Semiconductor quantum dot light emitting diode packaging structure

Abstract

The utility model is suitable for the technical field of diode packaging, and provides a semiconductor quantum dot light-emitting diode packaging structure, which comprises a packaging fixing seat; the lens is arranged in the center of the top of the packaging fixing seat; the two pins are symmetrically embedded into the bottom of the packaging fixing seat; the epoxy resin sleeve is arranged at a position above the packaging fixing seat; the quantum dot layer is arranged at the top of the epoxy resin sleeve; the epoxy resin limiting ring is integrally formed on the outer side wall of the epoxy resin sleeve; the limiting column is arranged at a position, close to the outer side of the lens, of the top of the packaging fixing seat; the epoxy resin sleeve is extruded on the packaging fixing base through the fastening sleeve, reinforcement of the connecting position of the epoxy resin sleeve and the packaging fixing base is achieved, the problem that the epoxy resin sleeve and the packaging fixing base are prone to breakage is avoided, and the epoxy resin sleeve is fixed between the packaging fixing base and the fastening sleeve through the clamping column. And the firmness and tightness of the epoxy resin sleeve and the packaging fixing seat can be further ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of diode packaging, and in particular relates to a semiconductor quantum dot light emitting diode packaging structure. Background Art

[0002] In the LED package, quantum dot layer is often used as wavelength conversion layer to convert the light emitted by the LED core into light of required wavelength. In electronics, diode package not only plays the role of installation, fixation, sealing, chip protection and enhancing electrothermal performance, but also connects to the pins of the package shell through the contacts on the chip with wires. The diode package is generally composed of three parts: package fixing frame, epoxy resin sleeve and lens. Since the connection between the epoxy resin sleeve and the fixing frame is generally through colloid bonding or hot-melt bonding of epoxy resin directly to the package fixing frame, the epoxy resin sleeve and the package fixing frame are prone to breakage, which leads to damage to the sealing of the package, which may cause the diode to be damaged and unusable.

[0003] In the prior art, a Chinese patent with a reference number of CN 218039259 U discloses a diode packaging structure, including a packaging fixing frame, a top end of which is fixedly connected to an epoxy resin sleeve, a lens being installed in the epoxy resin sleeve; and also including two groups of semicircular retaining rings movably connected to the epoxy resin sleeve, a retaining groove matched with the semicircular retaining ring is provided on the outer surface of the epoxy resin sleeve; the utility model strengthens the connection between the epoxy resin sleeve and the packaging fixing frame, thereby solving the problem of easy breakage between the epoxy resin sleeve and the packaging fixing frame in the prior art.

[0004] The comparative document provides a diode packaging structure, but the above patent requires many reinforcement accessories when reinforcing the epoxy resin sleeve and the packaging fixing frame, the assembly operation is relatively cumbersome, and the fixation is achieved only by the clamping connection between the semicircular clamping ring and the clamping groove. Due to the shallow depth of the clamping groove, the reinforcement strength is low, and the semicircular clamping ring is easily broken in the clamping groove, which in turn causes the problem of reduced sealing of the diode packaging structure.

[0005] Therefore, a semiconductor quantum dot light emitting diode packaging structure is proposed. Utility Model Content

[0006] The utility model provides a semiconductor quantum dot light emitting diode packaging structure, aiming to solve the above-mentioned problem.

[0007] The utility model is implemented as follows: a semiconductor quantum dot light-emitting diode packaging structure comprises: a packaging fixing seat; a lens arranged at the central position of the top of the packaging fixing seat; and two pins symmetrically embedded in the bottom of the packaging fixing seat; an epoxy resin sleeve arranged at a position above the packaging fixing seat; a quantum dot layer arranged at the top of the epoxy resin sleeve; an epoxy resin limiting ring integrally formed on the outer wall of the epoxy resin sleeve; a limiting column arranged at the top of the packaging fixing seat near the outer side of the lens; a limiting hole opened at the top of the epoxy resin limiting ring; a threaded groove opened on the outer wall of the packaging fixing seat; a fastening sleeve screwed on the outer wall of the threaded groove by thread; a support block fixed to the top of the fastening sleeve by adhesive bonding; a clamping column rotated on the outer wall of the support block; a clamping block arranged at the bottom end of the clamping column; and a soft rubber pad fixed to the top of the clamping block near one side of the clamping column by adhesive bonding.

[0008] Preferably, the quantum dot layer consists of a quantum dot substrate and quantum dots.

[0009] Preferably, a concave cavity is provided at a central position of the bottom of the epoxy resin sleeve close to an outer position of the lens.

[0010] Preferably, the limiting column passes through the limiting hole.

[0011] Preferably, a through hole is provided on the top of the fastening sleeve near the outer side of the epoxy resin sleeve, and a thread matching the thread groove is provided on the inner side wall of the fastening sleeve.

[0012] Preferably, there are four support blocks in total, and the four support blocks are symmetrically arranged on the top of the fastening sleeve in groups of two.

[0013] Preferably, an inclined surface is provided on the top of the soft rubber pad.

[0014] Preferably, the cross section of the clamping column is a "J"-shaped structure.

[0015] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0016] The epoxy resin sleeve is squeezed onto the packaging fixing seat through the fastening sleeve, so that the connection between the epoxy resin sleeve and the packaging fixing seat is reinforced, and the problem of easy breakage between the epoxy resin sleeve and the packaging fixing seat is avoided. The fastening sleeve is fixed between the packaging fixing seat and the fastening sleeve by the clamping column, which can further ensure that the epoxy resin sleeve and the packaging fixing seat are firmly and tightly reinforced. It is only necessary to tighten the fastening sleeve. The operation is simple and convenient, and only one fastening sleeve accessory is required. In addition, it can fully ensure the fastening of the epoxy resin sleeve and the packaging fixing seat, and avoid the problem of looseness or even breakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1It is a structural schematic diagram of the utility model;

[0018] Figure 2 This is a schematic diagram of the packaging fixing seat structure of the utility model;

[0019] Figure 3 It is a schematic diagram of the structure of the fastening sleeve of the utility model;

[0020] Figure 4 It is a schematic diagram of the epoxy resin sleeve structure of the utility model.

[0021] In the figure: 1. Package fixing seat; 2. Lens; 3. Pin; 4. Epoxy resin sleeve; 5. Quantum dot layer; 6. Epoxy resin limiting ring; 7. Limiting column; 8. Limiting hole; 9. Threaded groove; 10. Fastening sleeve; 11. Support block; 12. Clamping column; 13. Clamping block; 14. Soft rubber pad. DETAILED DESCRIPTION

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0023] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0024] The present invention provides a semiconductor quantum dot light emitting diode packaging structure. Figure 1-4As shown, it includes a packaging fixing seat 1, a lens 2 is arranged at the top center position of the packaging fixing seat 1, and two pins 3 are symmetrically embedded at the bottom of the packaging fixing seat 1, an epoxy resin sleeve 4 is arranged at the upper position of the packaging fixing seat 1, and a concave cavity is opened at the bottom center position of the epoxy resin sleeve 4 near the outer position of the lens 2, so as to facilitate the lens 2 to be inserted into the concave cavity at the bottom of the epoxy resin sleeve 4, a quantum dot layer 5 is arranged on the top of the epoxy resin sleeve 4, and the quantum dot layer 5 is composed of a quantum dot substrate and quantum dots. The light extraction efficiency of the quantum dot emitted light is improved, and the light extraction rate of the entire light emitting diode packaging structure is improved. An epoxy resin limiting ring 6 is integrally formed on the outer wall of the epoxy resin sleeve 4, and a limiting hole 8 is opened on the top of the epoxy resin limiting ring 6. A limiting column 7 is arranged at the outer position of the top of the packaging fixing seat 1 near the lens 2, and the limiting column 7 passes through the limiting hole 8. After the limiting column 7 is inserted into the limiting hole 8, the ring The epoxy resin limiting ring 6 is used for limiting, so as to prevent the epoxy resin sleeve 4 and the epoxy resin limiting ring 6 from rotating on the packaging fixing seat 1. A thread groove 9 is provided on the outer wall of one side of the packaging fixing seat 1, and a fastening sleeve 10 is provided on the outer side of the epoxy resin sleeve 4. A through hole is provided at the top of the fastening sleeve 10 near the outer side of the epoxy resin sleeve 4, and a thread matching the thread groove 9 is provided on the inner wall of the fastening sleeve 10. A support block 11 is provided on the top of the fastening sleeve 10, and a clamping column 12 is rotatably connected to the outer wall of one side of the support block 11. The cross-section of the clamping column 12 is a "J"-shaped structure, and a clamping block 13 is provided at the bottom of the clamping column 12. A soft rubber pad 14 is fixed by adhesive at the top of the clamping block 13 near one side of the support block 11. The top of the soft rubber pad 14 is provided with an inclined surface, which can reduce the friction resistance when the clamping block 13 is inserted into the bottom of the packaging fixing seat 1, so that the clamping block 13 is convenient for being clamped at the bottom of the packaging fixing seat 1.

[0025] It should be noted that, since the existing diode packaging structure requires many reinforcement accessories when reinforcing the epoxy resin sleeve and the packaging fixing frame, the assembly operation is relatively cumbersome, and the semicircular clamping ring is easily broken in the groove. In this embodiment, the epoxy resin sleeve 4 is squeezed onto the packaging fixing seat 1 by the fastening sleeve 10, so as to realize the reinforcement of the connection between the epoxy resin sleeve 4 and the packaging fixing seat 1, avoid the problem of easy breakage between the epoxy resin sleeve 4 and the packaging fixing seat 1, and fix the packaging fixing seat 1 and the fastening sleeve 10 by the clamping column 12, which can further ensure that the epoxy resin sleeve 4 and the packaging fixing seat 1 are firmly and tightly reinforced. It is only necessary to tighten the fastening sleeve 10, which is simple and convenient to operate, and only one fastening sleeve 10 accessory is required, and it can fully ensure the fastening of the epoxy resin sleeve 4 and the packaging fixing seat 1, avoiding the problem of looseness or even breakage.

[0026] Specifically, in this embodiment, this scheme mainly includes a packaging fixing seat 1, an epoxy resin limiting ring 6 and a fastening sleeve 10. When in use, the packaging fixing seat 1 and the epoxy resin sleeve 4 are connected together, and the limiting column 7 is inserted into the limiting hole 8 to limit the epoxy resin sleeve 4 and the epoxy resin limiting ring 6. At this time, the fastening sleeve 10 is sleeved on the epoxy resin sleeve 4 and then screwed on the threaded groove 9 on the outer wall of the packaging fixing seat 1. By gradually tightening the fastening sleeve 10, the epoxy resin sleeve 4 is squeezed on the packaging fixing seat 1 to achieve reinforcement of the connection between the epoxy resin sleeve 4 and the packaging fixing seat 1. The clamping column 12 between the two support blocks 11 is rotated, and the clamping block 13 at the bottom end of the clamping column 12 is rotated to the bottom of the packaging fixing seat 1, and the soft rubber pad 14 is squeezed between the clamping block 13 and the packaging fixing seat 1, and is fixed between the packaging fixing seat 1 and the fastening sleeve 10 through the clamping column 12, which can further ensure the firmness and tightness of the reinforcement of the epoxy resin sleeve 4 and the packaging fixing seat 1.

[0027] In a further preferred embodiment of the present invention, Figure 1 and Figure 3 As shown, there are four support blocks 11 in total, and the four support blocks 11 are symmetrically arranged on the top of the fastening sleeve 10 in groups of two.

[0028] In this embodiment, two clamping columns 12 can be supported, so that the two clamping columns 12 are symmetrically clamped between the packaging fixing seat 1 and the fastening sleeve 10, which can further ensure that the epoxy resin sleeve 4 and the packaging fixing seat 1 are reinforced firmly and tightly.

[0029] It should be noted that, for the above-mentioned embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should know that the utility model is not limited by the described action sequence, because according to the utility model, some steps may be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the utility model.

[0030] In the several embodiments provided in the present application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are merely schematic, such as the division of the above-mentioned units. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be in the form of telecommunication or other forms.

[0031] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0032] The above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit the protection scope of the utility model. Obviously, the described embodiments are only some embodiments of the utility model, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Although the utility model has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the utility model according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the utility model in essence, and these technical solutions also belong to the scope of protection of the utility model.

Claims

1. A semiconductor quantum dot light emitting diode packaging structure, characterized in that: include: Packaging fixing seat (1); A lens (2) disposed at the center of the top of the packaging fixing seat (1); and Two pins (3) symmetrically embedded in the bottom of the package fixing seat (1); An epoxy resin sleeve (4) disposed above the packaging fixing seat (1); A quantum dot layer (5) disposed on the top of the epoxy resin sleeve (4); An epoxy resin limiting ring (6) integrally formed on the outer side wall of the epoxy resin sleeve (4); A limiting column (7) provided at a position on the top of the packaging fixing seat (1) close to the outer side of the lens (2); A limiting hole (8) is provided on the top of the epoxy resin limiting ring (6); A thread groove (9) formed on the outer side wall of the packaging fixing seat (1); A fastening sleeve (10) screwed onto the outer wall of the thread groove (9) through a thread; A support block (11) fixed to the top of the fastening sleeve (10) by adhesive bonding; A clamping column (12) rotatable on the outer side wall of the support block (11); A clamping block (13) disposed at the bottom end of the clamping column (12); A soft rubber pad (14) is fixed to the top of the card block (13) at a position close to one side of the card column (12) by adhesive bonding.

2. A semiconductor quantum dot light emitting diode packaging structure as claimed in claim 1, characterized in that: A concave cavity is provided at the center of the bottom of the epoxy resin sleeve (4) close to the outer side of the lens (2).

3. A semiconductor quantum dot light emitting diode packaging structure as claimed in claim 1, characterized in that: The limiting column (7) passes through the limiting hole (8).

4. A semiconductor quantum dot light emitting diode packaging structure as claimed in claim 1, characterized in that: A through hole is provided at the top of the fastening sleeve (10) near the outer side of the epoxy resin sleeve (4), and a thread matching the thread groove (9) is provided on the inner side wall of the fastening sleeve (10).

5. The semiconductor quantum dot light emitting diode packaging structure according to claim 1, characterized in that: A total of four support blocks (11) are provided, and the four support blocks (11) are symmetrically arranged in groups of two on the top of the fastening sleeve (10).

6. A semiconductor quantum dot light emitting diode packaging structure as claimed in claim 1, characterized in that: The top of the soft rubber pad (14) is provided with an inclined surface.

7. A semiconductor quantum dot light emitting diode packaging structure as claimed in claim 1, characterized in that: The cross section of the clamping column (12) is a "J"-shaped structure.

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