Super-flexible copper wire lamp string production equipment

Abstract

The utility model discloses super-flexible copper wire lamp string production equipment, which comprises an equipment main body, the equipment main body is provided with a shaping mechanism, a de-insulation mechanism, a mounting table and a driving mechanism on an operation platform, the shaping mechanism can flatten a copper wire, the de-insulation mechanism can remove an insulation layer on the copper wire to form a welding point, the mounting table is provided with a mounting groove, and the driving mechanism drives the mounting groove to rotate. By means of the arrangement, the ultra-soft copper wire lamp string production line can produce ultra-soft copper wire lamp strings with ultra-soft copper wires as carriers and the LED chips as light-emitting sources so as to reduce the size of the lamp strings, is suitable for various taping technologies, is convenient to carry and can be used for manufacturing the ultra-soft copper wire lamp strings with the ultra-soft copper wires as the carriers and the LED chips as the light-emitting sources. In addition, the LED chips can be packaged in different colors on the same super-flexible copper wire, the adjacent LED chips can be controlled to be mounted at different distances on the same super-flexible copper wire during production of the lamp string, and the flexible applicability of the lamp string is improved.

Description

Technical Field

[0001] The invention relates to the technical field of lamp string processing and production, and in particular to a super-flexible copper wire lamp string production device. Background Art

[0002] The copper wire light string is a new type of LED energy-saving and environmentally friendly decorative light string that welds LED light-emitting bodies to copper wires. Currently, the copper wire light strings on the market are affected by the processing technology, and the copper wires used as LED carriers are mostly set to be relatively "thick" to facilitate the welding of the copper wires and the LED light-emitting bodies. This results in the existing light strings on the market having a larger overall volume, making it difficult to apply the light strings to small objects or to more delicate occasions, limiting the use of the light strings and not being conducive to the convenient carrying of the light strings. Furthermore, when the light strings on the market are processed, the adjacent LED light-emitting bodies are equidistant, and the producer cannot flexibly adjust the distance between the adjacent LED light-emitting bodies according to demand to make them unequal. Furthermore, the light strings on the market can only choose a single color of packaging glue when encapsulating the LED light-emitting bodies, which makes it difficult to meet the diverse needs of consumers. Summary of the invention

[0003] The purpose of the present invention is to provide a super-flexible copper wire light string production device in view of the technical problems existing in the background technology.

[0004] Specifically, an ultra-flexible copper wire light string production device of the present invention includes a device body, and the device body is provided with a shaping mechanism, a de-insulating mechanism, a mounting table and a driving mechanism on an operating platform. The shaping mechanism acts on the copper wire to flatten the copper wire, and the de-insulating mechanism is used to remove the insulating layer on the copper wire to form a welding point. The mounting table is provided with a mounting groove for guiding the copper wire. The copper wire is mounted and welded with solder paste and LED chip in the mounting groove, and the driving mechanism is used to drive the copper wire to move forward.

[0005] Furthermore, the operating platform also includes a glue picking mechanism, which is arranged on one side of the mounting table. The glue picking mechanism includes a tin tray and a first robotic arm. The tin tray is connected to a tin tray rotating device to drive the tin tray to rotate. The first robotic arm is provided with a tin dot head at one end and a first robotic arm driving device at the other end. The first robotic arm driving device is used to drive the tin dot head to move between the tin tray and the mounting table.

[0006] Furthermore, the glue taking mechanism also includes a tin scraping part and a tin scraping part lifting mechanism. The tin scraping part is arranged above the tin tray. The tin scraping part lifting mechanism is connected to the tin scraping part to drive the tin scraping part to move up and down relative to the tin tray.

[0007] Furthermore, the operating platform also includes a mounting mechanism, which is arranged on one side of the mounting table. The mounting mechanism includes a crystal expansion ring and a second robotic arm. One end of the crystal expansion ring is connected to a crystal expansion ring driving device for driving the crystal expansion ring to move relative to the operating platform in the X-axis direction and the Y-axis direction. The second robotic arm is provided with a pickup head at one end and a second robotic arm driving device at the other end. The second robotic arm driving device is used to drive the pickup head to move between the crystal expansion ring and the mounting table.

[0008] Furthermore, the mounting mechanism also includes a vacuum film suction device, which is arranged below the crystal expansion ring. The vacuum film suction device is provided with an adsorption mechanism at the top for adsorbing the LED chip film. The adsorption mechanism includes a shell, which is provided with an opening at the top and a ejector pin inside. The ejector pin can move upward relative to the shell and pass through the opening.

[0009] Furthermore, the operating platform also includes a packaging mechanism, which includes a dispensing device and a three-way driving device. The three-way driving device is connected to the dispensing device to drive the dispensing device to move in the X-axis direction, the Y-axis direction and the Z-axis direction. The dispensing device includes a plurality of dispensing pens. Different dispensing pens can store packaging glue of different colors. When packaging the LED chip, different dispensing pens can be selected to achieve multi-color packaging of the LED chip.

[0010] Furthermore, the packaging mechanism also includes a support seat, a first fixed plate and a second fixed plate. The three-way driving device includes an X-axis driving unit, a Y-axis driving unit and a Z-axis driving unit. The first fixed plate is movably connected to the support seat through the X-axis driving unit and the Y-axis driving unit to realize the movement of the first fixed plate relative to the support seat in the X-axis direction and the Y-axis direction. One end of the second fixed plate is fixedly connected to the first fixed plate, and the other end is connected to the dispensing device through the Z-axis driving unit.

[0011] Furthermore, the driving mechanism includes a clamping device for grabbing the copper wire, and the clamping device is provided with two groups, and the two groups of clamping devices can move back and forth alternately along the processing direction of the copper wire relative to the operating platform to drive the copper wire to move forward;

[0012] The clamping device includes a front and rear driving cylinder, a first connecting plate, a left and right driving cylinder, a second connecting plate, a clamping portion and a clamping cylinder. The front and rear driving cylinder is connected to the first connecting plate to drive the first connecting plate to move forward and backward along the processing direction of the copper wire. The second connecting plate is connected to the first connecting plate through the left and right driving cylinders. The left and right driving cylinders are used to drive the second connecting plate to move in the left and right directions relative to the first connecting plate. The clamping portion is arranged on the second connecting plate and connected to the clamping cylinder. The clamping cylinder is used to drive the clamping portion to open and close to achieve clamping of the copper wire.

[0013] Furthermore, the shaping mechanism includes a pressing part and a pressing platform. The pressing part is arranged above the pressing platform and can move up and down relative to the pressing platform. The pressing platform forms a first guide hole and a second guide hole at the front and rear ends respectively. The copper wire can pass through the first guide hole, pass under the pressing part, and then pass out from the second guide hole. The shaping mechanism also includes a flexible block, which is arranged between the pressing part and the pressing platform.

[0014] Furthermore, the main body of the equipment also includes a wire feeding drum, the copper wire to be processed can be wound around the wire feeding drum, the wire feeding drum is arranged on one side of the shaping mechanism, and is used to convey the copper wire to the shaping mechanism; the main body of the equipment also includes a wire taking-up device, the wire taking-up device includes a support rod, a counterweight rod, a wire taking-up drum and a wire taking-up motor, the support rod is arranged on one side of the driving mechanism, and a first wire taking-up pulley is arranged on the support rod, and is used to receive the copper wire from the driving mechanism;

[0015] The main body of the equipment forms a storage space below the operating platform. The counterweight rod, the wire take-up drum and the wire take-up motor are all arranged on a mounting seat in the storage space. A second wire take-up roller is arranged at one end of the counterweight rod, and the other end is movably connected to the mounting seat to realize the swing of the second wire take-up roller in the vertical direction. The second wire take-up roller is used to receive the copper wire from the first wire take-up pulley. The wire take-up motor is connected to the wire take-up drum to drive the wire take-up drum to rotate. The wire take-up drum is used to receive the copper wire from the second wire take-up pulley to realize the storage of the copper wire.

[0016] The main body of the equipment also includes a number of curing lamps, which are arranged on the operating platform and along the processing direction of the copper wire;

[0017] The mounting station also includes a heating element, which is used to generate heat after being powered on.

[0018] Compared with the prior art, the present invention has the following beneficial technical effects: because the present invention is provided with a shaping mechanism, a deinsulating mechanism, a mounting table and a driving mechanism, before the copper wire is processed, the insulating layer on the surface of the copper wire can be removed by the deinsulating mechanism to form a plurality of welding points, so as to facilitate welding with the LED chip. Furthermore, in order to improve the welding stability between the copper wire and the LED chip and improve the welding success rate, as an improvement of the present invention, before the copper wire is welded with the LED chip, the copper wire can be conveyed to the shaping mechanism to flatten the copper wire. It can be understood that after the copper wire is flattened, the welding area between its welding point and the LED chip will increase. Through the above-mentioned arrangement, the equipment of the present invention can be applied to thinner ultra-soft copper wires when producing light strings to reduce the volume of the light strings, is applicable to various braiding processes, is easy to carry, and enables the light strings to be widely used in various scenes, thereby increasing the applicability of the light strings.

[0019] Furthermore, since the present invention is also provided with a glue dispensing device, the glue dispensing device includes a plurality of glue dispensing pens. After the LED chip is welded, different glue dispensing pens can be selected to realize multi-color packaging of the LED chip. Specifically, the glue dispensing device of the present invention can include six glue dispensing pens, and the six glue dispensing pens store packaging glues of different colors. Through the above-mentioned structural setting, when producing the ultra-flexible copper wire light string, the present invention can select packaging glues of different colors to realize the packaging of the LED chip. The producer can form LED chips that can emit different colors in an ultra-flexible copper wire light string according to the needs, so as to enhance the beauty and interest of the product.

[0020] Furthermore, since the driving mechanism of the present invention includes a clamping device for grabbing the copper wire, the clamping device is provided with two groups, and the two groups of clamping devices can be relatively relative to the operating platform and move back and forth alternately along the processing direction of the copper wire. It can be understood that when moving the copper wire, one group of clamping devices can be controlled to move backward along the processing direction of the copper wire, and then move forward after clamping the copper wire. The two groups of clamping devices can move back and forth alternately to drive the copper wire forward in real time. Through the above arrangement, the present invention can adjust the forward movement distance of the copper wire by controlling the moving speed of the two groups of clamping devices, that is, the present invention can control the spacing between adjacent LED chips through the driving mechanism, and the manufacturer can flexibly adjust the spacing between adjacent LED chips in the same super-flexible copper wire lamp string according to demand to realize the mounting of different distances between LED chips, so as to meet the process of various complex scenes and improve the flexible applicability of the super-flexible copper wire lamp string.

[0021] In summary, the production equipment of the present invention can produce ultra-flexible copper wire light strings with ultra-flexible copper wire as a carrier and LED chips as light sources, which greatly reduces the overall volume of the light string, is easy to carry, is suitable for various braiding processes, can be widely used in respective scenes, and increases the applicability of the light string. Furthermore, when processing the light string, the present invention can select packaging glues of different colors to package the LED chips, so as to realize different color packaging of LED chips on the same ultra-flexible copper wire, thereby improving the beauty and fun of the product and meeting the diverse needs of users. Furthermore, the present invention can also flexibly adjust the spacing between adjacent LED chips in the same ultra-flexible copper wire light string according to needs, so as to realize the mounting of different distances between LED chips, so as to meet the processes of various complex scenes and improve the flexible applicability of the ultra-flexible copper wire light string. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a three-dimensional state diagram of the device of the present invention;

[0023] Figure 2 This is a partial enlarged view of point A;

[0024] Figure 3 It is a local enlarged view of point D;

[0025] Figure 4 It is a local enlarged view of point B;

[0026] Figure 5 It is a partial enlarged view of point C;

[0027] Figure 6 A three-dimensional state diagram of the device of the present invention from another viewing angle;

[0028] Figure 7 It is a position distribution diagram of the mounting station, the glue taking mechanism and the shaping mechanism of the present invention;

[0029] Figure 8 It is a local enlarged view of point E;

[0030] Fig. 9 It is a local enlarged view of point F;

[0031] Fig.10 is a schematic diagram of the three-dimensional state of the driving mechanism;

[0032] Fig.11 It is a schematic diagram of the three-dimensional state of the packaging mechanism. DETAILED DESCRIPTION

[0033] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or a specific connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0036] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0037] like Figure 1-Figure 11 As shown, the present invention proposes an ultra-flexible copper wire light string production device, including a device body 10, the device body 10 is provided with a shaping mechanism 11, a de-insulating mechanism 12, a mounting table 13 and a driving mechanism 14 on an operating platform 1, the shaping mechanism 11 acts on the copper wire to flatten the copper wire, the de-insulating mechanism 12 is used to remove the insulating layer on the copper wire to form a plurality of welding points, the mounting table 13 is provided with a mounting groove 131, the copper wire completes the mounting of the LED chip in the mounting groove 131, and the driving mechanism 14 is used to drive the copper wire to move forward.

[0038] Specifically, Figure 1 , 2 As shown in Figures 3, 4, 6, and 8, in the present embodiment, the copper wire is composed of two groups of fine ultra-flexible copper wires in parallel. Since an insulating layer is attached to the outer layer of the copper wire, the copper wire needs to be pretreated before processing. Specifically, the insulating layer on the surface of the copper wire can be removed by the de-insulation mechanism 12 of the present embodiment, such as a laser, to form a number of welding points for welding with the LED chip. Furthermore, the laser of the present embodiment is a position-adjustable laser. In the process of removing the insulating layer, the equipment can achieve precise removal of the insulating layer of the copper wire by controlling the movement or rotation of the laser.

[0039] Furthermore, since the copper wire of the present embodiment is relatively thin, in order to improve the welding stability between the copper wire and the LED chip and improve the welding success rate, as an improvement of the present invention, a shaping mechanism 11 is provided on the operating platform 1. Before the copper wire is welded to the LED chip, the copper wire can be conveyed to the shaping mechanism 11 to be flattened. It can be understood that after the copper wire is flattened, the welding area between its welding point and the LED chip will increase, so as to solve the technical problem that the copper wire is difficult to be stably welded to the LED chip because the copper wire is too thin.

[0040] Furthermore, after the copper wire is flattened, the copper wire can be pulled by the driving mechanism 14 so that the welding point of the copper wire is placed in the mounting groove 131 of the mounting table 13. The mounting groove 131 can limit the left and right movement of the copper wire to a certain extent and play a guiding role. At the same time, the copper wire can always remain straight during the processing to ensure that its position does not shift, thereby further improving the processing stability of the copper wire. During processing, solder paste can be applied to the welding point. The mounting table 13 can generate high temperature through the heating element 132 inside it to melt the solder paste, and then the LED chip can be installed at the welding point to achieve welding of the LED chip and the copper wire. After welding is completed, the copper wire can be pulled forward by the driving mechanism 14 to achieve welding of the next welding point.

[0041] Furthermore, if Figure 2 , 7 As shown in FIG. 9 , as a specific implementation of the shaping mechanism 11, the shaping mechanism 11 includes a pressing portion 111 and a pressing platform 112. The pressing portion 111 is arranged above the pressing platform 112 and can move up and down relative to the pressing platform 112. The pressing platform 112 is formed with a first guide hole 1121 and a second guide hole 1122 at the front and rear ends, respectively. The copper wire can be inserted through the first guide hole 1121, pass through the bottom of the pressing portion 111, and then pass out from the second guide hole 1122. When working, the pressing portion 111 can be driven to The pressing part 111 moving downward will give pressure to the copper wire to flatten it. Furthermore, preferably, the shaping mechanism 11 also includes a flexible block 113. The flexible block 113 can be a flexible object such as a sponge. The flexible block 113 is arranged between the pressing part 111 and the pressing platform 112 to clamp the copper wire between the flexible block 113 and the pressing platform 112. Through the above-mentioned structural arrangement, the flexible block 113 can clean the copper wire to avoid the copper wire from being mixed with debris during the welding process, thereby affecting the processing of the copper wire.

[0042] Furthermore, if Figure 2 , 3 As shown in Figures 6 and 7, in the present embodiment, the operating platform 1 further includes a glue taking mechanism 15, which is arranged on one side of the mounting table 13 for realizing automatic glue taking of solder paste. Specifically, the glue taking mechanism 15 includes a tin tray 151 and a first robotic arm 152. The tin tray 151 is connected to a tin tray rotating device 153 for driving the tin tray 151 to rotate. The first robotic arm 152 is provided with a tin dot head 1521 at one end and a first robotic arm driving device 1522 at the other end. The first robotic arm driving device 1522 is used to drive the tin dot head 1521 to move between the tin tray 151 and the mounting table 13. Specifically, the first robotic arm driving device 1522 includes a rotating motor and a lifting cylinder. The rotating motor can drive the first robotic arm 152 to rotate, and the lifting cylinder can drive the first robotic arm 152 to move up and down.

[0043] Through the above-mentioned structural setting, when solder paste is loaded, the first robotic arm 152 can be rotated by the rotating motor to place the tinning head 1521 above the tin tray 151, and then the first robotic arm 152 can be controlled to move up and down by the lifting cylinder to make the solder paste in the tin tray 151 adhere to the tinning head 1521. Similarly, the first robotic arm 152 can be controlled by the rotating motor and the lifting cylinder to move to the copper wire welding point in the mounting slot 131 to realize automatic glue removal of the solder paste at the welding point.

[0044] Furthermore, in the present embodiment, the glue taking mechanism 15 also includes a tin scraping part 154 and a tin scraping part lifting mechanism 155. The tin scraping part 154 is arranged above the tin tray 151, and the tin scraping part lifting mechanism 155 is connected to the tin scraping part 154 to drive the tin scraping part 154 to move up and down relative to the tin tray 151. In the present embodiment, the tin scraping part lifting mechanism 155 is a lifting cylinder. Through the above-mentioned structural arrangement, the tin scraping part 154 cooperates with the rotation of the tin tray 151, so that the solder paste in the tin tray 151 is always on the same horizontal plane. Furthermore, the tin scraping part lifting mechanism 155 can also control the upper and lower heights of the tin scraping part 154 in the tin tray 151 to achieve the adjustment of the solder paste thickness in the tin tray 151.

[0045] Furthermore, if Figure 2 , 3 6, in this embodiment, in order to realize automatic placement of LED chips, the operating platform 1 also includes a placement mechanism 16, which is arranged on one side of the placement platform 13. The placement mechanism 16 includes a crystal expansion ring 161 and a second mechanical arm 162. One end of the crystal expansion ring 161 is connected to a crystal expansion ring driving device 163 for driving the crystal expansion ring 161 to move relative to the operating platform 1 in the X-axis direction and the Y-axis direction. The second mechanical arm 162 is provided with a pick-up head 1621 at one end and a pick-up head 1621 at the other end. A second robot arm driving device 1622 is provided, and the second robot arm driving device 1622 is used to drive the pick-up head 1621 to move between the wafer expansion ring 161 and the mounting table 13. Specifically, in this embodiment, the second robot arm driving device 1622 also includes a rotating motor and a lifting cylinder. The rotating motor can drive the second robot arm 162 to rotate, and the lifting cylinder can drive the second robot arm 162 to move up and down, so as to realize the movement of the pick-up head 1621 between the wafer expansion ring 161 and the mounting table 13.

[0046] Through the above-mentioned structural setting, the LED chip film can be placed on the crystal expansion ring 161. When mounting the LED chip, the picking head 1621 can be moved to the top of the LED chip by rotating the motor and the lifting cylinder to achieve "grabbing" of the LED chip. Furthermore, in order to achieve accurate "grabbing" of the LED chip by the picking head 1621, the mounting mechanism 16 is also provided with a first visual mechanism 21 above the crystal expansion ring 161. The first visual mechanism 21 can be used to monitor the grabbing process of the LED chip by the picking head 1621. Furthermore, during the "grabbing" process of the LED chip, the position of the crystal expansion ring 161 can be fine-tuned by the crystal expansion ring driving device 163 to achieve accurate "grabbing" of the LED chip by the picking head 1621. After the picking head 1621 obtains the LED chip, the picking head 1621 can be moved to the welding point of the copper wire in the mounting slot 131 by rotating the motor and the lifting cylinder to achieve the mounting of the LED chip.

[0047] Furthermore, in the present embodiment, in order to improve the placement accuracy of the pick-up head 1621 on the copper wire welding point, the operating platform 1 is further provided with a second visual mechanism 22 above the placement table 13. The second visual mechanism 22 can be used to monitor the placement process of the LED chip by the pick-up head 1621. Furthermore, in the present embodiment, a placement table driving device 31 is further provided at the connection between the placement table 13 and the operating platform 1 to control the movement of the placement table 13 relative to the operating platform 1 in the X-axis direction and the Y-axis direction. During the placement process of the LED chip, the position of the placement table 13 can also be fine-tuned by the placement table driving device 31 to further increase the docking accuracy of the pick-up head 1621 at the copper wire welding point.

[0048] Furthermore, in the present embodiment, the mounting mechanism 16 also includes a vacuum film suction device 164, which is arranged below the crystal expansion ring 161. The vacuum film suction device 164 is provided with an adsorption mechanism 1641 at the top for adsorbing the LED chip film to fix the LED chip film to the crystal expansion ring 161. Further, the adsorption mechanism 1641 includes a shell, which is provided with an opening at the top and a ejector pin inside. The ejector pin can move upward relative to the shell and pass through the opening. Through the above-mentioned structural arrangement, when the pickup head 1621 "grabs" the LED chip, the ejector pin can be ejected from the opening to separate the LED chip from the LED chip film, thereby realizing the "grabbing" of the LED chip by the pickup head 1621. Further, in the present embodiment, a driving device 32 of the vacuum film suction device is also provided below the vacuum film suction device 164. The driving device can realize the movement of the vacuum film suction device 164 relative to the operating platform 1 in the X-axis direction and the Y-axis direction to realize fine-tuning of the position of the vacuum film suction device 164.

[0049] Furthermore, if Figure 1 , 4As shown in Figure 11, in this embodiment, the operating platform 1 also includes a packaging mechanism 17, which includes a dispensing device 171 and a three-way driving device 172. The three-way driving device 172 is connected to the dispensing device 171 to drive the dispensing device 171 to move in the X-axis direction, the Y-axis direction and the Z-axis direction. The dispensing device 171 includes a plurality of dispensing pens 1711, and different dispensing pens 1711 can store packaging glue of different colors.

[0050] It can be understood that after the LED chip is welded, the packaging mechanism 17 can be used to package the LED chip. Specifically, during packaging, the three-way driving device 172 can be used to drive the dispensing device 171 to move up, down, left and right in all directions to select dispensing pens 1711 with different colors, thereby realizing multi-color packaging of the LED chip. Specifically, in this embodiment, the dispensing device 171 can include six dispensing pens 1711, and the six dispensing pens 1711 contain six different colors of packaging glue. Through the above-mentioned structural setting, when producing ultra-flexible copper wire light strings, the present invention can select packaging glue of different colors to realize the packaging of LED chips. The producer can form LED chips that can emit different colors in a light string according to needs, so as to enhance the beauty and interest of the product, so that the product can be applied to various environments and scenes, thereby increasing the applicability of the product.

[0051] Specifically, in this embodiment, in order to realize the three-way movement of the dispensing device 171, the packaging mechanism 17 also includes a support seat 173, a first fixed plate 174 and a second fixed plate 175. The three-way driving device 172 includes an X-axis driving unit 1721, a Y-axis driving unit 1722 and a Z-axis driving unit 1723. The first fixed plate 174 is movably connected to the support seat 173 through the X-axis driving unit 1721 and the Y-axis driving unit 1722 to realize the movement of the first fixed plate 174 relative to the support seat 173 in the X-axis direction and the Y-axis direction. One end of the second fixed plate 175 is fixedly connected to the first fixed plate 174, and the other end is connected to the dispensing device 171 through the Z-axis driving unit 1723. Through the above-mentioned structural setting, the dispensing device 171 can be realized through the X-axis driving unit 1721, the Y-axis driving unit 1722 and the Z-axis driving unit 1723. The movement in the three directions of "X-axis", "Y-axis" and "Z-axis" can be realized.

[0052] Furthermore, if Figure 1 , 4As shown in Figure 10, in the present embodiment, the driving mechanism 14 includes a clamping device 141 for grasping the copper wire. The clamping device 141 is provided with two groups, and the two groups of clamping devices 141 can be relatively The operating platform can move back and forth alternately along the processing direction of the copper wire. It can be understood that when moving the copper wire, one group of clamping devices 141 can be controlled to move backward along the processing direction of the copper wire, and then move forward after clamping the copper wire. Through the above arrangement, the two groups of clamping devices 141 can move back and forth alternately to drive the copper wire to continue to move forward.

[0053] Furthermore, in this embodiment, the present invention can adjust the forward movement distance of the copper wire by controlling the moving speed of the two groups of clamping devices 141. Through the above settings, the present invention can adjust the forward movement distance of the copper wire by controlling the moving speed of the two groups of clamping devices 141, that is, the present invention can adapt the spacing between adjacent LED chips through the driving mechanism 14, and the manufacturer can flexibly adjust the spacing between adjacent LED chips in the same light string according to demand.

[0054] Specifically, in this embodiment, as a specific implementation of the clamping device 141, the clamping device 141 includes a front and rear driving cylinder 1411, a first connecting plate 1412, a left and right driving cylinder 1413, a second connecting plate 1414, a clamping portion 1415 and a clamping cylinder 1416. The front and rear driving cylinder 1411 is connected to the first connecting plate 1412 to drive the first connecting plate 1412 to move forward and backward along the processing direction of the copper wire. The second connecting plate 1414 is connected to the first connecting plate 1412 through the left and right driving cylinder 1413. The left and right driving cylinder 1413 is used to drive the second connecting plate 1414 to move in the left and right directions relative to the first connecting plate 1412. The clamping portion 1415 is arranged on the second connecting plate 1414 and is connected to the clamping cylinder 1416. The clamping cylinder 1416 is used to drive the clamping portion 1415 to open and close to achieve clamping of the copper wire.

[0055] Through the above-mentioned structural arrangement, when the two groups of clamping devices 141 move alternately back and forth, in order to prevent the clamping parts 1415 thereof from blocking each other, the two left and right driving cylinders 1413 need to cooperate and work alternately, so that the two groups of second connecting plates 1414 move in the left and right directions relative to the first connecting plates 1412 respectively, thereby ensuring that when the two groups of clamping devices 141 move alternately back and forth, their respective clamping parts 1415 will not be on the same straight line at the same time, that is, when the clamping parts 1415 of one group of clamping devices 141 clamp the copper wire and move forward, the left and right driving cylinders 1413 of the other group of clamping devices 141 are started, so that the clamping parts 1415 of the two groups of clamping devices 141 produce an alternating trend, so as to prevent the two clamping parts 1415 from blocking each other.

[0056] Furthermore, if Figure 1 , 2As shown in Figures 4 and 5, in this embodiment, the equipment body 10 also includes a wire feeding drum 21, which is arranged at the rear of the shaping mechanism 11. The copper wire to be processed can be wound around the wire feeding drum 21. During processing, the copper wire will be transmitted to the shaping mechanism 11 by the wire feeding drum 21.

[0057] Furthermore, in this embodiment, the equipment body 10 also includes a wire taking-up device 22, which is used to take up the copper wire after processing. Specifically, the wire taking-up device 22 includes a support rod 221, a counterweight rod 222, a wire taking-up drum 223 and a wire taking-up motor 224. The support rod 221 is arranged on one side of the driving mechanism 14, and a first wire taking-up pulley 2211 is arranged on the support rod 221. The first wire taking-up pulley 2211 is used to receive the copper wire from the driving mechanism 14. The equipment body 10 forms a storage space 101 below the operating platform 1, and the counterweight rod 222, the wire taking-up drum 223 and the wire taking-up motor 224 are provided. The wire reel 223 and the wire taking-up motor 224 are both arranged on the mounting seat 102 of the storage space 101. One end of the counterweight rod 222 is provided with a second wire taking-up pulley 2221, and the other end is movably connected to the mounting seat 102 to realize the vertical swing of the second wire taking-up pulley 2221. The second wire taking-up pulley 2221 is used to receive the copper wire from the first wire taking-up pulley 2211. The wire taking-up motor 224 is connected to the wire taking-up reel 223, and is used to drive the wire taking-up reel 223 to rotate. The wire taking-up reel 223 is used to receive the copper wire from the second wire taking-up pulley 2221 to realize the storage of the copper wire.

[0058] Through the above-mentioned structural arrangement, since the second wire-taking pulley 2221 of the counterweight rod 222 can swing in the vertical direction, when the second wire-taking pulley 2221 receives the copper wire from the first wire-taking pulley 2211, the second wire-taking pulley 2221 will swing downward under the action of gravity, thereby applying a force to the copper wire, so that the copper wire is always in a straight state to prevent the copper wire from being loosely knotted, making it easier for the wire-taking drum 223 to receive the copper wire.

[0059] Furthermore, in this embodiment, the device body 10 also includes a plurality of curing lamps 103, which are arranged behind the packaging mechanism 17 and arranged along the processing direction of the copper wire. Through the above-mentioned structural setting, when the LED chip is packaged by the packaging mechanism 17, the packaging glue thereon will be cured when passing through the curing lamp 103, so as to realize the fully automatic production of the light string.

[0060] The above is one or more implementation methods provided in combination with specific contents, and it is not intended that the specific implementation of the present invention is limited to these descriptions. Any similarity or similarity with the method, structure, etc. of the present invention, or any technical deduction or replacement made on the premise of the concept of the present invention, shall be regarded as the protection scope of the present invention.

Claims

1. A super-flexible copper wire light string production device, comprising a device body (10), characterized in that: The device body (10) is provided with a shaping mechanism (11), a deinsulating mechanism (12), a mounting platform (13) and a driving mechanism (14) on an operating platform (1); the shaping mechanism (11) acts on the copper wire to flatten the copper wire; the deinsulating mechanism (12) is used to remove the insulating layer on the copper wire to form a plurality of welding points; the mounting platform (13) is provided with a mounting groove (131) for guiding the copper wire; the welding points can realize the mounting and welding of solder paste and LED chips in the mounting groove (131); and the driving mechanism (14) is used to drive the copper wire to move forward.

2. The ultra-flexible copper wire light string production equipment according to claim 1, characterized in that: The operating platform (1) further comprises a glue taking mechanism (15), the glue taking mechanism (15) being arranged on one side of the mounting platform (13) for realizing automatic glue taking of solder paste, the glue taking mechanism (15) comprising a tin tray (151) and a first mechanical arm (152), the tin tray (151) being connected to a tin tray rotating device (153) for driving the tin tray (151) to rotate, the first mechanical arm (152) being provided with a tin dot head (1521) at one end and a first mechanical arm driving device (1522) at the other end, the first mechanical arm driving device (1522) being used to drive the tin dot head (1521) to move between the tin tray (151) and the mounting platform (13).

3. The ultra-flexible copper wire light string production equipment according to claim 2, characterized in that: The glue taking mechanism (15) further comprises a tin scraping part (154) and a tin scraping part lifting mechanism (155); the tin scraping part (154) is arranged above the tin tray (151); the tin scraping part lifting mechanism (155) is connected to the tin scraping part (154) and is used to drive the tin scraping part (154) to move up and down relative to the tin tray (151).

4. The ultra-flexible copper wire light string production equipment according to claim 1, characterized in that: The operating platform (1) also includes a mounting mechanism (16), which is arranged on one side of the mounting platform (13) and is used to realize automatic mounting of LED chips. The mounting mechanism (16) includes a crystal expansion ring (161) and a second mechanical arm (162). One end of the crystal expansion ring (161) is connected to a crystal expansion ring driving device (163) for driving the crystal expansion ring (161) to move relative to the operating platform (1) in the X-axis direction and the Y-axis direction. The second mechanical arm (162) is provided with a pick-up head (1621) at one end and a second mechanical arm driving device (1622) at the other end. The second mechanical arm driving device (1622) is used to drive the pick-up head (1621) to move between the crystal expansion ring (161) and the mounting platform (13).

5. The ultra-flexible copper wire light string production equipment according to claim 4, characterized in that: The mounting mechanism (16) also includes a vacuum film suction device (164), which is arranged below the crystal expansion ring (161). The vacuum film suction device (164) is provided with an adsorption mechanism (1641) at the top for adsorbing the LED chip film. The adsorption mechanism (1641) includes a shell, which is provided with an opening at the top and a ejector pin inside. The ejector pin can move upward relative to the shell and pass through the opening.

6. The ultra-flexible copper wire light string production equipment according to claim 1, characterized in that: The operating platform (1) further comprises a packaging mechanism (17), wherein the packaging mechanism (17) is used to realize automatic packaging of LED chips, wherein the packaging mechanism (17) comprises a glue dispensing device (171) and a three-way driving device (172), wherein the three-way driving device (172) is connected to the glue dispensing device (171) and is used to drive the glue dispensing device (171) to move relative to the operating platform (1) in the X-axis direction, the Y-axis direction and the Z-axis direction, and wherein the glue dispensing device (171) comprises a plurality of glue dispensing pens (1711), wherein different glue dispensing pens (1711) can store packaging glues of different colors, thereby realizing multi-color packaging of LED chips.

7. The ultra-flexible copper wire light string production equipment according to claim 6, characterized in that: The packaging mechanism (17) also includes a support seat (173), a first fixed plate (174) and a second fixed plate (175); the three-way driving device (172) includes an X-direction driving unit (1721), a Y-direction driving unit (1722) and a Z-direction driving unit (1723); the first fixed plate (174) is movably connected to the support seat (173) through the X-direction driving unit (1721) and the Y-direction driving unit (1722) to achieve movement of the first fixed plate (174) relative to the support seat (173) in the X-axis direction and the Y-axis direction; one end of the second fixed plate (175) is fixedly connected to the first fixed plate (174) and the other end is connected to the glue dispensing device (171) through the Z-direction driving unit (1723); the glue dispensing device (171) is moved in the Z-direction direction through the Z-direction driving unit (1723).

8. The ultra-flexible copper wire light string production equipment according to claim 1, characterized in that: The driving mechanism (14) comprises a clamping device (141) for "grabbing" the copper wire, and the clamping device (141) is provided with two groups, and the two groups of the clamping devices (141) can move back and forth alternately along the processing direction of the copper wire relative to the operating platform to continuously drive the copper wire to move forward; The clamping device (141) comprises a front-and-rear driving cylinder (1411), a first connecting plate (1412), a left-and-right driving cylinder (1413), a second connecting plate (1414), a clamping portion (1415) and a clamping cylinder (1416). The front-and-rear driving cylinder (1411) is connected to the first connecting plate (1412) to drive the first connecting plate (1412) to move forward and backward along the processing direction of the copper wire. The second connecting plate (1414) is connected to the first connecting plate (1412) to drive the first connecting plate (1412) to move forward and backward along the processing direction of the copper wire. The dynamic cylinder (1413) is connected to the first connecting plate (1412), and the left and right driving cylinders (1413) are used to drive the second connecting plate (1414) to move in the left and right directions relative to the first connecting plate (1412). The clamping part (1415) is arranged on the second connecting plate (1414) and is connected to the clamping cylinder (1416). The clamping cylinder (1416) is used to drive the clamping part (1415) to open and close so as to clamp the copper wire.

9. The ultra-flexible copper wire light string production equipment according to claim 1, characterized in that: The shaping mechanism (11) comprises a pressing portion (111) and a pressing platform (112); the pressing portion (111) is arranged above the pressing platform (112) and can move up and down relative to the pressing platform (112); the pressing platform (112) is formed with a first guide hole (1121) and a second guide hole (1122) at the front and rear ends respectively; the copper wire can be inserted through the first guide hole (1121), pass through the bottom of the pressing portion (111), and then pass out from the second guide hole (1122); the shaping mechanism (11) further comprises a flexible block (113); the flexible block (113) is arranged between the pressing portion (111) and the pressing platform (112).

10. The ultra-flexible copper wire light string production equipment according to claim 1, characterized in that: The equipment body (10) further comprises a wire feeding drum (21), wherein the wire feeding drum (21) is arranged behind the shaping mechanism (11) and is used for conveying copper wire to the shaping mechanism (11); The device body (10) further comprises a wire taking-up device (22), the wire taking-up device (22) comprising a support rod (221), a counterweight rod (222), a wire taking-up drum (223) and a wire taking-up motor (224), the support rod (221) being arranged on one side of the driving mechanism (14), and a first wire taking-up pulley (2211) being arranged on the support rod (221) for receiving the copper wire from the driving mechanism (14); The device body (10) forms a storage space (101) below the operating platform (1); the counterweight rod (222), the wire take-up drum (223) and the wire take-up motor (224) are all arranged on the mounting seat (102) of the storage space (101); a second wire take-up pulley (2221) is arranged at one end of the counterweight rod (222), and the other end is movably connected to the mounting seat (102) to realize the swing of the second wire take-up pulley (2221) in the vertical direction; the second wire take-up pulley (2221) is used to receive the copper wire from the first wire take-up pulley (2211); the wire take-up motor (224) is connected to the wire take-up drum (223) to drive the wire take-up drum (223) to rotate; the wire take-up drum (223) is used to receive the copper wire from the second wire take-up pulley (2221) to realize the storage of the copper wire; The equipment body (10) further comprises a plurality of curing lamps (103), wherein the curing lamps (103) are arranged on the operating platform (1) and arranged along the processing direction of the copper wire; The mounting platform (13) further comprises a heating element (132), wherein the heating element (132) is used to generate heat after being powered on.

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