Internal control type sole LED lamp bead

Abstract

The utility model discloses an internal control type sole LED lamp bead which comprises a lamp shell and an LED assembly packaged in the lamp shell, the LED assembly comprises a red light chip, a blue light chip, a green light chip and a control IC, a support is arranged in the lamp shell in a matched mode, and the red light chip, the blue light chip, the green light chip and the control IC are all packaged on the support. The shoe sole LED lamp bead has the advantages that an external control IC in a traditional shoe sole LED lamp bead is replaced by the built-in control IC packaged on the support in the lamp shell, the control IC can be effectively prevented from being affected with damp and damaged, and the overall service life of the shoe sole LED lamp bead is effectively prolonged.

Description

Technical Field

[0001] The utility model relates to an LED lamp bead, in particular to an internally controlled shoe sole LED lamp bead. Background Art

[0002] So far, the LED lamp beads for soles are mainly externally controlled LED lamp beads, especially for children who like to step on water or wear shoes for a period of time, the IC on the sole circuit board is soaked and damp, thus affecting the life of the IC. At present, the mainstream colorful shoe LED lamp bead products on the market are mainly externally controlled LED lamp beads, and the quality is uneven. The shoes lose their colorful effect after a short time of wearing.

[0003] In order to solve this problem and improve the service life of the sole LED lamp beads, we need an internally controlled sole LED lamp bead. Summary of the invention

[0004] Purpose of the invention: The purpose of the utility model is to provide an internally controlled sole LED lamp bead to address the deficiencies of the prior art.

[0005] Technical solution: The utility model describes an internally controlled sole LED lamp bead, comprising a lamp housing and an LED component encapsulated in the lamp housing, wherein the LED component comprises a red light chip, a blue light chip, a green light chip and a control IC, and a bracket is provided in the lamp housing, wherein the red light chip, the blue light chip, the green light chip and the control IC are all encapsulated on the bracket.

[0006] Preferably, the red light chip and the control IC are fixed on the bracket by high-thermal-conductivity silver glue solid layer and high-temperature baking, and the blue light chip and the green light chip are fixed on the bracket by high-thermal-conductivity silicone glue solid layer and high-temperature baking.

[0007] Preferably, a base is fitted under the lamp housing.

[0008] Preferably, four base brackets are provided and the four base brackets are symmetrically arranged at the bottom of the lamp housing.

[0009] Compared with the prior art, the utility model has the following beneficial effects: the external control IC in the traditional sole LED lamp bead is replaced with a built-in control IC encapsulated on a bracket in the lamp housing, which can effectively prevent the control IC from being damaged by moisture and effectively improve the overall service life of the sole LED lamp bead. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a schematic diagram of the structure of an internally controlled shoe sole LED lamp bead of the utility model. Figure 1 ;

[0011] Figure 2 This is a schematic diagram of the structure of an internally controlled shoe sole LED lamp bead of the utility model. Figure 2;

[0012] Figure 3 This is a schematic diagram of the structure of an internally controlled shoe sole LED lamp bead of the utility model. Figure 3 .

[0013] In the picture: 1. lamp housing; 2. bracket; 3. red light chip; 4. blue light chip; 5. green light chip; 6. control IC; 7. base. DETAILED DESCRIPTION

[0014] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0015] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0016] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0017] The technical solution of the present invention is described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0018] An internally controlled shoe sole LED lamp bead comprises a lamp housing 1 and an LED component encapsulated in the lamp housing 1, wherein the LED component comprises a red light chip 3, a blue light chip 4, a green light chip 5 and a control IC 6, and a bracket 2 is provided in the lamp housing 1, wherein the red light chip 3, the blue light chip 4, the green light chip 5 and the control IC 6 are all encapsulated on the bracket 2. The advantage of this technical solution is that the external control IC in the traditional shoe sole LED lamp bead is replaced with the built-in control IC 6 encapsulated on the bracket 2 in the lamp housing 1, which can effectively prevent the control IC 6 from being damaged by moisture, and effectively improve the overall service life of the shoe sole LED lamp bead.

[0019] During specific implementation, the red light chip 3 and the control IC6 are fixed on the bracket 2 by high-thermal conductive silver glue solid layer and high-temperature baking, the blue light chip 4 and the green light chip 5 are fixed on the bracket 2 by high-thermal conductive silicone solid layer and high-temperature baking, and a base support 7 is fitted under the lamp housing 1. There are four base supports 7, and the four base supports 7 are symmetrically arranged at the bottom of the lamp housing 1.

[0020] The internally controlled colorful shoe LED lamp beads are control IC6 plus red light chip 3, green light chip 5 and blue light chip 4, three chips are packaged into 3528LED lamp beads. The internally controlled colorful shoe LED lamp beads are solidified by imported ASM die bonding machine. First, high thermal conductivity silver glue is used to solidify the control IC6 and the red light chip 3, and then high-temperature baking is used to fix the control IC6 and the red light chip 3 on the bracket 2. Secondly, high thermal conductivity silicone is used to solidify the green light chip 5 and the blue light chip 4, and then high-temperature baking is used to fix the green light chip 5 and the blue light chip 4 on the bracket 2.

[0021] The bracket 2 that fixes the chip is plasma cleaned again, and then welded using high-precision imported equipment OPTOLUX, with 99.99% pure gold wire used for welding. Secondly, the welded materials are dehumidified at high temperature, and after dehumidification, the lamp beads are packaged using high-yield epoxy resin glue, and then the packaged lamp beads are baked at high temperature.

[0022] In the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first feature is in direct contact with the second feature, or the first feature and the second feature are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature. In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example.

[0023] Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples without contradiction.

[0024] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An internally controlled shoe sole LED lamp bead, characterized in that: The utility model comprises a lamp housing and an LED component encapsulated in the lamp housing, wherein the LED component comprises a red light chip, a blue light chip, a green light chip and a control IC, a bracket is arranged in the lamp housing, the red light chip, the blue light chip, the green light chip and the control IC are all encapsulated on the bracket, the red light chip and the control IC are fixed on the bracket by high-temperature baking of a high-thermal-conductivity silver glue solid layer, the blue light chip and the green light chip are fixed on the bracket by high-temperature baking of a high-thermal-conductivity silicone glue solid layer, a bottom bracket is fitted under the lamp housing, and four bottom brackets are provided and the four bottom brackets are symmetrically arranged on the bottom of the lamp housing.

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