Silicon wafer edge defect detection device

Abstract

The utility model relates to the technical field of semiconductor production, in particular to a silicon wafer edge defect detection device. The silicon wafer edge defect detection device comprises a conveying streamline, a light supplementing mechanism and a camera mechanism, the conveying streamline conveys the silicon wafers forwards in the flow direction of the silicon wafers, the conveying streamline is provided with a first action line and a second action line, and the distance between the first action line and the second action line is smaller than the length of the silicon wafers in the flow direction of the silicon wafers; the light supplementing mechanism comprises a first strip-shaped light source, a first reflecting mirror assembly, a second strip-shaped light source and a second reflecting mirror assembly, and illumination light rays emitted by the first strip-shaped light source are reflected to the camera mechanism through the first reflecting mirror assembly and a front edge at a first action line; and illumination light emitted by the second strip-shaped light source is reflected to the camera mechanism through the second reflector assembly and the rear edge at the second action line. The silicon wafer edge defect detection device shares the same camera mechanism to acquire the front edge image and the rear edge image of the silicon wafer, so that the cost is saved, and the structure is more compact and intensive.

Description

Technical Field

[0001] The present application relates to the field of semiconductor production technology, and in particular to a silicon wafer edge defect detection device. Background Art

[0002] As an important raw material for solar cells, silicon wafers are widely used in the production of solar cells, circuit boards and other products. In the production process of silicon wafers, silicon wafer sorting machines, as terminal equipment for quality control, detect and grade silicon wafers in terms of size, dirt, cracks, holes, resistivity, etc., to ensure the quality of solar cells, circuit boards and other products made from silicon wafers.

[0003] The shape of silicon wafers used in the solar energy field is square or rectangular, and the four corners are blunt. The edges of the silicon wafers are at risk of silicon falling off and edge collapse. Therefore, in order to improve the quality of silicon wafers, it is necessary to perform defect detection on the edges of silicon wafers. However, the current efficiency of silicon wafer edge detection is low, and it is necessary to go through two processes to detect the front and back edges of the silicon wafers respectively.

[0004] For example, the patent with application number 201920656245.8 and utility model name of silicon wafer side detection device and silicon wafer sorting machine discloses a silicon wafer side detection device including a camera, a linear light source, two point light sources, a reflector, and two mounting side plates arranged opposite to each other. The linear light source is used to provide illumination for one side of the silicon wafer, and the two point light sources are used to provide illumination for the chamfered edges at both ends of the side. The silicon wafer passes through the gap between the reflector and the linear light source. The linear light source is arranged above both sides of the reflector. The camera and the reflector are arranged up and down. The light reflected by the side and the light reflected by each chamfered edge are reflected to the camera through the reflector. The image taken by the camera is used to determine whether there is a defect on the side. It can be seen that the silicon wafer side detection device can only perform defect detection on one side of the silicon wafer at a time, and cannot complete the defect detection of the front edge and the back edge at one time. Utility Model Content

[0005] The purpose of the present application is to provide a silicon wafer edge defect detection device to solve, to a certain extent, the technical problem in the prior art that the current silicon wafer edge detection efficiency is low and two processes are required to detect the front and back edges of the silicon wafer respectively.

[0006] The present application provides a silicon wafer edge defect detection device, including a conveying streamline, a fill light mechanism and a camera mechanism;

[0007] The conveying flow line conveys the silicon wafer forward along the flow direction of the silicon wafer, the silicon wafer has a front edge in front and a rear edge in the flow direction of the silicon wafer, the conveying flow line has a silicon wafer conveying plane and a first action line and a second action line arranged in sequence along the flow direction of the silicon wafer, and in the flow direction of the silicon wafer, the distance between the first action line and the second action line is less than the length of the silicon wafer, so that the front edge of the silicon wafer passes through the first action line first, and the rear edge passes through the second action line later during the conveying process;

[0008] The camera mechanism is arranged at a distance in height direction on one side of the silicon wafer conveying plane;

[0009] The fill light mechanism includes a first bar light source, a first reflector assembly, a second bar light source and a second reflector assembly. The illumination light emitted by the first bar light source passes through the first reflector assembly and the front edge at the first action line and is reflected to the camera mechanism. The illumination light emitted by the second bar light source passes through the second reflector assembly and the rear edge at the second action line and is reflected to the camera mechanism.

[0010] In the above technical solution, further, the first bar-shaped light source and the second bar-shaped light source are both arranged on a first side of the silicon wafer conveying plane together with the camera mechanism;

[0011] The first reflector assembly includes a first lighting mirror group, a first reflector group, and a second reflector group. The first lighting mirror group is arranged opposite to the first bar light source in the height direction and is located on the second side of the silicon wafer conveying plane. The first reflector group and the second reflector group are both located on the first side of the silicon wafer conveying plane. The second reflector group is arranged opposite to the camera mechanism in the height direction.

[0012] The illumination light emitted by the first strip light source is reflected by the first lighting mirror group to the front edge at the first action line, and then sequentially reflected by the first reflector group and the second reflector group to the camera mechanism;

[0013] The second reflector assembly comprises a second light mirror group, a third reflector group, a fourth reflector group and a beam splitter group, the second light mirror group is arranged opposite to the second bar light source in the height direction and is located on the second side of the silicon wafer conveying plane, the third reflector group, the fourth reflector group and the beam splitter group are all located on the first side of the silicon wafer conveying plane, and the beam splitter group is arranged opposite to the camera mechanism in the height direction and is located between the second reflector and the camera mechanism;

[0014] The illumination light emitted by the second strip light source is reflected by the second lighting mirror group to the rear edge at the second action line, and then sequentially reflected by the third reflector group, the fourth reflector group and the beam splitter group to the camera mechanism.

[0015] In any of the above technical solutions, further, the angle between the first lighting mirror group and the rear side of the conveying streamline is 52.5±0.5°;

[0016] The angle between the first reflector group and the rear side of the conveying streamline is 82.37±2°;

[0017] The included angle between the second reflector group and the rear side in the height direction is 45±2°.

[0018] In any of the above technical solutions, further, the angle between the second lighting mirror group and the rear side of the conveying streamline is 52.5±2°;

[0019] The included angle between the third reflector group and the rear side in the height direction is 37.7±2°;

[0020] The included angle between the fourth reflector group and the rear side in the height direction is 44±2°;

[0021] The included angle between the beam splitter group and the front side of the height direction is 45±2°.

[0022] In any of the above technical solutions, further, the conveying flow line includes a conveyor belt and a pulley;

[0023] The pulleys are arranged in a concave shape at the first action line and the second action line, so that the conveyor belt forms a first pit and a second pit at the first action line and the second action line;

[0024] The first lighting lens group is located in the first pit, and the second lighting lens group is located in the second pit.

[0025] In any of the above technical solutions, further, the silicon wafer edge defect detection device also includes a mounting frame, and the camera mechanism, the conveying streamline and the fill light mechanism are all arranged on the mounting frame.

[0026] In any of the above technical solutions, further, the camera mechanism includes a height adjustment bracket and a camera, the height adjustment bracket is arranged on the mounting frame, the camera is arranged on the height adjustment bracket, and the height adjustment bracket can adjust the position of the camera along the height direction.

[0027] In any of the above technical solutions, further, the mounting bracket includes a support plate, the support plate is provided with a light-transmitting strip hole, the light-transmitting strip hole, the first strip light source and the second strip light source are parallel to each other, and the light-transmitting strip hole is directly opposite to the camera along the height direction.

[0028] In any of the above technical solutions, further, any one of the first reflector group, the second reflector group, the third reflector group, the fourth reflector group and the beam splitter group comprises a base, a coated reflector and a fixed end cap, the coated reflector is arranged on the base, and the fixed end cap is arranged on the end of the base;

[0029] The mounting frame is provided with a plug-in hole matched with the base, so that any lens group can be detachably plugged into the mounting frame and detachably fastened to the mounting frame through the fixed end cover.

[0030] In any of the above technical solutions, the base is provided with a mounting groove, and the coated reflector is arranged in the mounting groove.

[0031] Compared with the prior art, the beneficial effects of this application are:

[0032] The silicon wafer edge defect detection device provided by the present application uses the same camera mechanism to collect the front edge image and the back edge image of the silicon wafer, which saves costs compared to the traditional solution of using two sets of equipment or two groups of cameras to detect the front edge defect and the back edge defect of the silicon wafer respectively, and detecting the front edge defect and the back edge defect of the silicon wafer twice. In addition, by configuring the distance between the first action line and the second action line to be less than the length of the silicon wafer, the silicon wafer edge defect detection device improves space utilization and makes the structure more compact and intensive. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0034] Figure 1 A first structural schematic diagram of a silicon wafer edge defect detection device provided in an embodiment of the present application;

[0035] Figure 2 A second structural schematic diagram of a silicon wafer edge defect detection device provided in an embodiment of the present application;

[0036] Figure 3A third structural schematic diagram of the silicon wafer edge defect detection device provided in an embodiment of the present application;

[0037] Figure 4 A schematic diagram of the optical path principle of the silicon wafer edge defect detection device provided in an embodiment of the present application at the first action line;

[0038] Figure 5 A schematic diagram of the optical path principle of the silicon wafer edge defect detection device provided in an embodiment of the present application at the second action line;

[0039] Figure 6 A schematic diagram of the structure of any mirror group of the silicon wafer edge defect detection device provided in an embodiment of the present application.

[0040] Reference numerals:

[0041] 1-camera; 2-first bar light source; 3-second bar light source; 4-first mounting plate; 5-second mounting plate; 6-height adjustment slide rail; 7-camera mounting plate; 8-slider; 9-locking member; 10-support plate; 100-light-transmitting bar hole; 11-reinforcement beam; 1201-first reflector group; 1202-second reflector group; 1203-third reflector group; 1204-fourth reflector group; 13-beam splitter group; 1401-first lighting mirror group; 1402-second lighting mirror group; 15-chamfered fill light assembly; 16-silicon wafer; 160-front edge; 161-back edge; 17-conveyor streamline; 170-first pit; 171-second pit; 18-mounting substrate; 190-first action line; 191-second action line; 20-coated reflector; 21-fixed end cover; 22-base. DETAILED DESCRIPTION

[0042] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0043] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0044] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] See also Figures 1 to 6 As shown, an embodiment of the present application provides a silicon wafer edge defect detection device for performing defect detection on the edge of a silicon wafer.

[0046] In an optional solution of this embodiment, the silicon wafer edge defect detection device includes a conveying streamline 17, a fill light mechanism and a camera mechanism.

[0047] The conveying flow line 17 conveys the silicon wafer 16 forward along the flow direction of the silicon wafer. The silicon wafer 16 has a front edge 160 at the front and a rear edge 161 at the rear along the flow direction of the silicon wafer.

[0048] The conveying streamline 17 has a silicon wafer conveying plane and a first action line 190 and a second action line 191 arranged in sequence along the flow direction of the silicon wafer. Specifically, the first action line 190 and the second action line 191 are perpendicular to the flow direction of the silicon wafer, and the contact surface between the conveying streamline 17 and the silicon wafer 16 is the silicon wafer conveying plane. The conveying streamline 17 docks with the upstream streamline and the downstream streamline, thereby continuously conveying the silicon wafer 16 to the silicon wafer edge defect detection device, and moving the detected silicon wafer 16 to the downstream streamline without stopping for other processes.

[0049] In the flow direction of the silicon wafer, the distance between the first action line 190 and the second action line 191 is smaller than the length of the silicon wafer 16, so that the front edge 160 of the silicon wafer 16 passes through the first action line 190 first and the rear edge 161 passes through the second action line 191 later during the conveying process.

[0050] The camera mechanism is arranged at a height interval on one side of the silicon wafer conveying plane. For example, the camera mechanism is arranged above the silicon wafer conveying plane.

[0051] The fill light mechanism comprises a first strip light source 2, a first reflector assembly, a second strip light source 3 and a second reflector assembly.

[0052] The illumination light emitted by the first bar-shaped light source 2 is reflected to the camera mechanism through the first reflector assembly and the front edge 160 at the first action line 190. That is, when the silicon wafer 16 is being transported and the front edge 160 moves to the first action line 190, the first bar-shaped light source 2 is turned on, and the illumination light emitted by the first bar-shaped light source 2 directly hits the front edge 160 or hits the front edge 160 after being reflected by the first reflector assembly, and then the front edge 160 reflects the illumination light to the first reflector assembly, and then reflects it to the camera mechanism through the first reflector assembly, so that a clear front edge image can be captured by the camera mechanism, so that the defects of the front edge 160 can be determined through the front edge image.

[0053] The illumination light emitted by the second bar-shaped light source 3 is reflected to the camera mechanism through the second reflector assembly and the rear edge 161 at the second action line 191. That is, after the front edge image is shot, the silicon wafer 16 continues to be transported forward along the silicon wafer flow direction until the rear edge 161 moves to the second action line 191, and then the second bar-shaped light source 3 is lit, and the illumination light emitted by the second bar-shaped light source 3 directly hits the rear edge 161 or hits the rear edge 161 after being reflected by the second reflector assembly, and then the rear edge 161 reflects the illumination light to the second reflector assembly, and then reflects to the camera mechanism through the second reflector assembly, so that a clear rear edge image can be shot by the camera mechanism, so that the defect of the rear edge 161 can be determined through the rear edge image.

[0054] Optionally, photoelectric switches are provided at both the first action line 190 and the second action line 191. When the front edge 160 moves to the first action line 190, the photoelectric switch at the first action line 190 is triggered, and the photoelectric switch sends a trigger signal to the host computer, and the host computer lights up the first strip light source 2 according to the trigger signal; when the rear edge 161 moves to the second action line 191, the photoelectric switch at the second action line 191 is triggered, and the photoelectric switch sends a trigger signal to the host computer, and the host computer lights up the second strip light source 3 according to the trigger signal.

[0055] It is worth emphasizing that in order to prevent the photoelectric switch at the second action line 191 from being mistakenly triggered by the front edge 160, as an example, the photoelectric switches at the first action line 190 and the second action line 191 can be configured to be triggered alternately. Of course, false triggering can also be prevented by other methods, which are not listed here.

[0056] It can be seen that the silicon wafer edge defect detection device uses the same camera mechanism to collect the front edge image and the back edge image of the silicon wafer 16, which saves costs compared to the traditional solution of using two sets of equipment or two cameras to detect the defects of the front edge 160 and the defects of the back edge 161 of the silicon wafer 16 respectively, and detecting the defects of the front edge 160 and the back edge 161 of the silicon wafer 16 twice. In addition, by configuring the distance between the first action line 190 and the second action line 191 to be less than the length of the silicon wafer 16, the silicon wafer edge defect detection device improves space utilization and makes the structure more compact and intensive.

[0057] In an optional solution of this embodiment, the first strip light source 2 and the second strip light source 3 are both arranged on the first side of the wafer conveying plane together with the camera mechanism. The wafer conveying plane has a first side and a second side along the height direction, for example, the first side of the wafer conveying plane is above the wafer conveying plane, and the second side of the wafer conveying plane is below the wafer conveying plane.

[0058] The first reflector assembly includes a first lighting mirror group 1401, a first reflector group 1201, and a second reflector group 1202. The first lighting mirror group 1401 is arranged opposite to the first strip light source 2 in the height direction and is located on the second side of the wafer conveying plane, the first reflector group 1201 and the second reflector group 1202 are both located on the first side of the wafer conveying plane, and the second reflector group 1202 is arranged opposite to the camera mechanism in the height direction.

[0059] Specifically, if Figure 2 and Figure 3 As shown, the first lighting mirror group 1401 is arranged below the silicon wafer conveying plane, the first strip light source 2, the first reflector group 1201 and the second reflector group 1202 are arranged above the silicon wafer conveying plane, and the first lighting mirror group 1401 is located directly below the first strip light source 2, and the second reflector group 1202 is located directly below the camera mechanism.

[0060] The illumination light emitted by the first bar-shaped light source 2 is reflected by the first lighting mirror group 1401 to the front prism 160 at the first action line 190, and then sequentially reflected by the first reflector group 1201 and the second reflector group 1202 to the camera mechanism. The first lighting mirror group 1401 is used to collect the illumination light emitted by the first bar-shaped light source 2 to the front prism 160 at the first action line 190, and the first reflector group 1201 and the second reflector group 1202 are used to collect the illumination light reflected by the front prism 160 to the camera mechanism, thereby ensuring that the front prism image acquired by the camera mechanism is bright and clear enough.

[0061] The second reflector assembly includes a second lighting mirror group 1402, a third reflector group 1203, a fourth reflector group 1204 and a beam splitter group 13. The second lighting mirror group 1402 is arranged opposite to the second strip light source 3 in the height direction and is located on the second side of the silicon wafer conveying plane. The third reflector group 1203, the fourth reflector group 1204 and the beam splitter group 13 are all located on the first side of the silicon wafer conveying plane. The beam splitter group 13 is arranged opposite to the camera mechanism in the height direction and is located between the second reflector and the camera mechanism.

[0062] Specifically, if Figure 2 and Figure 3 As shown, the first lighting mirror group 1401 is arranged below the silicon wafer conveying plane, the second strip light source 3, the third reflector group 1203, the fourth reflector group 1204 and the beam splitter group 13 are arranged above the silicon wafer conveying plane, and the second lighting mirror group 1402 is located directly below the second strip light source 3, and the beam splitter group 13 is located directly below the camera mechanism.

[0063] The illumination light emitted by the second bar-shaped light source 3 is reflected by the second lighting mirror group 1402 to the rear edge 161 at the second action line 191, and then sequentially reflected by the third reflector group 1203, the fourth reflector group 1204 and the beam splitter group 13 to the camera mechanism. The second lighting mirror group 1402 is used to collect the illumination light emitted by the second bar-shaped light source 3 to the rear edge 161 at the second action line 191, and the third reflector group 1203, the fourth reflector group 1204 and the beam splitter group 13 are used to collect the illumination light reflected by the rear edge 161 to the camera mechanism, thereby ensuring that the rear edge image obtained by the camera mechanism is bright and clear enough.

[0064] In addition, the beam splitter group 13 also has the function of allowing the second reflector group 1202 to transmit light, thereby ensuring that the light reflected by the front edge 160 and the light reflected by the rear edge 161 can both enter the camera mechanism.

[0065] It can be seen that in the imaging light path at the front edge 160, it only needs two reflections to enter the camera mechanism, and in the imaging light path at the rear edge 161, it only needs three reflections to enter the camera mechanism, so that the fill light mechanism uses fewer lens groups, which is convenient for maintenance and debugging.

[0066] In the optional solution of this embodiment, Figure 4 As shown, the included angle a between the first lighting lens group 1401 and the rear side of the conveying streamline 17 is 52.5±0.5°, for example, 52°, 52.5° or 53°.

[0067] The rear angle b between the first reflector group 1201 and the conveying streamline 17 is 82.37±2°, such as 80.27°, 81°, 82°, 83° or 84.37°.

[0068] An included angle c between the second reflector group 1202 and the rear side in the height direction is 45±2°, for example, 43°, 45° or 47°.

[0069] Therefore, by configuring the angles of the first lighting mirror group 1401, the first reflecting mirror group 1201 and the second reflecting mirror group 1202, the front edge image is precisely directed to enter the camera mechanism.

[0070] Optionally, the first reflector group 1201 and the second reflector group 1202 are arranged at the same height.

[0071] In the optional solution of this embodiment, Figure 5 As shown, the included angle d between the second lighting lens group 1402 and the rear side of the conveying streamline 17 is 52.5±2°, for example, 50.5°, 52.5° or 54.5°.

[0072] An included angle e between the third reflector group 1203 and the rear side in the height direction is 37.7±2°, for example, 35.7°, 37.7° or 39.7°.

[0073] An included angle f between the fourth reflector group 1204 and the rear side in the height direction is 44±2°, such as 42°, 44° or 46°.

[0074] The included angle g between the beam splitter assembly 13 and the front side in the height direction is 45±2°, for example, 43°, 45° or 47°.

[0075] Therefore, by configuring the angles of the second lighting mirror group 1402, the third reflecting mirror group 1203, the fourth reflecting mirror group 1204 and the beam splitter group 13, the rear edge image is precisely directed to enter the camera mechanism.

[0076] Optionally, the fourth reflector group 1204 and the beam splitter group 13 are arranged at the same height, and the third reflector group 1203 is arranged directly below the fourth reflector group 1204 .

[0077] In an optional solution of this embodiment, the conveying flow line 17 includes a conveyor belt and a pulley.

[0078] like Figure 3 As shown, the conveyor belt is wound around the pulleys, and the pulleys are arranged in a concave shape at the first action line 190 and the second action line 191, that is, a plurality of pulleys are arranged along the concave shape, so that the conveyor belt bends and extends along the concave shape, so that the conveyor belt forms a first pit 170 and a second pit 171 at the first action line 190 and the second action line 191.

[0079] The first lighting mirror group 1401 is located in the first pit 170, so that the first lighting mirror group 1401 is located below the wafer conveying plane, and the second lighting mirror group 1402 is located in the second pit 171, so that the second lighting mirror group 1402 is located in the second pit 171. In this way, the conveyor belt avoids the imaging light path at the front edge 160 and the rear edge 161, thereby avoiding the conveyor belt from interfering with the imaging at the front edge 160 and the rear edge 161, thereby ensuring the imaging quality.

[0080] In the optional solution of this embodiment, Figure 1 As shown, the silicon wafer edge defect detection device also includes a mounting frame, and the camera mechanism, the conveying streamline 17 and the fill light mechanism are all arranged on the mounting frame, so that the camera mechanism, the conveying streamline 17 and the fill light mechanism are integrated through the mounting frame.

[0081] Optionally, the mounting frame and the conveying flow line 17 are both arranged on the mounting substrate 18 , so that the conveying flow line 17 and the mounting frame are connected through the mounting substrate 18 .

[0082] Optionally, the mounting frame includes a first mounting upright plate 4 and a second mounting upright plate 5 respectively disposed on both sides of the width direction of the conveying flow line 17, and a reinforcing crossbeam 11 connected between the first mounting upright plate 4 and the second mounting upright plate 5. The camera mechanism is disposed above the reinforcing crossbeam 11, and the fill light mechanism is installed on the mounting frame between the conveying flow direction and the camera mechanism.

[0083] In an optional solution of this embodiment, the camera mechanism includes a height adjustment bracket and a camera 1, the height adjustment bracket is arranged on the mounting frame, the camera 1 is arranged on the height adjustment bracket, and the height adjustment bracket can adjust the position of the camera 1 along the height direction.

[0084] Specifically, the height adjustment bracket includes a camera mounting plate 7 arranged on the mounting frame, a height adjustment slide rail 6 arranged on the camera mounting plate 7, a slider 8 and a locking member 9. The height adjustment slide rail 6 extends along the height direction, and the slider 8 is slidably arranged on the height adjustment slide rail 6. The locking member 9 can lock or unlock the slider 8 relative to the height adjustment slide rail 6. The camera 1 is fixed on the slider 8, so that the height of the camera 1 can be adjusted by moving the slider 8. After adjustment, the two are locked by the locking member 9 to obtain a field of view of appropriate size.

[0085] Optionally, the camera 1 may be an 8K ultra-high definition camera 1; and the locking member 9 may be a locking screw.

[0086] In this embodiment, the mounting frame includes a support plate 10, and the support plate 10 is provided with a light-transmitting strip hole 100. The light-transmitting strip hole 100, the first strip light source 2, and the second strip light source 3 are parallel to each other, and the light-transmitting strip hole 100 is directly opposite to the camera 1 in the height direction, so that the light reflected by the front edge 160 and the light reflected by the rear edge 161 can enter the camera 1 through the light-transmitting strip hole 100. While the camera mechanism is properly supported by the support plate 10, the imaging light path can also be avoided through the light-transmitting strip hole 100 to ensure the imaging quality.

[0087] Optionally, the support plate 10 is installed between the upper end of the first mounting plate 4 and the upper end of the second mounting plate 5 , and the camera 1 is installed on the support plate 10 via a height adjustment bracket.

[0088] Optionally, the silicon wafer edge defect detection device also includes a chamfer fill light component 15, so that the chamfer position of the silicon wafer 16 is illuminated by the chamfer fill light component 15, so that the camera mechanism can also clearly photograph the chamfers of the front edge 160 and the rear edge 161, thereby realizing chamfer defect detection.

[0089] In the optional solution of this embodiment, Figure 1 , Figure 3 and Figure 6 Any of the first reflector group 1201, the second reflector group 1202, the third reflector group 1203, the fourth reflector group 1204 and the beam splitter group 13 comprises a base 22, a coated reflector 20 and a fixed end cap 21, wherein the coated reflector 20 is disposed on the base 22 and the fixed end cap 21 is disposed at the end of the base 22.

[0090] The mounting frame is provided with a plug hole adapted to the base 22, so that any lens group can be detachably plugged into the mounting frame, which is convenient for removing any lens group from the mounting frame for maintenance or cleaning. Any lens group is detachably fastened to the mounting frame through the fixed end cap 21, so that through the fastening connection between the fixed end cap 21 and the mounting frame, any lens group can maintain the installation angle, ensuring the accuracy of the imaging optical path.

[0091] Optionally, the base 22 is cylindrical, and the first mounting plate 4 and the second mounting plate 5 are both provided with circular plug-in holes, so that the base 22 can be detachably inserted into the first mounting plate 4 and the second mounting plate 5 through the circular plug-in holes. When any lens group needs to be maintained or cleaned, it can be pulled out from the plug-in hole, thereby improving the maintenance convenience of any lens group.

[0092] Optionally, the fixed end cover 21 is provided with a first connection hole, and a second connection hole is provided on the periphery of the plug hole. The first connection hole and the second connection hole are connected by fasteners to achieve positioning and fastening installation of any lens group relative to the mounting frame.

[0093] It is understandable that the coated reflector 20 of the beam splitter assembly 13 is light-transmissive, ensuring that the light reflected by the second reflector assembly 1202 can pass through the beam splitter assembly 13 .

[0094] In an optional solution of this embodiment, a mounting groove is provided on the base 22, and the coated reflector 20 is disposed in the mounting groove, thereby preventing the coated reflector 20 from protruding relative to the circumferential side wall of the base 22, and ensuring that any mirror group can be smoothly inserted relative to the plug-in hole. Specifically, the coated reflector 20 can be bonded in the mounting groove.

[0095] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit them; although the utility model is described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the above embodiments, or replace some or all of the technical features therein by equivalent; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the various embodiments of the utility model. In addition, those skilled in the art can understand that although some embodiments described herein include certain features included in other embodiments instead of other features, the combination of features of different embodiments means that they are within the scope of the utility model and form different embodiments. For example, any one of the embodiments claimed for protection can be used in any combination. The information disclosed in this background technology section is only intended to deepen the understanding of the overall background technology of the utility model, and should not be regarded as an admission or in any form of implication that the information constitutes prior art known to those skilled in the art.

Claims

1. A silicon wafer edge defect detection device, It is characterized in that Including conveying streamline, fill light mechanism and camera mechanism; The conveying flow line conveys the silicon wafer forward along the flow direction of the silicon wafer, the silicon wafer has a front edge in front and a rear edge in the flow direction of the silicon wafer, the conveying flow line has a silicon wafer conveying plane and a first action line and a second action line arranged in sequence along the flow direction of the silicon wafer, and in the flow direction of the silicon wafer, the distance between the first action line and the second action line is less than the length of the silicon wafer, so that the front edge of the silicon wafer passes through the first action line first, and the rear edge passes through the second action line later during the conveying process; The camera mechanism is arranged at a distance in height direction on one side of the silicon wafer conveying plane; The fill light mechanism includes a first bar light source, a first reflector assembly, a second bar light source and a second reflector assembly. The illumination light emitted by the first bar light source passes through the first reflector assembly and the front edge at the first action line and is reflected to the camera mechanism. The illumination light emitted by the second bar light source passes through the second reflector assembly and the rear edge at the second action line and is reflected to the camera mechanism.

2. The silicon wafer edge defect detection device according to claim 1, It is characterized in that The first bar light source and the second bar light source are both arranged on a first side of the silicon wafer conveying plane together with the camera mechanism; The first reflector assembly includes a first lighting mirror group, a first reflector group, and a second reflector group. The first lighting mirror group is arranged opposite to the first bar light source in the height direction and is located on the second side of the silicon wafer conveying plane. The first reflector group and the second reflector group are both located on the first side of the silicon wafer conveying plane. The second reflector group is arranged opposite to the camera mechanism in the height direction. The illumination light emitted by the first strip light source is reflected by the first lighting mirror group to the front edge at the first action line, and then sequentially reflected by the first reflector group and the second reflector group to the camera mechanism; The second reflector assembly comprises a second light mirror group, a third reflector group, a fourth reflector group and a beam splitter group, the second light mirror group is arranged opposite to the second bar light source in the height direction and is located on the second side of the silicon wafer conveying plane, the third reflector group, the fourth reflector group and the beam splitter group are all located on the first side of the silicon wafer conveying plane, and the beam splitter group is arranged opposite to the camera mechanism in the height direction and is located between the second reflector and the camera mechanism; The illumination light emitted by the second strip light source is reflected by the second lighting mirror group to the rear edge at the second action line, and then sequentially passes through the third reflector group, the fourth reflector group and the beam splitter group to be reflected to the camera mechanism.

3. The silicon wafer edge defect detection device according to claim 2, It is characterized in that The included angle between the first lighting mirror group and the rear side of the conveying streamline is 52.5±0.5°; The angle between the first reflector group and the rear side of the conveying streamline is 82.37±2°; The included angle between the second reflector group and the rear side in the height direction is 45±2°.

4. The silicon wafer edge defect detection device according to claim 2, It is characterized in that The included angle between the second lighting mirror group and the rear side of the conveying streamline is 52.5±2°; The included angle between the third reflector group and the rear side in the height direction is 37.7±2°; The included angle between the fourth reflector group and the rear side in the height direction is 44±2°; The included angle between the beam splitter group and the front side of the height direction is 45±2°.

5. The silicon wafer edge defect detection device according to claim 2, It is characterized in that The conveying flow line includes a conveyor belt and a pulley; The pulleys are arranged in a concave shape at the first action line and the second action line, so that the conveyor belt forms a first pit and a second pit at the first action line and the second action line; The first lighting lens group is located in the first pit, and the second lighting lens group is located in the second pit.

6. The silicon wafer edge defect detection device according to claim 2, It is characterized in that It also includes a mounting frame, and the camera mechanism, the conveying streamline and the fill light mechanism are all arranged on the mounting frame.

7. The silicon wafer edge defect detection device according to claim 6, It is characterized in that The camera mechanism comprises a height adjustment bracket and a camera, wherein the height adjustment bracket is arranged on the mounting frame, and the camera is arranged on the height adjustment bracket, and the height adjustment bracket can adjust the position of the camera along the height direction.

8. The silicon wafer edge defect detection device according to claim 7, It is characterized in that The mounting frame includes a support plate, the support plate is provided with a light-transmitting strip hole, the light-transmitting strip hole, the first strip light source and the second strip light source are parallel to each other, and the light-transmitting strip hole is directly opposite to the camera along the height direction.

9. The silicon wafer edge defect detection device according to claim 6, It is characterized in that Any one of the first reflector group, the second reflector group, the third reflector group, the fourth reflector group and the beam splitter group comprises a base, a coated reflector and a fixed end cap, the coated reflector is arranged on the base, and the fixed end cap is arranged on the end of the base; The mounting frame is provided with a plug-in hole matched with the base, so that any lens group can be detachably plugged into the mounting frame and detachably fastened to the mounting frame through the fixed end cover.

10. The silicon wafer edge defect detection device according to claim 9, It is characterized in that The base is provided with a mounting groove, and the coated reflector is arranged in the mounting groove.

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