Multi-station polishing machine

Abstract

The utility model discloses a multi-station polishing machine, and relates to the technical field of polishing equipment. The utility model comprises a box body; the polishing machine body is fixedly mounted at the top of the box body; the belt conveyor is installed between the two sides of the inner wall of the box body, and a containing groove is formed in a conveying belt of the belt conveyor; the number of the mounting plates is two, and the two mounting plates are symmetrically distributed and fixedly mounted at the top of the box body; and the cleaning equipment is mounted between the two mounting plates. Through mutual cooperation of the fixing column, the rotating shaft, the dust-free cloth and the vibration assembly, dust and other impurities on the surface of a silicon wafer are cleverly removed, workers do not need to manually clean the silicon wafer to be processed, a clean and comfortable working environment is created, meanwhile, the labor amount of the workers is reduced, and the working efficiency is improved. And the processing efficiency and the qualified rate of the silicon wafer are effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing equipment, in particular to a multi-station polishing machine. Background Art

[0002] Single crystal silicon wafer is a crystal with a basically complete lattice structure. Different directions have different properties and are a good semiconductor material. Single crystal silicon wafers are refined from ordinary silicon salad and are the most commonly used semiconductor material. They are divided into 4 inches, 5 inches, 6 inches, 8 inches and other specifications according to their diameters. After the single crystal silicon wafer is made, the surface is relatively rough and usually needs to be polished. Therefore, the polishing machine plays a vital role in the processing of single crystal silicon wafers.

[0003] After the single crystal silicon wafer is manufactured, some impurities such as silicon powder will remain on the surface. If it is polished directly without cleaning, the polishing effect will be affected, making the thickness of the polished single crystal silicon wafer uneven, which requires rework. However, the existing polishing machine does not have the function of automatic cleaning. Before polishing the single crystal silicon wafer, manual cleaning is required, which increases the workload of the staff and affects the polishing efficiency. If the operation is improper, the silicon wafer is easily dropped on the ground, causing the silicon wafer to break, which is inconvenient to use. Utility Model Content

[0004] The purpose of the utility model is to solve the problems raised in the above background technology, and the utility model provides a multi-station polishing machine.

[0005] In order to achieve the above-mentioned purpose, the utility model specifically adopts the following technical scheme: a multi-station polishing machine, comprising: a box; a polishing machine body, the polishing machine body is fixedly installed on the top of the box; a belt conveyor, the belt conveyor is installed between the two sides of the inner wall of the box, and a placement groove is constructed on the conveyor belt of the belt conveyor; two mounting plates, the two mounting plates are symmetrically distributed and fixedly installed on the top of the box; a cleaning device, the cleaning device is installed between the two mounting plates, and is used to clean silicon wafers, the cleaning device includes a fixedly installed between the two mounting plates A fixed column, a rotating shaft is rotatably installed between the two mounting plates, a servo motor is fixedly installed on one side of one of the mounting plates, one end of the rotating shaft passes through one of the mounting plates and is fixedly connected to the output end of the servo motor, two rotating wheels are symmetrically distributed and rotatably installed between the two mounting plates, a dust-free cloth is sleeved on the outer surface of the fixed column, the dust-free cloth contacts the outer surfaces of the two rotating wheels and is fixedly connected to the outer surface of the rotating shaft, a vibration component for driving the dust-free cloth to vibrate is installed between the two mounting plates, and the vibration component is located between the two rotating wheels.

[0006] Furthermore, the vibration assembly includes a fixing plate fixedly mounted between the two mounting plates, a vibration motor is fixedly mounted inside the fixing plate, and a pressure plate is fixedly mounted on an output end of the vibration motor.

[0007] Furthermore, a plurality of nozzles are fixedly mounted on the top of the inner wall of the polishing machine body, a soft plate is fixedly mounted between two sides of the inner wall of the polishing machine body, and a baffle is fixedly mounted between two sides of the inner wall of the polishing machine body.

[0008] Furthermore, a dust removal device is installed on the box body, which is used to absorb the dust cleaned by the dust-free cloth.

[0009] Furthermore, the dust removal equipment includes two suction pumps symmetrically distributed and fixedly installed on one side of the box body, and the air inlet and outlet ends of the two suction pumps are fixedly installed with pipes. A dust collecting box is fixedly installed inside the box body, and the pipe passes through the box body and is fixedly connected to one side of the dust collecting box.

[0010] Furthermore, the bottom of the pressing plate is configured with a curved surface.

[0011] The beneficial effects of the utility model are as follows:

[0012] The utility model skillfully removes dust and other impurities on the surface of the silicon wafer through the mutual cooperation of the fixed column, the rotating shaft, the dust-free cloth and the vibration component. There is no need for the staff to manually clean the silicon wafer to be processed, thus creating a clean and comfortable working environment, reducing the workload of the staff and effectively improving the processing efficiency and qualification rate of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0014] Figure 2 This utility model Figure 1 A three-dimensional structural cross-sectional view;

[0015] Figure 3 This utility model Figure 1 Schematic diagram of the three-dimensional structure of the cleaning equipment;

[0016] Figure 4 This utility model Figure 3 A three-dimensional structural cross-sectional view of .

[0017] Figure numerals: 1. Box body; 2. Polishing machine body; 3. Belt conveyor; 31. Placement slot; 4. Mounting plate; 5. Cleaning equipment; 51. Fixed column; 52. Rotating shaft; 53. Servo motor; 54. Rotating wheel; 55. Dust-free cloth; 6. Vibration component; 61. Fixed plate; 62. Vibration motor; 63. Pressing plate; 7. Nozzle; 8. Soft board; 9. Baffle; 10. Dust removal equipment; 101. Suction pump; 102. Pipeline; 103. Dust collection box. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the embodiments of the present utility model clearer, the technical solution in the embodiments of the present utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the present utility model.

[0019] like Figure 1-4 As shown, a multi-station polishing machine proposed in one embodiment of the utility model comprises: a box body 1; a polishing machine body 2, wherein the polishing machine body 2 is fixedly mounted on the top of the box body 1; a belt conveyor 3, wherein the belt conveyor 3 is mounted between the two sides of the inner wall of the box body 1, and a placement groove 31 is constructed on the conveyor belt of the belt conveyor 3; two mounting plates 4, wherein the two mounting plates 4 are symmetrically distributed and fixedly mounted on the top of the box body 1; a cleaning device 5, wherein the cleaning device 5 is mounted between the two mounting plates 4, and is used for cleaning silicon wafers, and the cleaning device 5 comprises a fixing column 51 fixedly mounted between the two mounting plates 4, and the two mounting plates 4 are fixedly mounted on the top of the box body 1; and a fixing column 51 fixedly mounted between the two mounting plates 4. A rotating shaft 52 is rotatably installed between the mounting plates 4, a servo motor 53 is fixedly installed on one side of one of the mounting plates 4, one end of the rotating shaft 52 passes through one of the mounting plates 4 and is fixedly connected to the output end of the servo motor 53, two rotating wheels 54 are symmetrically distributed and rotatably installed between the two mounting plates 4, a dust-free cloth 55 is sleeved on the outer surface of the fixed column 51, the dust-free cloth 55 is in contact with the outer surfaces of the two rotating wheels 54, and is fixedly connected to the outer surface of the rotating shaft 52, a vibration component 6 for driving the dust-free cloth 55 to vibrate is installed between the two mounting plates 4, and the vibration component 6 is located between the two rotating wheels 54.

[0020] When the surface of the silicon wafer needs to be cleaned, the silicon wafer is placed in the placement groove 31 to avoid deviation when cleaning the surface of the silicon wafer, and the belt conveyor 3 is started (the belt conveyor 3 is a prior art, and its specific structure and principle are not repeated in the present utility model), and the silicon wafer is continuously driven to approach the cleaning device 5. When the upper surface of the silicon wafer contacts the dust-free cloth 55, the dust-free cloth 55 is driven to vibrate continuously on the surface of the silicon wafer through the vibration component 6, so that dust and other impurities on the surface of the silicon wafer are wiped off, which is convenient for the polishing machine body 2 to polish the silicon wafer. After a long period of work, the surface of the dust-free cloth 55 will absorb some dust. When the dust-free cloth 55 needs to be replaced, The servo motor 53 is started to drive the rotating shaft 52 to rotate, thereby rolling up the contaminated dust-free cloth 55 and storing it on the rotating shaft 52 for centralized processing. At the same time, the dust-free cloth 55 sleeved on the outer surface of the fixed column 51 begins to unfold, so that a new dust-free cloth 55 replaces the contaminated dust-free cloth 55 to clean the surface of the silicon wafer again. The cleaned silicon wafer is transported to the polishing machine body 2 through the belt conveyor 3, which is convenient for polishing the silicon wafer. There is no need for the staff to manually clean the silicon wafer to be processed, which creates a clean and comfortable working environment, reduces the workload of the staff, and effectively improves the processing efficiency and qualified rate of the silicon wafer.

[0021] like Figure 4 As shown, in some embodiments, the vibration assembly 6 includes a fixing plate 61 fixedly mounted between the two mounting plates 4, a vibration motor 62 is fixedly mounted inside the fixing plate 61, and a pressure plate 63 is fixedly mounted at the output end of the vibration motor 62.

[0022] When it is necessary to drive the dust-free cloth 55 to vibrate and clean the surface of the silicon wafer, specifically, the vibration motor 62 is started to drive the pressure plate 63 to vibrate continuously, thereby driving the dust-free cloth 55 in contact with the bottom of the pressure plate 63 to vibrate, thereby cleaning the surface of the silicon wafer.

[0023] like Figure 2 As shown, in some embodiments, a plurality of nozzles 7 are fixedly installed on the top of the inner wall of the polishing machine body 2, a soft plate 8 is fixedly installed between the two sides of the inner wall of the polishing machine body 2, and a baffle 9 is fixedly installed between the two sides of the inner wall of the polishing machine body 2.

[0024] Before polishing the silicon wafer, polishing liquid is sprayed onto the surface of the silicon wafer through the nozzle 7, and then the soft board 8 is used to evenly coat the surface of the silicon wafer with the polishing liquid. The polishing liquid is used to remove oil stains on the surface of the silicon wafer and enhance the performance of the silicon wafer. The baffle 9 is used to prevent the nozzle 7 from spraying the polishing liquid onto the dust-free cloth 55.

[0025] like Figure 1 As shown, in some embodiments, a dust removal device 10 is installed on the box body 1, which is used to absorb the dust cleaned by the dust-free cloth 55.

[0026] like Figure 1-2 As shown, in some embodiments, the dust removal equipment 10 includes two suction pumps 101 symmetrically distributed and fixedly installed on one side of the box body 1, and the air inlet and outlet ends of the two suction pumps 101 are fixedly installed with pipes 102. A dust collecting box 103 is fixedly installed inside the box body 1, and the pipe 102 passes through the box body 1 and is fixedly connected to one side of the dust collecting box 103.

[0027] When the dust-free cloth 55 cleans the surface of the silicon wafer, it is inevitable that some dust cannot be adsorbed on the dust-free cloth 55. When the residual dust needs to be removed, the suction pump 101 is started to generate suction, so that the dust cleaned by the dust-free cloth 55 is sucked into the dust collecting box 103 through the pipe 102, which is convenient for centralized treatment and avoids a large amount of dust floating in the air and affecting the working environment.

[0028] like Figure 4 As shown, in some embodiments, the bottom of the pressing plate 63 is configured with a curved surface.

[0029] The arc surface of the structure prevents the pressing plate 63 from scratching the dust-free cloth 55 when vibrating, thereby affecting the cleaning efficiency.

[0030] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A multi-station polishing machine, characterized in that: include: Box body (1); A polishing machine body (2), wherein the polishing machine body (2) is fixedly mounted on the top of the box body (1); A belt conveyor (3), the belt conveyor (3) being installed between two sides of the inner wall of the box body (1), and a placement groove (31) being configured on the conveyor belt of the belt conveyor (3); There are two mounting plates (4), and the two mounting plates (4) are symmetrically distributed and fixedly mounted on the top of the box body (1); A cleaning device (5), the cleaning device (5) is installed between the two mounting plates (4), and is used for cleaning silicon wafers. The cleaning device (5) comprises a fixed column (51) fixedly installed between the two mounting plates (4); a rotating shaft (52) is rotatably installed between the two mounting plates (4); a servo motor (53) is fixedly installed on one side of one of the mounting plates (4); one end of the rotating shaft (52) passes through one of the mounting plates (4) and is fixedly connected to the output end of the servo motor (53); two rotating wheels (54) are symmetrically distributed and rotatably installed between the two mounting plates (4); a dust-free cloth (55) is sleeved on the outer surface of the fixed column (51); the dust-free cloth (55) contacts the outer surfaces of the two rotating wheels (54) and is fixedly connected to the outer surface of the rotating shaft (52); a vibration component (6) for driving the dust-free cloth (55) to vibrate is installed between the two mounting plates (4); the vibration component (6) is located between the two rotating wheels (54).

2. A multi-station polishing machine according to claim 1, characterized in that: The vibration assembly (6) comprises a fixing plate (61) fixedly mounted between the two mounting plates (4), a vibration motor (62) fixedly mounted inside the fixing plate (61), and a pressure plate (63) fixedly mounted at the output end of the vibration motor (62).

3. A multi-station polishing machine according to claim 1, characterized in that: A plurality of nozzles (7) are fixedly mounted on the top of the inner wall of the polishing machine body (2), a soft plate (8) is fixedly mounted between the two sides of the inner wall of the polishing machine body (2), and a baffle (9) is fixedly mounted between the two sides of the inner wall of the polishing machine body (2).

4. A multi-station polishing machine according to claim 1, characterized in that: The box body (1) is provided with a dust removal device (10) for absorbing the dust cleaned by the dust-free cloth (55).

5. A multi-station polishing machine according to claim 4, characterized in that: The dust removal device (10) comprises two suction pumps (101) symmetrically distributed and fixedly mounted on one side of the housing (1); pipes (102) are fixedly mounted on the air inlet and air outlet ends of the two suction pumps (101); a dust collecting box (103) is fixedly mounted inside the housing (1); and the pipe (102) passes through the housing (1) and is fixedly connected to one side of the dust collecting box (103).

6. A multi-station polishing machine according to claim 2, characterized in that: The bottom of the pressing plate (63) is configured with a curved surface.

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