Magnetron sputtering target seat and magnetron sputtering equipment

Abstract

The utility model discloses a magnetron sputtering target seat and magnetron sputtering equipment, and relates to the technical field of target seats. The magnetron sputtering target seat is used for solving the problem that in the prior art, a magnetron sputtering target seat is integrally formed, so that the manufacturing cost of the magnetron sputtering target seat is increased. The target seat comprises a target seat body, a conducting ring, a sealing ring and a power supply; an embedding groove and a mounting cavity are formed in the target seat body, the mounting cavity is used for mounting a target material, and the conducting ring is mounted in the embedding groove and used for fixing the target material; the sealing ring is mounted on the target seat body and covers at least part of the conductive ring, and the sealing ring is used for insulating the target seat body from the target material; the power source is installed on the target seat body and used for supplying power to the target seat body. According to the target seat, the target seat body, the conducting ring and the sealing ring are arranged in a split mode, the target seat body, the conducting ring and the sealing ring are manufactured separately and then assembled, and then the target seat can be manufactured, so that the complexity of the target seat can be greatly reduced, and then the cost of the target seat can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of target seats, and in particular to a magnetron sputtering target seat and a magnetron sputtering device. Background Art

[0002] The basic principle of magnetron sputtering coating equipment is to change the direction of electron movement through a magnetic field, increase the probability of electron ionization by extending the electron movement path and confining the area range, and make the electron energy utilization more efficient. This is the "high speed" and "low temperature" characteristic mechanism of magnetron sputtering technology. Magnetron sputtering coating equipment includes a magnetron sputtering target.

[0003] The magnetron sputtering target in the related technology includes a magnetic conductive plate arranged at the bottom, a neodymium iron boron or iron oxide magnet is provided on the upper end of the magnetic conductive plate, and oxygen-free copper is provided at the lower end of the magnetic conductive plate. The magnetic conductive plate and the oxygen-free copper are fixedly connected by screws. An aluminum target cover is provided at the upper end of the magnetron sputtering target, a connector is provided at the bottom end of the aluminum target cover, and the outer side of the connector is coated with polytetrafluoroethylene. A cold water adapter is fixed above the magnetron sputtering target, and the neodymium iron boron or iron oxide magnet is provided with a copper target cooling water path connected to the cold water adapter.

[0004] However, the magnetron sputtering target in the related art is formed in one piece, which increases the complexity of manufacturing the magnetron sputtering target and further increases the cost of manufacturing the magnetron sputtering target. Utility Model Content

[0005] The main purpose of the present application is to provide a magnetron sputtering target seat and a magnetron sputtering device, aiming to solve the technical problem in the prior art that the magnetron sputtering target seat is integrally formed, thereby increasing the complexity of manufacturing the magnetron sputtering target seat and further increasing the cost of manufacturing the magnetron sputtering target seat.

[0006] In order to solve the above technical problems, the present application provides a magnetron sputtering target seat, the target seat comprising:

[0007] A target base body, wherein the target base body is provided with an inlay groove and a mounting cavity, and the mounting cavity is used for mounting a target material;

[0008] A conductive ring, which is installed in the inlay groove and is used to fix the target material;

[0009] A sealing ring, which is mounted on the target base body and covers at least a portion of the conductive ring, and is used to insulate the target base body from the target material;

[0010] A power supply is installed on the target base body, and the power supply is used to supply power to the target base body.

[0011] In a possible implementation manner, a cooling channel is further provided on the target base body, and cooling water is passed through the cooling channel to cool the target base body.

[0012] In a possible implementation, the cooling channel includes a water inlet, a water outlet, and a water trough provided on the target base body, and the water trough is connected to the water inlet and the water outlet.

[0013] In a possible implementation manner, a pressure relief port is further provided on the target base body, the pressure relief port is communicated with the water trough, and the pressure relief port is used to relieve pressure on the target base body.

[0014] In a possible implementation manner, a water inlet installation groove, a water outlet installation groove and a pressure relief installation groove are formed on a side of the target base body opposite to the water channel, the water inlet installation groove is communicated with the water inlet, the water outlet installation groove is communicated with the water outlet, and the pressure relief installation groove is communicated with the pressure relief port;

[0015] A water inlet flange seat is installed in the water inlet installation groove, a water outlet flange seat is installed in the water outlet installation groove, and a pressure relief flange seat is installed in the pressure relief installation groove.

[0016] In a possible implementation manner, a first sealing ring is installed between the water inlet flange seat, the water outlet flange seat, the pressure relief flange seat and the target seat body.

[0017] In a possible implementation manner, a sealing groove communicating with the installation cavity is further formed on the target base body, and a second sealing ring is installed in the sealing groove.

[0018] In a possible implementation manner, an insulating groove is further provided on the target base body, a sealing plate opposite to the conductive ring is installed in the insulating groove, and the sealing plate is used to insulate the conductive ring from the outside.

[0019] In a possible implementation manner, a slot is provided on the conductive ring, and the slot is used to fix the target material.

[0020] In a possible implementation, the present application further provides a magnetron sputtering device, wherein the device includes the magnetron sputtering target described in the present application.

[0021] Compared with the prior art, this application has the following beneficial effects:

[0022] A magnetron sputtering target and a magnetron sputtering device proposed in the embodiments of the present application have a target body, a conductive ring and a sealing ring arranged separately. The target body, the conductive ring and the sealing ring are prepared separately and then assembled to manufacture the target body, thereby greatly reducing the complexity of the target body and further reducing the cost of the target body. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 An exploded schematic diagram of a magnetron sputtering target provided in an embodiment of the present application;

[0025] Figure 2 A schematic diagram of the three-dimensional structure of a magnetron sputtering target provided in an embodiment of the present application;

[0026] Figure 3 A schematic diagram of the three-dimensional structure of the target base body provided in an embodiment of the present application;

[0027] Figure 4 A schematic diagram of a top view of a magnetron sputtering target provided in an embodiment of the present application;

[0028] Figure 5 Provided in the embodiments of this application Figure 4 Schematic cross-sectional view at AA in the middle;

[0029] Figure 6 A schematic diagram of a three-dimensional structure in which the water inlet flange seat, the water outlet flange seat and the pressure relief flange seat provided in an embodiment of the present application are not installed on the target seat body;

[0030] Figure 7 A schematic diagram of a three-dimensional structure in which a water inlet flange seat, a water outlet flange seat and a pressure relief flange seat provided in an embodiment of the present application are installed on a target seat body;

[0031] Figure 8 A schematic diagram of the three-dimensional structure of the water inlet flange seat provided in an embodiment of the present application;

[0032] Fig. 9 A schematic diagram of the three-dimensional structure of a conductive ring provided in an embodiment of the present application.

[0033] Description of the drawings: 1. Target seat body; 11. Inlay groove; 12. Mounting cavity; 13. Sealing groove; 14. Pressure relief port; 15. Water outlet; 16. Water trough; 17. Water inlet; 18. Insulation groove; 19. Water inlet mounting groove; 120. Water outlet mounting groove; 121. Pressure relief mounting groove; 2. Conductive ring; 21. Card groove; 3. Sealing ring; 4. Power supply; 5. Second sealing ring; 6. Water inlet flange seat; 7. Water outlet flange seat; 8. Pressure relief flange seat; 9. Closing plate; 10. First sealing ring. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0036] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0037] In the description of the present application, it should be noted that the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0038] See also Figure 1-Figure 3 The present application provides a magnetron sputtering target seat, which includes a target seat body 1, a conductive ring 2, a sealing ring 3 and a power supply 4.

[0039] The target base body 1 is provided with an inlay groove 11 and an installation cavity 12, the installation cavity 12 is used to install the target material, the conductive ring 2 is installed in the inlay groove 11, and the conductive ring 2 is used to fix the target material; the sealing ring 3 is installed on the target base body 1 and covers at least part of the conductive ring 2, and the sealing ring 3 is used to insulate the target base body 1 from the target material; the power supply 4 is installed on the target base body 1, and the power supply 4 is used to supply power to the target base body 1.

[0040] The material of the target base body 1 can be polyetheretherketone, the material of the conductive ring 2 can be copper, the power supply 4 is a conventional product, and the circuit connection between the power supply 4 and the target base body 1 is also known to those skilled in the art. The conductive ring 2 is installed in the inlay groove 11 of the target base body 1, so that it is easier to install the conductive ring 2 in the target base body 1, and the sputtered target material can be installed in the installation cavity 12 of the target base body 1, and the target material is fixed by the conductive ring 2.

[0041] The power supply 4 may include a power supply box, which may be fixed to the target base body 1 by conventional means, such as screws. In this way, the target base body 1, the conductive ring 2, the sealing ring 3 and the power supply 4 are separately arranged, and the whole is assembled. The tolerance accuracy requirements between the components are controlled at IT7 level, and the shape and position tolerances are controlled within the range of 0.03. Compared with the prior art method of integrally molding the magnetron sputtering target base by injection molding, the magnetron sputtering target base with a separate arrangement in this embodiment is simpler to manufacture.

[0042] Based on the above design, in this embodiment, the target seat body 1, the conductive ring 2 and the sealing ring 3 are separately arranged. The target seat body 1, the conductive ring 2 and the sealing ring 3 are prepared separately and then assembled to manufacture the target seat, which can greatly reduce the complexity of the target seat and further reduce the cost of the target seat.

[0043] In some embodiments, a cooling groove is further provided on the target base body 1, and cooling water is introduced into the cooling groove to cool the target base body 1. When the magnetron sputtering equipment is working, cooling water is connected to the cooling groove, and the cooling water can cool the magnetron sputtering target base and the target material, so that the target material and the magnetron sputtering target base form a circulating water channel, and a magnet rotating mechanism is set up in the water channel, so that the magnetron sputtering target base and the target material form an integral DC cathode, thereby generating stable DC magnetron sputtering.

[0044] In some embodiments, see Figure 4-Figure 5 The cooling channel includes a water inlet 17 , a water outlet 15 and a water trough 16 which are arranged on the target base body 1 . The water trough 16 is connected to the water inlet 17 and the water outlet 15 .

[0045] The cooling water enters the water trough 16 from the water inlet 17. When the cooling water flows through the water trough 16, the heat on the target base body 1 can be taken away, and the cooling water that takes away the heat flows out from the water outlet 15. In this way, by making the cooling water flow through the water inlet 17, the water trough 16 and the water outlet 15 in sequence, the magnetron sputtering target base can be cooled, so that the magnetron sputtering target base can work normally.

[0046] Preferably, the water grooves 16 are multiple circles, and the multiple circles of water grooves 16 are coaxially arranged. In this way, by arranging as many water grooves 16 as possible on the target base body 1, more heat on the target base body 1 can be taken away, thereby improving the cooling effect of the magnetron sputtering target base.

[0047] In some embodiments, please refer again to Figure 4-Figure 5 The target base body 1 is also provided with a pressure relief port 14 , which is connected to the water trough 16 , and is used to relieve pressure on the target base body 1 .

[0048] When the pressure of the magnetron sputtering target is too high, part of the pressure in the magnetron sputtering target can be released through the pressure relief port 14, thereby further ensuring that the magnetron sputtering target can work normally.

[0049] In some embodiments, see Figure 6-Figure 7 A water inlet mounting groove 19, a water outlet mounting groove 120 and a pressure relief mounting groove 121 are provided on one side of the target base body 1 opposite to the water trough 16. The water inlet mounting groove 19 is connected to the water inlet 17, the water outlet mounting groove 120 is connected to the water outlet 15, and the pressure relief mounting groove 121 is connected to the pressure relief port 14; a water inlet flange seat 6 is installed in the water inlet mounting groove 19, a water outlet flange seat 7 is installed in the water outlet mounting groove 120, and a pressure relief flange seat 8 is installed in the pressure relief mounting groove 121.

[0050] The water inlet flange seat 6, the water outlet flange seat 7 and the pressure relief flange seat 8 can all be installed on the target seat body 1 by screws. By opening the water inlet installation groove 19, the water outlet installation groove 120 and the pressure relief installation groove 121 on the target seat body 1, it is more convenient to install the water inlet flange seat 6, the water outlet flange seat 7 and the pressure relief flange seat 8 on the target seat body 1. The water inlet flange seat 6 can be connected to the water inlet pipe, the water outlet flange seat 7 can be connected to the water outlet pipe, and the pressure relief flange seat 8 can be connected to the pressure relief pipe. In this way, it is easier for cooling water to enter the water inlet 17 through the water inlet flange seat 6, it is easier for cooling water to flow out of the water outlet 15 through the water outlet flange seat 7, and the pressure in the magnetron sputtering target seat can be relieved through the pressure relief flange seat 8.

[0051] In some embodiments, see Figure 8 A first sealing ring 10 is installed between the water inlet flange seat 6, the water outlet flange seat 7, the pressure relief flange seat 8 and the target seat body 1.

[0052] The first sealing ring 10 can prevent the cooling water from leaking between the water inlet flange seat 6 and the target base body 1, and from leaking between the water outlet flange seat 7 and the target base body 1, thereby improving the sealing between the water inlet flange seat 6 and the target base body 1, and between the water outlet flange seat 7 and the target base body 1. The first sealing ring 10 can improve the sealing between the pressure relief flange seat 8 and the target base body 1, thereby making it easier to maintain a certain pressure in the magnetron sputtering target base, and preventing the cooling water from leaking between the pressure relief flange seat 8 and the target base body 1.

[0053] In some embodiments, please refer again to Figure 4-Figure 5 The target base body 1 is also provided with a sealing groove 13 which is connected with the mounting cavity 12 , and a second sealing ring 5 is installed in the sealing groove 13 .

[0054] The second sealing ring 5 can be clamped in the sealing groove 13, and the second sealing ring 5 can prevent water from flowing out of the target material, thereby preventing the target base body 1 from being conductive, and further preventing the target base body 1 from being punctured. Therefore, the second sealing ring 5 seals the target material and can also increase the service life of the target base body 1.

[0055] In some embodiments, please refer again to Figure 6-Figure 7 The target base body 1 is also provided with an insulating groove 18, in which a sealing plate 9 is installed opposite to the conductive ring 2, and the sealing plate 9 is used to insulate the conductive ring 2 from the outside. The sealing plate 9 can be fixed in the insulating groove 18 by screws, and the sealing plate 9 can insulate the conductive ring 2 from the outside.

[0056] In some embodiments, see Fig. 9 The conductive ring 2 is provided with a slot 21 for fixing the target. The target is fixed in the slot 21 of the conductive ring 2, so that the conductive ring 2 can fix the target in the installation cavity 12 more easily.

[0057] In summary, in the present application, the target seat body 1, the conductive ring 2 and the sealing ring 3 are separately arranged. The target seat body 1, the conductive ring 2 and the sealing ring 3 are prepared separately and then assembled to manufacture the target seat, thereby greatly reducing the complexity of the target seat and further reducing the cost of the target seat.

[0058] At the same time, the performance of the magnetron sputtering target is stable and reliable, meeting the requirements for target material sealing. It can ensure that there will be no breakdown or deformation under high pressure and drastic temperature changes. It can effectively provide support for added motors, magnets and other loads, and achieve stable operation of high-power DC magnetron sputtering.

[0059] Based on the same inventive concept, in some embodiments, the present application further provides a magnetron sputtering device, which includes the magnetron sputtering target in the present application. The magnetron sputtering device has all the beneficial effects of the above-mentioned magnetron sputtering target, which will not be described in detail here.

[0060] The above are only various implementations of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A magnetron sputtering target, characterized in that: The target base comprises: A target base body (1), wherein the target base body (1) is provided with an inlay groove (11) and a mounting cavity (12), and the mounting cavity (12) is used for mounting a target material; A conductive ring (2), the conductive ring (2) being installed in the embedding groove (11), and the conductive ring (2) being used to fix the target material; A sealing ring (3), the sealing ring (3) being mounted on the target base body (1) and covering at least a portion of the conductive ring (2), the sealing ring (3) being used to insulate the target base body (1) from the target material; A power source (4), the power source (4) being mounted on the target base body (1), and the power source (4) being used to supply power to the target base body (1).

2. The magnetron sputtering target according to claim 1, characterized in that: The target base body (1) is also provided with a cooling channel, and cooling water is passed into the cooling channel to cool the target base body (1).

3. The magnetron sputtering target according to claim 2, characterized in that: The cooling channel comprises a water inlet (17), a water outlet (15) and a water trough (16) which are arranged on the target seat body (1); the water trough (16) is connected to the water inlet (17) and the water outlet (15).

4. The magnetron sputtering target according to claim 3, characterized in that: The target base body (1) is also provided with a pressure relief port (14), the pressure relief port (14) being in communication with the water channel (16), and the pressure relief port (14) being used to relieve pressure on the target base body (1).

5. The magnetron sputtering target according to claim 4, characterized in that: A water inlet installation groove (19), a water outlet installation groove (120) and a pressure relief installation groove (121) are formed on a side of the target base body (1) opposite to the water channel (16); the water inlet installation groove (19) is connected to the water inlet (17); the water outlet installation groove (120) is connected to the water outlet (15); and the pressure relief installation groove (121) is connected to the pressure relief port (14); A water inlet flange seat (6) is installed in the water inlet installation groove (19), a water outlet flange seat (7) is installed in the water outlet installation groove (120), and a pressure relief flange seat (8) is installed in the pressure relief installation groove (121).

6. The magnetron sputtering target according to claim 5, characterized in that: A first sealing ring (10) is installed between the water inlet flange seat (6), the water outlet flange seat (7), the pressure relief flange seat (8) and the target seat body (1).

7. The magnetron sputtering target according to claim 1, characterized in that: The target base body (1) is also provided with a sealing groove (13) which is in communication with the installation cavity (12), and a second sealing ring (5) is installed in the sealing groove (13).

8. The magnetron sputtering target according to claim 1, characterized in that: The target base body (1) is also provided with an insulating groove (18), in which a sealing plate (9) opposite to the conductive ring (2) is installed, and the sealing plate (9) is used to insulate the conductive ring (2) from the outside.

9. The magnetron sputtering target according to any one of claims 1 to 8, characterized in that: The conductive ring (2) is provided with a clamping groove (21), and the clamping groove (21) is used to fix the target material.

10. A magnetron sputtering device, characterized in that: The device comprises the magnetron sputtering target according to any one of claims 1 to 9.

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