Online accurate single-point automatic ball supplementing equipment

Abstract

The utility model discloses an on-line accurate single-point automatic ball supplementing device which comprises a feeding flow channel device which is at least used for conveying a material disc loaded with products. The ball mounting platform device is arranged on one side of the feeding runner device; a feeding box mechanism is arranged at one end of the ball mounting platform device, and the feeding box mechanism is at least used for storing ball mounting jigs; a jig drag hook mechanism is further arranged between the ball mounting platform device and the feeding runner device, and the jig drag hook mechanism is at least used for pulling the ball mounting jig out of the feeding box mechanism to the ball mounting platform device; and the feeding and transferring device is arranged above one end of the feeding runner device. According to the utility model, a series of working procedures such as automatic feeding, soldering flux dipping and automatic ball mounting of products can be realized, the automation degree is high, the working efficiency is high, a large amount of manpower resources can be saved, and the labor cost is further greatly reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of BGA chip solder ball replenishment, in particular to an online precise single-point automatic ball replenishment device. Background Art

[0002] With the rapid development of the electronics industry, the integration capability of electronic products is constantly improving, and the requirements for the packaging and ball planting process of BGA chips are also increasing. The diameter of the solder balls is required to be smaller and smaller, so there is a certain probability of defective products such as bridges, large and small balls, missing balls, multiple balls, cold solder joints, and misalignment in the process of mass production. These defective BGA chips need to be repaired for the defective points to remove the defective solder balls and then perform ball planting corrections. There are two main traditional conventional repair methods in the industry:

[0003] 1) Use electric iron and solder sucking wire to remove all solder balls from the entire BGA chip, and then use the ball planting table to manually plant the balls;

[0004] 2) Manually under a microscope, use tweezers to scrape off the defective solder ball, then use tweezers to place a new solder ball and then re-plant the ball.

[0005] Both methods have obvious defects. When the first method uses a traditional electric soldering iron to clean the solder balls, the surface of the solder sucking wire is very rough, which will greatly reduce the adhesion of the metal pad on the circuit board. If you are not careful, the pad will be taken away, resulting in direct product scrapping. Moreover, this method is to remove all the solder balls on the entire BGA and then re-plant the entire piece. This method will greatly waste materials such as solder balls, making it difficult to reduce the maintenance-oriented, and also increase the risk of BGA scrapping due to careless tin removal and the risk of scrapping due to low success rate of secondary ball planting. The second method requires extremely high manual proficiency, and the overall repair yield is relatively low, generally only about 60%, and employees need to work under a microscope for a long time, causing irreversible damage to the employees' eyes. In addition, as BGA chips become smaller and smaller, the diameter of the solder balls is also getting smaller, and the difficulty of maintenance is increasing exponentially. Manual labor can no longer meet the rework of BGA chips with solder ball diameters below 0.3mm. Utility Model Content

[0006] The purpose of the utility model is to provide an online precise single-point automatic ball replenishing equipment, which is equipped with a feeding flow channel device, a ball planting platform device, a feeding and transferring device, a ball planting device, a solder ball supplying device and a flux supplying device. Through the mutual cooperation of the above devices, a series of processes such as automatic feeding of products, dipping in flux and automatic ball planting can be realized. It has a high degree of automation and high work efficiency, can save a lot of human resources, and thus greatly reduces labor costs.

[0007] To achieve the above objectives, the following technical solutions are adopted:

[0008] An online precise single-point automatic ball replenishment device, comprising:

[0009] A material feeding channel device, the material feeding channel device is at least used to transport a material tray carrying a product;

[0010] A ball planting platform device, the ball planting platform device is arranged on one side of the feed runner device; a feed box mechanism is provided at one end of the ball planting platform device, the feed box mechanism is at least used to store ball planting jigs; a jig hook mechanism is also provided between the ball planting platform device and the feed runner device, the jig hook mechanism is at least used to pull the ball planting jig out of the feed box mechanism and onto the ball planting platform device;

[0011] A loading and transferring device, which is arranged above one end of the loading flow channel device, and is used at least to transfer the product in the material tray to the ball planting fixture;

[0012] The ball planting device is arranged above the ball planting platform device, and a solder ball supply device and a solder flux supply device are respectively arranged below the two ends of the ball planting device.

[0013] Furthermore, the ball planting platform device includes a first X-axis translation mechanism, a first translation frame connected to the first X-axis translation mechanism, a first lifting mechanism installed on the first translation frame, and a first lifting plate connected to the first lifting mechanism; a plurality of ceramic suction cup assemblies are also installed at intervals along the top length direction of the first lifting plate.

[0014] Furthermore, the material feeding box mechanism includes a material box lifting mechanism, a material box lifting frame connected to the material box lifting mechanism, and a material storage box installed on the material box lifting frame; the jig hook mechanism includes a second X-axis translation mechanism, a hook lifting mechanism connected to the second X-axis translation mechanism, and a hook connected to the hook lifting mechanism; hook slots are also provided at both ends of the top of the ball planting jig.

[0015] Furthermore, the ball planting device includes a double-motor linear motor, a flux dipping mechanism, a ball planting mechanism, a first sliding plate, and a second sliding plate; the double-motor linear motor is arranged above the feeding channel device in a vertical direction thereof, and the first sliding plate and the second sliding plate are respectively connected to one of the movers of the double-motor linear motor; the ball planting mechanism includes a ball planting Z-axis lifting mechanism installed on one side of the first sliding plate, and a ball planting lifting plate connected to the ball planting Z-axis lifting mechanism; a plurality of ball planting modules are also installed on one side of the ball planting lifting plate, and the plurality of ball planting modules are arranged in parallel; each ball planting module includes a lifting voice coil motor, and a ball planting nozzle connected to the lifting voice coil motor.

[0016] Furthermore, the flux dipping mechanism includes a first Z-axis lifting mechanism installed on one side of the second sliding plate, a first lifting plate connected to the first Z-axis lifting mechanism, and a flux dipping assembly installed on one side of the first lifting plate; the flux dipping assembly includes a first slide plate, a flux dipping needle, and a dipping needle lifting motor; one side of the first slide plate is slidably connected to the first lifting plate, and the upper and lower parts of the other side of the first slide plate are respectively connected to a first connecting plate and a second connecting plate; the first connecting plate and the second connecting plate are both arranged in the horizontal direction; the dipping needle lifting motor is installed on the first lifting plate, and the output shaft of the dipping needle lifting motor is connected to the first connecting plate; the flux dipping needle is arranged in the vertical direction and is installed on the second connecting plate.

[0017] Furthermore, a first visual mechanism is installed on one side of the first lifting plate; a first fixed plate is connected to the first lifting plate, and a defective product transfer module is installed on the first fixed plate.

[0018] Furthermore, the solder ball supply device includes a third X-axis translation mechanism, a solder ball seat, a ball supply seat, and a multi-ball processing assembly; the third X-axis translation mechanism is driven and connected to a first translation plate, and the top of the first translation plate is also connected to a plurality of first support columns; the solder ball seat is installed on the first support column, and a plurality of mounting holes are spaced apart in the length direction of the top of the solder ball seat; a solder ball bin is installed in each of the mounting holes; the ball supply seat is arranged above the solder ball seat, and a ball supply port is also opened in the middle of the top of the ball supply seat; the multi-ball processing assembly is installed on one side of the ball supply seat; the other side of the ball supply seat is also connected to a first connecting seat, and a tool setting instrument is also installed on the first connecting seat.

[0019] Furthermore, the solder ball supply device also includes a static electricity removal component; the static electricity removal component includes a first stand and a plasma wind rod installed on the first stand; one end of the plasma wind rod extends to the top of the ball supply seat.

[0020] Furthermore, the flux supply device includes a first mounting frame, a scraper, a scraper assembly, and a scraper translation mechanism; a first bearing seat is installed on the top of the first mounting frame, and a first bearing groove is opened on the top of the first bearing seat along its length direction; the scraper is detachably installed in the first bearing groove; a plurality of flux scraping grooves of different thicknesses are also opened on the top of the scraper; the scraper assembly is arranged above the first bearing groove; the scraper translation mechanism is installed on the first mounting frame along the length direction of the first bearing groove, and the scraper translation mechanism is connected to the scraper assembly.

[0021] Furthermore, there are two scraper assemblies; the scraper translation mechanism is also driven to connect to a scraper translation seat, and a scraper lifting cylinder is arranged at each end of the scraper translation seat; each of the scraper lifting cylinders is respectively connected to a scraper assembly.

[0022] By adopting the above scheme, the beneficial effects of the utility model are:

[0023] The equipment is equipped with a feeding flow channel device, a ball planting platform device, a feeding and transferring device, a ball planting device, a solder ball supply device and a flux supply device. Through the mutual cooperation of the above devices, a series of processes such as automatic loading of products, dipping flux and automatic ball planting can be realized. It has a high degree of automation and high work efficiency, can save a lot of human resources, and thus greatly reduce labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of the utility model;

[0025] Figure 2 It is a structural schematic diagram of the ball planting device of the utility model;

[0026] Figure 3 It is a structural schematic diagram of the flux supply device of the utility model;

[0027] Figure 4 for Figure 3 A front view of

[0028] Figure 5 It is a structural schematic diagram of the flux dipping mechanism of the utility model;

[0029] Figure 6 for Figure 5 A local enlarged schematic diagram of point A;

[0030] Figure 7 It is a structural schematic diagram of the ball planting platform device of the utility model;

[0031] Figure 8 for Figure 7 Left view of

[0032] Fig. 9 It is a structural schematic diagram of the feeding box mechanism of the utility model;

[0033] Fig.10 It is a structural schematic diagram of the jig hook mechanism of the utility model;

[0034] Fig.11 It is a structural schematic diagram of the solder ball supply device of the utility model;

[0035] Fig.12 for Fig.11 A front view of

[0036] Fig.13 It is a structural schematic diagram of the ball planting mechanism of the utility model;

[0037] The accompanying drawings illustrate:

[0038] 1. Feeding channel device; 2. Ball planting platform device; 3. Feeding box mechanism; 4. Jig hook mechanism; 5. Feeding and transferring device; 6. Ball planting device; 7. Solder ball supply device; 8. Flux supply device; 21. First X-axis translation mechanism; 22. First translation frame; 23. First lifting mechanism; 24. First lifting plate; 25. Ceramic suction cup assembly; 31. Material box lifting mechanism; 32. Material box lifting frame; 33. Material storage box; 41. Second X-axis translation mechanism; 42. Hook lifting mechanism; 43. Hook; 61. Double-acting linear motor; 62. Flux dipping mechanism; 63. Ball planting mechanism; 71. Third X-axis translation mechanism; 72. Solder ball seat; 73. Ball supply seat; 74, multi-ball processing component; 75, solder ball bin; 76, ball supply port; 77, tool setting instrument; 78, plasma wind rod; 81, first mounting frame; 82, scraper; 83, scraper assembly; 84, scraper translation mechanism; 85, first bearing seat; 86, flux scraper groove; 87, scraper lifting cylinder; 621, first Z-axis lifting mechanism; 622, first lifting plate; 623, first slide plate; 624, flux dipping needle; 625, dipping needle lifting motor; 626, first visual mechanism; 627, defective product transfer module; 631, ball planting Z-axis lifting mechanism; 632, ball planting lifting plate; 633, lifting voice coil motor; 634, ball planting nozzle. DETAILED DESCRIPTION

[0039] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0040] Reference Figures 1 to 13 As shown, the utility model provides an online precise single-point automatic ball replenishing device, which, in one embodiment, includes

[0041] A material feeding channel device 1, wherein the material feeding channel device 1 is at least used for conveying a material tray carrying a product;

[0042] A ball planting platform device 2, the ball planting platform device 2 is arranged on one side of the feed runner device 1; a feed box mechanism 3 is provided at one end of the ball planting platform device 2, and the feed box mechanism 3 is at least used to store ball planting jigs; a jig hook mechanism 4 is also provided between the ball planting platform device 2 and the feed runner device 1, and the jig hook mechanism 4 is at least used to pull the ball planting jig out of the feed box mechanism 3 and onto the ball planting platform device 2;

[0043] A loading and transferring device 5, which is arranged above one end of the loading channel device 1, and is used at least to transfer the product in the material tray to the ball planting fixture;

[0044] The ball planting device 6 is arranged above the ball planting platform device 2, and a solder ball supply device 7 and a solder flux supply device 8 are respectively arranged below the two ends of the ball planting device 6.

[0045] Continue to refer to Figures 1 to 13 As shown, in this embodiment, the feed runner device 1 includes an assembly line mechanism, which is also provided with a lifting mechanism, a blocking mechanism, an end clamping mechanism, and a material unloading stacking mechanism. The feed runner device 1 is connected to the front-end assembly line. After the front-end assembly line performs single-point detinning on the product with defective solder balls, the product flows into the feed runner device 1 of this device through a standard material tray. After the feed runner device 1 lifts and positions the material tray through the blocking mechanism, the lifting mechanism and the end clamping mechanism, the feed transfer device 5 (including a three-axis translation mechanism and a vacuum suction nozzle) transports the products in the tray (in this embodiment, BGA chips) one by one to the ball planting platform device 2 On the ball planting fixture, then, the ball planting device 6 dips the flux from the flux supply device 8 and transfers it to the pad to be filled on the BGA chip, and the ball planting device 6 then absorbs the solder balls from the solder ball supply device 7 and implants them into the corresponding pads. After the ball planting is completed, it will be visually inspected, and the qualified chips will be transferred to the material tray, and the unqualified chips will be moved to the NG buffer. After all the chips in the material tray are filled, the loading flow channel device 1 will transfer them to the unloading stacking mechanism for unloading. In addition, in order to improve work efficiency, in this embodiment, the ball planting platform device 2, the material supply box mechanism 3 and the fixture hook mechanism 4 are each provided with two groups.

[0046] In one embodiment, the ball planting platform device 2 includes a first X-axis translation mechanism 21, a first translation frame 22 connected to the first X-axis translation mechanism 21, a first lifting mechanism 23 installed on the first translation frame 22, and a first lifting plate 24 connected to the first lifting mechanism 23; a plurality of ceramic suction cup assemblies 25 are also installed at intervals along the top length direction of the first lifting plate 24.

[0047] In this embodiment, the first X-axis translation mechanism 21 adopts a linear motor module, the first lifting mechanism 23 adopts a motor or cylinder drive mode, the number of ceramic suction cup assemblies 25 is provided with four groups (the number of ceramic suction cup assemblies 25 can be adaptively adjusted according to actual use requirements), the four groups of ceramic suction cup assemblies 25 are independent of each other, and at the same time, four groups of solenoid valve assemblies are provided, which independently control a ceramic suction cup assembly 25 to be vacuumed or broken, and a plurality of ball planting jigs are stored in the feed box mechanism 3, and the ball planting jigs can be pulled onto the jig platform mechanism through the jig hook mechanism 4, and then the first lifting mechanism 23 drives The first lifting plate 24 is moved upward to allow the ceramic suction cup assembly 25 to adhere to the bottom of the ball planting jig, and then the product in the ball planting jig (external robot, etc., transfers the product to the ball planting jig) is adsorbed and fixed, waiting for the ball planting process. After the ball planting process is completed, the product after ball planting needs to be tested. The qualified products are retained on the ball planting jig, and the unqualified products are transferred to the NG buffer area of ​​the ball planting jig. When the ball planting jig is filled with qualified products, it is pulled back into the feed box mechanism 3 by the jig hook mechanism 4, and then a new ball planting jig is pulled out from the feed box mechanism 3, and the above actions are repeated.

[0048] At the same time, the first translation frame 22 includes a first bottom plate and a first top plate; the bottom of the first bottom plate is connected to the first X-axis translation mechanism 21, and a first vertical plate is connected to each of the two sides of the top of the first bottom plate; the first top plate is connected to the tops of the two first vertical plates, and a through hole is also provided on the top of the first top plate; the first lifting mechanism 23 is installed on the first bottom plate, and the first lifting plate 24 is located below the first through hole. In this embodiment, a cleaning nozzle (using vacuum adsorption or a cleaning liquid in the cleaning nozzle) is also installed on one side of the first top plate to facilitate cleaning of the ball planting nozzle 634. At the same time, a guide strip is also provided on each of the two sides of the top of the first top plate along its length direction, and a limit strip is also provided at one end of the top of the first top plate. The ball planting jig can be guided by the guide strip, and the end of the ball planting jig can be limited by the limit strip.

[0049] In one embodiment, the material feeding box mechanism 3 includes a material box lifting mechanism 31, a material box lifting frame 32 connected to the material box lifting mechanism 31, and a material storage box 33 installed on the material box lifting frame 32; the jig hook mechanism 4 includes a second X-axis translation mechanism 41, a hook lifting mechanism 42 connected to the second X-axis translation mechanism 41, and a hook 43 connected to the hook lifting mechanism 42; hook slots are also provided at both ends of the top of the ball planting jig.

[0050] In this embodiment, the material box lifting mechanism 31 adopts a linear motor module, which can drive the material storage box 33 to lift and lower, so that the jig hook mechanism 4 can pull the ball planting jig. At the same time, the material storage box 33 is provided with a first cavity with an opening at one end, and a plurality of bearing bars are also spaced apart in the vertical direction on the inner walls on both sides of the first cavity. The ball planting jig can be inserted on the bearing bar. In addition, a clearance gap is also provided at one end of the top of the material storage box 33. The clearance gap is provided to facilitate the hook 43 of the jig hook mechanism 4 to pull the ball planting jig. The second X-axis translation mechanism 41 adopts a linear motor module, and the hook lifting mechanism 42 is a lifting cylinder. With the cooperation of the two, the hook 43 can be driven to perform translation and lifting movements, thereby facilitating the insertion of the hook 43 into the hook slot, and then pulling the ball planting jig.

[0051] In one embodiment, the ball planting device 6 includes a double-motor linear motor 61, a flux dipping mechanism 62, a ball planting mechanism 63, a first sliding plate, and a second sliding plate; the double-motor linear motor 61 is arranged above the feeding channel device 1 perpendicular to its transmission direction, and the first sliding plate and the second sliding plate are respectively connected to one of the movers of the double-motor linear motor 61; the ball planting mechanism 63 includes a ball planting Z-axis lifting mechanism 631 installed on one side of the first sliding plate, and a ball planting lifting plate 632 connected to the ball planting Z-axis lifting mechanism 631; a plurality of ball planting modules are also installed on one side of the ball planting lifting plate 632, and the plurality of ball planting modules are arranged in parallel; each ball planting module includes a lifting voice coil motor 633, and a ball planting nozzle 634 connected to the lifting voice coil motor 633.

[0052] In this embodiment, both the double-acting linear motor 61 and the ball planting Z-axis lifting mechanism 631 use linear motor modules. With the cooperation of the two, the ball planting module can be driven to perform translation and lifting movements, thereby facilitating the ball planting module to plant balls. At the same time, a plurality of ball planting modules are provided to improve the ball planting efficiency. The ball planting nozzle 634 can be driven to lift and lower through the lifting voice coil motor 633 to perform the ball planting action. In addition, an atomizing flux spraying component is also installed on one side of the first sliding plate. Before the ball planting process, the flux can be evenly applied to the corresponding pads of the BGA chip, which can effectively deal with the problem of misalignment by only applying flux without the need for ball planting.

[0053] At the same time, the flux dipping mechanism 62 includes a first Z-axis lifting mechanism 621 installed on one side of the second sliding plate, a first lifting plate 622 connected to the first Z-axis lifting mechanism 621, and a flux dipping assembly installed on one side of the first lifting plate 622; the flux dipping assembly includes a first slide plate 623, a flux dipping needle 624, and a dipping needle lifting motor 625; one side of the first slide plate 623 is slidably connected to the first lifting plate 622, and the upper and lower parts of the other side of the first slide plate 623 are respectively connected to a first connecting plate and a second connecting plate; the first connecting plate and the second connecting plate are both arranged in the horizontal direction; the dipping needle lifting motor 625 is installed on the first lifting plate 622, and the output shaft of the dipping needle lifting motor 625 is connected to the first connecting plate; the flux dipping needle 624 is arranged in the vertical direction and is installed on the second connecting plate. In this embodiment, the dip needle lifting motor 625 adopts a lifting torque motor, which can drive the flux dip needle 624 to lift and lower so that it can apply flux. At the same time, a first visual mechanism 626 is also installed on one side of the first lifting plate 622. The first visual mechanism 626 includes a camera and a light source, which can take pictures and locate the corresponding pads of the BGA chip so as to perform the process of transferring the flux. In addition, the first lifting plate 622 is also connected to a first fixed plate, and a defective product transfer module 627 is also installed on the first fixed plate. The defective product transfer module 627 is used to transfer NG products.

[0054] In one embodiment, the solder ball supply device 7 includes a third X-axis translation mechanism 71, a solder ball seat 72, a ball supply seat 73, and a multi-ball processing assembly 74; the third X-axis translation mechanism 71 is driven and connected to a first translation plate, and the top of the first translation plate is also connected to a plurality of first support columns; the solder ball seat 72 is installed on the first support column, and a plurality of mounting holes are spaced apart in the length direction of the top of the solder ball seat 72; a solder ball bin 75 is installed in each of the mounting holes; the ball supply seat 73 is arranged above the solder ball seat 72, and a ball supply port 76 is also opened in the middle of the top of the ball supply seat 73; the multi-ball processing assembly 74 is installed on one side of the ball supply seat 73; the other side of the ball supply seat 73 is also connected to a first connecting seat, and a tool setting instrument 77 is also installed on the first connecting seat.

[0055] In this embodiment, the third X-axis translation mechanism 71 adopts a linear motor module, and the number of solder ball bins 75 is set to four groups (the number can be adjusted accordingly according to usage requirements), each solder ball bin 75 stores solder balls of different diameters, and the third X-axis translation mechanism 71 can drive the solder ball seat 72 to translate left and right, and then automatically adjust the solder ball bin 75 supplying solder balls of corresponding diameters to the ball supply port 76, so as to realize the automatic ball supply of solder balls of different diameters, and then adapt to the needs of planting solder balls of different ball diameters, with strong versatility. At the same time, a multi-ball processing component 74 (including a suction nozzle component to absorb solder balls mixed or stuck together) is also provided, which can process mixed balls to avoid affecting the normal operation of the ball planting process. In addition, a tool setting instrument 77 is also provided, which can facilitate the calibration of the suction nozzle for sucking solder balls.

[0056] At the same time, the solder ball supply device 7 also includes a static electricity removal component; the static electricity removal component includes a first stand and a plasma wind rod 78 installed on the first stand; one end of the plasma wind rod 78 extends to the top of the ball supply seat 73. There are two groups of static electricity removal components, one of which is arranged on one side of the third X-axis translation mechanism 71, and the other static electricity removal component is arranged at one end of the third X-axis translation mechanism 71; the plasma wind rod 78 can remove static electricity from the solder balls to prevent them from sticking together due to static electricity.

[0057] In one embodiment, the flux supply device 8 includes a first mounting frame 81, a scraper 82, a scraper assembly 83, and a scraper translation mechanism 84; a first bearing seat 85 is installed on the top of the first mounting frame 81, and a first bearing groove is opened on the top of the first bearing seat 85 along its length direction; the scraper 82 is detachably installed in the first bearing groove; a plurality of flux scraping grooves 86 of different thicknesses are also opened on the top of the scraper 82; the scraper assembly 83 is arranged above the first bearing groove; the scraper translation mechanism 84 is installed on the first mounting frame 81 along the length direction of the first bearing groove, and the scraper translation mechanism 84 is connected to the scraper assembly 83.

[0058] In this embodiment, the first mounting frame 81 includes a bottom plate and a top plate; the top ends of the bottom plate are connected to a vertical plate, and the top ends of the top plate are connected to the top of a vertical plate; the first bearing seat 85 is mounted on the top plate, and the scraper translation mechanism 84 is mounted on the bottom plate. The scraper translation mechanism 84 can be a linear cylinder. When in use, the flux is placed in the bearing groove, and the scraper assembly 83 can slide left and right along the length direction of the first bearing groove under the drive of the scraper translation mechanism 84, and then scrape the flux into the flux scraping groove 86 in the scraper 82. The top of the scraper 82 is also provided with a plurality of flux scraping grooves 86 of different thicknesses, so that flux of different thicknesses can be provided.

[0059] In one embodiment, the number of the scraper assemblies 83 is two; the scraper translation mechanism 84 is also driven to connect a scraper translation seat, and a scraper lifting cylinder 87 is arranged at each end of the scraper translation seat; each scraper lifting cylinder 87 is connected to a scraper assembly 83. A first sliding hole is respectively opened on both sides of the top of the top plate along its length direction, and the first bearing seat 85 is arranged between the two first sliding holes; the scraper assembly 83 includes a scraper connecting seat and a scraper plate; the scraper connecting seat is U-shaped, one side of the U-shaped horizontal end of the scraper connecting seat is connected to the scraper lifting cylinder 87, and the two vertical ends of the U-shaped scraper connecting seat are respectively movable through a first sliding hole arrangement; the scraper plate is connected to the top of the two vertical ends of the U-shaped scraper connecting seat.

[0060] In this embodiment, the scraper connecting seat is designed to be a U-shaped structure, and the two vertical ends of the U-shape of the scraper connecting seat are respectively arranged through a first sliding hole, so as to realize the function of scraping flux while ensuring the compactness of the structure. In addition, under the drive of the scraper lifting cylinder 87, the scraper plate can be driven to rise and fall to adaptively adjust its height according to the use environment.

[0061] In addition, a fourth X-axis translation mechanism is also included, and the fourth X-axis translation mechanism is arranged along the length direction of the first bearing seat 85, and the fourth X-axis translation mechanism is connected to the first mounting frame 81. The fourth X-axis translation mechanism adopts a linear motor module, and the fourth X-axis translation mechanism can drive the first mounting frame 81 to translate, so as to move the scraped flux to the bottom of the flux dipping mechanism 62, so that it can apply the flux and transfer the flux to the corresponding pads of the BGA chip.

[0062] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An online precise single-point automatic ball replenishment device, characterized in that: include A material feeding channel device, the material feeding channel device is at least used to transport a material tray carrying a product; A ball planting platform device, the ball planting platform device is arranged on one side of the feed runner device; a feed box mechanism is provided at one end of the ball planting platform device, the feed box mechanism is at least used to store ball planting jigs; a jig hook mechanism is also provided between the ball planting platform device and the feed runner device, the jig hook mechanism is at least used to pull the ball planting jig out of the feed box mechanism and onto the ball planting platform device; A loading and transferring device, which is arranged above one end of the loading flow channel device, and is used at least to transfer the product in the material tray to the ball planting fixture; The ball planting device is arranged above the ball planting platform device, and a solder ball supply device and a solder flux supply device are respectively arranged below the two ends of the ball planting device.

2. The online precise single-point automatic ball replenishing device according to claim 1 is characterized in that: The ball planting platform device includes a first X-axis translation mechanism, a first translation frame connected to the first X-axis translation mechanism, a first lifting mechanism installed on the first translation frame, and a first lifting plate connected to the first lifting mechanism; a plurality of ceramic suction cup assemblies are also installed at intervals in the length direction of the top of the first lifting plate.

3. The online precise single-point automatic ball replenishing device according to claim 2 is characterized in that: The material feeding box mechanism includes a material box lifting mechanism, a material box lifting frame connected to the material box lifting mechanism, and a material storage box installed on the material box lifting frame; the jig hook mechanism includes a second X-axis translation mechanism, a hook lifting mechanism connected to the second X-axis translation mechanism, and a hook connected to the hook lifting mechanism; hook slots are also provided at both ends of the top of the ball planting jig.

4. The online precise single-point automatic ball replenishing device according to claim 1 is characterized in that: The ball planting device includes a double-motor linear motor, a flux dipping mechanism, a ball planting mechanism, a first sliding plate, and a second sliding plate; the double-motor linear motor is arranged above the feeding channel device in a transmission direction perpendicular to it, and the first sliding plate and the second sliding plate are respectively connected to one of the movers of the double-motor linear motor; the ball planting mechanism includes a ball planting Z-axis lifting mechanism installed on one side of the first sliding plate, and a ball planting lifting plate connected to the ball planting Z-axis lifting mechanism; a plurality of ball planting modules are also installed on one side of the ball planting lifting plate, and the plurality of ball planting modules are arranged in parallel; each ball planting module includes a lifting voice coil motor, and a ball planting nozzle connected to the lifting voice coil motor.

5. The online precise single-point automatic ball replenishing device according to claim 4 is characterized in that: The flux dipping mechanism includes a first Z-axis lifting mechanism installed on one side of the second sliding plate, a first lifting plate connected to the first Z-axis lifting mechanism, and a flux dipping assembly installed on one side of the first lifting plate; the flux dipping assembly includes a first slide plate, a flux dipping needle, and a dipping needle lifting motor; one side of the first slide plate is slidably connected to the first lifting plate, and the upper and lower parts of the other side of the first slide plate are respectively connected to a first connecting plate and a second connecting plate; the first connecting plate and the second connecting plate are both arranged in the horizontal direction; the dipping needle lifting motor is installed on the first lifting plate, and the output shaft of the dipping needle lifting motor is connected to the first connecting plate; the flux dipping needle is arranged in the vertical direction and is installed on the second connecting plate.

6. The online precise single-point automatic ball replenishing device according to claim 5 is characterized in that: A first visual mechanism is also installed on one side of the first lifting plate; a first fixing plate is also connected to the first lifting plate, and a defective product transfer module is also installed on the first fixing plate.

7. The online precise single-point automatic ball replenishing device according to claim 1 is characterized in that: The solder ball supply device includes a third X-axis translation mechanism, a solder ball seat, a ball supply seat, and a multi-ball processing assembly; the third X-axis translation mechanism is driven and connected to a first translation plate, and the top of the first translation plate is also connected to a plurality of first support columns; the solder ball seat is installed on the first support column, and a plurality of mounting holes are spaced apart in the length direction of the top of the solder ball seat; a solder ball bin is installed in each of the mounting holes; the ball supply seat is arranged above the solder ball seat, and a ball supply port is also opened in the middle of the top of the ball supply seat; the multi-ball processing assembly is installed on one side of the ball supply seat; the other side of the ball supply seat is also connected to a first connecting seat, and a tool setting instrument is also installed on the first connecting seat.

8. The online precise single-point automatic ball replenishing device according to claim 7 is characterized in that: The solder ball supply device also includes a static electricity removal component; the static electricity removal component includes a first stand and a plasma wind rod installed on the first stand; one end of the plasma wind rod extends to the top of the ball supply seat.

9. The online precise single-point automatic ball replenishing device according to claim 1 is characterized in that: The flux supply device includes a first mounting frame, a scraper, a scraper assembly, and a scraper translation mechanism; a first bearing seat is installed on the top of the first mounting frame, and a first bearing groove is opened on the top of the first bearing seat along its length direction; the scraper is detachably installed in the first bearing groove; a plurality of flux scraping grooves of different thicknesses are also opened on the top of the scraper; the scraper assembly is arranged above the first bearing groove; the scraper translation mechanism is installed on the first mounting frame along the length direction of the first bearing groove, and the scraper translation mechanism is connected to the scraper assembly.

10. The online precise single-point automatic ball replenishing device according to claim 9 is characterized in that: There are two scraper assemblies; the scraper translation mechanism is also driven to connect to a scraper translation seat, and a scraper lifting cylinder is arranged at each end of the scraper translation seat; each of the scraper lifting cylinders is connected to a scraper assembly.

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