Integrated circuit board packaging device
Through non-electronic positioning, pin positioning components and soldered packaging components are used to ensure that the IC chip pins correspond to the PCB substrate pins, solving the problem of welding misalignment, improving production efficiency and product quality, and achieving a more stable packaging process.
Patent Information
- Application Number
- CN202420379973.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-28
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-02-28
AI Technical Summary
During the soldering process, existing integrated circuit board packaging devices are prone to misalignment of chip pins and PCB substrate pins due to electronic vision detection failures, affecting product quality and stability.
By using non-electronic positioning, the pin positioning components are set, including rectangular placement plate, C-shaped limit block and sliding adjustment components to ensure that the IC chip pin corresponds to the PCB substrate pins, and the soldered packaging components are used for welding and packaging to avoid visual inspection. error.
It improves production efficiency and product quality, ensures the stability of the IC chip, avoids errors caused by external environment, and is more stable and reliable than electronic visual inspection.
Smart Images
Figure CN222214148U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board packaging, in particular to an integrated circuit board packaging device. Background Art
[0002] Integrated circuit board is a highly integrated electronic device. IC is one of the basic components of modern electronic information systems and is widely used in computers, communications, home appliances, medical and other fields. IC is usually composed of multiple chips, each chip contains thousands of transistors, which are integrated together to form functional units such as logic circuits and storage units. There are multiple pins inside the IC chip for connecting external circuits, such as power lines, signal lines, ground lines, etc. The IC shell is usually a small flat board, called an IC socket, which is used to insert into a circuit board or other device.
[0003] Integrated circuit board packaging device is used to fix the finished IC chip on the PCB substrate and assemble it by welding connectors and other components. PCB packaging is an important part of the electronic component manufacturing process and plays a vital role in the stable operation and performance of the product.
[0004] When the IC chip is fixedly packaged on the PCB substrate, the IC chip is placed on the PCB substrate and fixed by a fixing device. Before packaging, it is necessary to ensure that the pins of the IC chip correspond to the pins on the PCB substrate to prevent welding misalignment, which will affect the normal use of the product. The existing equipment uses electronic visual inspection to ensure that the pins of the IC chip correspond to the pins on the PCB substrate, but electronic visual inspection is prone to failure. Visual inspection relies on software calculation. Once the computer freezes or lags, it is easy for the pins of the IC chip to be misaligned with the pins on the PCB substrate, and welding misalignment will result in defective products, affecting the normal use of the product. Utility Model Content
[0005] The purpose of the utility model is to provide an integrated circuit board packaging device to solve the problems raised in the above background technology.
[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0007] An integrated circuit board packaging device comprises an IC chip, a PCB substrate, a packaging platform and a welding packaging component located on the top of the packaging platform, wherein a pin positioning component for positioning the PCB substrate and the IC chip pins is arranged directly below the welding packaging component on the top of the packaging platform;
[0008] The pin positioning assembly includes a placement plate for placing the PCB substrate, the placement plate is arranged in a rectangular structure, the placement plate structure matches the PCB substrate structure, a positioning hole matching the IC chip is opened through the top of the placement plate, and when the PCB substrate is placed on the top of the placement plate, the welding pin structure on the PCB substrate matches the positioning hole structure;
[0009] Limit blocks for positioning the placement plate are arranged at the four top corners of the placement plate, each of the limit blocks is arranged in a C-shaped structure, a locking limit groove is opened inside the limit block, and a sliding adjustment component is arranged at the bottom of the two top corner limit blocks at one end of the placement plate.
[0010] As a preferred solution of the utility model, the sliding adjustment component includes a sliding block and a spring, the top of the sliding block is fixed to the bottom of the limit block, a sliding groove is provided on the top of the placement plate located at the bottom of the sliding block, the sliding block slides inside the sliding groove, the spring is located parallel to the sliding groove, one end of the spring is connected to the inner wall of the sliding groove, and the other end of the spring is connected to the outer wall of the sliding block.
[0011] As a preferred solution of the utility model, the welding packaging assembly includes a welding frame, a welding head is connected to the bottom of the welding frame, the top outer wall of the welding head is fixed to the outer wall of the welding frame through a lifting rod, and a visual positioning camera is arranged at the bottom of the outer walls on both sides of the welding head, and the visual positioning camera is electrically connected to the packaging controller.
[0012] As a preferred solution of the utility model, a limiting telescopic rod is provided at the bottom of the welding frame for preventing the placement plate from being displaced, and the limiting telescopic rod is electrically connected to the packaging controller through a wire.
[0013] As a preferred solution of the utility model, when the PCB substrate is placed on the placement board, the bottom of the PCB substrate does not abut against the top of the placement board.
[0014] Compared with the prior art, the beneficial effects of the utility model are:
[0015] In view of the problems raised in the background technology, the present application adopts a non-electronic positioning method, and sets a pin positioning component to ensure that the pins on the IC chip correspond to the pins on the PCB substrate. It is easy to use and operate, can avoid errors caused by visual inspection errors, reduce the influence of other factors, improve production efficiency, ensure the stability of the IC chip, and improve product quality. Moreover, compared with electronic visual inspection, this non-electronic positioning method may be more stable and reliable, and is not easily affected by the external environment.
[0016] It is only necessary to position and connect the PCB substrate with the placement plate through the limit block. At this time, the welding pin structure on the PCB substrate matches the positioning hole structure, and the positioning hole opened on the top of the placement plate matches the IC chip. The IC chip is placed inside the positioning hole. At this time, the pins on the IC chip correspond to the pins on the PCB substrate. The welding package is performed by welding the packaging components. The structure is simple and the operation is convenient. It prevents electronic visual inspection from easily malfunctioning, and the computer from freezing or lagging. It is easy for the pins of the IC chip to be misaligned with the pins on the PCB substrate, and the welding is misaligned, resulting in defective products and affecting the normal use of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a side view of the overall structure of the utility model;
[0018] Figure 2 This is an axonometric diagram of the pin positioning component, IC chip and PCB substrate of the utility model;
[0019] Figure 3 This is a schematic diagram of the structure of the pin positioning component of the utility model;
[0020] Figure 4 This is an axonometric diagram of the connection between the limit block and the sliding adjustment assembly of the utility model;
[0021] Figure 5 It is an overall three-dimensional schematic diagram of the utility model.
[0022] In the figure: 1. IC chip; 2. PCB substrate; 3. packaging table; 4. welding packaging component; 41. welding rack; 411. welding head; 42. visual positioning camera; 5. pin positioning component; 51. placement plate; 511. slide groove; 52. limit block; 521. engagement limit groove; 53. sliding block; 54. spring; 55. positioning hole; 56. limit telescopic rod. DETAILED DESCRIPTION
[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the embodiments of the present invention.
[0024] Example
[0025] Each device in this application document adopts a conventional model in the prior art, and the control method is to control through a controller. The control circuit of the controller can be implemented by simple programming by technicians in this field, which belongs to the common knowledge in this field, so this application document will not explain it in detail.
[0026] See also Figure 1-5The utility model provides a technical solution: an integrated circuit board packaging device, comprising an IC chip 1, a PCB substrate 2, a packaging platform 3 and a welding packaging component 4 located on the top of the packaging platform 3, a pin positioning component 5 for positioning the pins of the PCB substrate 2 and the IC chip 1 is arranged directly below the welding packaging component 4 on the top of the packaging platform 3; the welding packaging component 4 comprises a welding frame 41, a welding head 411 is connected to the bottom of the welding frame 41, the top outer wall of the welding head 411 is fixed to the outer wall of the welding frame 41 through a lifting rod, and a visual positioning camera 42 is arranged at the bottom of the outer wall on both sides of the welding head 411, and the visual positioning camera 42 is electrically connected to the packaging controller; a limiting telescopic rod 56 for preventing the placement plate 51 from being displaced is arranged at the bottom of the welding frame 41, and the limiting telescopic rod 56 is electrically connected to the packaging controller through a wire.
[0027] It should be noted that the present application adopts a non-electronic positioning method, and by setting a pin positioning component 5 to ensure that the pins on the IC chip 1 correspond to the pins on the PCB substrate 2, it is easy to use and operate, can avoid errors caused by visual detection errors, reduce the influence of other factors, improve production efficiency, ensure the stability of the IC chip 1, and improve product quality. Moreover, compared with electronic visual detection, this non-electronic positioning method may be more stable and reliable, and is not easily affected by the external environment;
[0028] Furthermore, during welding, one end of the PCB substrate 2 is inserted into the engaging limit groove 521 of the limit block 52, and the limit block 52 on the other side is pushed outward. The sliding block 53 squeezes the spring 54 to compress the other end of the PCB substrate 2, and the other end of the PCB substrate 2 is inserted and limited in the engaging limit groove 521 of the limit block 52. The reverse elastic force of the squeezing spring 54 squeezes the limit block 52 to limit the PCB substrate 2. At this time, the positioning hole 55 through-opened on the top of the placement plate 51 matches the IC chip 1, and the IC chip 1 is placed in the positioning hole 55. At this time, the pins on the IC chip 1 correspond to the pins on the PCB substrate 2, and the controller starts the limiting telescopic rod 56 for limiting, and the welding package component 4 is used for welding and packaging. After welding, the next welding is carried out. It is easy to use and operate, and errors caused by visual detection errors can be avoided. Compared with electronic visual detection, this non-electronic positioning method may be more stable and reliable, and is not easily affected by the external environment.
[0029] See also Figure 2 , 3, 4 and 5, the pin positioning component 5 includes a placement plate 51 for placing the PCB substrate 2, the placement plate 51 is arranged in a rectangular structure, the placement plate 51 structure matches the PCB substrate 2 structure, the placement plate 51 top is provided with a positioning hole 55 matched with the IC chip 1, when the PCB substrate 2 is placed on the top of the placement plate 51, the welding pin structure on the PCB substrate 2 matches the positioning hole 55 structure; the four top corners of the top of the placement plate 51 are provided with limit blocks 52 for positioning the placement plate 51, each limit block 52 is arranged in a C-shaped structure, and a locking mechanism is provided inside the limit block 52 A limiting groove 521, a sliding adjustment component is provided at the bottom of two top corner limiting blocks 52 at one end of the placement plate 51; the sliding adjustment component includes a sliding block 53 and a spring 54, the top of the sliding block 53 is fixed to the bottom of the limiting block 52, a sliding groove 511 is provided at the top of the placement plate 51 at the bottom of the sliding block 53, the sliding block 53 is slidably located inside the sliding groove 511, the spring 54 is parallelly located inside the sliding groove 511, one end of the spring 54 is connected to the inner wall of the sliding groove 511, and the other end of the spring 54 is connected to the outer wall of the sliding block 53; when the PCB substrate 2 is placed on the placement plate 51, the bottom of the PCB substrate 2 does not abut against the top of the placement plate 51.
[0030] It should be noted that, in this embodiment, the PCB substrate 2 only needs to be positioned and connected with the placement plate 51 through the limit block 52. At this time, the welding pin structure on the PCB substrate 2 matches the positioning hole 55 structure. The positioning hole 55 provided through the top of the placement plate 51 matches the IC chip 1. The IC chip 1 is placed inside the positioning hole 55. At this time, the pins on the IC chip 1 correspond to the pins on the PCB substrate 2. The welding and packaging components 4 are welded and packaged. The structure is simple and the operation is convenient. It can prevent the electronic visual inspection from easily failing. The computer freezes or lags. It is easy to cause the pins of the IC chip 1 to be misaligned with the pins on the PCB substrate 2. The welding misalignment will lead to defective products and affect the normal use of the products.
[0031] Furthermore, one end of the PCB substrate 2 is inserted into the engaging limiting groove 521 of the limiting block 52, and the limiting block 52 on the other side is pushed outward. The sliding block 53 squeezes the spring 54 to compress the other end of the PCB substrate 2 and is inserted into the engaging limiting groove 521 of the limiting block 52. The squeezing spring 54 uses the reverse elastic force to squeeze the limiting block 52 to limit the PCB substrate 2. When the PCB substrate 2 is placed on the placement plate 51, the bottom of the PCB substrate 2 does not abut against the top of the placement plate 51, so as to prevent the placement plate 51 from damaging the electrical components or pins on the PCB substrate 2 and protect the equipment. At this time, the top of the placement plate 51 is provided with a through hole The positioning hole 55 matches the IC chip 1, and the IC chip 1 is placed inside the positioning hole 55. At this time, the pins on the IC chip 1 correspond to the pins on the PCB substrate 2. A non-electronic positioning method is adopted, and a pin positioning component 5 is set to ensure that the pins on the IC chip 1 correspond to the pins on the PCB substrate 2. It is easy to use and can avoid errors caused by visual inspection errors, reduce the influence of other factors, improve production efficiency, ensure the stability of the IC chip 1, and improve product quality. Moreover, compared with electronic visual inspection, this non-electronic positioning method may be more stable and reliable, and is not easily affected by the external environment.
[0032] The utility model workflow:
[0033] When in use, one end of the PCB substrate 2 is inserted into the engaging limiting groove 521 of the limiting block 52, and the limiting block 52 on the other side is pushed outward, and the sliding block 53 squeezes the spring 54 to compress the other end of the PCB substrate 2 and is inserted into the engaging limiting groove 521 of the limiting block 52. The squeezing spring 54 uses the reverse elastic force to squeeze the limiting block 52 to limit the PCB substrate 2. When the PCB substrate 2 is placed on the placement plate 51, the bottom of the PCB substrate 2 does not abut against the top of the placement plate 51, so as to prevent the placement plate 51 from damaging the electrical components or pins on the PCB substrate 2 and protect the equipment. At this time, the top of the placement plate 51 is provided with a through hole The positioning hole 55 matches the IC chip 1, and the IC chip 1 is placed inside the positioning hole 55. At this time, the pins on the IC chip 1 correspond to the pins on the PCB substrate 2. A non-electronic positioning method is adopted, and a pin positioning component 5 is set to ensure that the pins on the IC chip 1 correspond to the pins on the PCB substrate 2. It is easy to use and can avoid errors caused by visual inspection errors, reduce the influence of other factors, improve production efficiency, ensure the stability of the IC chip 1, and improve product quality. Moreover, compared with electronic visual inspection, this non-electronic positioning method may be more stable and reliable, and is not easily affected by the external environment.
[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. An integrated circuit board packaging device, comprising an IC chip (1), a PCB substrate (2), a packaging platform (3) and a welding packaging component (4) located on the top of the packaging platform (3), characterized in that: A pin positioning component (5) for positioning the pins of the PCB substrate (2) and the IC chip (1) is arranged directly below the top of the packaging platform (3) where the packaging component (4) is welded; The pin positioning assembly (5) comprises a placement plate (51) for placing the PCB substrate (2); the placement plate (51) is arranged in a rectangular structure; the placement plate (51) structure matches the structure of the PCB substrate (2); a positioning hole (55) matching the IC chip (1) is provided on the top of the placement plate (51); when the PCB substrate (2) is placed on the top of the placement plate (51), the soldering pin structure on the PCB substrate (2) matches the positioning hole (55) structure; Limit blocks (52) for positioning the placement plate (51) are arranged at the four top corners of the placement plate (51); each of the limit blocks (52) is arranged in a C-shaped structure; a locking limit groove (521) is provided inside the limit block (52); and a sliding adjustment component is arranged at the bottom of the two top corner limit blocks (52) at one end of the placement plate (51).
2. The integrated circuit board packaging device according to claim 1, characterized in that: The sliding adjustment component comprises a sliding block (53) and a spring (54); the top of the sliding block (53) is fixed to the bottom of the limiting block (52); a sliding groove (511) is provided on the top of the placing plate (51) located at the bottom of the sliding block (53); the sliding block (53) is slidably located inside the sliding groove (511); the spring (54) is located parallel to the sliding groove (511); one end of the spring (54) is connected to the inner wall of the sliding groove (511); and the other end of the spring (54) is connected to the outer wall of the sliding block (53).
3. The integrated circuit board packaging device according to claim 1, characterized in that: The welding packaging assembly (4) comprises a welding frame (41), a welding head (411) is connected to the bottom of the welding frame (41), the top outer wall of the welding head (411) is fixed to the outer wall of the welding frame (41) through a lifting rod, and visual positioning cameras (42) are arranged at the bottom of the outer walls on both sides of the welding head (411), and the visual positioning cameras (42) are electrically connected to the packaging controller.
4. The integrated circuit board packaging device according to claim 3, characterized in that: A limiting telescopic rod (56) for preventing the placement plate (51) from being displaced is arranged at the bottom of the welding frame (41); the limiting telescopic rod (56) is electrically connected to the packaging controller via a wire.
5. The integrated circuit board packaging device according to claim 4, characterized in that: When the PCB substrate (2) is placed on the placement plate (51), the bottom of the PCB substrate (2) does not abut against the top of the placement plate (51).