Die cooling device for copper substrate production

Abstract

The utility model relates to the technical field of copper substrate mold cooling, and discloses a mold cooling device for copper substrate production, which comprises a bottom plate, a cooling mechanism arranged at the top of the bottom plate, a filtering mechanism arranged at the top of the bottom plate, a collecting box mounted at the top of the bottom plate in a sliding manner, and a spraying device arranged at the top of the bottom plate, the cooling mechanism comprises a condensation assembly and an air sweeping assembly, and the air sweeping assembly is arranged on the inner side of the condensation assembly. Cold air in the low-temperature box is blown to the temperature conducting supporting plate through the supporting frame, the bottom of the copper substrate is cooled, and the top and the side face of the copper substrate are cooled, so that air blown out of the air blowing cover is low-temperature cold air, the cooling efficiency of the copper substrate is improved, an air sweeping plate sweeps air, and the cooling efficiency of the copper substrate is improved. And cold air blown out of the blowing cover can be evenly blown to the copper substrate, the cooling effect on the copper substrate is improved, the filtering frame is taken down, dust on the surface is cleaned, and the situation that the air inlet effect of the fan is affected by dust accumulation is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of copper substrate mold cooling, in particular to a mold cooling device for copper substrate production. Background Art

[0002] Copper substrate is the most expensive metal substrate. Its thermal conductivity is many times better than that of aluminum substrate and iron substrate. It is suitable for high-frequency circuits, areas with large changes in high and low temperatures, heat dissipation of precision communication equipment, and architectural decoration industries. Copper substrates will emit a lot of heat during processing, so a mold cooling device for copper substrate production is needed.

[0003] According to the description of a mold cooling device for copper substrate production disclosed on the patent website (authorization announcement number: CN212760728U), "the utility model relates to the technical field of copper substrates, and discloses a mold cooling device for copper substrate production, which includes a box body, the inner wall of the box body is provided with a groove, the top wall of the box body is fixedly connected to a motor, the outer surface of the motor output end is fixedly connected to a disc, the outer surface of the disc is fixedly connected to two L-shaped connecting rods, the insides of the two bearings are fixedly connected to a rotating shaft, one end of the two rotating shafts is fixedly connected to a fan blade, the other end of the two rotating shafts is fixedly connected to a gear, the inner wall of the groove is fixedly connected to two gear rings, the gear rings are meshed with the gears, and the inner side of the box body is provided with multiple air outlets, which can cool the workbench more thoroughly in all directions to avoid damage to the material caused by excessive temperature. The rotation of the fan blades drives the flow of air around the workbench, thereby achieving a cooling effect. At the same time, the water mist sprayed by the sprayer evaporates in the air to absorb heat, and the device can be cooled for a second time."

[0004] In view of the above description, the applicant believes that there are the following problems:

[0005] During use, the utility model can cool the workbench in an all-round and more thorough manner through the provided rotating shaft, L-shaped connecting rod and motor. However, in actual use, the heat dissipation efficiency is too low because the material is only cooled by the fan, and the side of the material in contact with the workbench cannot be effectively cooled, which may damage the mold. Therefore, it is necessary to improve a mold cooling device for copper substrate production to solve the above problems. Utility Model Content

[0006] The utility model aims to provide a mold cooling device for copper substrate production to solve the problems raised in the above background technology.

[0007] To achieve the above object, the utility model provides the following technical solution: a mold cooling device for copper substrate production, comprising a bottom plate, a cooling mechanism is arranged on the top of the bottom plate, a filtering mechanism is arranged on the top of the bottom plate, a collecting box is slidably mounted on the top of the bottom plate, and a spray device is arranged on the top of the bottom plate;

[0008] The cooling mechanism comprises a condensing component and an air sweeping component, and the air sweeping component is arranged inside the condensing component.

[0009] Preferably, the condensation assembly includes a low-temperature box, which is fixedly installed on the top of the base plate, a water tank is fixedly installed on the top of the base plate, a water pump is fixedly installed on the top of the base plate, a U-shaped tube is fixedly installed on the right side of the water pump, a condensing box is fixedly installed on the end of the U-shaped tube away from the water pump, a circulating water pump is fixedly installed on the top of the base plate, a fan is fixedly installed on the bottom of the base plate, air ducts are fixedly installed on the left and right sides of the low-temperature box, a blowing hood is fixedly installed on the end of the air duct away from the low-temperature box, a mounting frame is fixedly installed on the top of the low-temperature box, a supporting frame is fixedly installed on the top of the low-temperature box, and a heat-conducting support plate is fixedly installed on the top of the support frame, and cold air inside the low-temperature box is blown to the heat-conducting support plate through the supporting frame, the bottom of the copper substrate is cooled, and the top and sides of the copper substrate are cooled, so that the gas blown out of the blowing hood is low-temperature cold air, thereby increasing the cooling efficiency of the copper substrate.

[0010] Preferably, a water inlet pipe is provided at the back of the water tank, the water pump and the water tank are fixedly installed by a connecting pipe, the condensing tank and the circulating water pump are fixedly installed by circulating water pipe 1, and the circulating water pump and the water tank are fixedly installed by circulating water pipe 2. Through holes are provided at corresponding positions of the installation frame and the air duct, and the air duct is fixedly installed with the blow hood through the through holes. Two groups of the air duct, the blow hood and the installation frame are provided, and are symmetrically distributed about the center line of the front side of the base plate, so that the gas blown out of the blow hood is low-temperature cold air.

[0011] Preferably, the wind sweeping assembly includes a rotating shaft, which is rotatably mounted inside the mounting frame, a gear is fixedly mounted on the outside of the rotating shaft, a wind sweeping plate is fixedly mounted on the outside of the rotating shaft, an electric push rod is fixedly mounted inside the mounting frame, and a rack is fixedly mounted on the output end of the electric push rod, so that the wind sweeping plate sweeps the air, and the cold air blown out of the blowing hood can be evenly blown toward the copper substrate, thereby increasing the cooling effect on the copper substrate.

[0012] Preferably, the rack is slidably mounted inside the mounting frame, and the gear is meshed with the rack to enable the wind sweeping plate to sweep the wind.

[0013] Preferably, the filtering mechanism includes a fixed frame, which is fixedly installed on the bottom of the base plate, a spring is fixedly installed inside the fixed frame, a sliding block is fixedly installed on the end of the spring away from the fixed frame, a pull rod is fixedly installed on the bottom of the sliding block, and a filter frame is arranged at the bottom of the base plate. When the fan is blowing, the filter frame prevents dust from entering the low-temperature box and prevents dust from adhering to the surface of the copper substrate. The filter frame is removed and the dust on the surface is cleaned to prevent dust accumulation from affecting the air intake effect of the fan.

[0014] Preferably, the sliding block is slidably installed inside the fixed frame, slots are provided at positions corresponding to the filter frame and the sliding block, and the sliding block is plugged into the slots, and the filter frame is arranged outside the fan, so that the filter frame is easy to disassemble.

[0015] Compared with the prior art, the utility model provides a mold cooling device for copper substrate production, which has the following beneficial effects:

[0016] 1. The mold cooling device for copper substrate production, through the cooling mechanism, during use, blows the cold air inside the low temperature box to the temperature guide support plate through the support frame, cools the bottom of the copper substrate, and cools the top and side of the copper substrate, so that the gas blown out of the blowing hood is low-temperature cold air, which increases the cooling efficiency of the copper substrate, and makes the wind sweeping plate sweep the air, so that the cold air blown out of the blowing hood can be evenly blown to the copper substrate, thereby increasing the cooling effect of the copper substrate.

[0017] 2. The mold cooling device for copper substrate production has a filtering mechanism. During use, when the fan is blowing air, the filter frame prevents dust from entering the low-temperature box and adhering to the surface of the copper substrate. The filter frame is removed to clean the dust on the surface to prevent dust accumulation from affecting the air intake effect of the fan. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative labor:

[0019] Figure 1 This is a schematic diagram of the appearance structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the internal structure of the utility model;

[0021] Figure 3 This is a schematic diagram of the exploded structure of the condensing component of the utility model;

[0022] Figure 4 This is a schematic diagram of the cross-sectional structure of the air sweeping component of the utility model;

[0023] Figure 5 It is a schematic diagram of the decomposition structure of the filtering mechanism of the utility model.

[0024] In the figure: 1. bottom plate; 2. cooling mechanism; 21. condensing assembly; 211. low temperature box; 212. water tank; 213. water pump; 214. U-shaped tube; 215. condensing box; 216. circulating water pump; 217. fan; 218. air duct; 219. blow hood; 2110. mounting frame; 2111. supporting frame; 2112. temperature conducting supporting plate; 22. wind sweeping assembly; 221. rotating shaft; 222. gear; 223. wind sweeping plate; 224. electric push rod; 225. rack; 3. filtering mechanism; 31. fixing frame; 32. spring; 33. sliding block; 34. pull rod; 35. filtering frame; 4. collecting box; 5. spray device. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] Embodiment 1:

[0028] See also Figure 1-4 The utility model provides a technical solution: a mold cooling device for copper substrate production, comprising a bottom plate 1, a cooling mechanism 2 is arranged on the top of the bottom plate 1, a filtering mechanism 3 is arranged on the top of the bottom plate 1, a collecting box 4 is slidably installed on the top of the bottom plate 1, and a spray device 5 is arranged on the top of the bottom plate 1;

[0029] The cooling mechanism 2 includes a condensing assembly 21 and an air sweeping assembly 22 . The air sweeping assembly 22 is arranged inside the condensing assembly 21 .

[0030] Further, the condensation assembly 21 includes a low temperature box 211, which is fixedly mounted on the top of the bottom plate 1, a water tank 212 is fixedly mounted on the top of the bottom plate 1, a water pump 213 is fixedly mounted on the top of the bottom plate 1, a U-shaped pipe 214 is fixedly mounted on the right side of the water pump 213, a condensation box 215 is fixedly mounted on the end of the U-shaped pipe 214 away from the water pump 213, a circulating water pump 216 is fixedly mounted on the top of the bottom plate 1, a fan 217 is fixedly mounted on the bottom of the bottom plate 1, and air ducts 218 are fixedly mounted on the left and right sides of the low temperature box 211, and the air ducts 218 are away from the low temperature box 211. A blow hood 219 is fixedly installed at one end of the temperature box 211, a mounting frame 2110 is fixedly installed on the top of the low-temperature box 211, a support frame 2111 is fixedly installed on the top of the low-temperature box 211, and a temperature-conducting support plate 2112 is fixedly installed on the top of the support frame 2111. The cold air inside the low-temperature box 211 is blown to the temperature-conducting support plate 2112 through the support frame 2111, the bottom of the copper substrate is cooled, and the top and sides of the copper substrate are cooled, so that the gas blown out of the blow hood 219 is low-temperature cold air, thereby increasing the cooling efficiency of the copper substrate.

[0031] Furthermore, a water inlet pipe is provided at the back of the water tank 212, the water pump 213 and the water tank 212 are fixedly installed via a connecting pipe, the condensing tank 215 and the circulating water pump 216 are fixedly installed via a circulating water pipe 1, and the circulating water pump 216 and the water tank 212 are fixedly installed via a circulating water pipe 2. Through holes are provided at corresponding positions of the installation frame 2110 and the air duct 218, and the air duct 218 is fixedly installed with the blow hood 219 through the through holes. Two groups of the air duct 218, the blow hood 219 and the installation frame 2110 are provided, and are symmetrically distributed around the center line of the front of the base plate 1, so that the gas blown out of the blow hood 219 is low-temperature cold air.

[0032] Furthermore, the wind sweeping assembly 22 includes a rotating shaft 221, which is rotatably installed inside the installation frame 2110, a gear 222 is fixedly installed on the outside of the rotating shaft 221, a wind sweeping plate 223 is fixedly installed on the outside of the rotating shaft 221, an electric push rod 224 is fixedly installed inside the installation frame 2110, and a rack 225 is fixedly installed on the output end of the electric push rod 224, so that the wind sweeping plate 223 sweeps the air, and the cold air blown out of the blowing hood 219 can be evenly blown toward the copper substrate, thereby increasing the cooling effect on the copper substrate.

[0033] Furthermore, the rack 225 is slidably installed inside the installation frame 2110, and the gear 222 is meshed with the rack 225, so that the wind sweeping plate 223 sweeps the wind.

[0034] Embodiment two:

[0035] See also Figure 5, and combined with Example 1, it is further obtained that the filtering mechanism 3 includes a fixed frame 31, the fixed frame 31 is fixedly installed at the bottom of the base plate 1, a spring 32 is fixedly installed inside the fixed frame 31, a sliding block 33 is fixedly installed at one end of the spring 32 away from the fixed frame 31, a pull rod 34 is fixedly installed at the bottom of the sliding block 33, and a filter frame 35 is arranged at the bottom of the base plate 1. During the blowing process of the fan 217, the filter frame 35 prevents dust from entering the low temperature box 211 and preventing dust from adhering to the surface of the copper substrate. The filter frame 35 is removed, and the dust on the surface is cleaned to prevent dust accumulation from affecting the air intake effect of the fan 217.

[0036] Furthermore, the sliding block 33 is slidably installed inside the fixed frame 31, and slots are provided at positions corresponding to the filter frame 35 and the sliding block 33, and the sliding block 33 is inserted into the slots. The filter frame 35 is arranged outside the fan 217, so that the filter frame 35 is easy to disassemble.

[0037] In actual operation, when the device is used, the copper substrate to be cooled is placed on the top of the heat-conducting support plate 2112, and the water pump 213 is started. The water pump 213 draws water from the inside of the water tank 212, sends it into the U-shaped tube 214, and transports it to the inside of the condensation box 215 for condensation. The circulating water pump 216 is started to transport the condensed water to the inside of the water tank 212 to circulate and cool the water. The fan 217 is started to blow the cold air in the low-temperature box 211 through the support frame 2111 to the heat-conducting support plate 2112 to cool the bottom of the copper substrate. The cold air in the low-temperature box 211 is sent to the blowing hood 219 through the air duct 218 to cool the top and side of the copper substrate, so that the gas blown out of the blowing hood 219 is low-temperature cold air, which increases the heat dissipation of the copper substrate. In order to improve the cooling efficiency, the electric push rod 224 is started, and the output end of the electric push rod 224 pushes the rack 225 to move. The rack 225 moves and drives the rack 225 to move. The rack 225 moves and drives the gear 222 meshing therewith. The gear 222 rotates and drives the wind sweeping plate 223 to sweep the wind, so that the cold air blown out by the blowing hood 219 can be evenly blown to the copper substrate, thereby increasing the cooling effect on the copper substrate. During the blowing process of the fan 217, the filter frame 35 prevents dust from entering the low-temperature box 211 and preventing dust from adhering to the surface of the copper substrate. The pull rod 34 is pushed outward, and the pull rod 34 moves and drives the sliding block 33 to move, thereby making the sliding block 33 out of the clamping range of the filter frame 35, and the filter frame 35 is removed, and the dust on the surface is cleaned to prevent dust accumulation from affecting the air intake effect of the fan 217.

[0038] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

Claims

1. A mold cooling device for copper substrate production, comprising a bottom plate (1), characterized in that: A cooling mechanism (2) is provided on the top of the bottom plate (1), a filtering mechanism (3) is provided on the top of the bottom plate (1), a collecting box (4) is slidably mounted on the top of the bottom plate (1), and a spray device (5) is provided on the top of the bottom plate (1); The cooling mechanism (2) comprises a condensing component (21) and an air sweeping component (22), wherein the air sweeping component (22) is arranged on the inner side of the condensing component (21).

2. A mold cooling device for copper substrate production according to claim 1, characterized in that: The condensation assembly (21) comprises a low temperature box (211), the low temperature box (211) is fixedly mounted on the top of the base plate (1), a water tank (212) is fixedly mounted on the top of the base plate (1), a water pump (213) is fixedly mounted on the top of the base plate (1), a U-shaped tube (214) is fixedly mounted on the right side of the water pump (213), a condensation box (215) is fixedly mounted on one end of the U-shaped tube (214) away from the water pump (213), and a circulating water pump (216) is fixedly mounted on the top of the base plate (1). ), a fan (217) is fixedly mounted at the bottom of the base plate (1), air ducts (218) are fixedly mounted on the left and right sides of the low-temperature box (211), a blow hood (219) is fixedly mounted on one end of the air duct (218) away from the low-temperature box (211), a mounting frame (2110) is fixedly mounted on the top of the low-temperature box (211), a support frame (2111) is fixedly mounted on the top of the low-temperature box (211), and a heat conduction support plate (2112) is fixedly mounted on the top of the support frame (2111).

3. A mold cooling device for copper substrate production according to claim 2, characterized in that: A water inlet pipe is arranged at the back of the water tank (212); the water pump (213) and the water tank (212) are fixedly installed via a connecting pipe; the condensing tank (215) and the circulating water pump (216) are fixedly installed via a first circulating water pipe; and the circulating water pump (216) and the water tank (212) are fixedly installed via a second circulating water pipe. Through holes are provided at positions corresponding to the air duct (218) and the air duct (218), and the air duct (218) is fixedly installed with the blow hood (219) through the through holes. Two groups of the air duct (218), the blow hood (219) and the installation frame (2110) are arranged and are symmetrically distributed at the center line of the front of the bottom plate (1).

4. A mold cooling device for copper substrate production according to claim 2, characterized in that: The wind sweeping assembly (22) comprises a rotating shaft (221), the rotating shaft (221) is rotatably mounted inside the mounting frame (2110), a gear (222) is fixedly mounted on the outside of the rotating shaft (221), a wind sweeping plate (223) is fixedly mounted on the outside of the rotating shaft (221), an electric push rod (224) is fixedly mounted inside the mounting frame (2110), and a rack (225) is fixedly mounted on the output end of the electric push rod (224).

5. A mold cooling device for copper substrate production according to claim 4, characterized in that: The rack (225) is slidably mounted inside the mounting frame (2110), and the gear (222) is meshed with the rack (225).

6. The mold cooling device for copper substrate production according to claim 1, characterized in that: The filtering mechanism (3) comprises a fixed frame (31), the fixed frame (31) is fixedly mounted on the bottom of the base plate (1), a spring (32) is fixedly mounted inside the fixed frame (31), a sliding block (33) is fixedly mounted on one end of the spring (32) away from the fixed frame (31), a pull rod (34) is fixedly mounted on the bottom of the sliding block (33), and a filtering frame (35) is arranged at the bottom of the base plate (1).

7. A mold cooling device for copper substrate production according to claim 6, characterized in that: The sliding block (33) is slidably installed inside the fixed frame (31), a slot is provided at a position corresponding to the filter frame (35) and the sliding block (33), and the sliding block (33) is inserted into the slot, and the filter frame (35) is arranged outside the fan (217).

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