Cylindrical semiconductor refrigerating and heating module and electronic cigarette heating body

Abstract

The utility model relates to the technical field of semiconductor chilling plates, and discloses a cylindrical semiconductor refrigerating and heating module and an electronic cigarette heating element, the cylindrical semiconductor refrigerating and heating module comprises an inner shell, an outer shell and a crystal grain layer, the inner shell and the outer shell are enclosed to form an annular installation space, and one side, facing the outer shell, of the inner shell is provided with a first wire layer; a second wire layer is arranged on one side, facing the inner shell, of the outer shell; the crystal grain layer comprises a plurality of N-type crystal grains and a plurality of P-type crystal grains, the N-type crystal grains and the P-type crystal grains are alternately arranged between the first wire layer and the second wire layer, and the first wire layer, the N-type crystal grains, the P-type crystal grains and the second wire layer are connected in series. In the technical scheme of the utility model, when the first wire layer, the N-type crystal grain, the P-type crystal grain and the second wire layer are connected in series to generate a current loop after being electrified, the N-type crystal grain and the P-type crystal grain can conduct heat on the outer shell to the inner shell, so that heat loss on the outer shell of the cylindrical semiconductor refrigeration and heating module is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration sheets, in particular to a cylindrical semiconductor refrigeration and heating module and an electronic cigarette heating element. Background Art

[0002] Heat-not-burn cigarettes are a new type of tobacco product, and their related products are gradually taking up a larger share of the global tobacco industry. Compared with traditional cigarettes, heat-not-burn cigarettes do not burn during the user's inhalation process, and the smoke produced does not contain carcinogenic chemicals such as tar and solid particles produced by high-temperature combustion, that is, the harmful chemical components in aerosol smoke are greatly reduced, which reduces the harm to the health of smokers, and therefore has attracted more and more attention.

[0003] The current heating element of electronic cigarettes is a PTC material or a nickel-chromium alloy heating element, which has low heating efficiency. The heat generated by the heating element will diffuse outward and be conducted to the entire outer shell of the electronic cigarette. A large amount of heat will be lost in the process of heating the cigarette, and the electronic cigarette heating element consumes more electricity for a single use. Utility Model Content

[0004] The main purpose of the utility model is to provide a cylindrical semiconductor refrigeration and heating module, aiming to reduce the heat loss of the electronic cigarette heating element during use.

[0005] To achieve the above-mentioned purpose, the cylindrical semiconductor refrigeration and heating module proposed in the utility model comprises:

[0006] Inner shell;

[0007] The outer shell, the inner shell and the outer shell enclose an annular installation space, the inner shell is provided with a first conductor layer on a side facing the outer shell; the outer shell is provided with a second conductor layer on a side facing the inner shell;

[0008] A grain layer, wherein the grain layer includes a plurality of N-type grains and a plurality of P-type grains, each of the N-type grains and each of the P-type grains are alternately arranged between the first wire layer and the second wire layer, and the first wire layer, each of the N-type grains, each of the P-type grains and the second wire layer are connected in series.

[0009] Optionally, the first conductor layer and the second conductor layer respectively include a plurality of first conductor blocks and second conductor blocks arranged side by side, and the opposite ends of each of the N-type grains or each of the P-type grains are respectively connected to the first conductor blocks and the second conductor blocks arranged at intervals, and each of the first conductor blocks or each of the second conductor blocks is respectively connected to one of the N-type grains and one of the P-type grains.

[0010] Optionally, the cylindrical semiconductor refrigeration and heating module further includes a positive electrode wire and a negative electrode wire, wherein the positive electrode wire and the negative electrode wire are arranged in the shell and are electrically connected to the second wire block.

[0011] Optionally, the cylindrical semiconductor refrigeration and heating module further includes a temperature sensor, and the temperature sensor is arranged on the inner shell or the outer shell.

[0012] Optionally, the connection line of the temperature sensor is co-linear with the power line of the cylindrical semiconductor refrigeration and heating module, and the temperature sensor is connected in series with the first conductor layer or the second conductor layer.

[0013] Optionally, the temperature sensor comprises two connecting wires.

[0014] Optionally, the cylindrical semiconductor refrigeration and heating module further includes a protective adhesive layer, and the protective adhesive layer is arranged at both ends of the cylindrical semiconductor refrigeration and heating module.

[0015] Optionally, the material of the protective adhesive layer is epoxy resin or RTV silicone.

[0016] Optionally, the inner shell and the outer shell are made of one of aluminum, copper, a ceramic substrate, and stainless steel.

[0017] The utility model also provides an electronic cigarette heating element, the electronic cigarette heating element comprises a cylindrical semiconductor refrigeration and heating module, the cylindrical semiconductor refrigeration and heating module comprises:

[0018] Inner shell;

[0019] The outer shell, the inner shell and the outer shell enclose an annular installation space, the inner shell is provided with a first conductor layer on a side facing the outer shell; the outer shell is provided with a second conductor layer on a side facing the inner shell;

[0020] A grain layer, wherein the grain layer includes a plurality of N-type grains and a plurality of P-type grains, each of the N-type grains and each of the P-type grains are alternately arranged between the first wire layer and the second wire layer, and the first wire layer, each of the N-type grains, each of the P-type grains and the second wire layer are connected in series.

[0021] In the technical solution of the utility model, a cylindrical semiconductor refrigeration and heating module is proposed, comprising an inner shell, an outer shell and a grain layer, the grain layer comprising a plurality of N-type grains and a plurality of P-type grains alternately arranged between the inner shell and the outer shell, and connected in series through a first wire layer, N-type grains, P-type grains and the second wire layer, so that when the cylindrical semiconductor refrigeration and heating module is energized to generate a current loop, the N-type grains and P-type grains can conduct heat on the outer shell to the inner shell, thereby reducing heat loss on the outer shell of the cylindrical semiconductor refrigeration and heating module and improving the heating effect of the inner shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0023] Figure 1 A three-dimensional structural schematic diagram of an embodiment of a cylindrical semiconductor refrigeration and heating module provided by the utility model;

[0024] Figure 2 for Figure 1 Front view in;

[0025] Figure 3 for Figure 2 Schematic diagram of the mid-dorsal side;

[0026] Figure 4 The utility model is a cross-sectional schematic diagram of a cylindrical semiconductor refrigeration and heating module.

[0027] Description of Figure Numbers:

[0028]

[0029] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0032] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0033] Heat-not-burn cigarettes are a new type of tobacco product, and their related products are gradually taking up a larger share of the global tobacco industry. Compared with traditional cigarettes, heat-not-burn cigarettes do not burn during the user's inhalation process, and the smoke produced does not contain carcinogenic chemicals such as tar and solid particles produced by high-temperature combustion, that is, the harmful chemical components in aerosol smoke are greatly reduced, which reduces the harm to the health of smokers, and therefore has attracted more and more attention.

[0034] The current heating element of electronic cigarettes is a PTC material or a nickel-chromium alloy heating element, which has low heating efficiency. The heat generated by the heating element will diffuse outward and be conducted to the entire outer shell of the electronic cigarette. A large amount of heat will be lost in the process of heating the cigarette, and the electronic cigarette heating element consumes more electricity for a single use.

[0035] In order to solve the above problems, the utility model proposes a cylindrical semiconductor refrigeration and heating module, which aims to reduce the heat loss of the electronic cigarette heating element during use. Figures 1 to 4 The present invention provides a schematic structural diagram of a cylindrical semiconductor refrigeration and heating module according to an embodiment of the present invention.

[0036] Please refer to Figures 1 to 4The utility model proposes a cylindrical semiconductor refrigeration and heating module 1000, comprising an inner shell 1, an outer shell 2 and a grain layer 3, wherein the inner shell 1 and the outer shell 2 enclose an annular installation space, a first wire layer 11 is provided on the side of the inner shell 1 facing the outer shell 2; a second wire layer 21 is provided on the side of the outer shell 2 facing the inner shell 1; the grain layer 3 comprises a plurality of N-type grains 31 and a plurality of P-type grains 32, each of the N-type grains 31 and each of the P-type grains 32 are alternately arranged between the first wire layer 11 and the second wire layer 21, and the first wire layer 11, each of the N-type grains 31, each of the P-type grains 32 and the second wire layer 21 are connected in series.

[0037] In the technical solution of the present utility model, a cylindrical semiconductor refrigeration and heating module 1000 is proposed, comprising an inner shell 1, an outer shell 2 and a grain layer 3, wherein the grain layer 3 comprises a plurality of N-type grains 31 and a plurality of P-type grains 32 alternately arranged between the inner shell 1 and the outer shell 2, and is connected in series through a first wire layer 11, N-type grains 31, P-type grains 32 and the second wire layer 21, so that when the cylindrical semiconductor refrigeration and heating module 1000 is energized to generate a current loop, the N-type grains 31 and P-type grains 32 can conduct heat on the outer shell 2 to the inner shell 1, thereby reducing heat loss on the outer shell 2 of the cylindrical semiconductor refrigeration and heating module 1000 and improving the heating effect of the inner shell 1.

[0038] In an optional embodiment, in order to facilitate connecting the plurality of N-type crystals 31 and the plurality of P-type crystals 32 in series, the first wire layer 11 and the second wire layer 21 respectively include a plurality of first wire blocks and second wire blocks arranged side by side, and the opposite ends of each N-type crystal 31 or each P-type crystal 32 are respectively connected to the first wire blocks and the second wire blocks arranged at intervals, and each first wire block or each second wire block is respectively connected to one N-type crystal 31 and one P-type crystal 32. Please refer to Figures 1 to 4, a plurality of first wire blocks and a plurality of second wire blocks are arranged side by side on the inner shell 1 and the outer shell 2, respectively, and each of the first wire blocks and each of the second wire blocks are arranged at intervals on the inner shell 1 and the outer shell 2, respectively, and the series connection between each of the first wire blocks and each of the second wire blocks is realized through the N-type grains 31 and the P-type grains 32, each of the first wire blocks is respectively connected to one of the N-type grains 31 and one of the N-type grains 31, and the opposite ends of each of the N-type grains 31 or one of the P-type grains 32 are respectively connected to one of the first wire blocks and one of the second wire blocks, so that each of the first wire segments, the N-type grains 31, the N-type grains 31 and each of the second wire segments are connected in series through a head-to-tail connection mode, so that the cylindrical semiconductor refrigeration and heating module 1000 is energized to form an internal loop, so as to realize the transfer of heat from the outer shell 2 to the inner shell 1, and reduce the heat loss generated by the cylindrical semiconductor refrigeration and heating module 1000 during operation, and optionally, the material of the first wire block and the second wire block is copper.

[0039] Furthermore, in order to realize the conduction of the circuit between the cylindrical semiconductor refrigeration and heating module 1000, the cylindrical semiconductor refrigeration and heating module 1000 further includes a positive wire 4 and a negative wire 5, the positive wire 4 and the negative wire 5 are arranged in the housing 2 and are electrically connected to the second wire layer 21. Please refer to Figure 1 and Figure 2 The positive wire 4 is connected to one of the second wire blocks at the starting end, and the negative wire 5 is connected to another of the second wire blocks at the end. In this way, after the positive wire 4 and the negative wire 5 are connected to the power supply, a closed DC circuit is formed in the cylindrical semiconductor refrigeration and heating module 1000, so that heat is transferred from the outer shell 2 to the inner shell 1, reducing heat loss.

[0040] In an optional embodiment, in order to accurately detect and control the temperature of the cylindrical semiconductor refrigeration and heating module 1000, the cylindrical semiconductor refrigeration and heating module 1000 further includes a temperature sensor 6, and the temperature sensor 6 is arranged in the inner shell 1 or the outer shell 2. Optionally, the temperature sensor 6 is arranged in the annular installation space formed by the inner shell 1 and the outer shell 2, and the temperature sensor can be arranged on the inner shell 1 or the outer shell 2 to improve the detection accuracy of the temperature sensor 6 as much as possible. In this embodiment, please refer to Figure 1 and Figure 2The temperature sensor 6 is connected to the inner shell 1, so that the temperature sensor 6 is closest to the cigarette on the other side of the inner shell 1, and can more accurately detect the actual temperature on the other side of the inner shell 1, so as to adjust the heating temperature of the cigarette by adjusting the magnitude of the DC current, so that the user can have a better user experience. Optionally, the temperature sensor 6 is an NTC temperature sensor 6.

[0041] In an optional embodiment, the connection line of the temperature sensor 6 is colinear with the power line of the cylindrical semiconductor refrigeration and heating module 1000 , and the temperature sensor 6 is connected in series with the first wire layer 11 or the second wire layer 21 . The connecting wire of the temperature sensor 6 may share one wire or two wires with the cylindrical semiconductor refrigeration and heating module 1000. For example, when the temperature sensor 6 shares two wires with the cylindrical semiconductor refrigeration and heating module 1000, the positive terminal and the negative terminal of the temperature sensor 6 correspond to the positive wire 4 and the negative wire 5, that is, the temperature sensor 6 is connected in series in the loop of the cylindrical semiconductor refrigeration and heating module 1000, or the temperature sensor 6 only shares one positive wire 4 or negative wire 5 with the cylindrical semiconductor refrigeration and heating module 1000. In addition, the temperature sensor 6 may not share a connecting wire with the cylindrical semiconductor refrigeration and heating module 1000, but only make the temperature sensor 6 contact and connect with the inner shell 1 to detect the temperature, and realize the electrical connection with the temperature sensor 6 by connecting two other wires. The specific selection can be made according to actual needs and is not specifically limited here.

[0042] In an optional embodiment, in order to protect the ends of the cylindrical semiconductor refrigeration and heating module 1000, the cylindrical semiconductor refrigeration and heating module 1000 also includes a protective adhesive layer, and the protective adhesive layer is arranged at both ends of the cylindrical semiconductor refrigeration and heating module 1000. In order to provide moisture-proof protection for the cylindrical semiconductor refrigeration and heating module 1000 and improve its high-pressure resistance, the upper and lower ends of the cylindrical semiconductor refrigeration and heating module 1000 can be sealed with glue to close the openings at both ends, so as to prevent water vapor or other foreign matter from entering the cylindrical semiconductor refrigeration and heating module 1000 from the gap between the inner shell 1 and the outer shell 2, thereby affecting the stability of the internal structure and ensuring the normal operation of the internal circuit of the cylindrical semiconductor refrigeration and heating module 1000. In addition, by sealing the cylindrical semiconductor refrigeration and heating module 1000, it is equivalent to setting a gelatinous shell 2 around it, which can also improve the strength of the cylindrical semiconductor refrigeration and heating module 1000, reduce the influence of external interference on it during operation, improve the stability of operation, and extend its service life to a certain extent.

[0043] Furthermore, the material of the protective adhesive layer is epoxy resin or RTV silicone. Both materials have good insulation properties, relatively stable chemical properties, excellent moisture-proof and corrosion-resistant properties, and certain strength. They can be used to protect the cylindrical semiconductor refrigeration and heating module 1000 by sealing it. While ensuring the normal operation of the cylindrical semiconductor refrigeration and heating module 1000, it can also prevent it from being interfered by the outside world. In addition, the protective adhesive layer can also be some other types of high-temperature resistant adhesive, so that when the cylindrical semiconductor refrigeration and heating module 1000 maintains a high heating temperature, the protective adhesive layer can also play a protective role normally to ensure the normal operation of the internal circuit.

[0044] In an optional embodiment, in order to ensure the strength of the inner shell 1 and the outer shell 2, the inner shell 1 and the outer shell 2 are made of one of aluminum, copper, ceramic substrate, and stainless steel. Figure 1 The outer wall shape of the inner shell 1 and the inner wall shape of the outer shell 2 are set in a polygonal shape, so that the two can better contact and cooperate with the two end faces of the N-type grain 31 and the P-type grain 32. Optionally, the inner shell 1 can be designed in an integrated manner, and the outer shell 2 can be assembled by splicing two parts, which can facilitate the assembly and molding of the N-type grain 31 and the P-type grain 32 in the cylindrical semiconductor refrigeration and heating module 1000. In order to improve the strength of the cylindrical semiconductor refrigeration and heating module 1000, the material of the inner shell 1 and the outer shell 2 can be one of aluminum, copper, ceramic substrate, and stainless steel. The inner shell 1 can be made of the same material as the outer shell 2, or two different materials, which are not specifically limited here. In addition, if the material of the inner shell 1 and the outer shell 2 is a ceramic substrate, a heating material can be built into the ceramic substrate for auxiliary heating, or auxiliary heating is not required. Optionally, in order to ensure the insulation effect between the inner shell 1 and the outer shell 2 and the first wire layer 11 and the second wire layer 21, an insulating coating is provided between the inner shell 1 and the first wire layer 11, and between the outer shell 2 and the second wire layer 21, so as to prevent the inner shell 1 and the outer shell 2 from having conductivity and interfering with the normal conduction of the internal current circuit of the cylindrical semiconductor refrigeration and heating module 1000.

[0045] The utility model also proposes an electronic cigarette heating element, which includes a cylindrical semiconductor refrigeration and heating module 1000. The cylindrical semiconductor refrigeration and heating module 1000 is connected to an external power supply to realize the conduction of the entire series circuit, so as to generate heat in the electronic cigarette inner shell 1 and transfer the heat of the outer shell 2 to the inner shell 1, so that the inner side of the electronic cigarette heating element in contact with the cigarette can have a higher temperature, and reduce the heat loss caused by the heat dissipation of the outer shell 2, thereby reducing the amount of electricity consumed by the electronic cigarette heating element for heating a cigarette once, and improving the user experience. The specific structure of the cylindrical semiconductor refrigeration and heating module 1000 refers to the above embodiment. Since the electronic cigarette heating element adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0046] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A cylindrical semiconductor refrigeration and heating module, characterized in that: include: Inner shell; The outer shell, the inner shell and the outer shell enclose an annular installation space, the inner shell is provided with a first conductor layer on a side facing the outer shell; the outer shell is provided with a second conductor layer on a side facing the inner shell; A grain layer, wherein the grain layer includes a plurality of N-type grains and a plurality of P-type grains, each of the N-type grains and each of the P-type grains are alternately arranged between the first wire layer and the second wire layer, and the first wire layer, each of the N-type grains, each of the P-type grains and the second wire layer are connected in series.

2. The cylindrical semiconductor refrigeration and heating module according to claim 1, characterized in that: The first conductor layer and the second conductor layer respectively include a plurality of first conductor blocks and second conductor blocks arranged side by side, and the opposite ends of each of the N-type grains or each of the P-type grains are respectively connected to the first conductor blocks and the second conductor blocks arranged at intervals, and each of the first conductor blocks or each of the second conductor blocks is respectively connected to one of the N-type grains and one of the P-type grains.

3. The cylindrical semiconductor refrigeration and heating module according to claim 2, characterized in that: The cylindrical semiconductor refrigeration and heating module further comprises a positive lead and a negative lead, wherein the positive lead and the negative lead are arranged in the housing and are electrically connected to the second lead block.

4. The cylindrical semiconductor refrigeration and heating module according to claim 3, characterized in that: The cylindrical semiconductor refrigeration and heating module further comprises a temperature sensor, and the temperature sensor is arranged on the inner shell or the outer shell.

5. The cylindrical semiconductor refrigeration and heating module according to claim 4, characterized in that: The connection line of the temperature sensor is co-linear with the power line of the cylindrical semiconductor refrigeration and heating module, and the temperature sensor is connected in series with the first conductor layer or the second conductor layer.

6. The cylindrical semiconductor refrigeration and heating module according to claim 4, characterized in that: The temperature sensor comprises two connecting wires.

7. The cylindrical semiconductor refrigeration and heating module according to any one of claims 1 to 6, characterized in that: The cylindrical semiconductor refrigeration and heating module further comprises a protective adhesive layer, and the protective adhesive layer is arranged at both ends of the cylindrical semiconductor refrigeration and heating module.

8. The cylindrical semiconductor refrigeration and heating module according to claim 7, characterized in that: The material of the protective adhesive layer is epoxy resin or RTV silicone.

9. The cylindrical semiconductor refrigeration and heating module according to claim 7, characterized in that: The inner shell and the outer shell are made of one of aluminum, copper, ceramic substrate and stainless steel.

10. An electronic cigarette heating element, characterized in that: It comprises a cylindrical semiconductor refrigeration and heating module as claimed in any one of claims 1 to 9.

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