SMT solder paste printing device

Abstract

The utility model relates to the technical field of solder paste printing, in particular to an SMT solder paste printing device which comprises an operation table, a guide rail, a movable air cylinder, a scraper fixing frame, a scraper, a supporting table, a laser range finder, a contraction air cylinder, a sliding plate and a drying device. A circuit board is inserted into the supporting table, the laser range finder scans the circuit board on the supporting table, different heights of solder paste are determined, the air cylinder is contracted according to different heights to drive the sliding plate to move along with the air cylinder, and the scraper is fixed to the sliding plate and aligned with the lowest position to conduct even scraping. The bundling shell fixed on the other side moves along with movement of the scraper fixing frame, a heating wire conducts heating, an air blower blows heat emitted by the heating wire out of heating holes, solder paste scraped by the scraper is dried in an accelerated mode to guarantee fixation, an isolation net conducts isolation to avoid direct contact with the heating wire, and safety is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of solder paste printing, in particular to an SMT solder paste printing device. Background Art

[0002] Surface mount technology is an assembly technology that directly attaches and solders surface-mount components to specified positions on the surface of a printed circuit board without drilling holes in the printed circuit board. It is now widely used in communications, computers, and home appliances. Solder paste printing is the first step in surface mount technology and also a very critical step.

[0003] The current prior art (CN206983476U) discloses an SMT solder paste printing device including an operating table, a guide rail, a movable cylinder, a scraper fixing frame and a scraper. The guide rail is fixedly connected to the operating table, the movable cylinder is slidably connected to the guide rail, the scraper fixing frame is fixedly connected to the movable cylinder, and the scraper is fixedly connected to the scraper fixing frame. The circuit board is placed on the operating table, the guide rail is located in the upper half of the operating table, and the movable cylinder drives the scraper fixing frame to slide on the guide rail, thereby driving the scraper to evenly scrape the solder paste on the circuit board.

[0004] However, the solder paste in the above solution fails to solidify in a short time and is fluid. The shaking when taking down the circuit board after evenly scraping may cause uneven solder paste and affect the processing quality. Utility Model Content

[0005] The utility model aims to provide an SMT solder paste printing device to solve the problem that the solder paste may not be fixed for a certain period of time and has fluidity, and the shaking when taking off the circuit board after evenly scraping may cause uneven solder paste and thus affect the processing quality.

[0006] To achieve the above-mentioned objectives, the utility model provides an SMT solder paste printing device, comprising an operating table, a guide rail, a movable cylinder, a scraper fixing frame and a scraper, wherein the guide rail is fixedly connected to the operating table and is located on one side of the operating table, the movable cylinder is slidably connected to the guide rail and is located on one side of the guide rail, the scraper fixing frame is fixedly connected to the movable cylinder and is located on one side of the movable cylinder, the scraper is installed on one side of the scraper, and also comprises a drying device; the drying device comprises an isolation net, a heating wire, a blower and a focusing shell, the focusing shell is fixedly connected to the scraper fixing frame and is located on one side of the scraper fixing frame, the focusing shell has a heating hole, the heating hole is located on one side of the focusing shell, the isolation net is fixedly connected to the focusing shell and is located on one side of the focusing shell, the heating wire is fixedly connected to the focusing shell and is located on one side of the focusing shell, the blower is fixedly connected to the focusing shell and is located on one side of the focusing shell.

[0007] Wherein, the SMT solder paste printing device also includes a support platform, which is fixedly connected to the operating table and is located on one side of the operating table.

[0008] Wherein, the SMT solder paste printing device also includes a laser rangefinder, and the laser rangefinder is fixedly connected to the support platform and is located on one side of the support platform.

[0009] Among them, the SMT solder paste printing device also includes a retraction cylinder and a sliding plate, the retraction cylinder is slidably connected to the scraper fixing frame and is located on one side of the scraper fixing frame, and the sliding plate is fixedly connected to the retraction cylinder and is located on one side of the retraction cylinder.

[0010] Among them, the SMT solder paste printing device supports a seat and a limiter, the support seat is fixedly connected to the support platform and is located on one side of the support platform, and the limiter is rotatably connected to the support seat and is located on one side of the support seat.

[0011] The utility model discloses an SMT solder paste printing device, wherein a circuit board is placed on the operating table, and the movable cylinder drives the scraper fixing frame to move on the guide rail, and the scraper fixing frame will evenly scrape the solder paste on the circuit board when moving left and right on the guide rail, and the convergence shell fixed on the other side moves along with the movement of the scraper fixing frame, and the heating wire is heated, and the blower blows the heat emitted by the heating wire out from the heating hole, so as to accelerate the drying of the solder paste scraped by the scraper and ensure fixation, and the isolation net is isolated to avoid direct contact with the heating wire to ensure safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0013] Figure 1 It is a schematic diagram of the overall structure of the first embodiment of the utility model.

[0014] Figure 2 It is an overall cross-sectional view of the first embodiment of the utility model.

[0015] Figure 3 It is a schematic diagram of the overall structure of the second embodiment of the utility model.

[0016] 101-operating table, 102-guide rail, 103-moving cylinder, 104-scraper fixing frame, 105-scraper, 106-isolating net, 107-heating wire, 108-blower, 109-heating hole, 110-condensing shell, 111-support table, 112-laser rangefinder, 113-contraction cylinder, 114-sliding plate, 201-support seat, 202-limiting member. DETAILED DESCRIPTION

[0017] The first embodiment of the present application is:

[0018] See also Figure 1-Figure 2 ,in, Figure 1 It is a schematic diagram of the overall structure of the first embodiment of the utility model. Figure 2 It is an overall cross-sectional view of the first embodiment of the utility model.

[0019] The utility model provides an SMT solder paste printing device including an operating table 101, a guide rail 102, a movable cylinder 103, a scraper fixing frame 104, a scraper 105, a support table 111, a laser rangefinder 112, a shrinking cylinder 113, a sliding plate 114 and a drying device, wherein the drying device includes an isolation net 106, a heating wire 107, a blower 108, and a convergence shell 110. The above-mentioned solution solves the problem that the solder paste may not be fixed for a certain period of time and has fluidity, and the shaking when taking down the circuit board after uniform scraping may cause uneven solder paste and thus affect the processing quality.

[0020] According to this specific embodiment, the guide rail 102 is fixedly connected to the operating table 101 and is located on one side of the operating table 101. The movable cylinder 103 is slidably connected to the guide rail 102 and is located on one side of the guide rail 102. The scraper fixing frame 104 is fixedly connected to the movable cylinder 103 and is located on one side of the movable cylinder 103. The scraper 105 is installed on one side of the scraper 105. The circuit board is placed on the operating table 101. The movable cylinder 103 drives the scraper fixing frame 104 to move on the guide rail 102. When the scraper fixing frame 104 moves left and right on the guide rail 102, the scraper 105 will evenly scrape the solder paste on the circuit board.

[0021] Among them, the focusing shell 110 is fixedly connected to the scraper fixing frame 104 and is located on one side of the scraper fixing frame 104. The focusing shell 110 has a heating hole 109, and the heating hole 109 is located on one side of the focusing shell 110. The isolation net 106 is fixedly connected to the focusing shell 110 and is located on one side of the focusing shell 110. The heating wire 107 is fixedly connected to the focusing shell 110 and is located on one side of the focusing shell 110. The blower 108 is fixedly connected to the focusing shell 110 and is located on one side of the focusing shell 110. The heating wire 107 is heated, and the blower 108 blows the heat emitted by the heating wire 107 out of the heating hole 109, so as to accelerate the drying of the solder paste scraped by the scraper 105 to ensure fixation. The isolation net 106 is isolated to avoid direct contact with the heating wire 107 to ensure safety.

[0022] Secondly, the support platform 111 is fixedly connected to the operating table 101 and is located on one side of the operating table 101. The support platform 111 is located on both sides of the operating table 101. The support platform 111 has two limiting holes of equal size, and the circuit board can be slid in the support platform 111 to fix the circuit board on the operating table 101, ensuring that the circuit board is fixed and will not move when the scraper 105 is scraped.

[0023] At the same time, the laser rangefinder 112 is fixedly connected to the support platform 111 and is located on one side of the support platform 111. The solder paste on the circuit board is uneven, and the floating height of the solder paste on the circuit board is tested by the laser rangefinder 112.

[0024] In addition, the retraction cylinder 113 is slidably connected to the scraper fixing frame 104 and is located on one side of the scraper fixing frame 104. The sliding plate 114 is fixedly connected to the retraction cylinder 113 and is located on one side of the retraction cylinder 113. After being tested by the laser rangefinder 112, the retraction cylinder 113 moves on the scraper 105 support frame according to the information, and drives the sliding plate 114, thereby adjusting the position to align with the position of the solder paste for scraping, thereby ensuring that the solder paste is evenly distributed on the circuit board.

[0025] When using the utility model, the circuit board is inserted into the support table 111, and the laser rangefinder 112 will scan the circuit board on the support table 111 to determine the different heights of the solder paste. According to the different heights, the contraction cylinder 113 drives the sliding plate 114 to move accordingly, and the scraper 105 is fixed on the sliding plate 114 and aligned with the lowest position. Then the moving cylinder 103 drives the scraper fixing frame 104 to move on the guide rail 102. When the scraper fixing frame 104 moves left and right on the guide rail 102, the scraper 105 will evenly scrape the solder paste on the circuit board. As the scraper fixing frame 104 moves, the convergence shell 110 fixed on the other side will move accordingly, and the heating wire 107 is heated. The blower 108 blows the heat emitted by the heating wire 107 out of the heating hole 109, accelerates the drying of the solder paste scraped by the scraper 105 to ensure fixation, and the isolation net 106 isolates to avoid direct contact with the heating wire 107 to ensure safety.

[0026] The second embodiment of the present application is:

[0027] Based on the first embodiment, please refer to Figure 3 ,in Figure 3 20 is a schematic diagram of the overall structure of the second embodiment of the present invention. The present invention provides an SMT solder paste printing device which further includes a support seat 201 and a limiting member 202 .

[0028] According to this specific embodiment, the support seat 201 is fixedly connected to the support platform 111 and is located on one side of the support platform 111. The limiter 202 is rotatably connected to the support seat 201 and is located on one side of the support seat 201. The limiter 202 rotates on the support seat 201 to limit the position of the circuit board after it is inserted into the support platform 111, thereby ensuring that the circuit board is completely fixed.

[0029] When using the utility model, the circuit board is inserted into the support table 111 and the limiting member 202 is rotated. The limiting member 202 rotates on the support seat 201 while ensuring connection with the support table 111 to ensure that the circuit board is completely fixed. The laser rangefinder 112 scans the circuit board on the support table 111 to determine the different heights of the solder paste. According to the different heights, the shrink cylinder 113 drives the sliding plate 114 to move accordingly. The scraper 105 is fixed on the sliding plate 114 and aligned with the lowest position. Then the moving cylinder 103 drives the scraper fixing frame 104 to move. The scraper 105 moves on the guide rail 102, and when the scraper fixing frame 104 moves left and right on the guide rail 102, the scraper 105 will evenly scrape the solder paste on the circuit board. As the scraper fixing frame 104 moves, the bundling shell 110 fixed on the other side will move accordingly, and the heating wire 107 is heated. The blower 108 blows the heat emitted by the heating wire 107 out from the heating hole 109, and accelerates the drying of the solder paste scraped by the scraper 105 to ensure fixation. The isolation net 106 isolates and avoids direct contact with the heating wire 107 to ensure safety.

[0030] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. An SMT solder paste printing device, comprising an operating table, a guide rail, a movable cylinder, a scraper fixing frame and a scraper, wherein the guide rail is fixedly connected to the operating table and is located on one side of the operating table, the movable cylinder is slidably connected to the guide rail and is located on one side of the guide rail, the scraper fixing frame is fixedly connected to the movable cylinder and is located on one side of the movable cylinder, and the scraper is installed on one side of the scraper, characterized in that: Also includes a drying device; The drying device includes an isolation net, a heating wire, a blower and a focusing shell. The focusing shell is fixedly connected to the scraper fixing frame and is located on one side of the scraper fixing frame. The focusing shell has a heating hole, and the heating hole is located on one side of the focusing shell. The isolation net is fixedly connected to the focusing shell and is located on one side of the focusing shell. The heating wire is fixedly connected to the focusing shell and is located on one side of the focusing shell. The blower is fixedly connected to the focusing shell and is located on one side of the focusing shell.

2. The SMT solder paste printing device according to claim 1, characterized in that: The SMT solder paste printing device also includes a support platform, which is fixedly connected to the operating platform and is located on one side of the operating platform.

3. A SMT solder paste printing device as claimed in claim 2, characterized in that: The SMT solder paste printing device also includes a laser rangefinder, which is fixedly connected to the support platform and is located on one side of the support platform.

4. The SMT solder paste printing device according to claim 1, characterized in that: The SMT solder paste printing device also includes a retracting cylinder and a sliding plate. The retracting cylinder is slidably connected to the scraper fixing frame and is located on one side of the scraper fixing frame. The sliding plate is fixedly connected to the retracting cylinder and is located on one side of the retracting cylinder.

5. The SMT solder paste printing device according to claim 2, characterized in that: The SMT solder paste printing device supports a seat and a limiting member, wherein the support seat is fixedly connected to the support platform and is located on one side of the support platform, and the limiting member is rotatably connected to the support seat and is located on one side of the support seat.

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