Silicon-based sample scribing device

Abstract

The technical scheme of the utility model provides a silicon-based sample scribing device. The silicon-based sample scribing device comprises a sample platform, a carving head assembly, a linear driving piece and a microscope, the carving head assembly comprises a telescopic piece, a pressure sensor and a carving head, the carving head is arranged at the movable end of the telescopic piece, and the pressure sensor is arranged between the carving head and the telescopic piece and used for detecting the carving pressure of the carving head; the linear driving piece is mounted above the sample platform, and the movable end of the linear driving piece is connected with the carving head assembly and used for driving the carving head assembly to linearly move. Through the cooperation of the carving head assembly and the linear driving piece, the pressure can be controlled, scribing is carried out in a linear guiding mode, the scribing direction is stable, the scribing success rate is high, silicon-based sample breakage caused by too large pressure is avoided, and the scribing efficiency is improved through the cooperation of a microscope and marked lines on the microscope. The scribing position can be calibrated and positioned conveniently, the whole scribing process can be monitored conveniently, and the scribing position precision can be controlled conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon-based sample processing, in particular to a silicon-based sample slicing device. Background Art

[0002] Silicon-based samples are usually slicing by diamond scribing or laser scribing. Laser scribing, for example, patent 201621468324.9, a laser scribing device for silicon-based solar cells, uses a high-energy laser beam to scribing the silicon base, which is fast but costly. When using diamond to scribing silicon-based samples, short lines several millimeters long are usually scratched vertically and horizontally along the crystal direction, and then the sample is cracked along the scratched lines. This scribing method is fast, convenient, and low-cost. In addition, in applications where optoelectronic chips use end-face optical coupling, the diamond scribing method can provide clean and neat end faces to achieve low-loss optical coupling, which cannot be replaced by laser cutting.

[0003] In the prior art, the following are common schemes for diamond scribing: Scheme 1, manual scribing based on a diamond scribing pen, holding the diamond scribing pen in hand, using tools such as a ruler and tweezers to scribble lines at the corresponding position of the substrate; Scheme 2, manual scribing based on an X, Y dual-axis slide rail, mounting the diamond scribing pen on a fixture with an X, Y dual-axis slide rail, using a ruler, moving the scribing pen in the X, Y directions to the planned scribing starting point, locking the movement in the X direction, pressing the scribing head, and manually sliding the scribing pen in one direction along the Y direction to complete the scribing ; Option three, manual engraving based on a spring-buffered engraving head, install the diamond engraving head in the hollow hole of the spring to form a spring-buffered engraving head, and then install it on a slider that can slide along the Y direction. The silicon-based sample is placed on a sample stage that can move along the X direction. A microscope is installed above the sample stage for observation. With the help of a microscope, the position of the sample to be engraved is moved to the middle position of the device, and the engraving head is moved to the middle position of the device, that is, the starting point of the engraving line. Press the spring-buffered engraving head and lock it. Manually slide the engraving head in one direction along the Y direction to complete the engraving.

[0004] The existing operation scheme mentioned above is difficult to control the pressure of the engraving head and correct the position of the engraving line, resulting in a high rate of operational errors and a high probability of substrate breakage. Therefore, in order to improve the success rate of diamond scribing, how to accurately scribe on silicon-based samples is a technical problem that needs to be solved. Utility Model Content

[0005] In view of this, it is necessary to provide a silicon-based sample scribing device to solve the technical problem of how to accurately scribing on silicon-based samples in the prior art.

[0006] In order to achieve the above technical objectives, the technical solution of the present utility model provides a silicon-based sample scribing device, comprising:

[0007] Sample platform;

[0008] A carving head assembly includes a telescopic member, a pressure sensor, and a carving head, wherein the carving head is arranged at the movable end of the telescopic member, and the pressure sensor is arranged between the carving head and the telescopic member for detecting the carving pressure of the carving head;

[0009] a linear drive component, which is installed above the sample platform and has a movable end connected to the engraving head assembly, and is used to drive the engraving head assembly to move linearly; and

[0010] The microscope is slidably connected to the linear drive member through a frame and is opposite to the scribing head. A marking line is provided on the lens of the microscope for calibration and positioning of the marking line position.

[0011] Furthermore, the sample platform includes a rotating base, a linear guide rail and a storage platform. The rotating base is slidably connected to the linear guide rail, and the storage platform is arranged at the rotating end of the rotating base.

[0012] Furthermore, the sample platform also includes a pumping assembly, which is installed on the storage platform and is used to absorb and fix the sample.

[0013] Furthermore, the pump suction assembly includes a suction cup port, an air pipe and a vacuum pump. The suction cup port is embedded in the top of the storage platform and passes through the storage platform downward. The air pipe is arranged at the bottom of the suction cup port and is connected and communicated with the vacuum pump.

[0014] Furthermore, the microscope is inclined at a 45° angle toward the bottom end of the scribing head.

[0015] Furthermore, the linear drive component includes a guide rail, a screw pair and a slider, the slider is slidably connected to the guide rail, the slider is threadedly connected to the screw pair, and a stepping motor is provided at one end of the screw pair.

[0016] Furthermore, the frame is slidably connected to the guide rail.

[0017] Furthermore, the microscope is connected to a display via an image sensor for image display.

[0018] Furthermore, the scribing head includes a diamond scribing head and a buffer member, wherein the buffer member is arranged on the top of the diamond scribing head and connected to the movable end of the telescopic member.

[0019] Furthermore, the buffer member includes a base tube, a guide rod and a spring. Several guide rods are arranged in a circular distribution on the outside of the diamond engraving head. The two ends of the spring are respectively connected to the top wall of the base tube and the top of the diamond engraving head. The inner wall of the base tube is provided with several guide grooves, and the guide rods are slidably connected to the guide grooves in a one-to-one corresponding manner.

[0020] Compared with the existing technology, the beneficial effects of the present invention are as follows: through the cooperation of the engraving head assembly and the linear drive component, the pressure can be controlled, and the scribing is performed with linear guidance, the engraving direction is stable, the success rate of scribing is high, and the cracking of the silicon-based sample caused by excessive pressure is avoided. In combination with a microscope, the marking lines on it are convenient for calibrating and positioning the engraving position and monitoring the entire engraving process, which is convenient for controlling the position accuracy of the scribing. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a three-dimensional diagram of the structure of the silicon-based sample scribing device according to an embodiment of the present utility model;

[0022] Figure 2 1 is a front view of a silicon-based sample scribing device according to an embodiment of the present utility model;

[0023] Figure 3 is a three-dimensional exploded view of a scoring head according to an embodiment of the present invention;

[0024] Figure 4 This is a three-dimensional exploded view from another perspective of the scoring head according to an embodiment of the present invention;

[0025] Figure 5 This is a three-dimensional elevation diagram of the storage platform, rotating base, and pumping assembly according to an embodiment of the present utility model;

[0026] In the figure: 1. Sample platform; 11. Rotating base; 12. Linear guide; 13. Storage platform; 14. Pump assembly; 141. Suction cup port; 142. Air pipe; 143. Vacuum pump;

[0027] 2. Engraving head assembly; 21. Telescopic member; 22. Pressure sensor; 23. Scribing head; 231. Diamond engraving head; 232. Buffer; 2321. Base tube; 2322. Guide rod; 2323. Spring; 2324. Guide groove;

[0028] 3. Linear drive; 31. Guide rail; 32. Screw pair; 33. Slider;

[0029] 4. Microscope; 41. Stand. DETAILED DESCRIPTION

[0030] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, and are not used to limit the scope of the present invention.

[0031] like Figure 1-5 As shown, the utility model provides a silicon-based sample slicing device, including a sample platform 1, a carving head assembly 2, a linear drive 3 and a microscope 4. The sample platform 1 is used to position the silicon-based sample for subsequent slicing by the carving head assembly 2; the carving head assembly 2 includes a telescopic member 21, a pressure sensor 22 and a scratching head 23. The scratching head 23 is arranged at the movable end of the telescopic member 21, and the telescopic member 21 controls the scratching head 23 to be raised and lowered so that it applies pressure to the surface of the silicon-based sample and can be lifted up to away from the surface of the silicon-based sample. The pressure sensor 22 is arranged between the scratching head 23 and the telescopic member 21, and is used to detect the scratching pressure of the scratching head 23. According to the pressure value fed back by the pressure sensor 22, the downward pressure of the telescopic member 21 is correspondingly adjusted to avoid pressure. The silicon-based sample is broken due to being too large; the linear drive 3 is installed above the sample platform 1, and fixed beams are provided on both sides of the sample platform 1. The linear drive 3 is horizontally mounted on the top of the fixed beam, and the movable end of the linear drive 3 is connected to the engraving head assembly 2, which is used to drive the engraving head assembly 2 to move linearly and drive the engraving head assembly 2 to engrave along the engraving position; the microscope 4 is slidably connected to the linear drive 3 through the frame 41, which is used to slide and adjust the position along the guide direction of the linear drive 3, and the microscope 4 is opposite to the engraving head 23, which is used to shoot the engraving position, wherein a marking line is provided on the lens of the microscope 4 for calibrating and positioning the engraving position, monitoring the engraving head 23 throughout the engraving process, and obtaining better positioning accuracy.

[0032] It can be understood that in use, the silicon-based sample is placed on the sample platform 1, and a limit line is set on the sample platform 1. The edge to be engraved is facing the side of the engraving head 23 and basically coincides with the limit line, and is positioned on the sample platform 1. The sample platform 1 is adjusted so that the marking line in the microscope 4 coincides with the position to be engraved (or the engraving line mark) of the sample. The engraving head 23 is moved downward through the telescopic part 21. When the engraving head 23 contacts the surface of the sample, the engraving head 23 is slowly moved downward to apply pressure so that the pressure reaches the set value, and then the linear drive part 3 is used to drive the engraving head 23 to move, draw the engraved line, and move the engraving head 23 upward to reset it; wherein, the telescopic part 21 can adopt an electric push rod or other telescopic device with controllable pressure speed and pressure to facilitate the control of the lifting and lowering of the engraving head 23. In addition, the telescopic part 21 can also adopt manual downward pressure, but it needs to be equipped with a locking part. When the pressure is applied to the corresponding pressure value, the locking part can be used to lock the position.

[0033] In this embodiment, in order to facilitate the adjustment of the position of the silicon-based sample, the sample platform 1 includes a rotating base 11, a linear guide rail 12 and a storage platform 13. The rotating base 11 is slidably connected to the linear guide rail 12, and the storage platform 13 is arranged at the rotating end of the rotating base 11. The rotating base 11 is used to provide a rotation function for the storage platform 13 so that it can be rotated to adjust the position. The linear guide rail 12 is parallel to the linear drive member 3 and is used to adjust the position of the storage platform 13 along the guide rail direction, wherein fixed beams are installed at both ends of the linear guide rail 12.

[0034] It can be understood that the movement adjustment of the storage platform 13 can be manually adjusted by sliding the storage platform 13 and the rotating base 11 along the linear guide rail 12 to adjust the position horizontally. If the storage platform 13 needs to be rotated, the storage platform 13 can be rotated based on the rotating base 11.

[0035] It should be noted that both the linear guide rail 12 and the rotating base 11 have damping to improve the stability of position movement, and the linear guide rail 12 and the rotating base 11 are also provided with locking parts for locking the position to further improve stability. The locking parts can be locked with bolts, which is a conventional operation in the existing technology and will not be elaborated on here.

[0036] Furthermore, in order to facilitate rapid and stable positioning of silicon-based samples, the sample platform 1 also includes a pumping assembly 14, which is installed on the storage platform 13 and is used to adsorb and fix the sample. Adsorption positioning is used to avoid damage to the silicon-based sample by rigid clamping.

[0037] Specifically, the pumping assembly 14 includes a suction cup port 141, an air pipe 142 and a vacuum pump 143. Several of the suction cup ports 141 are embedded in the top of the placement platform 13 and penetrate downward through the placement platform 13. The air pipe 142 is arranged at the bottom of the suction cup port 141 and is connected and communicated with several of the vacuum pumps 143. By drawing a vacuum through the vacuum pump 143, suction is generated at the suction cup port 141, and the silicon-based sample can be positioned on the placement platform 13.

[0038] In this embodiment, in order to capture the bottom end of the scribing head 23 , the microscope 4 is tilted at a 45° angle toward the bottom end of the scribing head 23 to avoid obstruction and unclear capture.

[0039] It is understandable that the microscope 4 and the frame 41 can also be connected via a multi-dimensional adjustment arm to facilitate multi-angle adjustment of the shooting angle and position of the microscope 4.

[0040] In this embodiment, in order to electrically control the linear drive of the scoring head 23, the linear drive member 3 includes a guide rail 31, a lead screw pair 32, and a slider 33. The slider 33 is slidably connected to the guide rail 31, and the slider 33 is threadedly connected to the lead screw pair 32. A stepper motor is provided at one end of the lead screw pair 32. The lead screw pair 32 includes brackets and a lead lever at both ends. The brackets at both ends are connected to the fixed beams on both sides of the sample platform 1. The lead lever is rotatably connected to the bracket, and the stepper motor is fixed to one side of the bracket, and the output shaft on the stepper motor is fixedly connected to the lead lever. The stepper motor drives the lead lever to rotate, driving the slider 33 to slide along the guide rail 31, thereby achieving the purpose of linear drive.

[0041] It is understandable that the linear drive component 3 is not limited to the above structure. The linear drive component 3 can also adopt mature equipment with linear drive effect such as hydraulic telescopic rods, electric telescopic rods, and a set of screw guide pairs to achieve the function of linear drive.

[0042] Furthermore, in order to facilitate the movement of the microscope 4 along the driving direction of the linear driver 3 based on the linear driver 3, the frame 41 is slidably connected to the guide rail 31, so that the microscope 4 can be moved along the driving direction of the linear driver 3 by pushing the frame 41.

[0043] It is understandable that the frame 41 is also provided with a locking bolt for locking the guide rail 31 to lock the position.

[0044] Furthermore, in order to facilitate viewing of the images captured by the microscope 4, the microscope 4 is connected to a display via an image sensor for image display. The microscope 4 may also be equipped with a bottom lighting lamp for illumination to enhance image clarity.

[0045] It should be noted that the transmission of video signals by the microscope 4 through the image sensor is a prior art and will not be elaborated on here.

[0046] In this embodiment, in order to provide stable buffering when the scratching head 23 contacts the silicon-based sample, the scratching head 23 includes a diamond scratching head 231 and a buffer 232. The buffer 232 is arranged at the top of the diamond scratching head 231 and is connected to the movable end of the telescopic member 21. The buffer 232 provides buffering when scratching the silicon-based sample to avoid the silicon-based sample from being broken due to direct hard pressure.

[0047] Specifically, in order to achieve a stable and non-shaking buffering effect, the buffer member 232 includes a base tube 2321, a guide rod 2322 and a spring 2323. The four guide rods 2322 are arranged in a circular distribution on the outside of the diamond engraving head 231. The two ends of the spring 2323 are respectively connected to the inner top wall of the base tube 2321 and the top of the diamond engraving head 231. The inner wall of the base tube 2321 is provided with four guide grooves 2324. The guide rods 2322 are slidably connected to the guide grooves 2324 in a one-to-one corresponding manner. When the diamond engraving head 231 contacts the silicon-based sample, it is squeezed upward and buffered by the spring 2323. In the process of upward extrusion, the sliding guidance of the guide rods 2322 and the guide grooves 2324 improves the stability of the upward extrusion buffering movement.

[0048] The specific working process of the present invention is as follows: during the scoring process, the sample is placed on the sample platform 1, and the edge to be scored is directed toward the scoring head 23 and basically coincides with the limit line. The vacuum pump 143 is turned on to adsorb and fix the sample. The sample is observed through the microscope 4, and the focus is fine-tuned to make the image of the sample surface clear. The sample stage is adjusted so that the marking line in the microscope 4 coincides with the position to be scored (or the scoring mark) of the sample. The scoring head 23 is driven to the starting point of the scoring line by the linear drive 3, and then the scoring head 23 is moved downward by the telescopic part 21. When the scoring head 23 contacts the sample surface, the scoring head 23 is slowly moved downward to apply pressure so that the pressure reaches the set value. The linear drive 3 is then used to drive the moving scoring head 23 to score the line, and then the scoring head 23 is moved upward to reset. The vacuum pump 143 is turned off, and the sample is removed. , the engraving is completed; calibration process, when the device has not been used for a long time, the microscope 4 is moved, or the thickness of the sample to be engraved is much thicker than the thickness of the commonly used samples, it is necessary to calibrate the engraving positioning, prepare an empty silicon-based sample, place it on the sample platform 1 and fix it by vacuum adsorption. During the calibration process, first move the engraving head 23 to the starting position of the engraving line, fine-tune the microscope 4, observe a clear image of the sample and the engraving head 23, and then move the microscope 4 along the guide rail direction so that the positioning mark line in the microscope 4 basically coincides with the engraving head 23, and then control the engraving head 23 to engrave a line, and move the microscope 4 along the guide rail direction again so that the positioning mark line in the microscope 4 coincides with the engraving line, repeat the calibration several times until they coincide with the engraving line, and then do not change the position of the microscope 4.

[0049] The entire workflow is complete, and all contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0050] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any changes or replacements that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed in the present invention should be covered by the protection scope of the present invention.

Claims

1. A silicon-based sample slicing device, characterized in that: include: Sample platform; A carving head assembly, comprising a telescopic member, a pressure sensor and a carving head, wherein the carving head is arranged at the movable end of the telescopic member, and the pressure sensor is arranged between the carving head and the telescopic member to detect the carving pressure of the carving head; A linear drive component, which is installed above the sample platform and has a movable end connected to the engraving head assembly, and is used to drive the engraving head assembly to move linearly; as well as The microscope is slidably connected to the linear drive member through a frame and is opposite to the scribing head. A marking line is arranged on the lens of the microscope for calibration and positioning of the marking line position.

2. The silicon-based sample scribing device according to claim 1, characterized in that: The sample platform comprises a rotating base, a linear guide rail and a storage platform. The rotating base is slidably connected to the linear guide rail, and the storage platform is arranged at the rotating end of the rotating base.

3. The silicon-based sample scribing device according to claim 2, characterized in that: The sample platform also includes a pumping assembly, which is installed on the storage platform and is used to absorb and fix the sample.

4. The silicon-based sample scribing device according to claim 3, characterized in that: The pump suction assembly includes a suction cup port, an air pipe and a vacuum pump. The suction cup port is embedded in the top of the storage platform and penetrates downward through the storage platform. The air pipe is arranged at the bottom of the suction cup port and is connected and communicated with the vacuum pump.

5. The silicon-based sample scribing device according to claim 4, characterized in that: The microscope is inclined at 45° toward the bottom end of the scribing head.

6. The silicon-based sample scribing device according to claim 5, characterized in that: The linear drive component comprises a guide rail, a lead screw pair and a slider, wherein the slider is slidably connected to the guide rail, the slider is threadedly connected to the lead screw pair, and a stepping motor is arranged at one end of the lead screw pair.

7. The silicon-based sample scribing device according to claim 6, characterized in that: The frame is slidably connected to the guide rail.

8. The silicon-based sample scribing device according to claim 7, characterized in that: The microscope is connected to a display via an image sensor for image display.

9. The silicon-based sample scribing device according to claim 8, characterized in that: The scribing head comprises a diamond scribing head and a buffer member, wherein the buffer member is arranged on the top end of the diamond scribing head and connected to the movable end of the telescopic member.

10. The silicon-based sample scribing device according to claim 9, characterized in that: The buffer component includes a base tube, a guide rod and a spring. A plurality of the guide rods are arranged in a circular distribution on the outside of the diamond engraving head. The two ends of the spring are respectively connected to the inner top wall of the base tube and the top of the diamond engraving head. A plurality of guide grooves are opened on the inner wall of the base tube. The guide rods are slidably connected to the guide grooves in a one-to-one corresponding manner.

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