Vapor chamber supporting structure

Abstract

The utility model provides a vapor chamber supporting structure which comprises a lower cover plate, a groove is formed in the middle of the lower cover plate, a steam diffusion cavity is formed in the groove, a plurality of supporting columns are arranged in the groove and the steam diffusion cavity, and the gap between the supporting columns in the steam diffusion cavity is larger than that between the supporting columns in the groove. According to the vapor chamber, the gap between the supporting columns in the vapor diffusion chamber is larger than that between the supporting columns in the groove, so that the vapor space of the vapor diffusion chamber is enlarged, liquid has enough space for containing vapor after absorbing heat, the problem that heat conduction is limited due to the fact that the heat source vapor space is small and power is large is solved, and uniform temperature distribution in the vapor chamber is achieved. The heat transfer efficiency of the vapor chamber is improved, and the heat dissipation performance of the vapor chamber is optimized.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature equalizing plates, and in particular to a temperature equalizing plate supporting structure. Background Art

[0002] In pursuit of the convenience of carrying and high functional efficiency of electronic products, the size of electronic products is mostly designed to be thin and light, so the size of the heat spreader is also designed to be ultra-thin. However, the ultra-thinness of the heat spreader will make its heat dissipation area relatively small, and the electronic components may not be able to effectively dissipate the heat generated when operating at high power. In addition, with the miniaturization of electronic components, the small size of the heat-generating device will limit the heat conduction of the heat spreader, resulting in heat accumulation, and it may not be possible to achieve uniform temperature distribution, resulting in local overheating. Therefore, we have made improvements to this and proposed a heat spreader support structure. Summary of the invention

[0003] The utility model aims to solve the problem that the ultra-thinness of the existing temperature homogenizing plate will make its heat dissipation area relatively small, and the electronic components may not be able to effectively dissipate the heat generated when operating at high power.

[0004] In order to achieve the above-mentioned purpose of the invention, the utility model provides a temperature equalizing plate support structure to improve the above-mentioned problem.

[0005] The specific application is as follows:

[0006] A temperature equalizing plate support structure includes a lower cover plate, a groove is arranged in the middle of the lower cover plate, a steam diffusion chamber is arranged in the groove, a plurality of support columns are arranged in the groove and the steam diffusion chamber, and the gap between the support columns in the steam diffusion chamber is larger than the gap between the support columns in the groove.

[0007] As a preferred technical solution of the present application, the heat source end and the condensation end are respectively arranged in the areas of the groove close to the two ends of the lower cover plate, and the heat source end is located in the steam diffusion chamber.

[0008] As a preferred technical solution of the present application, a plurality of supporting ribs are further arranged in the groove, the supporting ribs are located between the heat source end and the condensation end, a direct current channel is arranged between the plurality of the supporting ribs, and an upper cover plate is arranged on one side of the lower cover plate.

[0009] As a preferred technical solution of the present application, the lower cover plate and the upper cover plate are fixed by laser welding or brazing, and the upper cover plate is used to seal the groove.

[0010] As a preferred technical solution of the present application, the outer surfaces of the lower cover plate and the upper cover plate are provided with locking mechanisms, and the locking mechanisms are used for installing the lower cover plate.

[0011] As a preferred technical solution of the present application, the locking mechanism includes an installation frame movably sleeved on the outer peripheral side of the lower cover plate, a plurality of countersunk holes are opened on the installation frame, a fixing frame is fixedly sleeved on the outer surface of the upper cover plate, and a locking part is arranged between the fixing frame and the installation frame.

[0012] As a preferred technical solution of the present application, the locking portion includes a pull plate located on one side of the installation frame, and two locking pieces are connected between the pull plate, the installation frame and the fixed frame.

[0013] As a preferred technical solution of the present application, the locking member includes a plurality of slots provided on the fixed frame and a plurality of slide slots provided on the installation frame, and the positions of the slide slots correspond to the positions of the fixed frame.

[0014] As a preferred technical solution of the present application, each of the slide grooves is slidably connected with a buckle, the buckle is buckled with the slot, a pull rod is inserted and connected between several buckles and the installation frame, one end of the pull rod passes through the installation frame and is fixedly connected to the pull plate.

[0015] As a preferred technical solution of the present application, a plurality of springs are sleeved on the outer surface of the pull rod, and the plurality of springs are respectively located in a plurality of slide grooves, and the two ends of the springs are respectively fixedly connected to the buckle and the slide groove.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] In the scheme of this application:

[0018] In order to solve the problem in the prior art that the ultra-thinness of the heat spreader will make its heat dissipation area relatively small, and the electronic components may not be able to effectively dissipate the generated heat when operating at high power, the gap between the support columns in the steam diffusion chamber in this application is larger than the gap between the support columns in the groove, so that the steam space in the steam diffusion chamber is enlarged, so that there is enough space for the liquid to accommodate the steam after absorbing the heat, and the problem of limited heat conduction caused by the small steam space and high power of the heat source is solved, and the temperature in the heat spreader is evenly distributed. The heat transfer efficiency of the heat spreader is improved, and the heat dissipation performance of the heat spreader is optimized. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of the temperature homogenizing plate support structure provided in this application;

[0020] Figure 2 A schematic diagram of the structure of the upper cover plate of the temperature homogenizing plate support structure provided in this application;

[0021] Figure 3 The support structure of the temperature equalizing plate provided in this application Figure 2 Exploded diagram of

[0022] Figure 4 A schematic diagram of the structure of the locking mechanism and the upper cover plate of the temperature homogenizing plate support structure provided in this application;

[0023] Figure 5 A schematic diagram of the structure of the locking mechanism of the temperature homogenizing plate support structure provided in this application;

[0024] Figure 6 An exploded view of the locking mechanism of the temperature homogenizing plate support structure provided in this application.

[0025] Indicated in the figure:

[0026] 1. Lower cover plate; 101. Steam diffusion chamber; 102. Heat source end; 103. Condensation end; 104. Support column; 105. Support rib; 106. DC channel; 2. Upper cover plate; 3. Locking mechanism; 301. Mounting frame; 302. Countersunk hole; 303. Slide groove; 304. Buckle; 305. Pull plate; 306. Pull rod; 307. Spring; 308. Fixed frame; 309. Slot. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0028] As mentioned in the background technology, the ultra-thinness of the temperature spreader will make its heat dissipation area relatively small, and the electronic components may not be able to effectively dissipate the heat generated when operating at high power. In addition, in the current era of miniaturization of electronic components, the small size of the heat generating device will limit the heat conduction of the temperature spreader, resulting in heat accumulation, and it may not be possible to achieve uniform temperature distribution, resulting in local overheating.

[0029] In order to solve this technical problem, the utility model provides a temperature equalizing plate supporting structure.

[0030] Specifically, please refer to Figure 1-Figure 3 , the support structure of the temperature equalizer specifically includes:

[0031] The lower cover plate 1 has a groove in the middle thereof, a steam diffusion chamber 101 is arranged in the groove, a plurality of support columns 104 are arranged in the groove and the steam diffusion chamber 101, and the gap between the support columns 104 in the steam diffusion chamber 101 is larger than the gap between the support columns 104 in the groove.

[0032] The utility model provides a heat spreader support structure, in which the gap between the support columns 104 in the steam diffusion chamber 101 is larger than the gap between the support columns 104 in the groove, so that the steam space in the steam diffusion chamber 101 is enlarged, so that there is enough space for the liquid to accommodate the steam after absorbing the heat, and the problem of limited heat conduction caused by the small steam space and high power of the heat source is solved, and the temperature in the heat spreader is evenly distributed. The heat transfer efficiency of the heat spreader is improved, and the heat dissipation performance of the heat spreader is optimized.

[0033] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0034] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0035] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0036] Example 1, please refer to Figure 1-Figure 3 A heat spreader support structure includes a lower cover plate 1, a groove is provided in the middle of the lower cover plate 1, a steam diffusion chamber 101 is provided in the groove, and a plurality of support columns 104 are provided in the groove and the steam diffusion chamber 101, and the gap between the support columns 104 in the steam diffusion chamber 101 is larger than the gap between the support columns 104 in the groove, so that the steam space of the steam diffusion chamber 101 is enlarged, so that there is enough space for the liquid to accommodate the steam after absorbing the heat, so as to solve the problem of limited heat conduction caused by the small steam space and high power of the heat source, and realize the uniform temperature distribution in the heat spreader. So that the heat transfer efficiency of the heat spreader is improved, and the heat dissipation performance of the heat spreader is optimized;

[0037] The support column 104 can provide sufficient structural support for the temperature vapor chamber to prevent deformation of the temperature vapor chamber during use, and at the same time help to evenly distribute heat on the temperature vapor chamber;

[0038] Further, such as Figure 1 As shown, the areas of the groove near the two ends of the lower cover plate 1 are respectively provided with a heat source end 102 and a condensation end 103, and the heat source end 102 is located in the steam diffusion chamber 101, and the heat source end 102 is used to contact with a heat source.

[0039] Further, such as Figure 1As shown, a plurality of supporting ribs 105 are further provided in the groove, and the supporting ribs 105 are located between the heat source end 102 and the condensation end 103. A direct current channel 106 is provided between the plurality of supporting ribs 105. The provision of the supporting ribs 105 can replace a part of the supporting columns 104 to provide sufficient supporting force for the cavity of the temperature equalizing plate, and also increase the diffusion space in the cavity. The direct current channel 106 can assist the steam from the heat source end 102 and the steam diffusion chamber 101 to diffuse quickly to the condensation end 103, and provide a fast and unobstructed transmission channel for the steam. An upper cover plate is provided on one side of the lower cover plate;

[0040] The steam diffusion chamber 101 ensures that the heat spreader has less contact with the heat source and has high power thermal conduction efficiency. The direct current channel 106 can assist the steam to flow quickly to the condensation end 103, has a fixed-point guiding function, and expands the steam diffusion channel so that the steam can diffuse quickly to improve the heat exchange efficiency, solving the problem of heat accumulation and uneven heat distribution that is easily caused by the heat spreader under the conditions of small heat source and high power.

[0041] Embodiment 2 further optimizes the temperature equalizing plate support structure provided in Embodiment 1. Specifically, the lower cover plate 1 and the upper cover plate 2 are fixed by laser welding or brazing. The upper cover plate 2 is used to seal the groove. The lower cover plate 1 and the upper cover plate 2 are welded together.

[0042] Embodiment 3 further optimizes the support structure of the temperature homogenizing plate provided in Embodiment 1. Specifically, Figure 4-Figure 6 As shown, a locking mechanism 3 is provided on the outer surfaces of the lower cover plate 1 and the upper cover plate 2 , and the locking mechanism 3 is used for installing the lower cover plate 1 .

[0043] Further, such as Figure 4-Figure 6 As shown, the locking mechanism 3 includes a mounting frame 301 movably sleeved on the outer peripheral side of the lower cover plate 1, a plurality of countersunk holes 302 are opened on the mounting frame 301, a fixing frame 308 is fixedly sleeved on the outer surface of the upper cover plate 2, a locking portion is provided between the fixing frame 308 and the mounting frame 301, the mounting frame 301 is used to be installed on the heat source equipment by means of bolts and the countersunk holes 302, and the locking portion is used to lock the fixing frame 308 with the mounting frame 301.

[0044] Further, such as Figure 4-Figure 6 As shown, the locking part includes a pull plate 305 located on one side of the installation frame 301. Two locking pieces are connected between the pull plate 305 and the installation frame 301 and the fixed frame 308. Pulling the pull plate 305 can pull the two locking pieces to move to achieve unlocking and locking.

[0045] Further, such as Figure 4-Figure 6As shown, the locking member includes a plurality of slots 309 formed on the fixing frame 308 and a plurality of slide slots 303 formed on the installation frame 301 , and the positions of the slide slots 303 correspond to the positions of the fixing frame 308 .

[0046] Further, such as Figure 4-Figure 6 As shown, each slide groove 303 is slidably connected with a buckle 304, and the buckle 304 is buckled with the slot 309. A pull rod 306 is inserted and connected between several buckles 304 and the installation frame 301. One end of the pull rod 306 passes through the installation frame 301 and is fixedly connected to the pull plate 305. The mutual abutment between the buckle 304 and the slot 309 can realize the connection and fixation between the fixed frame 308 and the installation frame 301.

[0047] Further, such as Figure 4-Figure 6 As shown, a plurality of springs 307 are sleeved on the outer surface of the pull rod 306, and the plurality of springs 307 are respectively located in a plurality of slide grooves 303. The two ends of the spring 307 are respectively fixedly connected to the buckle 304 and the slide groove 303. The force of the spring 307 can improve the stability of the connection between the buckle 304 and the slot 309.

[0048] The use process of the temperature equalizing plate support structure provided by the utility model is as follows:

[0049] During installation, first fix the installation frame 301 on the heat source equipment by passing bolts through the countersunk holes 302, then push the pull plate 305 toward the installation frame 301, and then insert the lower cover 1 into the installation frame 301. At this time, the fixed frame 308 is in contact with the installation frame 301, and the buckle 304 is inserted into the slot 309. Release the pull plate 305, and the force of the spring 307 drives the buckle 304 to move and engage with the side wall of the slot 309 to complete the installation. During disassembly, push the pull plate 305 toward the installation frame 301 to move the buckle 304, pull the fixed frame 308 to move the fixed frame 308 away from the installation frame 301, and the lower cover 1 can be separated from the heat source equipment, which is convenient for inspection and maintenance.

[0050] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. A temperature homogenizing plate support structure, characterized in that: The invention comprises a lower cover plate (1), wherein a groove is arranged in the middle of the lower cover plate (1), a steam diffusion chamber (101) is arranged in the groove, a plurality of support columns (104) are arranged in the groove and the steam diffusion chamber (101), and the gap between the support columns (104) in the steam diffusion chamber (101) is larger than the gap between the support columns (104) in the groove.

2. A temperature homogenizing plate support structure according to claim 1, characterized in that: The areas of the groove close to the two ends of the lower cover plate (1) are respectively provided with a heat source end (102) and a condensation end (103), and the heat source end (102) is located in the steam diffusion chamber (101).

3. A temperature homogenizing plate support structure according to claim 2, characterized in that: A plurality of supporting ribs (105) are also arranged in the groove, the supporting ribs (105) are located between the heat source end (102) and the condensation end (103), and a direct current channel (106) is arranged between the plurality of supporting ribs (105); an upper cover plate (2) is arranged on one side of the lower cover plate (1).

4. A temperature homogenizing plate support structure according to claim 3, characterized in that: The lower cover plate (1) and the upper cover plate (2) are fixed by laser welding or brazing, and the upper cover plate (2) is used for sealing the groove.

5. The support structure of a temperature homogenizing plate according to claim 3, characterized in that: The outer surfaces of the lower cover plate (1) and the upper cover plate (2) are provided with locking mechanisms (3), and the locking mechanisms (3) are used for installing the lower cover plate (1).

6. A temperature homogenizing plate support structure according to claim 5, characterized in that: The locking mechanism (3) comprises a mounting frame (301) movably sleeved on the outer peripheral side of the lower cover plate (1), a plurality of countersunk holes (302) being provided on the mounting frame (301), a fixing frame (308) being fixedly sleeved on the outer surface of the upper cover plate (2), and a locking portion being provided between the fixing frame (308) and the mounting frame (301).

7. A temperature homogenizing plate support structure according to claim 6, characterized in that: The locking portion comprises a pull plate (305) located on one side of the installation frame (301), and two locking pieces are connected between the pull plate (305), the installation frame (301) and the fixing frame (308).

8. The support structure of a temperature homogenizing plate according to claim 7, characterized in that: The locking element comprises a plurality of locking slots (309) formed on the fixing frame (308) and a plurality of sliding slots (303) formed on the installation frame (301), wherein the positions of the sliding slots (303) correspond to the positions of the fixing frame (308).

9. The support structure of a temperature homogenizing plate according to claim 8, characterized in that: A buckle (304) is slidably connected in each of the slide grooves (303), and the buckle (304) is buckled with the slot (309). A pull rod (306) is inserted and connected between a plurality of the buckles (304) and the installation frame (301), and one end of the pull rod (306) passes through the installation frame (301) and is fixedly connected to the pull plate (305).

10. A temperature homogenizing plate support structure according to claim 9, characterized in that: The outer surface of the pull rod (306) is sleeved with a plurality of springs (307), and the plurality of springs (307) are respectively located in a plurality of slide grooves (303), and the two ends of the springs (307) are respectively fixedly connected to the buckle (304) and the slide groove (303).

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