Wafer grinding device

Abstract

The utility model relates to the technical field of grinding devices, in particular to a wafer grinding device which comprises a workbench, a containing groove is formed in the upper surface of the workbench, a supporting frame is fixedly connected to the right side wall in the containing groove, and a vacuum suction cup is installed at the top of the supporting frame. When the wafer grinding device works, a wafer workpiece is placed on the vacuum chuck, the wafer workpiece is adsorbed and fixed by means of the vacuum chuck, one end of the piston rod of the electric cylinder extends to drive the grinding plate to be attached to the wafer workpiece, and the grinding motor drives the grinding plate to rotate to grind the wafer workpiece. The conveying pump pumps the grinding liquid and sprays the grinding liquid to the grinding position of the wafer workpiece through the spray head, ground particles are mixed in the grinding liquid and fall into the containing groove together, particulate matter is filtered down by the filter plate, the grinding liquid falls to the bottom of the containing groove through the filter plate, and separation of liquid and the particulate matter in the grinding liquid is achieved. And the grinding liquid is pumped and sent back to the grinding liquid box by the reflux pump for recycling, so that the grinding liquid is recycled, and resource waste is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding devices, in particular to a wafer grinding device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. When processing wafers, after cutting the crystal rod, the cut wafer needs to be ground to make its surface flat;

[0003] China Public Authorized Invention: CN216228745U discloses a wafer grinding device, including: a machine platform; a grinding turntable, which is arranged on the machine platform. A patch is arranged on the grinding turntable, and the patch includes: an adhesive layer, which is arranged on the upper surface of the grinding turntable; a carrier layer, which is arranged on the adhesive layer; and a covering layer, which is arranged on the carrier layer, wherein the carrier layer connects the adhesive layer and the covering layer. A grinding pad is arranged on the patch, and the lower surface of the grinding pad contacts the upper surface of the covering layer. And a grinding head is located above the grinding pad;

[0004] When the grinding device grinds the wafer, the particles ground off the wafer surface will be mixed in the grinding liquid, which makes it inconvenient to recycle the grinding liquid and easily causes waste of resources. Therefore, a wafer grinding device is proposed. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer grinding device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer grinding device, comprising a workbench, a receiving groove is provided on the upper surface of the workbench, a support frame is fixedly connected to the inner right wall of the receiving groove, a vacuum suction cup is installed on the top of the support frame, a wafer workpiece is adsorbed on the upper surface of the vacuum suction cup, a fixing frame is fixedly connected to the rear side of the upper surface of the workbench, an electric cylinder is installed on the inner side wall and top wall of the fixing frame, one end of the piston rod of the electric cylinder is fixedly connected to a lifting plate, a grinding motor is installed on the lower surface of the lifting plate, one end of the output shaft of the grinding motor is fixedly connected to the grinding plate, and the inner side wall of the receiving groove is fixedly connected to the inner side wall of the fixing frame. A filter plate is fixedly connected thereto, and the filter plate is inclined with the left side higher and the right side lower. A support plate is fixedly connected to the upper portion of the left side wall of the workbench, and a grinding liquid box and a delivery pump are respectively installed on the upper surface of the support plate. A support rod is fixedly connected to the left side of the upper surface of the workbench, and a nozzle is fixedly connected to the top of the support rod. A fixed plate is fixedly connected to the lower portion of the left side wall of the workbench, and a reflux pump is installed on the upper surface of the fixed plate. A liquid extraction pipe is connected between one end of the liquid inlet of the reflux pump and the lower portion of the left side wall of the workbench, and the liquid extraction pipe is communicated with the containing tank, and a reflux pipe is connected between one end of the liquid outlet of the reflux pump and the top of the front surface of the grinding liquid box.

[0007] As a further preferred embodiment of the present technical solution: one end of the liquid inlet of the delivery pump is connected to the bottom of the right side wall of the grinding liquid box through a pipe, one end of the liquid outlet of the delivery pump is connected to the left end of the nozzle through a pipe, a blind groove is opened on the right side wall of the workbench, the blind groove is connected to the receiving groove, and a collection box is placed on the inner wall of the blind groove.

[0008] As a further preferred embodiment of the present technical solution: finger grooves are provided on both sides of the outer side wall of the collection box.

[0009] As a further preferred embodiment of the technical solution: the right side wall of the workbench is provided with a baffle, the fixed parts of two locks are symmetrically installed on the right side of the outer side wall of the workbench, the movable parts of two locks are symmetrically installed on the outer side wall of the baffle, the workbench and the baffle are connected by the locks, and the right side wall of the baffle is fixedly connected with a handle.

[0010] As a further preferred embodiment of the present technical solution: the upper surface of the grinding liquid box is connected to a liquid adding pipe.

[0011] As a further preferred embodiment of the present technical solution: a sealing cap is threadedly connected to the top of the outer side wall of the liquid adding tube.

[0012] As a further preferred embodiment of the present technical solution: a control panel is installed on the front surface of the workbench, and the electrical output end of the control panel is electrically connected to the electrical input ends of the vacuum suction cup, the electric cylinder, the grinding motor, the conveying pump and the reflux pump through wires.

[0013] As a further preferred embodiment of the present technical solution: four legs are symmetrically welded on the lower surface of the workbench.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] When the utility model is working, the wafer workpiece is placed on the vacuum suction cup, the wafer workpiece is adsorbed and fixed by means of the vacuum suction cup, one end of the piston rod of the electric cylinder is extended to drive the grinding plate to fit the wafer workpiece, the grinding motor drives the grinding plate to rotate to grind the wafer workpiece, the delivery pump extracts the grinding liquid and sprays it to the grinding part of the wafer workpiece with the help of the nozzle, the ground particles will be mixed in the grinding liquid and fall into the receiving tank together, the particles are filtered by the filter plate, the grinding liquid falls on the bottom of the receiving tank through the filter plate, the liquid and the particles in the grinding liquid are separated, the reflux pump extracts the grinding liquid and sends it back to the grinding liquid box for reuse, so as to realize the recovery of the grinding liquid and avoid waste of resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the grinding motor and the grinding plate in the utility model;

[0018] Figure 3 It is a cross-sectional structural schematic diagram of a workbench at a certain viewing angle in the utility model;

[0019] Figure 4 This is a schematic cross-sectional structural diagram of a workbench from another viewing angle in the present invention.

[0020] In the figure: 1. workbench; 2. receiving groove; 3. support frame; 4. vacuum suction cup; 5. wafer workpiece; 6. fixed frame; 7. electric cylinder; 8. lifting plate; 9. grinding motor; 10. grinding plate; 11. filter plate; 12. support plate; 13. grinding liquid box; 14. delivery pump; 15. support rod; 16. nozzle; 17. fixed plate; 18. reflux pump; 19. suction pipe; 20. reflux pipe; 21. blind groove; 22. collection box; 23. finger groove; 24. baffle; 25. lock; 26. handle; 27. filling pipe; 28. sealing cap; 29. ​​control panel; 30. support leg. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and cannot be understood as limitations on the present application. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0022] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", and "set" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] See also Figure 1-4The utility model provides a technical solution: a wafer grinding device, including a workbench 1, a receiving groove 2 is opened on the upper surface of the workbench 1, a support frame 3 is fixedly connected to the inner right side wall of the receiving groove 2, a vacuum suction cup 4 is installed on the top of the support frame 3, and a wafer workpiece 5 is adsorbed on the upper surface of the vacuum suction cup 4, a fixing frame 6 is fixedly connected to the rear side of the upper surface of the workbench 1, an electric cylinder 7 is installed on the inner side wall top wall of the fixing frame 6, one end of the piston rod of the electric cylinder 7 is fixedly connected to a lifting plate 8, a grinding motor 9 is installed on the lower surface of the lifting plate 8, and a grinding plate 10 is fixedly connected to one end of the output shaft of the grinding motor 9, a filter plate 11 is fixedly connected to the inner side wall of the receiving groove 2, and the filter plate 11 is inclined with a left side higher than a right side, a support plate 12 is fixedly connected to the upper part of the left side wall of the workbench 1, and a grinding liquid box 13 and a delivery pump 14 are respectively installed on the upper surface of the support plate 12, a support rod 15 is fixedly connected to the left side of the upper surface of the workbench 1, and a nozzle 16 is fixedly connected to the top of the support rod 15. A fixing plate 17 is fixedly connected to the lower part of the wall, and a reflux pump 18 is installed on the upper surface of the fixing plate 17. A liquid extraction pipe 19 is connected between one end of the liquid inlet of the reflux pump 18 and the lower part of the left wall of the workbench 1. The liquid extraction pipe 19 is connected to the containing tank 2, and a reflux pipe 20 is connected between one end of the liquid outlet of the reflux pump 18 and the top of the front surface of the grinding liquid box 13; the wafer workpiece 5 is placed on the vacuum suction cup 4, and the wafer workpiece 5 is adsorbed and fixed by the vacuum suction cup 4, and one end of the piston rod of the electric cylinder 7 is extended to drive the grinding The grinding plate 10 is attached to the wafer workpiece 5, and the grinding motor 9 drives the grinding plate 10 to rotate to grind the wafer workpiece 5. The delivery pump 14 extracts the grinding liquid and sprays it to the grinding position of the wafer workpiece 5 with the help of the nozzle 16. The ground particles will be mixed in the grinding liquid and fall into the receiving tank 2. The particles are filtered by the filter plate 11, and the grinding liquid falls on the bottom of the receiving tank 2 through the filter plate 11, thereby realizing the separation of the liquid and the particles in the grinding liquid. The reflux pump 18 extracts the grinding liquid and sends it back to the grinding liquid tank 13 for reuse.

[0024] In this embodiment, specifically: one end of the liquid inlet of the delivery pump 14 is connected to the bottom of the right side wall of the grinding liquid box 13 through a pipe, one end of the liquid outlet of the delivery pump 14 is connected to the left end of the nozzle 16 through a pipe, and a blind groove 21 is opened on the right side wall of the workbench 1, and the blind groove 21 is connected to the receiving groove 2, and a collecting box 22 is placed on the inner wall of the blind groove 21; after the particulate matter is filtered out, it rolls down into the collecting box 22 along the surface of the filter plate 11 under the action of gravity, so as to realize the recovery of the ground particulate matter.

[0025] In this embodiment, specifically: finger grooves 23 are provided on both sides of the outer wall of the collection box 22 to facilitate the movement of the collection box 22 .

[0026] In this embodiment, specifically: a baffle 24 is provided on the right side wall of the workbench 1, two fixed parts of locks 25 are symmetrically installed on the right side of the outer side wall of the workbench 1, and two movable parts of locks 25 are symmetrically installed on the outer side wall of the baffle 24. The workbench 1 and the baffle 24 are connected by the lock 25, and a handle 26 is fixedly connected to the right side wall of the baffle 24; the lock 25 can lock the baffle 24.

[0027] In this embodiment, specifically: the upper surface of the grinding liquid box 13 is connected with a liquid adding pipe 27 to facilitate the replenishment of the grinding liquid.

[0028] In this embodiment, specifically: a sealing cap 28 is threadedly connected to the top of the outer wall of the liquid adding tube 27 ; the sealing performance of the liquid adding tube 27 can be improved by providing the sealing cap 28 .

[0029] In this embodiment, specifically: a control panel 29 is installed on the front surface of the workbench 1, and the electrical output end of the control panel 29 is electrically connected to the electrical input ends of the vacuum suction cup 4, the electric cylinder 7, the grinding motor 9, the delivery pump 14 and the reflux pump 18 through wires; it is convenient to control the working status of the vacuum suction cup 4, the electric cylinder 7, the grinding motor 9, the delivery pump 14 and the reflux pump 18.

[0030] In this embodiment, specifically: four legs 30 are symmetrically welded on the lower surface of the workbench 1 ; the legs 30 are arranged to provide support for the workbench 1 .

[0031] The working principle of the utility model is as follows: a wafer workpiece 5 is placed on a vacuum suction cup 4, the wafer workpiece 5 is adsorbed and fixed by means of the vacuum suction cup 4, one end of the piston rod of the electric cylinder 7 is extended to drive the grinding plate 10 to fit the wafer workpiece 5, the grinding motor 9 drives the grinding plate 10 to rotate to grind the wafer workpiece 5, the delivery pump 14 extracts the grinding liquid and sprays it to the grinding part of the wafer workpiece 5 with the help of the nozzle 16, the ground particles will be mixed in the grinding liquid and fall into the receiving tank 2 together, the particles are filtered by the filter plate 11, and the grinding liquid falls to the bottom of the receiving tank 2 through the filter plate 11, so as to realize the separation of the liquid and the particles in the grinding liquid, the reflux pump 18 extracts the grinding liquid and sends it back to the grinding liquid box 13 for reuse, so as to realize the recovery of the grinding liquid and avoid waste of resources, after the particles are filtered, they roll down to the collection box 22 along the surface of the filter plate 11 under the action of gravity, so as to realize the recovery of the ground particles.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer grinding device, characterized in that: The invention comprises a workbench (1), wherein a receiving groove (2) is provided on the upper surface of the workbench (1), a support frame (3) is fixedly connected to the inner right side wall of the receiving groove (2), a vacuum suction cup (4) is installed on the top of the support frame (3), a wafer workpiece (5) is adsorbed on the upper surface of the vacuum suction cup (4), a fixing frame (6) is fixedly connected to the rear side of the upper surface of the workbench (1), an electric cylinder (7) is installed on the inner side wall and top wall of the fixing frame (6), one end of the piston rod of the electric cylinder (7) is fixedly connected to a lifting plate (8), a grinding motor (9) is installed on the lower surface of the lifting plate (8), one end of the output shaft of the grinding motor (9) is fixedly connected to a grinding plate (10), and a filter plate (11) is fixedly connected to the inner side wall of the receiving groove (2), and the filter plate (11) is arranged to be higher on the left and lower on the right. A support plate (12) is fixedly connected to the upper portion of the left side wall of the workbench (1), and a grinding liquid box (13) and a delivery pump (14) are respectively installed on the upper surface of the support plate (12). A support rod (15) is fixedly connected to the left side of the upper surface of the workbench (1), and a nozzle (16) is fixedly connected to the top of the support rod (15). A fixed plate (17) is fixedly connected to the lower portion of the left side wall of the workbench (1), and a reflux pump (18) is installed on the upper surface of the fixed plate (17). A liquid extraction pipe (19) is connected between one end of the liquid inlet of the reflux pump (18) and the lower portion of the left side wall of the workbench (1), and the liquid extraction pipe (19) is connected to the containing tank (2). A reflux pipe (20) is connected between one end of the liquid outlet of the reflux pump (18) and the top of the front surface of the grinding liquid box (13).

2. The wafer grinding device according to claim 1, characterized in that: One end of the liquid inlet of the delivery pump (14) is connected to the bottom of the right side wall of the grinding liquid box (13) through a pipeline, and one end of the liquid outlet of the delivery pump (14) is connected to the left end of the nozzle (16) through a pipeline. A blind groove (21) is provided on the right side wall of the workbench (1), and the blind groove (21) is connected to the containing groove (2). A collecting box (22) is placed on the inner side wall of the blind groove (21).

3. The wafer grinding device according to claim 2, characterized in that: Finger grooves (23) are provided on both sides of the outer side wall of the collection box (22).

4. The wafer grinding device according to claim 3, characterized in that: The right side wall of the workbench (1) is provided with a baffle (24); the fixed parts of two lock buckles (25) are symmetrically mounted on the right side of the outer side wall of the workbench (1); the movable parts of two lock buckles (25) are symmetrically mounted on the outer side wall of the baffle (24); the workbench (1) and the baffle (24) are connected via the lock buckles (25); and the right side wall of the baffle (24) is fixedly connected with a handle (26).

5. The wafer grinding device according to claim 4, characterized in that: The upper surface of the grinding liquid box (13) is connected to a liquid adding pipe (27).

6. The wafer grinding device according to claim 5, characterized in that: A sealing cap (28) is threadedly connected to the top of the outer wall of the liquid adding pipe (27).

7. The wafer grinding device according to claim 6, characterized in that: A control panel (29) is installed on the front surface of the workbench (1), and the electrical output end of the control panel (29) is electrically connected to the electrical input ends of the vacuum suction cup (4), the electric cylinder (7), the grinding motor (9), the delivery pump (14), and the reflux pump (18) through wires.

8. The wafer grinding device according to claim 7, characterized in that: Four supporting legs (30) are symmetrically welded to the lower surface of the workbench (1).

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