Coating equipment

Abstract

The utility model relates to film coating equipment which comprises two film coating sets arranged on a belt conveying path of the same base material, each film coating set comprises a plurality of cooling rollers and a plurality of film coating mechanisms, and each film coating mechanism is opposite to one cooling roller and arranged at an interval so that the base material can penetrate through the film coating mechanisms. In one coating set, the cooling roller is used for making contact with the first face of the base material, and the coating mechanism is used for coating the second face of the base material. And in the other coating group, the cooling roller is used for being in contact with the second surface, and the coating mechanism is used for coating the first surface. According to the coating equipment, by arranging the two coating sets, double-face coating of the base material can be achieved, and the coating efficiency of the coating equipment can be greatly improved. Moreover, each coating group comprises a plurality of pairs of cooling rollers and coating mechanisms, so that a certain coating surface of the base material can be subjected to multi-layer coating, and the coating efficiency of the coating equipment is further improved.

Description

Technical Field

[0001] The present application relates to the field of film coating technology, and in particular to a film coating device. Background Art

[0002] The coating technology is a technology that prepares one or more layers of thin films with certain functions on a flexible substrate (windable) by methods such as thermal evaporation or sputtering in a cavity. Most of the existing coating equipment can only coat the substrate on one side during the first coating stage (such as the public document with application number 201510068222.1, patent name: A single-sided reciprocating continuous coating magnetron sputtering winding coating machine). When it is necessary to coat the substrate on both sides, the coating equipment needs to go through a second coating stage. Among them, the "first coating stage" refers to the process from the coating equipment creating the internal environment of the cavity (such as vacuuming) to the beginning of coating and the end of coating. The first coating stage only needs to create the internal environment of the cavity once.

[0003] Most of the current coating equipment can only coat one side of the substrate. When multiple layers of material need to be coated on both sides of the substrate, the cavity needs to be opened to replace the substrate and turn the substrate over. The internal environment of the cavity also needs to be created twice, resulting in low production efficiency.

[0004] To this end, in the relevant technology (such as the public document with application number 202010053715.9, patent name “A coating machine”), in response to the above-mentioned technical problems, a coating machine is proposed, which can realize the simultaneous coating of different materials on both sides of the substrate of a single-cavity coating machine without opening the vacuum chamber. However, when the coating machine coats multiple layers of film on both sides, it needs to stop to switch the position of the cooling roller through a rotating mechanism, and the production efficiency is still low. Utility Model Content

[0005] In view of the above problems, the present application provides a coating device that can solve the problem of low production efficiency of the coating device.

[0006] In the first aspect, the present application provides a coating device, including two coating groups, the two coating groups are arranged on the belt path of the same substrate, each coating group includes a plurality of cooling rollers and a plurality of coating mechanisms, and each coating mechanism is opposite to a cooling roller and is arranged at intervals for the substrate to pass through. In one of the coating groups, the cooling roller is used to contact the first surface of the substrate, and the coating mechanism is used to coat the second surface of the substrate. In the other coating group, the cooling roller is used to contact the second surface, and the coating mechanism is used to coat the first surface.

[0007] In the technical solution of the embodiment of the present application, by setting two sets of coating groups, two different coating surfaces of the same substrate can be coated respectively in one coating stage, which can greatly improve the coating efficiency of the coating equipment. Moreover, each set of coating groups includes multiple pairs of cooling rollers and coating mechanisms, which can perform multi-layer coating on a certain coating surface of the substrate, further improving the coating efficiency of the coating equipment.

[0008] In some embodiments, along the coating sequence of each coating mechanism, the coating materials loaded by two adjacent coating mechanisms are different. In this case, the coating materials loaded by two adjacent coating mechanisms in the coating sequence are different, so that the two adjacent coating mechanisms can plate film layers of different materials on the substrate, and the different physical and chemical properties between film layers of different materials can be used to improve the physical and chemical properties of the substrate after coating, thereby improving the coating quality of the substrate.

[0009] In some embodiments, in each coating group, along the tape-walking direction of the substrate, the arrangement order of each coating mechanism is arranged according to the corresponding coating order. At this time, as the substrate walks, each coating mechanism of one coating group sequentially coats the first side of the substrate, and each coating mechanism of another coating group sequentially coats the second side of the substrate. When each part of the substrate has completed the corresponding path, the first side and the second side of the substrate are all coated. In other words, the substrate only needs to be walked once to complete double-sided coating, and the coating efficiency is high.

[0010] In some embodiments, each coating group includes at least two coating mechanisms, and along the order of the coating mechanisms, at least two coating mechanisms are configured to sequentially coat a ceramic primer layer and a metal layer on the substrate. At this time, each coating surface of the substrate can be sequentially coated with a ceramic primer layer and a metal layer when passing through each coating mechanism of each coating group. The ceramic primer layer is directly coated on the substrate to improve the adhesion of the film layer on the substrate. At the same time, the metal layer is coated on the primer layer to improve the coating defects of the metal layer (such as pinholes and holes). In addition, the ceramic primer layer has good thermal conductivity and fast heat dissipation speed, which can prevent the substrate from being deformed too quickly under the high temperature generated by the coating mechanism.

[0011] In some embodiments, each coating group includes at least three coating mechanisms. Along the coating order of the coating mechanisms, at least three coating mechanisms are configured to sequentially coat a ceramic primer layer, a metal layer, and a ceramic passivation layer on the substrate. At this time, when each coating surface of the substrate passes through each coating mechanism of each coating group, it can be sequentially coated with a ceramic primer layer, a metal layer, and a ceramic passivation layer. The use of the ceramic primer layer directly coated on the substrate can improve the adhesion of the film layer on the substrate. At the same time, the metal layer is coated on the primer layer, which can improve the coating defects of the metal layer (such as pinholes and holes). Moreover, the ceramic primer layer has good thermal conductivity and fast heat dissipation speed, which can prevent the substrate from deforming too quickly under the high temperature generated by the coating mechanism. In addition, coating the ceramic passivation layer outside the metal layer can avoid oxidation and corrosion of the metal layer.

[0012] In some embodiments, the coating device further includes two winding and unwinding mechanisms, and the two coating groups are located between the two winding and unwinding mechanisms on the tape path of the substrate. Each winding and unwinding mechanism is constructed to be able to switch between a winding state and an unwinding state, and when one of the winding and unwinding mechanisms is in a winding state, the other winding and unwinding mechanism is in an unwinding state. The coating of the multilayer film of the substrate is achieved by changing the working state of the winding and unwinding mechanism, and the coating interval time of two adjacent layers of film is relatively long, so that a certain deposition time can be reserved for each film layer. After each film layer is deposited, other film layers are deposited, which can reduce the influence of other film layers on the previous film layer during coating, so that each film layer is deposited more evenly and more densely, and the quality of the film can be improved.

[0013] In some embodiments, the cooling roller is configured to be connected to a negative bias. When the cooling roller is loaded with a negative bias, the cooling roller contacts the substrate, so that the substrate is negatively biased. When the substrate is negatively biased, the adhesion between the film layer and the substrate and the density of the film layer can be improved.

[0014] In some embodiments, the coating equipment further includes a static electricity removal mechanism. On the substrate's tape path, a static electricity removal mechanism is arranged downstream of each coating group to remove static electricity from the first surface after coating and the second surface after coating. Since the cooling roller is negatively biased, the substrate is negatively charged. After coating, the static electricity removal mechanism is used to remove static electricity from the substrate, which can prevent relevant personnel from touching the substrate after coating and getting an electric shock.

[0015] In some embodiments, each coating mechanism includes an evaporation source, which is arranged opposite to and spaced from the cooling roller. At this time, the coating mechanism coats the film through the evaporation source, and the film deposition speed of the evaporation source is fast, which is conducive to improving the coating efficiency. At the same time, its price is relatively low, which can reduce the use cost of the coating equipment.

[0016] In some embodiments, at least one coating mechanism further includes a sputtering source, and the coating mechanism is configured to selectively select a pair of substrate coating from an evaporation source and a sputtering source. The film layer formed by the sputtering source has the advantages of good film quality and firm bonding with the substrate. In practical applications, the evaporation source or the sputtering source can be flexibly selected to be used, so that the coating equipment can be adapted to various coating processes.

[0017] In some embodiments, the coating device further includes an ion cleaning mechanism, and an ion cleaning mechanism is arranged upstream of each coating group on the substrate's tape path. In this case, an ion cleaning mechanism is arranged upstream of each coating group, and the coating surface of the substrate can be cleaned and activated by the ion cleaning mechanism before coating, which can improve the coating quality.

[0018] In some embodiments, the coating device further includes a thickness measuring mechanism. On the substrate's tape path, two coating groups are arranged at intervals, and a thickness measuring mechanism is arranged downstream of each coating group. In this case, the thickness measuring mechanism is arranged downstream of each coating group to measure the thickness of the substrate after coating, which helps to monitor the coating process and ensure the coating quality.

[0019] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0021] Figure 1 It is a working schematic diagram of the coating equipment in some embodiments of the present application;

[0022] Figure 2 It is a working schematic diagram of the coating equipment in some other embodiments of the present application;

[0023] Figure 3 It is a working schematic diagram of the coating equipment in some other embodiments of the present application;

[0024] Figure 4 It is a working schematic diagram of the coating equipment in some other embodiments of the present application;

[0025] Figure 5 Schematic diagram of the structure of a substrate after coating in some embodiments of the present application.

[0026] The reference numerals in the specific implementation manner are as follows:

[0027] 100, coating equipment; 110, coating group; 110a, first coating group; 110b, second coating group; 111, cooling roller; 112, coating mechanism; 112a, evaporation source; 112b, sputtering source; 120, winding and unwinding mechanism; 121, first winding and unwinding mechanism; 122, second winding and unwinding mechanism; 130, bias power supply; 140, ion cleaning mechanism; 150, thickness measuring mechanism; 160, static electricity removal mechanism; 170, chamber; 180, vacuum equipment; 190, conveying mechanism; 191, conveying roller; 192, flattening roller; 200, substrate; m1, first side; m2, second side; 201, ceramic base layer; 202, metal layer; 203, ceramic passivation layer. DETAILED DESCRIPTION

[0028] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0030] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0031] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0032] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0033] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0034] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0035] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0036] Coating technology is a technology that prepares one or more layers of thin films with certain functions on a flexible substrate (rollable) in a cavity by thermal evaporation or sputtering. Coating equipment is a device derived from coating technology.

[0037] The inventor of the present application noticed that the existing coating equipment can only coat one side of the substrate in the first coating stage. The "first coating stage" refers to the process from the coating equipment creating the internal environment of the cavity (such as vacuuming) to the beginning of coating and the end of coating. The first coating stage only needs to create the internal environment of the cavity once. When the substrate needs to be coated on both sides, the coating equipment needs to go through a second coating stage. That is to say, when the substrate needs to be coated on both sides, the internal environment of the cavity needs to be created twice and the substrate needs to be turned over, resulting in low production efficiency of the coating equipment.

[0038] In order to improve the production efficiency of the coating equipment, the inventors of the present application have found that double-sided coating of the substrate can be achieved in one coating stage, and double-sided coating can be achieved without going through a secondary coating stage, which can improve production efficiency. Specifically, after in-depth research, the inventors have designed a coating equipment, in which two coating groups are arranged in the coating equipment, and the two coating groups are located on the belt path of the same substrate, one of which is used to coat one side of the substrate, and the other is used to coat the other side of the substrate, so that double-sided coating of the substrate can be achieved in one coating process. At the same time, in order to further improve the coating effect, each coating group includes at least two coating mechanisms, which can realize the coating of different film layers in one coating stage.

[0039] The coating equipment disclosed in the embodiment of the present application can be applied to the preparation of metal (such as aluminum) thin films, and is also suitable for the preparation of other thin film parts. The application scenario of the coating equipment is not specifically limited in the present application.

[0040] Figure 1 and Figure 2 Shown is a schematic diagram of the working of the coating equipment in some embodiments of the present application.

[0041] Please refer to Figure 1 and Figure 2 According to some embodiments of the present application, the coating device 100 includes two coating groups 110, which are arranged in a cavity 170 and on the belt path of the same substrate 200. Each coating group 110 includes a plurality of cooling rollers 111 and a plurality of coating mechanisms 112, and each coating mechanism 112 is opposite to a cooling roller 111 and is arranged at intervals for the substrate 200 to pass through. In one of the coating groups 110, the cooling roller 111 is used to contact the first surface m1 of the substrate 200, and the coating mechanism 112 is used to coat the second surface m2 of the substrate 200. In the other coating group 110, the cooling roller 111 is used to contact the second surface m2, and the coating mechanism 112 is used to coat the first surface m1.

[0042] The coating device 100 provided in the embodiment of the present application is used for coating on a substrate 200. The substrate 200 can be a reelable strip made of PT (polypropylene), PI (polyimide), PET (polyethylene terephthalate), or steel, etc. The specific type of the substrate 200 is not limited in the present application. The substrate 200 has two coating surfaces arranged opposite to each other, namely a first surface m1 and a second surface m2.

[0043] The cooling roller 111 is a roller-shaped member capable of cooling the substrate 200. A cooling liquid may flow through the cooling roller 111 or a refrigerant may be stored therein to cool the substrate 200 in contact with the cooling roller 111. The cooling roller 111 is a common component in the art, and its specific structure is not limited in the embodiments of the present application.

[0044] The coating mechanism 112 is a mechanism capable of forming a film layer on the substrate 200, and may include, but is not limited to, an evaporation source 112a and a sputtering source 112b. The evaporation source 112a is a device that evaporates and deposits the coating material on the surface of the substrate 200 to form a film layer, and the sputtering source 112b is a device that utilizes the collision of charged ions with target atoms to sputter the target atoms from the surface of the coating material and shoot them toward the substrate 200, thereby forming a film layer on the substrate 200. The specific implementation of the evaporation source 112a and the sputtering source 112b is not specifically limited in the embodiments of the present application, and can refer to the conventional settings in the art.

[0045] During the conveying process of the substrate 200 , one coating surface of the substrate 200 passes through the cooling roller 111 and contacts the cooling roller 111 , while the other coating surface of the substrate 200 faces the coating mechanism 112 and receives coating treatment from the coating mechanism 112 .

[0046] A cooling roller 111 and a coating mechanism 112 are arranged opposite to each other, which means that the projection of the cooling roller 111 overlaps with the projection of the coating mechanism 112 in the direction perpendicular to the substrate 200. In other words, when the coating mechanism 112 coats the substrate 200, the coated part of the substrate 200 is cooled by the cooling roller 111 at the same time, that is, the substrate 200 is cooled while being coated in the coating device 100.

[0047] The two coating groups 110 are arranged on the tape path of the same substrate 200, which means that the two coating groups 110 coat the same substrate 200. It can be understood that in the two coating groups 110, the coating mechanisms 112 of the same group can be arranged adjacent to each other, or the coating mechanisms 112 of different groups can be arranged alternately in sequence.

[0048] The cooling roller 111 of one of the coating groups 110 contacts the first surface m1 of the substrate 200, and the corresponding coating mechanism 112 is used to coat the second surface m2 of the substrate 200. The cooling roller 111 of another coating group 110 contacts the second surface m2 of the substrate 200, and the corresponding coating mechanism 112 is used to coat the first surface m1 of the substrate 200. When the substrate 200 is conveyed in the coating device 100, one of the coating groups 110 coats the first surface m1 of the substrate 200, and the other coating group 110 coats the second surface m2 of the substrate 200, so that both sides of the substrate 200 can be coated after only one coating stage.

[0049] In addition, since each coating group 110 includes multiple pairs of cooling rollers 111 and coating mechanisms 112, the coating mechanisms 112 in the same group can coat the substrate 200 with the same coating material (which can increase the thickness of the film) or with different coating materials (which can form different film layers). Regardless of whether the coating mechanisms 112 in the same group coat the same coating material, they can speed up the coating of the film layer on the substrate 200 and further improve the coating efficiency of the coating equipment 100.

[0050] The above-mentioned coating device 100, in actual operation, can coat two different coating surfaces of the same substrate 200 in one coating stage by setting two coating groups 110, thereby achieving double-sided coating of the substrate 200, which can greatly improve the coating efficiency of the coating device 100. Moreover, each coating group 110 includes multiple pairs of cooling rollers 111 and coating mechanisms 112, which can perform multi-layer coating on a certain coating surface of the substrate 200, further improving the coating efficiency of the coating device 100.

[0051] Understandably, please refer to Figure 1 and Figure 2 The coating device 100 includes a conveying mechanism 190, which is used to convey the substrate 200. The conveying mechanism 190 may include a plurality of conveying rollers 191, and the substrate 200 passes through each conveying roller 191 in sequence. The running direction of the substrate 200 is determined by the arrangement direction of the conveying rollers 191. Further, part of the conveying roller 191 can be used as a tensioning roller for tensioning the substrate 200. Further, part of the conveying roller 191 can be used as a flattening roller 192 for flattening the substrate 200. The arrangement of the conveying roller 191 can refer to the conventional arrangement in the art, and is not specifically limited in the embodiments of the present application.

[0052] In some embodiments, please refer to Figure 2 , the coating equipment 100 also includes a cavity 170, and each coating group 110 is arranged in the cavity 170. The cavity 170 is used to form a required internal environment (not limited to a vacuum environment), which can be a metal cavity, etc., without limitation. The cavity 170 can be, but is not limited to, connected to a vacuum device 180, and the vacuum device 180 is used to evacuate the cavity 170 so that the cavity 170 reaches a vacuum coating environment. At this time, setting the cavity 170 can create a coating environment only in the area where the cavity 170 is located, and the coating production cost is low. In other embodiments, the coating equipment 100 can also be used in a clean environment such as a clean laboratory, and the cavity 170 can be omitted.

[0053] In some embodiments, in each coating group 110 , along the coating sequence of each coating mechanism 112 , the coating materials loaded in two adjacent coating mechanisms 112 are different.

[0054] The coating order of each coating mechanism 112 in the same group refers to the order in which each coating mechanism 112 in the same group coats the same part of the substrate 200. For example, on the tape path of the substrate 200, the coating mechanism 112 located upstream is preferentially coated, and the coating order is the same as the tape direction of the substrate 200. For another example, on the tape path of the substrate 200, the coating mechanism 112 located downstream is preferentially coated, and the coating order is opposite to the tape direction of the substrate 200. For another example, on the tape path of the substrate 200, the coating mechanism 112 located in the middle is preferentially coated (in this case, each coating group 110 includes three coating mechanisms 112), and the coating order is not related to the tape direction of the substrate 200. The coating order of each coating mechanism 112 in each coating group 110 is not limited in the embodiment of the present application.

[0055] Along the coating sequence of each coating mechanism 112 in the same group, the coating materials loaded by two adjacent coating mechanisms 112 are different, which is reflected in that the materials of two adjacent film layers on the substrate 200 are different.

[0056] In one embodiment, the number of coating mechanisms 112 in the same group is two, and the coating material loaded by one coating mechanism 112 is a base coating material (such as a ceramic coating material), and the base coating is first formed on the substrate 200, and the coating material loaded by the other coating mechanism 112 is a metal coating material (such as a copper, aluminum, etc. coating material), and finally forms a metal layer 202 on the base coating. Plating the metal layer 202 on the base coating can enhance the adhesion of the film on the substrate 200 and improve the plating defects (such as pinholes and holes) of the metal layer 202. In another embodiment, the number of coating mechanisms 112 in the same group is two, and the coating material loaded by one coating mechanism 112 is a metal coating material, and the metal layer 202 is first formed on the substrate 200, and the coating material loaded by the other coating mechanism 112 is a corrosion-resistant coating material (such as titanium metal, ceramics, etc.), and finally forms a corrosion-resistant layer on the metal layer 202.

[0057] In actual application, the types of coating materials loaded in two adjacent coating mechanisms 112 in the coating sequence are not specifically limited in the embodiment of the present application, and those skilled in the art can flexibly set them according to actual needs.

[0058] At this time, the coating materials loaded in the two adjacent coating mechanisms 112 in the coating order are different, so that the two adjacent coating mechanisms 112 can coat film layers of different materials on the substrate 200. The different physical and chemical properties between different film layers can be used to improve the physical and chemical properties of the coated substrate 200, thereby improving the coating quality of the substrate 200.

[0059] In some embodiments, in each coating group 110 , along the running direction of the substrate 200 , the arrangement order of each coating mechanism 112 is arranged according to the corresponding coating order.

[0060] The running direction of the substrate 200 refers to the direction in which the substrate 200 moves along the running path. Usually, the running direction is from the unwinding side of the substrate 200 to the winding side of the substrate 200 .

[0061] The arrangement order of the coating mechanisms 112 refers to the arrangement order of the coating mechanisms 112 on the tape path of the substrate 200. When the arrangement order of the coating mechanisms 112 is arranged according to the corresponding coating order, among the coating mechanisms 112 in the same group, the coating mechanism 112 located upstream preferentially coats the substrate 200.

[0062] In the embodiment of the present application, "upstream" and "downstream" refer to the running direction of the substrate 200. The substrate first passes through the upstream component and then passes through the downstream component. A being upstream of B means that the substrate 200 first passes through A and then passes through B.

[0063] At this time, as the substrate 200 moves, each coating mechanism 112 of one coating group 110 sequentially coats the first surface m1 of the substrate 200, and each coating mechanism 112 of another coating group 110 sequentially coats the second surface m2 of the substrate 200. When each part of the substrate 200 completes the corresponding path, the first surface m1 and the second surface m2 of the substrate 200 are all coated. That is to say, the substrate 200 only needs to be walked once to complete double-sided coating, and the coating efficiency is high.

[0064] It should be noted that in the embodiment of the present application, the specific composition of the coating material used by the coating mechanism 112 is not limited. The coating material loaded therein can be a commonly used coating material or a known material in the art. The coating mechanism 112 only selects and loads the type of coating material, which includes metal coating materials, ceramic coating materials, other polymer coating materials, etc.

[0065] In some embodiments, please refer to Figure 1 and Figure 2 Each coating group 110 includes at least two coating mechanisms 112 . Along the order of the coating mechanisms 112 , at least two coating mechanisms 112 are configured to sequentially coat a ceramic base layer 201 and a metal layer 202 on the substrate 200 .

[0066] The coating mechanism 112 for forming the ceramic base layer 201 can be loaded with ceramic coating materials such as nitrides, oxynitrides, oxides, carbides, and carbonitrides, and the coating mechanism 112 for forming the metal layer 202 can be loaded with coating materials such as metal aluminum and metal copper.

[0067] At least two coating mechanisms 112 are configured to sequentially coat the ceramic base layer 201 and the metal layer 202 on the substrate 200, which means that the at least two coating mechanisms 112 as a whole sequentially coat the ceramic base layer 201 and the metal layer 202 on the substrate 200. When there are only two coating mechanisms 112, one coating mechanism 112 is used to first coat the ceramic base layer 201 on the substrate 200, and the other coating mechanism 112 is used to later coat the metal layer 202 on the substrate 200. When there are more than two coating mechanisms 112, some of the coating mechanisms 112 sequentially coat the ceramic base layer 201 on the substrate 200, and then the remaining coating mechanisms 112 sequentially coat the metal layer 202 on the substrate 200. That is to say, as long as the ceramic base layer 201 and the metal layer 202 can be formed successively on the substrate 200, there is no specific limitation on the number of plating layers of the ceramic base layer 201 and the metal layer 202 on the substrate 200, that is to say, it is allowed that two or more plating mechanisms 112 have the same plating material.

[0068] At this time, when each coating surface of the substrate 200 passes through each coating mechanism 112 of each coating group 110, it can be coated with a ceramic base layer 201 and a metal layer 202 in sequence. The ceramic base layer 201 is directly coated on the substrate 200 to improve the adhesion of the film layer on the substrate 200. At the same time, the metal layer 202 is coated on the base layer to improve the coating defects (such as pinholes and holes) of the metal layer 202. In addition, the ceramic base layer 201 has good thermal conductivity and fast heat dissipation speed, and can prevent the substrate 200 from being deformed too quickly under the high temperature generated by the coating mechanism 112.

[0069] Figure 3 Shown is a working schematic diagram of the coating equipment 100 in some embodiments of the present application. Figure 5 Shown is a schematic structural diagram of a substrate 200 prepared by a coating device 100 in some embodiments of the present application.

[0070] Please refer to Figure 3 In some embodiments, each coating group 110 includes at least three coating mechanisms 112. Along the coating order of the coating mechanisms 112, at least three coating mechanisms 112 are configured to sequentially coat a ceramic base layer 201, a metal layer 202, and a ceramic passivation layer 203 on the substrate 200.

[0071] The coating mechanism 112 for forming the ceramic base layer 201 and the ceramic passivation layer 203 can be loaded with ceramic coating materials such as nitride, oxynitride, oxide, carbide, carbonitride, etc., and the coating mechanism 112 for forming the metal layer 202 can be loaded with coating materials such as metal aluminum and metal copper. The structure of the substrate 200 after coating can refer to Figure 5 .

[0072] At least three coating mechanisms 112 are configured to sequentially coat the ceramic base layer 201, the metal layer 202, and the ceramic passivation 203 on the substrate 200, which means that the at least three coating mechanisms 112 as a whole sequentially coat the ceramic base layer 201, the metal layer 202, and the ceramic passivation 203 on the substrate 200. When only three coating mechanisms 112 are configured, one coating mechanism 112 is used to first coat the ceramic base layer 201 on the substrate 200, one coating mechanism 112 is used to then coat the metal layer 202 on the substrate 200, and the remaining coating mechanism 112 is used to finally coat the ceramic passivation 203 on the substrate 200. When there are more than three coating mechanisms 112, some of the coating mechanisms 112 first coat the ceramic base layer 201 on the substrate 200, and the other coating mechanisms 112 then coat the metal layer 202 on the substrate 200, and the remaining coating mechanisms 112 finally coat the ceramic passivation 203 on the substrate 200. In other words, as long as the ceramic base layer 201, the metal layer 202 and the ceramic passivation 203 can be formed on the substrate 200 in sequence, the number of coating layers of the ceramic base layer 201, the metal layer 202 and the ceramic passivation 203 on the substrate 200 is not specifically limited, that is, it is allowed that two or more coating mechanisms 112 have the same coating material.

[0073] At this time, when each coating surface of the substrate 200 passes through each coating mechanism 112 of each coating group 110, it can be coated with a ceramic base layer 201, a metal layer 202 and a ceramic passivation layer 203 in sequence. The ceramic base layer 201 is directly coated on the substrate 200, which can improve the adhesion of the film layer on the substrate 200. At the same time, the metal layer 202 is coated on the base layer, which can improve the coating defects (such as pinholes and holes) of the metal layer 202. Moreover, the ceramic base layer 201 has good thermal conductivity and fast heat dissipation speed, which can prevent the substrate 200 from deforming too quickly under the high temperature generated by the coating mechanism 112. In addition, coating the ceramic passivation layer 203 on the outside of the metal layer 202 can prevent the metal layer 202 from oxidation and corrosion.

[0074] In some embodiments, please refer to Figure 1 , Figure 2 and Figure 3 The coating device 100 further includes two winding and unwinding mechanisms 120. On the tape path of the substrate 200, the two coating groups 110 are located between the two winding and unwinding mechanisms 120. Each winding and unwinding mechanism 120 is configured to be switchable between a winding state and an unwinding state, and when one of the winding and unwinding mechanisms 120 is in the winding state, the other winding and unwinding mechanism 120 is in the unwinding state.

[0075] The reeling and unwinding mechanism 120 refers to a mechanism that has both reeling and unwinding functions. When it reels the substrate 200, the substrate 200 is gradually wound around its reel, and when it unwinds the substrate 200, the substrate 200 is gradually released from its reel. Specifically, the reeling and unwinding mechanism 120 includes a reel and a power mechanism. The reel can rotate forward and reverse under the drive of the power mechanism. When the reel rotates forward, the reeling and unwinding mechanism 120 is in a reeling state, and when the reel reverses, the reeling and unwinding mechanism 120 is in an unwinding state. The specific structure of the reeling and unwinding mechanism 120 is not limited in the embodiments of the present application, and can be set according to conventional means.

[0076] Each reeling and unreeling mechanism 120 has two working states, namely, a reeling state and an unreeling state. When in the reeling state, the reeling and unreeling mechanism 120 can reel the substrate 200, and when in the unreeling state, the reeling and unreeling mechanism 120 can unreel the substrate 200.

[0077] Since each reeling and unwinding mechanism 120 has two working states, that is, the working state of each reeling and unwinding mechanism 120 can be switched to change the running direction of the substrate 200. The running direction of the substrate 200 points from the reeling and unwinding mechanism 120 in the unwinding state to the reeling and unwinding mechanism 120 in the winding state.

[0078] In actual application, the coating process can be made more flexible by switching the working state of the reeling and unwinding mechanism 120. In an actual demand, when two layers of film need to be coated on the substrate 200, the operation process of the coating device 100 can be: first, the substrate 200 is unwound from the first unwound and unwinding mechanism 121 to the second unwound and unwinding mechanism 122, during which the coating mechanism 112 of each coating group 110 coats the first surface m1 and the second surface m2 of the substrate 200 with a first layer of film, and then the working states of the first unwound and unwinding mechanism 121 and the second unwound and unwinding mechanism 122 are switched, and the substrate 200 is unwound from the second unwound and unwinding mechanism 122 to the first unwound and unwinding mechanism 121, during which the coating mechanism 112 of each coating group 110 coats the second layer of film on the first surface m1 and the second surface m2 of the substrate 200, so as to achieve coating of two layers of film on the substrate 200.

[0079] The multi-layer coating of the substrate 200 is achieved by changing the working state of the reeling and winding mechanism 120. The coating interval between two adjacent layers is long, so that a certain deposition time can be reserved for each film layer. After each film layer is deposited, other film layers are deposited. This can reduce the influence of other film layers on the previous film layer during coating, making the deposition of each film layer more uniform and denser, thereby improving the quality of the film.

[0080] In some embodiments, the cooling roller 111 is configured to be able to communicate a negative bias voltage.

[0081] Negative bias refers to a voltage whose potential is lower than zero potential. Figure 1 The coating device 100 may include a bias power supply 130 (Bias power supply), which is connected to the cooling roller 111 and is used to strengthen the negative bias voltage to the cooling roller 111. During the coating process, the negative electrode of the bias power supply 130 is connected to the cooling roller 111, and the positive electrode thereof is connected to the cavity 170. At the same time, the cavity 170 is grounded. Since the voltage of the earth is generally considered to be zero potential, the voltage on the cooling roller 111 is negatively biased. The bias power supply 130 (Bias power supply) is a common component in this field and is not described in detail in the embodiments of the present application.

[0082] When a negative bias is applied to the cooling roller 111, the cooling roller 111 contacts the substrate 200, so that the substrate 200 is provided with a negative bias. When the substrate 200 is provided with a negative bias, the adhesion between the film layer and the substrate 200 and the compactness of the film layer can be improved.

[0083] In some embodiments, please refer to Figure 1 , Figure 2 and Figure 3 The coating device 100 also includes a static electricity removal mechanism 160. On the tape path of the substrate 200, a static electricity removal mechanism 160 is arranged downstream of each coating group 110 for removing static electricity from the first surface m1 and the second surface m2 after coating.

[0084] The static electricity removal mechanism 160 is a device that can generate a large amount of airflow with positive and negative charges. When the static electricity removal mechanism 160 sprays airflow toward the substrate 200, the charge on the substrate 200 can be neutralized to achieve the purpose of eliminating static electricity. The static electricity removal device is a common component in the art and is not specifically limited or detailed in the embodiments of the present application.

[0085] Since the cooling roller 111 is negatively biased, the substrate 200 is negatively charged. After the coating is completed, the static electricity removal mechanism 160 is used to remove static electricity from the substrate 200 to prevent relevant personnel from touching the coated substrate 200 and getting an electric shock.

[0086] In some embodiments, please refer to Figure 1 , Figure 2 and Figure 3 Each coating mechanism 112 includes a vapor deposition source 112 a , and the vapor deposition source 112 a is opposite to the cooling roller 111 and is spaced apart from each other.

[0087] The evaporation source 112a is a device that evaporates the coating material and deposits it on the surface of the substrate 200 to form a film layer. The evaporation source 112a can be a thermal resistance evaporation source, an electron beam evaporation source, or a high-frequency induction evaporation source. The evaporation source 112a is a common component in the art, and the embodiment of the present application does not limit the specific structure of the evaporation source 112a.

[0088] At this time, the coating mechanism 112 coats the film through the evaporation source 112a. The film deposition speed of the evaporation source 112a is fast, which is beneficial to improving the coating efficiency. At the same time, its price is relatively low, which can reduce the use cost of the coating equipment 100.

[0089] Figure 4 Shown is a schematic structural diagram of a coating device 100 in some embodiments of the present application.

[0090] In some embodiments, please refer to Figure 4 At least one coating mechanism 112 further includes a sputtering source 112 b , and the coating mechanism 112 is configured to selectively coat a pair of substrates 200 from the evaporation source 112 a and the sputtering source 112 b .

[0091] The sputtering source 112b is a device that utilizes the collision of charged ions with target atoms to sputter the target atoms from the surface of the coating material and eject them toward the substrate 200, thereby forming a film layer on the substrate 200. The coating material loaded on the sputtering source 112b is also called a target material. The sputtering source 112b can be a magnetron sputtering source, a radio frequency sputtering source, a diode sputtering source, a reactive sputtering source, etc. The sputtering source 112b is a common component in the art, and the specific structure of the sputtering source 112b is not limited in the embodiment of the present application.

[0092] The film layer formed by the sputtering source 112b has the advantages of good film quality and strong bonding with the substrate 200. In practical applications, the evaporation source 112a or the sputtering source 112b can be flexibly selected to use, so that the coating device 100 can be adapted to various coating processes.

[0093] Specifically in the embodiment, the coating mechanism 112 in each coating group 110 configured to form a ceramic base layer 201 on the substrate 200 includes the above-mentioned evaporation source 112 a and the above-mentioned sputtering source 112 b .

[0094] In some embodiments, please refer to Figures 1 to 4 The coating device 100 further includes an ion cleaning mechanism 140 . On the tape path of the substrate 200 , an ion cleaning mechanism 140 is arranged upstream of each coating group 110 .

[0095] The ion cleaning mechanism 140 is a mechanism that uses gas as a cleaning medium. When working, the ions it generates act on the surface of the object to be cleaned, and the pollutants can be thoroughly cleaned in a short time, with a high cleaning degree and good cleaning effect. In addition, the ion cleaning mechanism 140 can activate the surface of the substrate 200, change the microstructure of the surface of the substrate 200, and effectively improve the adhesion of the film layer on the substrate 200. The ion cleaning mechanism 140 is a common component in this field and will not be described in detail in the embodiments of this application.

[0096] At this time, an ion cleaning mechanism 140 is arranged upstream of each coating group 110 , and the coating surface of the substrate 200 can be cleaned and activated by the ion cleaning mechanism 140 before coating, which can improve the coating quality.

[0097] In some embodiments, please refer to Figures 1 to 4 The coating device 100 further includes a thickness measuring mechanism 150 . On the tape path of the substrate 200 , two coating groups 110 are arranged at intervals, and a thickness measuring mechanism 150 is arranged downstream of each coating group 110 .

[0098] The thickness measuring mechanism 150 is a mechanism for measuring the thickness of the substrate 200 , and may be an eddy current thickness measuring mechanism 150 or an ultrasonic thickness measuring mechanism 150 , and the specific selection thereof is not limited in the embodiment of the present application.

[0099] At this time, a thickness measuring mechanism 150 is arranged downstream of each coating group 110 to measure the thickness of the substrate 200 after coating, which helps to monitor the coating process and ensure the coating quality.

[0100] In one embodiment of the present application, the coating device 100 includes a cavity 170, two coating groups 110 and two winding and unwinding mechanisms 120. The two winding and unwinding mechanisms 120 and the two coating groups 110 are arranged in the cavity 170 and arranged on the tape path of the same substrate 200. The two coating groups 110 are located between the two winding and unwinding mechanisms 120. Each coating group 110 includes a plurality of cooling rollers 111 and a plurality of coating mechanisms 112, and each coating mechanism 112 is opposite to a cooling roller 111 and is arranged at intervals for the substrate 200 to pass through. In one of the coating groups 110, the cooling roller 111 is used to contact the first surface m1 of the substrate 200, and the coating mechanism 112 is used to coat the second surface m2 of the substrate 200. In another coating group 110, the cooling roller 111 is used to contact the second surface m2, and the coating mechanism 112 is used to coat the first surface m1. The two coating groups 110 are arranged at intervals on the tape path of the substrate 200. The two reeling and unreeling mechanisms 120 can be switched between a reeling state and an unreeling state.

[0101] The coating device of this embodiment can be used to coat multiple layers of film on a substrate 200, and the number of coating mechanisms 112 in each coating group 110 is equivalent to the number of film layers to be coated. One operation process is: first, the substrate 200 is unwound from the first unwinding mechanism 121 to the second unwinding mechanism 122, during which one coating mechanism 112 in each coating group 110 coats the first layer of film on the first surface m1 and the second surface m2 of the substrate 200, respectively. Then, the working states of the first unwinding mechanism 121 and the second unwinding mechanism 122 are switched, and the substrate 200 is unwound from the second unwinding mechanism 122 to the first unwinding mechanism 121, during which another coating mechanism 112 in each coating group 110 coats the second layer of film on the first surface m1 and the second surface m2 of the substrate 200, respectively. Then the substrate 200 is unwound from the first unwinding mechanism 121 to the second unwinding mechanism 122, and in this process, another coating mechanism 112 in each coating group 110 coats the first surface m1 and the second surface m2 of the substrate 200 with a third layer of film respectively... and so on, each time the winding and unwinding is performed, only one layer of film is coated on each coating surface.

[0102] Another operation process is to unwind the substrate 200 from the first unwinding mechanism 121 to the second unwinding mechanism 122. During this process, each coating mechanism 112 of each coating group 110 coats the first surface m1 and the second surface m2 of the substrate 200 with a first layer of film, a second layer of film, a third layer of film... respectively, and completes the coating of all film layers at one time.

[0103] Another operation process is to unwind the substrate 200 from the second unwinding mechanism 122 to the first unwinding mechanism 121. During this process, each coating mechanism 112 of each coating group 110 coats the first surface m1 and the second surface m2 of the substrate 200 with a first layer of film, a second layer of film, a third layer of film... in turn, and completes the coating of all film layers at one time.

[0104] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0105] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A coating device, characterized in that: include: Two coating groups are arranged on the same substrate's belt path, each coating group comprises a plurality of cooling rollers and a plurality of coating mechanisms, and each coating mechanism is opposite to one of the cooling rollers and is arranged at intervals for the substrate to pass through; In one of the coating groups, the cooling roller is used to contact the first surface of the substrate, and the coating mechanism is used to coat the second surface of the substrate; in the other coating group, the cooling roller is used to contact the second surface of the substrate, and the coating mechanism is used to coat the first surface of the substrate; In each of the coating groups, along the coating sequence of each of the coating mechanisms, the coating materials loaded in two adjacent coating mechanisms are different.

2. The coating device according to claim 1, characterized in that: In each of the coating groups, along the tape-feeding direction of the substrate, the arrangement order of each of the coating mechanisms is arranged according to the corresponding coating order.

3. The coating device according to claim 1, characterized in that: Each of the coating groups includes at least two of the coating mechanisms. Along the coating order of the coating mechanisms, at least two of the coating mechanisms are configured to sequentially plate a ceramic base layer and a metal layer on the substrate.

4. The coating device according to claim 1, characterized in that: Each of the coating groups comprises at least three coating mechanisms. Along the coating sequence of the coating mechanisms, at least three coating mechanisms are configured to sequentially coat a ceramic primer layer, a metal layer and a ceramic passivation layer on the substrate.

5. The coating device according to any one of claims 1 to 4, characterized in that: The coating equipment further comprises two winding and unwinding mechanisms, and the two coating groups are located between the two winding and unwinding mechanisms on the tape path of the substrate; Each of the reeling and unwinding mechanisms is constructed to be switchable between a reeling state and an unwinding state, and when one of the reeling and unwinding mechanisms is in the reeling state, the other reeling and unwinding mechanism is in the unwinding state.

6. The coating device according to any one of claims 1 to 4, characterized in that: The cooling roller is configured to be able to communicate a negative bias voltage.

7. The coating device according to claim 6, characterized in that: The coating equipment also includes a static electricity removal mechanism. On the tape path of the substrate, the static electricity removal mechanism is arranged downstream of each coating group to remove static electricity from the first surface of the substrate after coating and the second surface of the substrate after coating.

8. The coating device according to any one of claims 1 to 4, characterized in that: Each of the coating mechanisms includes a vapor deposition source, and the vapor deposition source is arranged opposite to the cooling roller and at a distance therefrom.

9. The coating device according to claim 8, characterized in that: At least one of the coating mechanisms further includes a sputtering source, and the coating mechanism is configured to selectively coat the substrate with a pair of the evaporation source and the sputtering source.

10. The coating device according to any one of claims 1 to 4, characterized in that: The coating equipment further comprises an ion cleaning mechanism, and the ion cleaning mechanism is arranged upstream of each coating group on the belt path of the substrate.

11. The coating device according to any one of claims 1 to 4, characterized in that: The coating device further comprises a thickness measuring mechanism, and the two coating groups are arranged at intervals on the tape path of the substrate; The thickness measuring mechanism is arranged downstream of each coating group.

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