Heat dissipation structure and server

Abstract

The utility model belongs to the technical field of servers, and relates to a heat dissipation structure, the heat dissipation structure comprises a case and a fan module, the case comprises a front panel, a rear panel, a top plate, a bottom plate and two side plates, the end parts of the two side plates facing the front panel are respectively provided with an air inlet, the rear panel is provided with an air outlet, and the fan module is connected with the top plate and the bottom plate. The fan module is located between the air inlet and the air outlet. The utility model further relates to a server which comprises the heat dissipation structure. According to the technical scheme provided by the utility model, hardware near the front panel and hardware far away from the front panel in the server case can be well cooled, and the uncomfortable influence of airflow formed by heat dissipation of the server on a human body in front of the front panel can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of servers, and more specifically, to a heat dissipation structure and a server. Background Art

[0002] When the server is working, the internal hardware will generate heat. If the temperature is too high, the hardware will be damaged and the server will not be able to operate normally. Therefore, heat dissipation is required. At present, there are various forms of heat dissipation design for servers, but there are still some imperfections. For example, the hardware near the front panel inside the server cannot be fully cooled. Utility Model Content

[0003] The embodiment of the utility model is used to solve the technical problem in the prior art that the hardware near the front panel inside the server cannot be sufficiently cooled.

[0004] In order to solve the above technical problems, the embodiment of the utility model provides a heat dissipation structure, which adopts the following technical solutions:

[0005] A heat dissipation structure comprises a chassis and a fan module. The chassis comprises a front panel, a rear panel, a top panel, a bottom panel and two side panels. The ends of the two side panels facing the front panel are each provided with an air inlet. The rear panel is provided with an air outlet. The fan module is located between the air inlet and the air outlet.

[0006] Furthermore, the air inlet and the air outlet are both arranged in a plurality in an array, and the minimum distance between the air inlet and the front panel is 5 mm to 30 mm.

[0007] Furthermore, among the two side panels, at least one of the side panels is provided with an exhaust port at an end portion facing the rear panel, and the fan module is located between the air inlet and the exhaust port.

[0008] Furthermore, the minimum distance between the air outlet and the outer side surface of the rear panel is 15 mm to 60 mm.

[0009] Furthermore, the fan module is located in the middle of the chassis.

[0010] In order to solve the above technical problems, the embodiment of the utility model further provides a server, which adopts the following technical solution:

[0011] A server comprises the heat dissipation structure described above.

[0012] Furthermore, the server also includes a mainboard, and the mainboard is located between the fan module and the air outlet.

[0013] Furthermore, the server further includes a power supply module, wherein the power supply module is located between the fan module and the air outlet, and a distance between the power supply module and the mainboard is greater than zero.

[0014] Furthermore, the server further includes a hard disk module, and the hard disk module is located between the front panel and the fan module.

[0015] Furthermore, the distances between the hard disk module and the two side panels are greater than zero.

[0016] Compared with the prior art, the embodiments of the present invention have at least the following beneficial effects:

[0017] By setting air inlets at the ends of the two side panels of the chassis facing the front panel, setting air outlets on the rear panel, and the fan module being located between the air inlet and the air outlet, when the fan module is working, the air entering from the air inlet can flow through the hardware near and far from the front panel in the chassis, and bring the heat on the hardware to the outside of the chassis, so as to achieve good heat dissipation effect. Since the airflow through port required for heat dissipation is omitted on the front panel, it can be avoided that the airflow formed by heat dissipation causes an uncomfortable effect on the human body located in front of the front panel (the front is located on the extension line of the line from the rear panel to the front panel). BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described below are only some embodiments of the present utility model. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

[0019] Figure 1 This is a schematic diagram of the overall structure of a server according to an embodiment of the utility model;

[0020] Figure 2 for Figure 1 A schematic diagram of the other direction of the server in FIG.

[0021] Figure 3 for Figure 1 The main view of the server in;

[0022] Figure 4 for Figure 1 Schematic diagram of the server with the top panel removed;

[0023] Figure 5 for Figure 4 A partial enlarged view of the middle A;

[0024] Figure 6 for Figure 1 Schematic diagram of the server in another direction after removing the top plate.

[0025] Figure numerals: 1—chassis, 11—front panel, 12—rear panel, 121—air outlet, 13—top panel, 14—bottom panel, 15—side panel, 151—air inlet, d1—first distance, 152—air outlet, d2—second distance, 2—fan module, 3—mainboard, 4—power module, 5—hard disk module. DETAILED DESCRIPTION

[0026] The present invention is described in more detail below in conjunction with specific examples, but the implementation of the present invention is not limited thereto. The examples are exemplary and intended to be used to explain the present invention, and cannot be understood as limiting the present invention. For process parameters or conditions not specifically noted, conventional techniques may be used.

[0027] See also Figures 1 to 6 As shown, an embodiment of the utility model provides a heat dissipation structure for a server, wherein the heat dissipation structure includes a chassis 1 and a fan module 2, wherein the chassis 1 includes a front panel 11, a rear panel 12, a top panel 13, a bottom panel 14 and two side panels 15, and air inlets 151 are provided at the ends of the two side panels 15 facing the front panel 11, and an air outlet 121 is provided on the rear panel 12, and the fan module 2 is located between the air inlet 151 and the air outlet 121.

[0028] Specifically, the two side panels 15 are arranged opposite to each other, the top panel 13 and the bottom panel 14 are arranged opposite to each other, the front panel 11 and the rear panel 12 are arranged opposite to each other, and the front panel 11, the rear panel 12, the top panel 13, the bottom panel 14 and the two side panels 15 enclose a rectangular internal space. It should be noted that the front panel 11 refers to the surface of the chassis 1 facing the person when the person normally uses the server. Of course, in other embodiments, the shape of the internal space enclosed by the front panel 11, the rear panel 12, the top panel 13, the bottom panel 14 and the two side panels 15 can be other shapes, such as a cube. The specific shapes of the front panel 11, the rear panel 12, the top panel 13, the bottom panel 14 and the two side panels 15 can also be adjusted. For example, they can have a certain degree of curvature and can be shaped like a spherical crown, etc., so that the shape of the internal space enclosed by the front panel 11, the rear panel 12, the top panel 13, the bottom panel 14 and the two side panels 15 is non-square, for example, roughly spherical, ellipsoidal, hemispherical, etc.

[0029] By setting air inlets 151 on the ends of the two side panels 15 of the chassis 1 facing the front panel 11, setting air outlets 121 on the rear panel 12, and the fan module 2 being located between the air inlet 151 and the air outlet 121, when the fan module 2 is working, the fan module 2 forms a suction effect on the air inlets 151 on the two side panels 15, and the air outside the chassis 1 enters the chassis 1 through the air inlets 151 on the two side panels 15 to form two airflows, both of which can flow through the hardware near the front panel 11 in the chassis 1, and bring the heat on the hardware near the front panel 11 to the outside of the chassis 1, which has a good heat dissipation effect on the hardware near the front panel 11. It can be understood that the hardware in the chassis 1 far away from the front panel 11 is on the airflow path formed by the operation of the fan module 2, and the heat on the hardware far away from the front panel 11 will also be brought to the outside of the chassis 1 by the airflow, which has a good heat dissipation effect on the hardware in the chassis 1 far away from the front panel 11. It should be noted that people usually sit in front of the front panel 11 when using the server. The front panel 11 of the utility model omits the airflow opening required for heat dissipation, which can avoid the uncomfortable effect of airflow on the human body. For example, in summer, the airflow discharged from the front panel 11 will make the person who is using the server unbearably hot, or in winter, the airflow from the front panel 11 into the chassis 1 will form wind around the person who is using the server, increasing the person's feeling of coldness.

[0030] Furthermore, in this embodiment, the air inlet 151 and the air outlet 121 are arranged in a plurality in an array shape. Under the condition of the same flow rate requirement, the size of each single air inlet 151 and each single air outlet 121 can be reduced, so that the isolation effect between the inside and outside of the chassis 1 is good, and the hardware in the chassis 1 is prevented from being damaged by foreign objects, and people are prevented from being scalded or electrocuted by the hardware in the chassis 1 when the server is running. The array-shaped arrangement is also convenient for batch processing of the air inlet 151 and the air outlet 121, and has a high aesthetics.

[0031] In this embodiment, the air inlets 151 and the air outlets 121 are arranged in rows and columns. For example, the air inlets 151 on each side panel 15 are arranged in four rows and six columns. Of course, in other embodiments, the number of rows and columns of the air inlets 151 can be adjusted according to the size of the chassis 1. When the chassis 1 is large, the number of rows and columns can be increased, and when the chassis 1 is small, the number of rows and columns can be reduced. Similarly, the number of rows and columns of the air outlets 121 can be determined according to the size of the chassis 1. In other embodiments, the air inlet 151 and the air outlet 121 can also be arranged in a concentric circle manner. For example, in one embodiment, a total of seventy-six air inlets 151 are arranged, with one air inlet 151 as the center, and the remaining seventy-five air inlets 151 are arranged around the center, and a total of five circles are arranged, which are called the first circle, the second circle, the third circle, the fourth circle and the fifth circle in the direction of increasing radius. The first circle is evenly distributed with five air inlets 151, the second circle is evenly distributed with ten air inlets 151, the third circle is evenly distributed with fifteen air inlets 151, the fourth circle is evenly distributed with twenty air inlets 151, and the fifth circle is evenly distributed with twenty-five air inlets 151. In the direction of increasing radius, the distance between each circle and the center is an arithmetic progression. Of course, the arrangement of the air inlets 151 is diverse. In other embodiments, the number and arrangement of the air inlets 151 can be determined according to specific circumstances.

[0032] In this embodiment, the air inlet 151 and the air outlet 121 are both rectangular. Of course, in other embodiments, the shapes of the air inlet 151 and the air outlet 121 can be adjusted. For example, the air inlet 151 and the air outlet 121 can be elliptical, circular, pentagonal, hexagonal, etc. The shapes of the air inlet 151 and the air outlet 121 can be the same or different.

[0033] Furthermore, in this embodiment, the minimum distance between the air inlet 151 and the front panel 11 (referred to as the first distance d1) is 5 mm to 30 mm, wherein 15 mm is preferred. The smaller the first distance d1, the better the heat dissipation effect on the hardware near the front panel 11 in the chassis 1, and the larger the first distance d1, the more convenient it is to process the air inlet 151. Therefore, the first distance d1 is 5 mm to 30 mm, which can ensure both good heat dissipation effect and convenient processing of the air inlet 151. Of course, in other embodiments, the first distance d1 can be adjusted according to the arrangement of the hardware in the chassis 1, and can also be less than 5 mm or greater than 30 mm, as long as it can ensure good heat dissipation of all hardware with heat dissipation requirements in the chassis 1.

[0034] Furthermore, in the present embodiment, an exhaust port 152 is provided on the end of one side panel 15 facing the rear panel 12, and the fan module 2 is located between the air inlet 151 and the exhaust port 152. Hardware with high heat dissipation requirements can be installed close to the exhaust port 152. The wind blown out by the fan module 2 is divided into two paths, one path is discharged from the air outlet 121 to the outside of the chassis 1, and the other path is discharged from the exhaust port 152 to the outside of the chassis 1. The heat can be dissipated in time, the temperature of the airflow in the chassis 1 is reduced, and the heat dissipation effect is enhanced. Of course, in other embodiments, the exhaust ports 152 can be provided on the ends of the two side panels 15 facing the rear panel 12. The shape, number and arrangement of the exhaust ports 152 are similar to the setting of the air inlet 151, and will not be repeated here.

[0035] Furthermore, in this embodiment, the minimum distance between the exhaust port 152 and the outer side surface of the rear panel 12 (referred to as the second distance d2) is 15 mm to 60 mm, wherein 40 mm is preferred. The smaller the second distance d2 is, the better the heat dissipation effect on the hardware in the chassis 1 is, and the larger the second distance d2 is, the more convenient it is to process the exhaust port 152. Therefore, the second distance d2 is 15 mm to 60 mm, which can ensure both good heat dissipation effect and convenient processing of the exhaust port 152. Of course, in other embodiments, the second distance d2 can be adjusted according to the arrangement of the hardware in the chassis 1, and can also be less than 15 mm or greater than 60 mm, as long as it can ensure good heat dissipation of all hardware with heat dissipation requirements in the chassis 1.

[0036] Furthermore, in this embodiment, the fan module 2 is located in the middle of the chassis 1, and the fan module 2 and the chassis 1 support hot plugging, so that the fan module 2 is easy to install and maintain in the chassis 1, and the hand feel is good when plugging and unplugging the fan module 2. Hot plugging is plugging and unplugging with power on, and the hot plugging function allows the user to remove or replace the fan module 2, hard disk and other components without cutting off the power supply, thereby improving the ability to recover in time when the system fails, the scalability and flexibility, etc.

[0037] Furthermore, in this embodiment, the fan module 2 includes four fan units, which are arranged side by side. The height of the fan module 2 is consistent with the height of the fan units, that is, the four fan units are arranged side by side in the horizontal direction, which can minimize the height of the fan module 2, increase the internal height space of the server, facilitate the design of other functional components, and have high structural reliability. Of course, in other embodiments, the number of fan units can be adjusted. When the chassis 1 is larger, the number of fan units can be increased, which can be five, six, or even more; when the chassis 1 is smaller, the number of fan units can be reduced, which can be three, two, or even one.

[0038] The embodiment of the utility model further provides a server, the server comprising the heat dissipation structure described above. Due to the use of the heat dissipation structure of the utility model, the heat on the hardware near the front panel 11 in the chassis 1 and the hardware far from the front panel 11 can be easily brought to the outside of the chassis 1 by the airflow formed when the fan module 2 is working, the heat dissipation effect is good, the server runs reliably, and the service life is long.

[0039] Furthermore, in this embodiment, the server also includes a mainboard 3, and the mainboard 3 is located between the fan module 2 and the air outlet 121. The distance between the mainboard 3 and the fan module 2 is greater than zero, so that the mainboard 3 can be kept away from the front panel 11. The wind blown by the fan module 2 blows directly towards the mainboard 3, ensuring that the mainboard 3 fully receives the wind blown by the fan module 2, thereby achieving a good heat dissipation effect on the mainboard 3.

[0040] Furthermore, in this embodiment, the server also includes a power supply module 4, which provides power for the operation of the server. The power supply module 4 is located between the fan module 2 and the air outlet 121, and the distance between the power supply module 4 and the mainboard 3 is greater than zero, so that the power supply module 4 can be kept away from the front panel 11, ensuring that the power supply module 4 fully receives the wind blown by the fan module 2, and an air flow channel is formed between the power supply module 4 and the mainboard 3, which can increase the heat dissipation area of ​​the power supply module 4 and the mainboard 3, and can avoid direct heat conduction between the power supply module 4 and the mainboard 3, which has a good heat dissipation effect on the power supply module 4 and the mainboard 3.

[0041] Furthermore, in the present embodiment, the mainboard 3 is installed close to the side panel 15 provided with the exhaust port 152. The heat generated by the operation of the mainboard 3 is discharged to the outside of the chassis 1 in two ways, one way is discharged to the outside of the chassis 1 from the air outlet 121, and the other way is discharged to the outside of the chassis 1 from the exhaust port 152. The heat on the mainboard 3 can be dissipated in time, and the temperature of the air flow passing through the mainboard 3 can be reduced to enhance the heat dissipation effect on the mainboard 3.

[0042] Furthermore, in this embodiment, the server further includes a hard disk module 5, which is located between the front panel 11 and the fan module 2, so that the hard disk module 5 is far away from the power module 4 and the main board 3, reducing the heat transfer between the power module 4 and the main board 3 and the hard disk module 5, and the two airflows formed by the air inlets 151 on the two side panels 15 entering the chassis 1 can flow through the hard disk module 5 and take away the heat on the hard disk module 5, which has a good effect on the heat dissipation of the hard disk module 5. The fan module 2 of the utility model separates the hard disk module 5 from the main board 3, which can prevent the heat generated on the main board 3 from being brought to the hard disk module 5 by the airflow formed by the operation of the fan module 2, and can well protect the hard disk module 5 and extend the service life of the hard disk module 5.

[0043] Furthermore, in this embodiment, the distances between the hard disk module 5 and the two side panels 15 are greater than zero, and the heat dissipation area of ​​the hard disk module 5 is large, so as to enhance the heat dissipation effect of the hard disk module 5 .

[0044] The heat dissipation principle of the utility model is that after the server is started, the fan module 2 starts to work, and the air outside the chassis 1 is sucked into the chassis 1 from the air inlet 151 during the rotation of the fan blades, and the air in the chassis 1 is pushed to the air outlet 121 and the exhaust port 152. When the airflow flows through the hard disk module 5, the main board 3 and the power module 4, the heat generated by the operation of the hard disk module 5, the main board 3 and the power module 4 is brought to the outside of the chassis 1, so that the hard disk module 5, the main board 3 and the power module 4 are cooled. Since the air inlet 151 is arranged on the end of the side panel 15 facing the front panel 11, the distance between the airflow and the front panel 11 is close, and the airflow can drive the air flow close to the front panel 11, which can avoid the formation of an air stagnant area near the front panel 11, so that the hardware near the front panel 11 is fully exposed to the wind, so the heat dissipation effect on the hardware near the front panel 11 is good.

[0045] It should be noted that, in other embodiments, the mainboard 3 may be disposed between the fan module 2 and the front panel 11, and the hard disk module 5 may be disposed between the fan module 2 and the rear panel 12, which can also achieve good heat dissipation. The heat dissipation principle is as described above.

[0046] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. There are many ways of detachable installation, for example, it can be through the method of plug-in and buckle matching, and for example, through the method of bolt connection, etc.

[0047] The above clearly and completely describes the concept, specific structure and technical effects of the utility model in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, other embodiments obtained by technicians in this field without creative work are all within the scope of protection of the utility model. In addition, all the connection / connection relationships mentioned in the text do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation.

[0048] The specific description of the present invention in the above embodiments is only used to further illustrate the present invention and cannot be understood as limiting the scope of protection of the present invention. Technical engineers in this field may make some non-essential improvements and adjustments to the present invention based on the contents of the above-mentioned utility model, which fall within the scope of protection of the present invention.

Claims

1. A heat dissipation structure, characterized in that: The heat dissipation structure includes a chassis and a fan module. The chassis includes a front panel, a rear panel, a top panel, a bottom panel and two side panels. The ends of the two side panels facing the front panel are each provided with an air inlet, the rear panel is provided with an air outlet, and the fan module is located between the air inlet and the air outlet.

2. The heat dissipation structure according to claim 1, characterized in that: The air inlet and the air outlet are both arranged in a plurality in an array, and the minimum distance between the air inlet and the front panel is 5 mm to 30 mm.

3. The heat dissipation structure according to claim 1 or 2, characterized in that: Among the two side panels, at least one of the side panels is provided with an exhaust port at an end portion facing the rear panel, and the fan module is located between the air inlet and the exhaust port.

4. The heat dissipation structure according to claim 3, characterized in that: The minimum distance between the air outlet and the outer side surface of the rear panel is 15 mm to 60 mm.

5. The heat dissipation structure according to claim 1 or 2, characterized in that: The fan module is located in the middle of the chassis.

6. A server, characterized in that: The server comprises the heat dissipation structure according to any one of claims 1 to 5.

7. The server according to claim 6, characterized in that: The server further includes a mainboard, and the mainboard is located between the fan module and the air outlet.

8. The server according to claim 7, characterized in that: The server further includes a power supply module, wherein the power supply module is located between the fan module and the air outlet, and a distance between the power supply module and the mainboard is greater than zero.

9. The server according to claim 6, characterized in that: The server further comprises a hard disk module, and the hard disk module is located between the front panel and the fan module.

10. The server according to claim 9, characterized in that: The distances between the hard disk module and the two side panels are greater than zero.

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