Screen module and electronic equipment
By designing through holes and buffers in the screen module, the problem of white spots in the perforation of the screen FPC is solved, the risk of increasing the thickness of the device is reduced, and the effect of lightness and thinness is achieved.
Patent Information
- Application Number
- CN202323626569.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-28
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2033-12-28
AI Technical Summary
In electronic devices, white spots are easily generated at the perforation of screen FPC, especially near the perforation position of the middle frame FPC. The prior art reduces the probability of white spots by increasing the thickness of the middle frame, but this will increase the thickness of the device, which is not conducive to lightness and thinness.
Design a screen module, including a middle frame, a screen body and a cooling plate. The cooling plate can be detachably installed on the screen body. The cooling plate is equipped with a through hole. The through hole is located near the perforation, which increases the between the screen body and the middle frame. Clearance and optional buffers to reduce impact force.
By increasing the gap and buffer, the probability of white spots in the perforation of the screen FPC is reduced, the direct impact of the middle frame on the screen body is avoided, the risk of increasing the thickness of the equipment is reduced, and the goal of lightness and thinness is achieved.
Smart Images
Figure CN222233210U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure belongs to the technical field of electronic equipment, and particularly relates to a screen module and an electronic equipment. Background Art
[0002] With the rapid development of the mobile phone industry, the thickness of electronic devices is getting thinner and thinner, and the screen border is reduced. When the screen crashes, it is easy to cause white spots, especially near the perforation position of the middle frame FPC. In order to reduce the white spots at the middle frame FPC, the related art increases the thickness of the middle frame. However, the increase in the thickness of the middle frame will increase the thickness of the electronic device, which is not conducive to the thinness of the electronic device. Summary of the invention
[0003] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. To this end, an embodiment of the present invention provides a screen module that can reduce the probability of white spots being generated at the perforation of the FPC of the screen.
[0004] An embodiment of the present disclosure also provides an electronic device.
[0005] The screen module of an embodiment of the present invention includes: a middle frame, the middle frame having a through hole; a screen body, the screen body is connected to the middle frame, and the screen body has an FPC, and the FPC is inserted into the through hole; a cooling plate, the cooling plate is detachably mounted on the screen body, and the cooling plate is located on a side of the screen body adjacent to the middle frame, the cooling plate is provided with a through hole, the through hole passes through the cooling plate, and the through hole is arranged adjacent to the through hole.
[0006] The screen module of the disclosed embodiment can reduce the probability of white spots being generated at the perforations of the FPC of the screen.
[0007] In some embodiments, a projection of the through hole in the thickness direction of the middle frame surrounds a periphery of a projection of the through hole in the thickness direction of the middle frame.
[0008] In some embodiments, the through hole has a first section, a second section and a third section that are interconnected, the first section and the second section are located on opposite sides of the through hole, the second section is located on the other side of the through hole, and the second section connects the first section and the third section.
[0009] In some embodiments, there are multiple through holes, and the multiple through holes are respectively located on two opposite sides of the through hole.
[0010] In some embodiments, in the width direction of the middle frame, the plurality of through holes are symmetrically arranged on both sides of the through hole.
[0011] In some embodiments, the screen module further includes a buffer component, which is connected to the cooling plate and is located in the through hole.
[0012] In some embodiments, the buffer is detachably connected to the cooling plate.
[0013] In some embodiments, the cushioning element is cushioning foam.
[0014] In some embodiments, the cooling plate is a graphite plate.
[0015] The electronic device of the embodiment of the present disclosure includes the screen module as described in any of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the structure of the screen module of the embodiment of the present disclosure.
[0017] Figure 2 It is a schematic diagram of the middle frame of an embodiment of the present disclosure.
[0018] Figure 3 It is a structural schematic diagram of a screen module according to another embodiment of the present disclosure.
[0019] Reference numerals:
[0020] Middle frame 1, perforation 11,
[0021] Cooling plate 2 , through hole 21 , first section 211 , second section 212 , third section 213 , buffer 3 , screen body 4 . DETAILED DESCRIPTION
[0022] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.
[0023] like Figures 1 to 3 As shown, the screen module of an embodiment of the present invention includes a middle frame 1, a cooling plate 2 and a screen body 4, the middle frame 1 is provided with a through hole 11, the screen body 4 is connected to the middle frame 1, and the screen body 4 is provided with an FPC, and the FPC is penetrated in the through hole 11, the cooling plate 2 is detachably mounted on the screen body 4, and the cooling plate 2 is located on a side of the screen body 4 adjacent to the middle frame 1, and a through hole 21 is provided on the cooling plate 2, and the through hole 21 passes through the cooling plate 2, and the through hole 21 is arranged adjacent to the through hole 11.
[0024] It should be noted that if Figure 1The area A shown is arranged adjacent to the perforation 11. Due to the existence of the perforation 11, the strength of the middle frame 1 near the perforation 11 and the area A is relatively weak. When the screen module falls, the area A will cause the middle frame 1 to deform more greatly, which can easily cause damage to the screen body 4 and produce white spots and other problems.
[0025] Specifically, Figure 1 and Figure 2 As shown, the screen body 4 is connected to the middle frame 1, and the screen body 4 has an FPC, the cooling plate 2 is connected to the screen body 4 by pasting, and the cooling plate 2 is located on the side of the screen body 4 adjacent to the middle frame 1. In other words, the cooling plate 2 is located between the screen body 4 and the middle frame 1.
[0026] The through hole 11 is located in the lower half of the middle frame 1 . The through hole 11 passes through the middle frame 1 . The FPC of the screen module is passed through the through hole 11 . The cooling plate 2 is covered on the middle frame 1 . The through hole 21 on the cooling plate 2 surrounds the outer peripheral side of the through hole 11 . In other words, the through hole 21 on the cooling plate 2 is located on the outer side of the through hole 11 .
[0027] It should be noted that, in the thickness direction of the middle frame 1, the projection of the through hole 21 in the thickness direction of the middle frame overlaps with area A at least partially or completely. In other words, the through hole 21 at least partially or completely covers area A, thereby increasing the gap between the screen body 4 and the middle frame 1, and preventing the deformed middle frame from hitting the screen body 1 during the falling process.
[0028] For example, the cooling plate 2 may be a graphite plate.
[0029] The screen module of the disclosed embodiment can increase the gap between the screen body 4 and the middle frame 1 by opening a through hole 21 on the cooling plate 2. The through hole 21 is arranged adjacent to the perforation 11 and surrounds the outer peripheral side of the perforation 11. This can reduce the incompressible thickness between the screen body 4 and the middle frame 1, thereby reducing the probability of white spots forming at the perforation 11 of the screen FPC.
[0030] In some embodiments, the projection of the through hole 21 in the thickness direction of the middle frame 1 surrounds the periphery of the projection of the through hole 11 in the thickness direction of the middle frame 1 .
[0031] Specifically, Figure 1 and Figure 2As shown, in the projection parallel to the thickness direction of the middle frame 1, the projection of the through hole 21 can surround the upper half of the projection of the perforation 11, that is, the through hole 21 is half surrounded by the periphery of the perforation 11, or the through hole 21 can surround the upper half of the perforation 11. The through hole 21 surrounds the periphery of the perforation 11, so that the thickness distribution of the periphery of the through hole 21 can be uniform. In other words, the uniform distribution of the gap between the middle frame 1 and the screen body 4 is ensured, so that the incompressible thickness between the screen body 4 and the middle frame 1 is uniformly distributed, reducing the probability of white spots.
[0032] In some embodiments, the through hole 21 has a first section 211, a second section 212 and a third section 213 that are interconnected. In the width direction of the middle frame 1, the first section 211 and the third section 213 are located on opposite sides of the through hole 11, and the first section 211 and the third section 213 extend in the length direction of the middle frame 1, the second section 212 is on the other side of the through hole 11, the second section 212 is located between the first section 211 and the third section 213, and the second section 212 extends along the width direction of the middle frame 1.
[0033] Specifically, Figure 1 As shown, the first section 211 is located on the left side of the perforation 11, and the third section 213 is located on the right side of the perforation 11. The first section 211 and the third section 213 extend in the up-down direction, and the second section 212 extends in the left-right direction. The widths of the first section 211 and the third section 213 may be the same, and the widths of the first section 211 and the third section 213 are greater than the width of the second section 212, or the widths of the first section 211, the second section 212, and the third section 213 are the same.
[0034] In some embodiments, there are multiple through holes 21 , and the multiple through holes 21 are respectively located on both sides of the through hole 11 .
[0035] For example, there are two through holes 21 , which are located on both sides of the through hole 11 in the left-right direction; or, there are four through holes 21 , which are located in groups of two on the left and right sides of the through hole 11 .
[0036] For example, the through holes 21 can also be arranged on the upper and lower sides of the through hole 11, or the through holes 21 can be arranged on the upper and lower sides and the left and right sides of the through hole 21 at the same time. It should be noted that the multiple through holes 21 are independent of each other. In other words, the multiple through holes 21 are not connected. By setting a plurality of through holes 21 that intersect at the connected through holes 21, the area occupied by the through holes 21 on the cooling plate 2 can be reduced, and the influence of the through holes 21 on the strength of the cooling plate 2 can be reduced.
[0037] The through holes 21 are arranged on both sides of the through hole 11 to ensure the uniformity of the gap distribution between the screen body 4 and the middle frame 1 on both sides of the through hole 11, thereby ensuring the uniformity of the stress that can be borne by both sides of the through hole 11.
[0038] Optionally, in the width direction of the middle frame 1 , a plurality of through holes 21 are symmetrically arranged on both sides of the through hole 11 .
[0039] For example, the number of the through holes 21 is two, and the two through holes 21 are symmetrically arranged on the left and right sides of the through hole 11. In other words, in the left-right direction, the spacing distance between the through holes 21 and the through hole 11 on the left and right sides is the same.
[0040] In some embodiments, the screen module further includes a buffer member 3 , which is connected to the cooling plate 2 , and is located in the through hole 21 .
[0041] Optionally, the buffer member 3 is detachably connected to the cooling plate 2 , for example, the buffer member 3 is clamped in the through hole 21 , or the buffer member 3 is pasted in the through hole 21 . Alternatively, the buffer member 3 is filled in the through hole 21 .
[0042] Specifically, Figure 1 and Figure 2 As shown, the buffer member 3 is located between the hollow part and the cooling plate 2 . In other words, the buffer member 3 is located between the screen body 4 and the middle frame 1 .
[0043] Optionally, the buffer member 3 may be a buffer foam, and the buffer foam is attached to the through hole 21 .
[0044] It should be noted that the reason why the strength of the middle frame 1 in area A is relatively weak is due to the existence of the perforation 11. When the through hole 21 is opened on two opposite sides of the perforation 11, since the position of the through hole 21 is far away from the perforation and a buffer 3 is provided in the through hole 21, during the falling process of the screen module, the buffer 3 in the through holes 21 on both sides of the perforation 11 can support the screen body, buffer the force of the middle frame 1 hitting the screen body 4, and reduce the risk of damage to the screen body 4.
[0045] By using the buffer 3, during the falling process, the buffer 3 can alleviate the deformation or impact force generated by the middle frame 1, convert the point stress into surface stress, prevent the deformation and impact force of the middle frame 1 from directly acting on the screen body 4, and cooperate with the through hole 21 on the cooling plate 2 to reduce the risk of white spots on the screen assembly.
[0046] Furthermore, when the through hole 21 is located on both sides of the perforation 11, the buffer 3 in the through hole 21 will support the screen body 4. When the middle frame 1 is deformed or impacted, the buffer 3 on both sides of the perforation 11 supports the screen body 4, thereby alleviating the deformation or impact force generated by the middle frame 1. At the same time, since there are no buffers 3 at other positions around the perforation 11, there will be no contact and interference between the buffer 3 and the screen body 4, which can further reduce the risk of white spots.
[0047] The electronic device of the embodiment of the present disclosure includes a screen module as described in any one of the above embodiments.
[0048] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0049] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0050] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0051] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0052] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.
[0053] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.
Claims
1. A screen module, characterized in that: include: A middle frame, wherein the middle frame has a perforation; A screen body, wherein the screen body is connected to the middle frame, and an FPC is provided on the screen body, and the FPC is inserted into the through hole; A cooling plate is detachably mounted on the screen body, and the cooling plate is located on a side of the screen body adjacent to the middle frame. A through hole is provided on the cooling plate, and the through hole passes through the cooling plate, and the through hole is arranged adjacent to the perforation.
2. The screen module according to claim 1, characterized in that: The projection of the through hole in the thickness direction of the middle frame surrounds the periphery of the projection of the through hole in the thickness direction of the middle frame.
3. The screen module according to claim 2, characterized in that: The through hole has a first section, a second section and a third section which are interconnected. The first section and the third section are located at opposite sides of the through hole. The second section is located at the other side of the through hole and the second section connects the first section and the third section.
4. The screen module according to claim 1, characterized in that: There are multiple through holes, and the multiple through holes are respectively located on two opposite sides of the through hole.
5. The screen module according to claim 4, characterized in that: In the width direction of the middle frame, the plurality of through holes are symmetrically arranged on both sides of the through hole.
6. The screen module according to claim 1, characterized in that: A buffer component is also included, wherein the buffer component is connected to the cooling plate and is located in the through hole.
7. The screen module according to claim 6, characterized in that: The buffer member is detachably connected to the cooling plate.
8. The screen module according to claim 7, characterized in that: The buffer component is buffer foam.
9. The screen module according to claim 1, characterized in that: The cooling plate is a graphite plate.
10. An electronic device, characterized in that: The invention comprises a screen module as claimed in any one of claims 1 to 9.