Optical module micro-channel liquid cooling plate

Abstract

The utility model discloses an optical module micro-channel liquid cooling plate, which relates to the technical field of optical module heat dissipation, and comprises an optical module cold plate, an optical module cold plate upper cover and an optical module cold plate bottom plate, the optical module cold plate upper cover and the optical module cold plate bottom plate are covered on the surface of an optical module mouse cage and are connected with each other in a sealing manner, a channel cavity is arranged in the optical module cold plate, and heat conduction fins are laid in the channel cavity. The micro-channels are used for enabling the channel cavity to form a plurality of micro-channels; the optical module liquid inlet water nozzle is arranged on one side of the optical module cold plate, one end is communicated with the interior of the runner cavity, and the other end is communicated with the liquid inlet pipeline; and the optical module drainage water nozzle is arranged on the other side of the optical module cold plate, one end is communicated with the interior of the runner cavity, and the other end is communicated with the drainage pipeline. According to the optical module micro-channel liquid cooling plate provided by the utility model, the optical module cold plate adopts a plate structure and covers the optical module mouse cage, so that the installation and the maintenance are more convenient. And the integrated micro-channel structure formed by the channel cavity and the heat conduction fins is matched, so that the cooling effect is more stable, the heat dissipation efficiency is higher, and the heat dissipation energy consumption is effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of optical module heat dissipation, in particular to an optical module microchannel liquid cooling plate. Background Art

[0002] With the rapid application and promotion of switches, the traditional air-cooling of switches has increased with the growth of heat dissipation demand. As a standard device, the switch has limited internal space and cannot meet the heat dissipation demand by increasing the number of fans, which makes the high power consumption, high speed and high noise problems of fans prominent.

[0003] Chinese patent CN 202220269567.9 discloses an optical module liquid-cooled radiator, comprising: a water-cooled plate, a heat pipe, a pressure plate, an optical module assembly, a power module heat sink and a group of CPU heat sinks, the water-cooled plate is arranged on one side of the optical module assembly, a copper block is arranged on the optical module assembly, the heat pipe is arranged above the optical module assembly, the pressure plate is arranged above the heat pipe, the heating end of the heat pipe is connected to the copper block, the heat dissipation end is connected to the water-cooled plate, one end of the water-cooled plate is connected to the water inlet pipe through an inlet joint connected to a quick joint, and the other end is provided with a cooling pipe, the cooling pipe is laid on the power module heat sink, the other end of the cooling pipe is connected to the water inlet end of the CPU heat sink through a pipeline, and the water outlet end of the CPU heat sink is connected to the outlet joint through a connecting pipe and a quick joint.

[0004] Existing optical modules use air cooling or liquid cooling, and the air cooling effect is poor. Due to technical limitations, existing liquid cooling usually adopts a split heat conduction and heat dissipation structure. The heat dissipation effect of high-load optical modules cannot be maintained continuously, energy consumption increases, and the heat dissipation effect is unstable. Utility Model Content

[0005] The utility model aims to at least solve the technical problems existing in the prior art, namely, "the existing air cooling has high energy consumption, the existing liquid cooling has large volume, the split structure leads to unstable heat dissipation effect, and low energy utilization efficiency". To this end, the utility model proposes an optical module microfluidic liquid cooling plate, which integrates integrated liquid cooling in the effective space without changing the original structure of the optical module, making installation and maintenance more convenient, the cooling effect more stable, and reducing the energy consumption of the heat dissipation components.

[0006] According to some embodiments of the present invention, the optical module microfluidic liquid cooling plate is applied to the optical module cage; it includes:

[0007] An optical module cold plate, covering the surface of the optical module cage, the optical module cold plate comprising an optical module cold plate upper cover and an optical module cold plate bottom plate which are sealed and connected to each other, a flow channel cavity is arranged in the optical module cold plate, a heat conducting fin is laid in the flow channel cavity, and the heat conducting fin is used to form a plurality of micro channels in the flow channel cavity;

[0008] An optical module liquid inlet nozzle is arranged on one side of the optical module cold plate, one end of which is connected to the interior of the flow channel cavity, and the other end of which is connected to the liquid inlet pipeline;

[0009] The optical module drainage nozzle is arranged on the other side of the optical module cold plate, one end of which is communicated with the interior of the flow channel cavity, and the other end of which is communicated with the drainage pipeline.

[0010] According to some embodiments of the present invention, the heat-conducting fins are in any one of a strip shape, a tooth shape, a column shape and a prismatic shape.

[0011] According to some embodiments of the present invention, the heat conducting fins are arranged in multiple rows, and the heat conducting fins in adjacent rows are arranged in a staggered manner to extend the path length of the microchannel.

[0012] According to some embodiments of the present invention, the thickness of the thermal conductive fins is 1.0 mm, and the arrangement spacing of the thermal conductive fins in the same row is 2.5 mm to 3.5 mm.

[0013] According to some embodiments of the present invention, the heat conducting fins extend from the bottom of the flow channel cavity to the top of the flow channel cavity.

[0014] According to some embodiments of the present invention, the optical module cold plates are provided in two groups, which are respectively located at the upper and lower ends of the optical module cage.

[0015] According to some embodiments of the present invention, a plurality of contact surfaces are arranged at equal intervals on one side of the optical module cold plate close to the optical module cage, and the contact surfaces are used to fit the surface of the optical module cage.

[0016] According to some embodiments of the present invention, the thickness of the optical module cold plate is 4.5 mm to 5.5 mm.

[0017] According to some embodiments of the utility model, a switch cooling part is included, the switch cooling part includes a switch cold plate upper cover and a switch cold plate bottom plate, the switch cold plate upper cover and the switch cold plate bottom plate are sealed and connected; a switch liquid inlet nozzle is provided on one side of the switch cooling part, and a switch liquid discharge nozzle is provided on the other side.

[0018] According to some embodiments of the utility model, it includes a liquid inlet separator and a liquid outlet separator, one end of the liquid inlet separator is connected to a liquid inlet quick-plug connector through a pipeline, and the other end is respectively connected to the optical module liquid inlet nozzle and the switch liquid inlet nozzle; one end of the liquid outlet separator is connected to a liquid outlet quick-plug connector through a pipeline, and the other end is respectively connected to the optical module liquid discharge nozzle and the switch liquid discharge nozzle.

[0019] According to some embodiments of the optical module microfluidic cooling plate of the utility model, at least the following beneficial effects are achieved: the optical module cold plate adopts a plate structure, which is covered on the optical module cage, and is more convenient to install and maintain. The integrated microfluidic structure formed by the flow channel cavity and the heat conducting fins has a more stable cooling effect, a higher heat dissipation efficiency, and effectively reduces heat dissipation energy consumption.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0022] Figure 1 This is a three-dimensional schematic diagram of a microfluidic cooling plate for an optical module according to an embodiment of the utility model;

[0023] Figure 2 This is a partial schematic diagram of a microfluidic cooling plate for an optical module according to an embodiment of the utility model;

[0024] Figure 3 This is an exploded schematic diagram of an optical module cold plate according to an embodiment of the present utility model;

[0025] Figure 4 This is a schematic diagram of the flow channel cavity and heat conducting fins of the optical module cold plate according to an embodiment of the present utility model.

[0026] Reference numerals:

[0027] Optical module cold plate 100, optical module cold plate upper cover 110, optical module cold plate bottom plate 120, flow channel cavity 130, heat conducting fins 140, optical module liquid inlet nozzle 150, optical module liquid discharge nozzle 160, contact surface 170,

[0028] Switch cooling unit 200, switch cold plate upper cover 210, switch cold plate bottom plate 220, switch liquid inlet nozzle 230, switch liquid discharge nozzle 240,

[0029] A liquid inlet dispenser 310 , a liquid outlet dispenser 320 , a liquid inlet quick-connect connector 330 , and a liquid outlet quick-connect connector 340 . DETAILED DESCRIPTION

[0030] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0031] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, top, bottom, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0033] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0034] Reference below Figure 1-Figure 4 The microfluidic channel cooling plate for an optical module according to an embodiment of the utility model is described.

[0035] like Figure 1-Figure 4 As shown, the optical module microfluidic cooling plate is mainly used in the optical module cage. It includes an optical module cold plate 100, an optical module liquid inlet nozzle 150 and an optical module liquid outlet nozzle 160. Specifically, the optical module cold plate 100 covers the surface of the optical module cage, and the optical module cold plate 100 includes an optical module cold plate upper cover 110 and an optical module cold plate bottom plate 120 which are sealed and connected to each other.

[0036] A flow channel cavity 130 is arranged in the optical module cold plate 100, and heat-conducting fins 140 are laid in the flow channel cavity 130. The heat-conducting fins 140 are used to form a plurality of micro-channels in the flow channel cavity 130. Specifically, the upper cover 110 of the optical module cold plate and the bottom plate 120 of the optical module cold plate are connected by a brazing process to form a sealed flow channel cavity 130, and a plurality of rows of heat-conducting fins 140 are arranged in the flow channel cavity 130, and each row of heat-conducting fins 140 is spaced a certain distance apart, and the space in the flow channel cavity 130 is divided into a plurality of micro-channels by the heat-conducting fins 140. The optical module liquid inlet nozzle 150 is arranged on one side of the optical module cold plate 100, one end of which is connected to the inside of the flow channel cavity 130, and the other end of which is connected to the liquid inlet pipeline. The optical module liquid discharge nozzle 160 is arranged on the other side of the optical module cold plate 100, one end of which is connected to the inside of the flow channel cavity 130, and the other end of which is connected to the liquid discharge pipeline.

[0037] In this embodiment, the cooling medium enters the flow channel cavity 130 through the optical module liquid inlet nozzle 150, and the side of the optical module cold plate 100 that contacts the optical module cage absorbs the heat from the heat source surface of the cage, and the thermal conductive fins 140 can further transfer the heat of the optical module cold plate 100 to the thermal conductive fins 140, so that the heat is concentrated in the three-dimensional space of the flow channel cavity 130, and the cooling medium flows along the microchannel to absorb and take away the heat from the heat source contact surface 170 of the thermal conductive fins 140 and the optical module cold plate 100, thereby achieving efficient cooling.

[0038] Compared with the existing split structure that forms the cooling channel through a metal tube, the optical module microchannel liquid cooling plate in this embodiment uses a plate structure to directly add multiple heat-conducting fins 140 on the cold plate to cooperate with the channel cavity 130 to form a larger thermal contact surface 170. Not only does it improve the cooling effect of the optical module cooling plate, but it also reduces the volume of the cooling component, achieving more efficient cooling efficiency with a smaller cooling volume, reducing the heat dissipation energy consumption of the equipment, reducing the total amount of energy consumed by the data center, and reducing the PUE ratio.

[0039] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, the heat-conducting fin 140 is in any one of the shapes of a long strip, a tooth, a column, and a prism. Specifically, in this embodiment, the heat-conducting fin 140 is in a long strip structure, and the heat-conducting fin 140 is integrally formed with the optical module cold plate bottom plate 120. In addition to absorbing the heat from the heat source surface of the optical module cold plate 100, the heat-conducting fin 140 can also form a plurality of reinforcing ribs in the flow channel cavity 130, thereby improving the structural strength of the optical module cold plate 100 and extending the flow path of the cooling medium in the flow channel cavity 130, so that the cooling medium can fully absorb the heat and improve the cooling effect.

[0040] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, the heat conducting fins 140 are arranged in multiple rows, and the heat conducting fins 140 in adjacent rows are arranged in a staggered manner to extend the path length of the microchannel. Specifically, each row of heat conducting fins 140 is spaced a certain distance apart, and the heat conducting fins 140 in adjacent rows are arranged in a staggered manner to extend the path length of the microchannel in the channel cavity 130.

[0041] In some embodiments of the present invention, Figure 3 and Figure 4As shown, the thickness of the thermal fins 140 is 1.0 mm, and the arrangement spacing of the thermal fins 140 in the same row is 2.5 mm to 3.5 mm. Specifically, in this embodiment, the arrangement spacing of the thermal fins 140 is 3 mm. The use of a 3mm layout density will not cause excessive flow resistance to affect the flow rate of the cooling medium, nor will it increase the operation and maintenance costs due to too low a density. If the density of the thermal fins 140 is too small, the water quality particle size requirements for the computer room will be more stringent, and poor water filtration will cause microchannel blockage.

[0042] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, the heat conducting fin 140 extends from the bottom of the flow channel cavity 130 to the top of the flow channel cavity 130. Specifically, the bottom and top of the heat conducting fin 140 are respectively attached to the upper and lower walls of the flow channel cavity 130. The structural strength of the optical module cold plate 100 is effectively improved, and the gap between the heat conducting fin 140 and the flow channel cavity 130 is prevented from affecting the flow of the cooling medium.

[0043] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, the optical module cold plate 100 is provided with two groups, which are respectively located at the upper and lower ends of the optical module cage. Specifically, in this embodiment, the optical module cold plate 100 is provided with two groups, one group is attached to the top of the optical module cage, and the other group is attached to the bottom of the optical module cage, so that the heat dissipation effect is better and the space gap in the device is fully utilized.

[0044] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, a plurality of contact surfaces 170 are evenly spaced on one side of the optical module cold plate close to the optical module cage, and the contact surfaces 170 are used to fit the surface of the optical module cage. Specifically, the contact surface 170 fits more closely with the heat source surface of the optical module cage, and can transfer heat to the flow channel cavity 130 more quickly, thereby improving the heat dissipation effect.

[0045] In some embodiments of the utility model, the thickness of the optical module cold plate 100 is 4.5 mm to 5.5 mm. In this embodiment, the optical module cold plate 100 is thin and can be installed at the optical module cage of most servers and switches. Without changing the internal structure of the device, the optical module microfluidic liquid cooling plate of this embodiment is more convenient to install and maintain later.

[0046] In some embodiments of the present invention, Figure 1 and Figure 2As shown, the switch cooling unit 200 includes a switch cold plate upper cover 210 and a switch cold plate bottom plate 220. The switch cold plate upper cover 210 and the switch cold plate bottom plate 220 are sealed and connected. A switch liquid inlet nozzle 230 is provided on one side of the switch cooling unit 200, and a switch liquid discharge nozzle 240 is provided on the other side.

[0047] Specifically, in addition to cooling the optical module cage, a switch cooling unit 200 is also provided to cool the heat generated by the device chip.

[0048] In a further embodiment, Figure 1 and Figure 2 As shown, it includes a liquid inlet dispenser 310 and a liquid outlet dispenser 320. One end of the liquid inlet dispenser 310 is connected to a liquid inlet quick-plug connector 330 through a pipeline, and the other end is respectively connected to the optical module liquid inlet nozzle 150 and the switch liquid inlet nozzle 230. One end of the liquid outlet dispenser 320 is connected to a liquid outlet quick-plug connector 340 through a pipeline, and the other end is respectively connected to the optical module liquid discharge nozzle 160 and the switch liquid discharge nozzle 240.

[0049] Specifically, the cooling medium enters the liquid inlet distributor 310 from the liquid inlet quick connector 330, and is then divided into two cooling pipelines. One cooling pipeline enters the switch cooling unit 200 through the switch liquid inlet nozzle 230 and is then discharged from the switch liquid discharge nozzle 240. The other cooling pipeline enters the flow channel cavity 130 through the optical module liquid inlet nozzle 150 and is then discharged from the optical module liquid discharge nozzle 160. The pipelines of the two liquid discharge nozzles are connected to the liquid outlet distributor 320 to form a pipeline that is discharged from the liquid outlet quick connector 340.

[0050] In some embodiments of the present invention, the cooling medium can be single-phase liquid cooling, including deionized water, PG25, EG25, fluorinated liquid, etc. It can also be two-phase liquid cooling, including Freon, R1233zd, R134a, etc. The internal cooling medium uses two-phase medium heat dissipation to consider the following design requirements. After the two-phase liquid cooling undergoes phase change, the internal pressure is about 1Mpa. When designing the optical module cold plate 100, reinforcing ribs need to be added to the flow channel cavity 130 for welding to increase the pressure-bearing capacity of the optical module cold plate 100.

[0051] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0052] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An optical module microfluidic cooling plate, applied to the optical module cage; characterized in that: include: An optical module cold plate (100) is covered on the surface of the optical module cage, the optical module cold plate (100) comprises an optical module cold plate upper cover (110) and an optical module cold plate bottom plate (120) which are sealed and connected to each other, a flow channel cavity (130) is arranged in the optical module cold plate (100), a heat conducting fin (140) is laid in the flow channel cavity (130), and the heat conducting fin (140) is used to form a plurality of micro channels in the flow channel cavity (130); An optical module liquid inlet nozzle (150) is arranged on one side of the optical module cold plate (100), one end of which is in communication with the interior of the flow channel cavity (130) and the other end of which is in communication with the liquid inlet pipeline; The optical module drainage nozzle (160) is arranged on the other side of the optical module cold plate (100), one end of which is in communication with the interior of the flow channel cavity (130), and the other end of which is in communication with the drainage pipeline.

2. The optical module microfluidic liquid cooling plate according to claim 1, characterized in that: The heat-conducting fins (140) are in any one of a strip shape, a tooth shape, a column shape and a ridge shape.

3. The optical module microfluidic liquid cooling plate according to claim 1, characterized in that: The heat conducting fins (140) are arranged in multiple rows, and the heat conducting fins (140) in adjacent rows are arranged in a staggered manner, so as to extend the path length of the microchannel.

4. The optical module microfluidic liquid cooling plate according to claim 1, characterized in that: The thickness of the heat-conducting fins (140) is 1.0 mm, and the arrangement spacing of the heat-conducting fins (140) in the same row is 2.5 mm to 3.5 mm.

5. The optical module microfluidic liquid cooling plate according to claim 4, characterized in that: The heat conducting fin (140) extends from the bottom of the flow channel cavity (130) to the top of the flow channel cavity (130).

6. The optical module microfluidic liquid cooling plate according to claim 1, characterized in that: The optical module cold plates (100) are provided in two groups, respectively located at the upper and lower ends of the optical module cage.

7. The optical module microfluidic liquid cooling plate according to claim 1, characterized in that: A plurality of contact surfaces (170) are arranged at equal intervals on one side of the optical module cold plate close to the optical module cage, and the contact surfaces (170) are used to fit the surface of the optical module cage.

8. The optical module microfluidic liquid cooling plate according to any one of claims 1 to 7, characterized in that: The optical module cold plate (100) has a thickness of 4.5 mm to 5.5 mm.

9. The optical module microfluidic liquid cooling plate according to claim 1, characterized in that: The switch cooling part (200) comprises a switch cold plate upper cover (210) and a switch cold plate bottom plate (220), and the switch cold plate upper cover (210) and the switch cold plate bottom plate (220) are sealed and connected; A switch liquid inlet nozzle (230) is provided on one side of the switch cooling part (200), and a switch liquid discharge nozzle (240) is provided on the other side.

10. The optical module microfluidic liquid cooling plate according to claim 9, characterized in that: It comprises a liquid inlet separator (310) and a liquid outlet separator (320), wherein one end of the liquid inlet separator (310) is connected to a liquid inlet quick-connect connector (330) via a pipeline, and the other end is respectively connected to the optical module liquid inlet nozzle (150) and the switch liquid inlet nozzle (230); One end of the liquid outlet distributor (320) is connected to a liquid outlet quick-connect connector (340) via a pipeline, and the other end is respectively connected to the optical module liquid outlet nozzle (160) and the switch liquid outlet nozzle (240).

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