographic imaging device. Background Art

[0003] The processing box is a consumable material suitable for electronic photographic imaging equipment. The processing box contains the developer required for imaging. When the electronic photographic imaging equipment is working, the developer will develop the electrostatic latent image formed on the surface of the photosensitive member under the action of the electric field force.

[0004] A chip has been installed in the processing box to realize the communication connection between the processing box and the imaging device. When the processing box reaches the predetermined installation position of the imaging device, the chip makes electrical contact with the contact pins in the imaging device, so that the imaging device can obtain various parameter information stored in the chip, for example, at least one of the model, manufacturing information, imaging life information, etc. of the processing box.

[0005] In order to improve the user experience, imaging device manufacturers will occasionally upgrade the main components in the imaging device through remote control. Therefore, the relevant information stored in the chip also needs to be updated in a timely manner. Otherwise, the imaging device will not be able to recognize the chip, which will cause the processing box to fail to work in the imaging device.

[0006] Existing chips are generally fixed in a preset chip fixing position in the processing box by means of a snap connection. When the main components in the imaging device are upgraded, the user may not be able to take out the chip to upgrade it in time. Therefore, it is necessary to design a structure that is convenient for users to upgrade the chip. Utility Model Content

[0007] In view of this, the utility model provides a processing box adopting the following technical solution, so that the user can conveniently upgrade the chip, or conveniently replace the chip before the upgrade. The specific solution is:

[0008] A processing box is detachably installed in an imaging device provided with a contact pin, and the processing box includes: a shell; a developing member and a photosensitive member, both extending along the x direction and rotatably arranged in the shell, and the two are arranged opposite to each other; a separation mechanism, used to receive a separation force from the imaging device to force the developing member and the photosensitive member to separate from each other; a driving force receiving member, used to receive the driving force from the imaging device and provide it to the developing member or the photosensitive member, the side where the driving force receiving member is located is the driving side, the side opposite to the driving side is the non-driving side, and the direction from the driving side to the non-driving side is the -x direction; a chip assembly, including a chip frame and a chip, the chip is used to contact the contact pin, the chip frame is detachably combined with the shell, the chip frame includes a main body and a supporting part connected to the main body, the main body is used to cooperate with the shell, the supporting part is used to support the chip and limit the chip from falling out in the -x direction; when the processing box is installed to a predetermined position of the imaging device, at least a portion of the chip assembly is located above the separation mechanism.

[0009] In one embodiment, the direction from the side where the developing member and the photosensitive member are installed to the side where the developing member and the photosensitive member are not installed is the +z direction, and the opposite direction is the -z direction; the support portion is recessed from the end of the main body facing the +z direction toward the -z direction, and a part of the main body forms a limiting portion in the -x direction to limit the chip from escaping.

[0010] In one embodiment, the chip rack further includes a buckling position extending from the main body toward the +z direction, and the chip is restrained on the supporting portion by being abutted by the buckling position.

[0011] Specifically, the buckle includes an extension portion connected to the main body and an abutment portion arranged on the extension portion; during the installation of the chip, the chip presses the abutment portion and the extension portion is deformed; after the chip is installed on the supporting surface, the extension portion is reset and the abutment portion restricts the chip in the +z direction of the chip.

[0012] In one embodiment, the relative direction of the developing member and the photosensitive member is the y direction; the shell is provided with a cavity for cooperating with the chip frame, and the cavity includes a plurality of side panels extending from the shell toward the +z direction and a blocking portion extending from the side panels. During the installation of the chip frame, the buckle reaches between one of the side panels and the blocking portion by forcing the blocking portion to undergo elastic deformation.

[0013] Specifically, the side plate includes two first side plates and a second side plate located between the two first side plates, the two first side plates are arranged opposite to each other along the y direction, the blocking portion is formed by extending from at least one first side plate toward the y direction, and along the installation direction of the chip rack, the second side plate is located downstream of the blocking portion.

[0014] In one embodiment, the processing box also includes a first driving force receiving member and a second driving force receiving member for receiving driving force from the imaging device, the first driving force receiving member provides driving force for the developing member, and the second driving force receiving member provides driving force for the photosensitive member; the shell includes: a first box body, the developing member is rotatably arranged in the first box body; a second box body, the photosensitive member is rotatably arranged in the second box body; an end cover, having a first exposure hole, a second exposure hole and an exposure portion, the first driving force receiving member is exposed to the outside through the first exposure hole, and the second driving force receiving member is exposed to the outside through the second exposure hole; along a direction perpendicular to the x direction, the exposure portion is connected to the first exposure hole or the second exposure hole.

[0015] In one embodiment, the process cartridge further includes a protective cover surrounding the first driving force receiving member in a circumferential direction, wherein a portion of a circumferential surface of the protective cover for covering the first driving force receiving member is exposed from the exposed portion toward a direction perpendicular to the x direction.

[0016] In one embodiment, the processing box also includes a first driving force receiving member and a second driving force receiving member for receiving driving force from the imaging device, the first driving force receiving member provides driving force for the developing member, and the second driving force receiving member provides driving force for the photosensitive member; the shell includes: a first box body, the developing member is rotatably arranged in the first box body; a second box body, the photosensitive member is rotatably arranged in the second box body; an end cover, having a first exposure hole and a second exposure hole, the first driving force receiving member is exposed to the outside through the first exposure hole, and the second driving force receiving member is exposed to the outside through the second exposure hole; when observed along the x direction, at least one of the first exposure hole and the second exposure hole is not closed.

[0017] In one embodiment, the end cover also includes an exposure portion connected to the first exposure hole, and the processing box also includes a protective cover surrounding the first driving force receiving member in a circumferential direction, and a portion of the circumferential surface of the protective cover for covering the first driving force receiving member is exposed from the exposure portion toward a direction perpendicular to the x direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1A and Figure 1B It is a three-dimensional diagram of a processing box having a chip assembly involved in the first embodiment of the present utility model.

[0019] Figure 1C It is observed from +x direction to -x direction Figure 1A Side view of the processing box in the figure.

[0020] Figure 1D It is a side view of a processing box having a chip assembly according to the first embodiment of the present invention after partial structural deformation, observed from the +x direction to the -x direction.

[0021] Figure 2This is an exploded view of the chip assembly and the processing box housing involved in the first embodiment of the present invention after being separated.

[0022] Figure 3 It is a three-dimensional diagram of the chip assembly involved in the first embodiment of the present utility model.

[0023] Figure 4 This is an exploded view of the chip frame and the chip in the chip assembly involved in the second embodiment of the present invention after being separated.

[0024] Figure 5 This is an exploded view of the chip frame and the chip in the chip assembly involved in the third embodiment of the present invention after being separated.

[0025] Figure 6 It is a three-dimensional diagram of the chip assembly involved in the third embodiment of the present utility model.

[0026] Figure 7 This is an exploded view of the chip frame and the chip in the chip assembly involved in the fourth embodiment of the present invention after being separated.

[0027] Fig. 8A This is an exploded view of the chip assembly involved in the fifth embodiment of the present invention after being separated from the processing box shell.

[0028] Figure 8B It is a three-dimensional diagram of the chip assembly involved in the fifth embodiment of the present utility model.

[0029] Fig. 9 It is a stereoscopic view of the chip assembly involved in the fifth embodiment of the present invention after being installed in the processing box housing. DETAILED DESCRIPTION

[0030] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings; Figure 1A and Figure 1B It is a three-dimensional diagram of a processing box having a chip assembly according to the first embodiment of the utility model; Figure 1C It is observed from +x direction to -x direction Figure 1A A side view of the middle processing box; Figure 1D It is a side view of a processing box having a chip assembly according to the first embodiment of the present utility model after partial structural deformation, observed from the +x direction to the -x direction; Figure 2 This is an exploded view of the chip assembly and the processing box housing involved in the first embodiment of the present utility model after being separated; Figure 3 It is a three-dimensional diagram of the chip assembly involved in the first embodiment of the present utility model.

[0031] [Overall structure of the processing box]

[0032] The processing box 100 can be installed to the imaging device in a detachable manner, and the processing box 100 includes a first unit 1 and a second unit 2 that are combined with each other and an end cover 4 located at the end of the processing box. The first unit 1 and the second unit 2 are combined through the end cover 4. Specifically, the first unit 1 and the second unit 2 are combined through the end cover 4 in a relatively rotatable manner.

[0033] The first unit 1 includes a first box body 10 and a developing member 11 rotatably arranged in the first box body 10, and the second unit 2 includes a second box body 20 and a photosensitive member 21 rotatably arranged in the second box body 20, the developing member 11 and the photosensitive member 21 extend in the same direction and are parallel to each other, and the developing member 11 and the photosensitive member 21 are arranged relative to each other. When the processing box 100 is working / developing, the developing member 11 and the photosensitive member 21 are close to each other, and an electrostatic latent image is formed on the surface of the photosensitive member 21. The developing member 11 is used to supply the developer stored in the first box body 10 to the surface of the photosensitive member 21 to develop the electrostatic latent image.

[0034] The processing box 100 also includes a driving force receiving component 3 for receiving driving force from the imaging device and driving the developing member 11 and the photosensitive member 21 to rotate. The driving force receiving component 3 can be set to be one that provides driving force to the developing member 11 and the photosensitive member 21 at the same time, or it can be set to be two that provide driving force to the developing member 11 and the photosensitive member 21 respectively. As shown in Figure 1, the driving force receiving component 3 includes a first driving force receiving component 31 for providing driving force to the developing member 11 and a second driving force receiving component 32 for providing driving force to the photosensitive member 21. Along the x direction, at least a portion of the driving force receiving component 3 is exposed to the outside through the end cover 4; obviously, when the driving force receiving component 3 is set to two, not only the driving force transmission structure in the imaging device and the processing box can be simplified, but also the load of the driving force output member in the imaging device and the driving force receiving component can be reduced. Accordingly, the service life of the driving force output member and the driving force receiving member can be extended.

[0035] The end cover 4 includes an end cover body 40 and a first exposure hole 41 and a second exposure hole 42 arranged on the end cover body 40. The first driving force receiving member 31 rotates around the first rotation axis L1 and is exposed to the outside through the first exposure hole 41. The second driving force receiving member 42 rotates around the second rotation axis L2 and is exposed to the outside through the second exposure hole 42.

[0036] In the following, for the convenience of description, the extension direction of the developing member 11 and the photosensitive member 21 is defined as the x direction / longitudinal direction, the arrangement direction of the first box body 10 and the second box body 20 (the direction relative to the developing member 11 and the photosensitive member 21) is defined as the y direction / transverse direction, and the direction intersecting the x direction and the y direction is defined as the z direction / vertical direction. Among them, the driving force receiving assembly 3 and the end cover 4 are both arranged at the end of the processing box in the x direction, the side where the driving force receiving assembly 3 is located is called the driving side F, the side opposite to the driving side is the non-driving side E, the direction from the driving side F to the non-driving side E is the -x direction, on the contrary, the direction from the non-driving side E to the driving side F is the +x direction; the direction from the first box body 10 to the second box body 20 (the direction from the developing member 11 to the photosensitive member 21) is the -y direction, on the contrary, the direction from the second box body 20 to the first box body 10 is the +y direction. The direction (the direction from the photosensitive member 21 to the developing member 11) is the +y direction; the direction from the side where the developing member 11 and the photosensitive member 21 are not installed to the side where the developing member 11 and the photosensitive member 21 are installed is the -z direction. On the contrary, the direction from the side where the developing member 11 and the photosensitive member 21 are installed to the side where the developing member 11 and the photosensitive member 21 are not installed is the +z direction. When the processing box 100 is installed to the imaging device, the developing member 11 and the photosensitive member 21 will be located below the processing box, that is, the +z direction is upward and the -z direction is downward.

[0037] Furthermore, the processing box 100 also includes a separation mechanism 6. When the processing box 100 is in a state of being installed in the imaging device, when the imaging device does not need to perform a developing operation (the processing box 100 is not working), in order to avoid the developer 11 and the photosensitive member 21 being close to each other for a long time, resulting in the surface of the photosensitive member 21 being contaminated by the developer carried by the developer 11 and / or the developer 11 being compressed and deformed by the photosensitive member 21, the force-applying mechanism in the imaging device applies a separation force to the separation mechanism 6, thereby forcing the first box body 10 and the second box body 20 to move relative to each other. Specifically, the first box body 20 and the second box body 20 rotate relative to each other, so that the developer 11 and the photosensitive member 21 can be separated from each other; when the imaging device needs to perform a developing operation again (the processing box 100 is working), the force-applying mechanism no longer applies a separation force to the separation mechanism 6, the first box body 10 and the second box body 20 move relative to each other again, and the developer 11 and the photosensitive member 21 are close to each other again.

[0038] It is feasible that the separation mechanism 6 can be arranged at any position of the processing box 100 according to the design requirements, as long as the relative movement of the first unit 1 and the second unit 2 can be realized. The end cover 4 can be set as an independent component, or it can be set to be formed integrally with the first box body 10 or the second box body 20, so the end cover 4 can also be regarded as a part of the first unit 1 or the second unit 2; further, the first box body 10, the second box body 20 and the end cover 4 can be collectively referred to as the shell of the processing box 100, the developing part 11 and the photosensitive part 21 can be collectively referred to as a rotating part, and in addition, other rotatable parts in the processing box 100 (such as a stirring part arranged in the first box body 10, a charging part arranged in the second box body 20, etc.) can also be regarded as a rotating part, and the rotating part is arranged in the shell in a rotating manner.

[0039] Furthermore, the processing box 100 also includes a chip assembly CA detachably mounted on the shell, wherein the chip assembly CA includes a chip 9 and a chip frame 8 for supporting the chip 9, wherein at least the chip frame 8 is configured to be detachable relative to the shell, so that the user can easily remove the chip assembly CA from the shell, and then upgrade the chip 9, or directly replace the chip assembly CA.

[0040] In some embodiments, the chip 9 may also be configured to be detachable relative to the chip rack 8. On the one hand, compared to taking the chip 9 out of the chip rack 8, when the chip rack 8 is easier to take out from the shell, the user may first take out the chip rack 8, and then take the chip 9 out of the chip rack 8. The chip 9 may be taken out with the aid of tools, or may be directly pulled out or dug out by hand, etc. In this way, the user may have more ways and a larger operating space to take out the chip 9; on the other hand, the user may only replace the chip 9, and the chip rack 8 that can still be used may continue to be used.

[0041] In some embodiments, the processing box 100 also includes an error-proofing device 7 disposed on the shell, and the error-proofing device 7 is used to cooperate with a corresponding part in the imaging device to prevent the user from installing the processing box 100 to a wrong position. For example, the user puts the driving end F and the non-driving end E in reverse. Especially in a color imaging device where multiple processing boxes need to be installed at the same time, each processing box contains a developer of a different color, and the imaging device is also provided with a plurality of processing box accommodating chambers, each of which can accommodate a processing box with a developer of a corresponding color. The error-proofing device 7 can also ensure that the user installs the processing box into the correct processing box accommodating chamber.

[0042] like Figure 1CAs shown, when the processing box 100 is installed to the predetermined position of the imaging device, the separation mechanism 6 is located below the processing box 100, and the chip assembly CA is located above the processing box 100, or in other words, along the z direction, the first rotation axis L1 is located in the +z direction (above) of the second rotation axis L2, at least a portion of the separation mechanism 6 is located in the -z direction (below) of the second rotation axis L2, and at least a portion of the chip assembly CA is located in the +z direction (above) of the first rotation axis L1. One of the benefits of such an arrangement is that when the separation mechanism 6 separates the developing member 11 and the photosensitive member 21, the vibration influence on the chip assembly CA is reduced, thereby improving the contact stability between the chip 9 and the contact pin.

[0043] Along the z direction, at least a portion of the chip component CA is opposite to at least a portion of the second driving force receiving member 32, preferably, the chip component CA is opposite to the second rotation axis L2, but the chip component CA and the first driving force receiving member 31 are staggered in the y direction, and at least a portion of the separation mechanism 6 is opposite to at least a portion of the first driving force receiving member 31, preferably, the separation mechanism 6 is opposite to the first rotation axis L1, but the separation mechanism 6 and the second driving force receiving member 32 are staggered in the y direction; further, when the chip component CA, the first rotation axis L1, the second rotation axis L2 and the separation mechanism 6 are projected along the y direction to a projection plane parallel to the z direction, along the z direction, the first rotation axis L1 is located between the chip component CA and the second rotation axis L2, and the second rotation axis L2 is located between the first rotation axis L1 and the separation mechanism 6, and in the direction from +z to -z, the chip component CA, the first rotation axis L1, the second rotation axis L2 and the separation mechanism 6 are arranged in sequence, but along the z direction, the chip component CA is not opposite to the first rotation axis L1, and the separation mechanism 6 is not opposite to the second rotation axis L2.

[0044] From the above description, it can be known that the first rotation axis L1 and the second rotation axis L2 are staggered in the z direction and the y direction; along the z direction, one of the first rotation axis L1 and the second rotation axis L2 that is closer to the chip component CA is staggered with the chip component CA in the y direction, and the other is opposite to the chip component CA in the z direction; one of the first rotation axis L1 and the second rotation axis L2 that is closer to the separation mechanism 6 is staggered with the separation mechanism 6 in the y direction, and the other is opposite to the separation mechanism 6 in the z direction. Through such an arrangement, when the separation mechanism 6 moves when it receives the separation force from the imaging device and when the first driving force receiving member 31 and the second driving force receiving member 32 rotate when they receive the driving force from the imaging device, the mutual influence between the separation mechanism 6 and the first driving force receiving member 31 and the second driving force receiving member 32 can be effectively reduced. At the same time, the influence of the moving separation mechanism 6 and the rotating first driving force receiving member 31 and the second driving force receiving member 32 on the chip component CA is also effectively reduced.

[0045] In some embodiments, in order to effectively protect the separation mechanism 6, the processing box 100 also includes a shielding member (not shown) arranged on the end cover 4, and the separation mechanism 6 has a separation force receiving surface for receiving the separation force. Along the x direction, the shielding member is located in the +x direction / -x direction of the separation force receiving surface, that is, along the x direction, the shielding member is farther away from the first box body 10 or the second box body 20 than the separation mechanism 6. In this way, the shielding member can protect the separation mechanism 6 on the outside of the separation mechanism 6; when the processing box is installed to a predetermined position of the imaging device, along the z direction, preferably, the lower end of the separation force receiving surface is not lower than the lower end of the shielding member, and when the processing box 100 is installed at a predetermined position of the imaging device, preferably, the lower end of the separation force receiving surface is not lower than the lower end of the shielding member. Figure 1C When the device is placed on a desktop in the posture shown, the contact moment between the lower end of the shielding member and the desktop is no later than the contact moment between the separation force receiving surface and the desktop, so that the separation mechanism 6 can be protected.

[0046] The chip assembly involved in the utility model is described below.

[0047] Embodiment 1

[0048] like Figure 2 As shown, the chip 9 includes a substrate 91 and an electrical contact portion 92 and a storage portion 93 (eg, Figure 5 As shown, the electrical contact portion 92 is used to electrically contact with the contact pin in the imaging device. The storage portion 93 stores various information of the processing box 100. The storage portion 93 is electrically connected to the electrical contact portion 92. The storage portion 93 can be arranged on the same side of the substrate 91 as the electrical contact portion 92, or can be arranged on both sides of the substrate 91. Generally, the storage portion 93 protrudes from the surface of the substrate 91. Figure 2 The structure in which the storage part 93 and the electrical contact part 92 are respectively located on both sides of the substrate 91 is shown. This design is beneficial to prevent the storage part 93 from interfering with the contact pin, or the storage part 93 from interfering with other components in the imaging device, thereby affecting the contact stability between the electrical contact part 92 and the contact pin.

[0049] In some embodiments, the storage portion 93 can also be separated from the substrate 91, and the electrical contact portion 92 is connected to the storage portion 93 through a conductor. This structure can reduce the design difficulty of the support portion 82 described below, thereby improving the design freedom of the chip rack 8.

[0050] Specifically, the storage part 93 and the electrical contact part 92 are respectively located on both sides of the thickness direction of the substrate 91. Preferably, the storage part 93 and the electrical contact part 92 are staggered along the thickness direction (z direction) of the substrate 91. Along the direction intersecting the thickness direction, the substrate 91 includes a first substrate 91a and a second substrate 91b, wherein the electrical contact part 92 is arranged on the first substrate 91a, and the storage part 93 is arranged on the second substrate 91b. Along the thickness direction of the substrate 91, a part of the surface of one side of the substrate 91 where the electrical contact part 92 is not arranged will form the following adhesive bearing part, and another part of the surface will form a storage part bearing part for setting the storage part 93, wherein the adhesive bearing part and the electrical contact part 92 are arranged opposite to each other in the z direction.

[0051] The chip rack 8 includes a main body 81 and a chip support portion (referred to as "support portion") 82 connected to the main body 81. The main body 81 is constructed to cooperate with the processing box shell so that the chip rack 8 is supported by the processing box shell; the shell is provided with a accommodating portion 43 for accommodating the chip rack 8, and the main body 81 and the accommodating portion 43 can be completely matched or only partially matched, as long as the chip rack 8 can be supported by the shell; in this embodiment, the support portion 82 is formed by protruding toward the +z direction from a surface (end surface) 811 of the main body 81 facing the +z direction, so that at least one step portion (avoidance space) 85 will be formed between the support portion 82 and the main body 81; the +z direction end of the support portion 82 will form a support surface 821 for supporting the chip 9. Preferably, the support surface 821 is formed as a plane, that is, the surface 821 for supporting the chip 9 in the support portion 82 is a plane, and in all directions intersecting with the thickness direction of the substrate 91, the surface 821 is unobstructedly connected to the step portion 85.

[0052] When the chip 9 needs to be installed, the adhesive is first applied to the adhesive bearing portion, and then the adhesive bearing portion is attached to the support surface 821, so that the chip 9 is adhered to the support surface 821. Optionally, the adhesive can also be applied to the support surface 821 first, or the adhesive is applied to the support surface 821 and the adhesive bearing portion at the same time. Finally, the chip 9 and the chip frame 8 are bonded to each other through the adhesive; Figure 3 As shown, along the thickness direction of the substrate 91 , the adhesive bearing portion is opposite to the supporting surface 821 , and the storage portion 93 is opposite to the step portion 85 , so that the chip frame 8 stably supports the chip 9 .

[0053] Preferably, the adhesive bearing portion is also formed as a plane, so that the area of ​​the adhesive bearing portion and the area of ​​the supporting surface 821 should not be restricted. That is to say, the adhesive bearing portion can be arranged to exactly match the shape of the supporting surface 821, or can be arranged to exceed the contour line of the supporting surface 821, or be located within the contour line of the supporting surface 821, as long as the adhesive bearing portion and the supporting surface 821 can be bonded together by the adhesive; the storage portion 93 is accommodated by the step portion 85, and finally, the chip 9 can be combined with the supporting surface 821 without tilting, and the adhesive bearing portion and the supporting surface 821 form good surface contact.

[0054] The adhesive can be a solid adhesive such as double-sided tape, foam adhesive, hot melt adhesive, etc., or a fluid adhesive such as glue, etc. The fluid adhesive is in a flowable state when sealed. The present embodiment is preferably a fluid adhesive because the solid adhesive has more coating / pasting steps and the coating / pasting position accuracy of the adhesive is required to be higher, otherwise a stable bond cannot be formed between the adhesive bearing portion and the support surface 821, and the solid adhesive is easily affected by the external environment and changes, thereby affecting the bonding state between the adhesive bearing portion and the support surface 821.

[0055] It can be seen that the chip assembly CA using the above technical solution can at least produce the following beneficial effects:

[0056] 1. As long as the fluid adhesive is coated on the adhesive bearing part, as the adhesive bearing part and the supporting surface 821 gradually approach each other, the fluid adhesive will flow between the adhesive bearing part and the supporting surface 821 and gradually form a uniform distribution between the two. Finally, the adhesive bearing part and the supporting surface 821 form a stable combination, and the fluid adhesive is less affected by the external environment.

[0057] On the contrary, in the solution using solid adhesive, once the solid adhesive is applied excessively or the pasting position is not precise enough, even if the extrusion between the adhesive bearing portion and the supporting surface 821 forces the solid adhesive to overflow outside the area opposite to the adhesive bearing portion and the supporting surface 821, the solid adhesive will not enter the step portion 85, but may reach the storage portion 93, thereby causing the storage portion 93 to be contaminated.

[0058] In addition, in the existing solution of using solid adhesive, it is very likely that the adhesive coating will be uneven, resulting in the inability to form a stable bond between the adhesive carrier and the support surface 821, and may also cause the chip 9 to be installed in a tilted state relative to the support surface 821.

[0059] 2. When the support surface 821 is connected to the step portion 85 without obstruction, even if excess fluid adhesive flows out from between the adhesive bearing portion and the support surface 821, the fluid adhesive will flow from the edge of the support surface 821 to the step portion 85, and the fluid adhesive will not overflow to the electrical contact portion 92 or the storage portion 93, causing damage to the chip 9.

[0060] 3. When the support surface 821 is in unobstructed communication with the step portion 85 , since the storage portion 93 can be accommodated by the step portion 85 , the chip rack 8 can also be combined with chips 9 of various sizes and become universal.

[0061] 4. When the support surface 821 is unobstructedly connected to the step portion 85, the installation direction of the chip 9 will no longer be restricted. At this time, the chip 9 can be installed in a direction parallel to the support surface 821 or in a direction intersecting the support surface 821. In other words, the chip 9 has greater installation freedom.

[0062] 5. Compared with the case where the chip 9 is fixed by snapping, when the support surface 821 is unobstructedly connected to the step portion 85 and a fluid adhesive is used, the chip 9 can be more easily removed. For example, the user removes the entire chip 9 from the support surface 821 by grasping the second substrate 91b, or the user inserts a thin sheet tool such as a blade between the adhesive bearing portion and the support surface 821 to "cut off" the chip 9 from the support surface 821.

[0063] In addition, the chip rack 8 also includes a coupling portion 83 connected to the main body 81 or the supporting portion 82, through which the chip rack 8 and the shell are detachably coupled; in the main body 81, the components other than the supporting portion 82 and the coupling portion 83 can also be regarded as the handle portion 84 of the chip rack 8, so that the user can operate the chip rack 8 / chip assembly CA by grasping the handle portion 84.

[0064] In this embodiment, the coupling portion 83 extends in a direction parallel to the supporting surface 821, which is beneficial to reducing the overall space of the chip rack 8, thereby realizing the miniaturization of the chip rack 8; at the same time, there are more parts in the shell that can be coupled with the chip rack 8, and the volume of the shell that can be coupled with the chip rack 8 is also larger, so that the chip rack 8 and the shell can be stably coupled.

[0065] As described above, the chip rack 8 is detachably combined with the processing box shell. When the chip 9 needs to be upgraded, the user can remove the chip rack 8 from the shell, and then use the upgrading equipment to directly upgrade the chip 9 on the chip rack 8. The user can also take the chip 9 out of the chip rack 8 and then upgrade the chip 9. The user can also directly replace it with a new chip assembly CA, in which the chip has been pre-upgraded. Finally, the original chip rack 8 or the new chip assembly CA is detachably installed to the shell. It can be seen that this technical solution allows users to conveniently upgrade the chip 9 or conveniently replace the chip 9 before the upgrade.

[0066] like Figure 1D As shown, in a variation of the present embodiment, the structure of the chip assembly CA is not limited, but a portion of at least one of the first exposure hole 41 and the second exposure hole 42 in the end cover 4 is cut off so that the end cover 4 can more conveniently combine the first unit 1 and the second unit 2. It can be understood that when viewed along the x direction, the first exposure hole 41 and the second exposure hole 42 do not have to be a closed shape. For example, the first exposure hole 41 and the second exposure hole 42 do not have to form a circular, elliptical, regular or irregular polygonal shape.

[0067] like Figure 1A As shown, the process box 100 further includes a protective cover 33 covering the first driving force receiving member 31 in the circumferential direction, the protective cover 33 is fixedly connected to the first box body 10, and the first driving force receiving member 31 is exposed from the protective cover 33 along the x direction. Figure 1D It is shown in the figure that after a part of the first exposure hole 41 is cut off, an exposure portion 44 is formed in the end cover 4. In the direction perpendicular to the x-direction, the exposure portion 44 is connected with the first exposure hole 41, and a part of the circumferential surface of the protective cover 33 used to cover the first driving force receiving member 31 will be exposed from the exposure portion 44 toward the direction perpendicular to the x-direction; in a deformable manner, the exposure portion 44 can also be connected with the second exposure hole 42 in the direction perpendicular to the x-direction. At this time, a part of the circumferential surface of the second driving force receiving member 32 will be exposed through the exposure portion 44 toward the direction perpendicular to the x-direction.

[0068] When the diameters of the first exposure hole 41 and the second exposure hole 42 are different, in order to improve the assembly efficiency of the processing box 100, the inner diameters of the first exposure hole 41 and the second exposure hole 42 can also be set to be the same. At the same time, the first driving force receiving member 31 and the second driving force receiving member 32 do not need to be distinguished in size, and the factory only needs to prepare one driving force receiving member.

[0069] Embodiment 2

[0070] Figure 4 This is an exploded view of the chip frame and the chip in the chip assembly involved in the second embodiment of the present invention after being separated.

[0071] Different from the first embodiment, the chip frame 8 in this embodiment also includes at least one side wall 87 extending from the supporting portion 82 and a limiting protrusion 89 arranged on the side wall 87. Along the z direction, the limiting protrusion 89 is opposite to the supporting surface 821, and a slot 86 is formed therebetween. The chip 9 is installed toward the chip frame 8 along a direction parallel to the supporting surface 821, and at least a portion of the first substrate 91a can enter the slot 86. Therefore, the first substrate 91a can be limited in the z direction.

[0072] Along the installation direction of the chip 9 toward the chip holder 8, a side wall is formed at the downstream end of the support surface 821 as a restriction portion for restricting the chip 9 from escaping. In the solution where the chip 9 is combined with the chip holder 8 by a fluid adhesive, since the chip 9 has been adhered to the support surface 821 by the adhesive, the slot 86 and the restriction portion 87 are no longer necessary, but at least one side wall 87 is provided along a direction parallel to the installation direction of the chip 9, which is conducive to guiding the installation of the chip 9 and ensuring that the chip 9 reaches the predetermined installation position.

[0073] Embodiment 3

[0074] Figure 5 This is an exploded view of the chip frame and the chip in the chip assembly involved in the third embodiment of the present utility model after being separated; Figure 6 It is a three-dimensional diagram of the chip assembly involved in the third embodiment of the present utility model.

[0075] Different from the above-mentioned embodiment, the coupling portion 83 in this embodiment is configured to extend along a direction intersecting with the supporting surface 821. Preferably, the extension direction of the coupling portion 83 is perpendicular to the extension direction of the supporting surface 821. This structural design can avoid the chip 9 and the coupled portion 83 from scratching each other during the installation of the chip 9, thereby reducing the installation efficiency of the chip 9 and preventing the chip 9 from being worn.

[0076] Embodiment 4

[0077] Figure 7 This is an exploded view of the chip frame and the chip in the chip assembly involved in the fourth embodiment of the present invention after being separated.

[0078] On the basis of Example 3, the support portion 82 in this embodiment is divided into a first support portion 82a and a second support portion 82b spaced apart from each other. The first support portion 82a and the second support portion 82b are spaced apart along the y direction to form a connecting portion 82c therebetween. The step portion 85 is located in the -z direction of the support portion 82, and the connecting portion 82c is also connected to the step portion 85.

[0079] In the structure of the chip rack 8 involved in the present embodiment, the step portion 85 and the supporting portion 82 are arranged relative to each other in the z direction, and the overall size of the chip rack 8 in at least one of the x direction and the y direction can be reduced, so that the overall size of the processing box 100 can also be reduced; at the same time, the setting of the connecting portion 82c makes it possible for even if there is excess adhesive between the adhesive bearing portion and the supporting surface 821, the adhesive can enter the step portion 85 through the connecting portion 82c.

[0080] Embodiment 5

[0081] Fig. 8A This is an exploded view of the chip assembly and the processing box housing involved in the fifth embodiment of the present utility model after being separated; Figure 8B is a three-dimensional diagram of a chip assembly involved in Embodiment 5 of the present utility model; Fig. 9 It is a stereoscopic view of the chip assembly involved in the fifth embodiment of the present invention after being installed in the processing box housing.

[0082] The size of the chip rack 8 in this embodiment is further reduced. Fig. 8A and Figure 8B As shown, the support portion 82 is recessed from a surface (end surface) 811 of the main body 81 facing the +z direction toward the −z direction, so that a part of the main body 81 forms a side wall 87 around the support surface 821 .

[0083] Preferably, a step portion 85 is disposed adjacent to the support surface 821 , and along the z direction, the step portion 85 is farther away from the surface 811 than the support surface 821 .

[0084] The chip frame 8 also includes a buckle position 89 extending from the main body 81 toward the +z direction, and the buckle position 89 includes an extension portion 891 connected to the main body 81 and an abutment portion 892 arranged on the extension portion 891. The chip 9 is installed to the support surface 821 by squeezing the abutment portion 892 so that the extension portion 891 is deformed. Subsequently, the extension portion 891 is reset and the abutment portion 892 restricts the chip 9 in the +z direction of the chip 9.

[0085] The buckle position 89 in this embodiment also plays a role in combining the chip frame 8 with the shell, so the buckle position 89 can also be regarded as the combining portion 83 of the chip frame 8 in this embodiment, which will be described in detail below.

[0086] like Fig. 8A and Fig. 9As shown, the accommodating portion 43 is a cavity formed on the shell, including a side plate 431 extending from the shell and a blocking portion 432 extending from the side plate 431. Specifically, the side plates 431 are arranged to extend from the shell toward the +z direction, and the multiple side plates 431 enclose a chip rack accommodating cavity 433 opening toward the +z direction and the +x direction. The chip rack accommodating cavity 433 is located between two side plates (first side plates) 431a arranged opposite to each other in the y direction, and the blocking portion 432 extends from the first side plate 431a toward the y direction. Preferably, the blocking portion 432 is extended on both first side plates 431a, so that the two blocking portions 432 are also arranged opposite to each other in the y direction, but the two blocking portions 432 are not connected, so that each blocking portion 432 forms a cantilever and has elasticity, and the gap 434 formed by the two blocking portions 432 in the y direction is smaller than the size of the part of the buckle 89 used to pass through the gap 434 in the y direction.

[0087] The multiple side panels 431 also include a second side panel 431b located between the two first side panels 431a. The chip rack 8 is installed along the -x direction toward the chip rack accommodating cavity 433. Along the installation direction of the chip rack 8, the second side panel 431b is located downstream of the blocking portion 432. During the installation of the chip rack 8, after the main body 81 enters the chip rack accommodating cavity 433, the buckle position 89 squeezes the two blocking portions 432. By forcing the elastic deformation of the two blocking portions 432, the buckle position 89 reaches between the second side panel 431b and the blocking portions 432. Subsequently, the two blocking portions 432 are reset, and the buckle position 89 is restricted between the second side panel 431b and the two blocking portions 432. The chip rack 8 is combined with the shell. At the same time, the two blocking portions 432 also prevent the chip rack 8 from being separated from the shell in the +z direction of the chip rack 8.

[0088] In a feasible deformation mode, the blocking portion 432 can also be configured to extend from the first side plate 431a toward the y direction, but the two blocking portions are no longer arranged relative to each other in the y direction, but are staggered in the z direction, that is, one of the blocking portions is located in the +z direction or -z direction of the other blocking portion. At this time, in the z direction, the two blocking portions may have partial overlap or no overlap, and when the two blocking portions are projected along the z direction, the projections of the two blocking portions may be spaced apart from each other in the y direction, may just touch each other, or may partially overlap.

[0089] In another achievable variation, the two blocking portions 432 can also be simplified into one blocking portion, that is, only one cantilevered blocking portion 432 needs to be provided in the accommodating portion 43, and the one blocking portion 432 can also prevent the chip rack 8 from detaching from the shell in a direction opposite to the installation direction (-x direction), and prevent the chip rack 8 from detaching from the shell in the +z direction of the chip rack 8.

[0090] Preferably, in the installation direction of the chip rack 8, the minimum distance between the blocking portion 432 and the second side plate 431b is substantially equivalent to the maximum distance between two parts of the buckle position 89 contacting the blocking portion 432 and the second side plate 431b in the x-direction, respectively. In this way, the buckle position 89 can be stably positioned between the blocking portion 432 and the second side plate 431b. Finally, the chip rack 8 is stably positioned in the x-direction.

[0091] Similarly, when the chip 9 needs to be upgraded, the user pulls the chip rack 8 along the +x direction. After overcoming the elastic force of the blocking part 432, the chip rack 8 is disengaged from the shell. Then, the user can directly upgrade the chip 9 according to the actual situation, or only replace the chip 9, or directly replace the entire chip assembly CA.

[0092] In the chip assembly CA involved in this embodiment, the chip 9 can be restricted in the support part 82 by being abutted by the abutment part 892 of the buckle position 89, and can also be fixed in the support part 82 by applying adhesive in the adhesive bearing part.

[0093] Similar to the above embodiment, when the adhesive carrying portion of the chip 9 carries a fluid adhesive, the side wall 87 and the abutting portion 892 will no longer be necessary.

[0094] In summary, the chip assembly CA involved in the utility model is combined with the processing box shell in a detachable manner. In this way, when the chip 9 in the chip assembly CA needs to be upgraded, the user only needs to take the chip assembly CA out of the shell and then directly upgrade the chip 9, or take the chip 9 out of the chip frame 8 of the chip assembly for upgrading, or directly replace the chip assembly CA with the upgraded chip, and the other components of the processing box 100 can continue to be used. Compared with the method of installing the chip assembly on the shell in a non-detachable manner for chip upgrading, the solution provided by the utility model enables users to operate more conveniently.

Claims

1. A process cartridge, detachably mounted in an imaging device provided with a stylus, characterized in that: Processing box includes: case; The developing member and the photosensitive member are both extended along the x direction and are rotatably arranged in the housing, and the two are arranged opposite to each other; A separation mechanism for receiving a separation force from the image forming device to force the developing member and the photosensitive member to separate from each other; A driving force receiving member, used for receiving driving force from an imaging device and providing it to a developing member or a photosensitive member, the side where the driving force receiving member is located is a driving side, the side opposite to the driving side is a non-driving side, and the direction from the driving side to the non-driving side is a -x direction; a chip assembly, including a chip frame and a chip, wherein the chip is used to contact with the contact pin; The chip rack is detachably combined with the housing, and the chip rack includes a main body and a support portion connected to the main body, the main body is used to cooperate with the housing, and the support portion is used to support the chip and limit the chip from falling out in the -x direction; When the process cartridge is mounted to a predetermined position of the image forming apparatus, at least a portion of the chip assembly is located above the separation mechanism.

2. The process cartridge according to claim 1, wherein: The direction from the side where the developing member and the photosensitive member are installed to the side where the developing member and the photosensitive member are not installed is the +z direction, and the opposite direction is the -z direction; The support portion is recessed from the end surface of the main body portion facing the +z direction toward the -z direction, and a portion of the main body portion forms a restriction portion that restricts the chip from escaping in the -x direction.

3. The process cartridge according to claim 2, wherein: The chip rack further comprises a buckling position extending from the main body toward the +z direction, and the chip is restrained on the supporting portion by being abutted by the buckling position.

4. The process cartridge according to claim 3, wherein: The buckle position includes an extension portion connected to the main body portion and an abutment portion arranged on the extension portion; During the chip installation process, the chip presses the abutment portion and the extension portion is deformed; After the chip is mounted on the supporting surface, the extending portion is reset and the abutting portion restricts the chip in the +z direction of the chip.

5. The process cartridge according to claim 3, wherein: The relative direction between the developing member and the photosensitive member is the y direction; The shell is provided with a cavity for cooperating with the chip rack, and the cavity includes a plurality of side panels extending from the shell toward the +z direction and a blocking portion extending from the side panels. During the installation of the chip rack, the buckle reaches between one of the side panels and the blocking portion by forcing the blocking portion to undergo elastic deformation.

6. The process cartridge according to claim 5, wherein: The side plate includes two first side plates and a second side plate located between the two first side plates. The two first side plates are arranged opposite to each other along the y direction. The blocking part is extended from at least one first side plate toward the y direction. Along the installation direction of the chip frame, the second side plate is located downstream of the blocking part.

7. The process cartridge according to any one of claims 1 to 6, characterized in that: The process cartridge further comprises a first driving force receiving member and a second driving force receiving member for receiving driving force from the image forming device, the first driving force receiving member providing driving force for the developing member, and the second driving force receiving member providing driving force for the photosensitive member; The housing includes: A first box body, in which the developing member is rotatably disposed; A second box body, in which the photosensitive member is rotatably arranged; an end cover having a first exposure hole, a second exposure hole, and an exposure portion, the first driving force receiving member being exposed to the outside through the first exposure hole, and the second driving force receiving member being exposed to the outside through the second exposure hole; In a direction perpendicular to the x-direction, the exposed portion communicates with the first exposure hole or the second exposure hole.

8. The process cartridge according to claim 7, wherein: The process cartridge further includes a protective cover surrounding the first driving force receiving member in a circumferential direction, wherein a portion of a circumferential surface of the protective cover for covering the first driving force receiving member is exposed from the exposed portion toward a direction perpendicular to the x direction.

9. The process cartridge according to any one of claims 1 to 6, characterized in that: The process cartridge further comprises a first driving force receiving member and a second driving force receiving member for receiving driving force from the image forming device, the first driving force receiving member providing driving force for the developing member, and the second driving force receiving member providing driving force for the photosensitive member; The housing includes: A first box body, in which the developing member is rotatably disposed; A second box body, in which the photosensitive member is rotatably arranged; an end cover having a first exposure hole and a second exposure hole, the first driving force receiving member is exposed to the outside through the first exposure hole, and the second driving force receiving member is exposed to the outside through the second exposure hole; When viewed along the x-direction, at least one of the first exposure hole and the second exposure hole is not closed.

10. The process cartridge according to claim 9, wherein: The end cover also includes an exposure portion communicating with the first exposure hole, and the process box also includes a protective cover surrounding the first driving force receiving member in the circumferential direction, wherein a portion of the circumferential surface of the protective cover for covering the first driving force receiving member is exposed from the exposure portion toward a direction perpendicular to the x direction.

Images